A new electronic component solder joint inspection apparatus

Abstract

A new electronic component welding point detection equipment, including the chassis, the center of the top of the chassis is provided with a manipulator, the lower side of the top of the chassis is provided with a conveyor belt, the upper right corner of the top of the chassis is provided with an electronic component defective product placing disc, the conveyor belt is connected with an electronic component placing carrier, a visual detection system is arranged above the electronic component placing carrier, a customized light source is arranged below the visual detection system, and the manipulator is connected with an electronic component suction module. The present application can change the existing electronic component welding point detection mode, and provides a new electronic component welding point detection equipment, which can realize rapid and stable detection, improves the production efficiency, further improves the production line UPH, reduces the operation cost, and realizes the goal of lean production. Compared with the traditional manual electronic component welding point detection, the present application reduces the labor cost and shortens the operation time, and greatly improves the operation efficiency.

Description

Technical Field

[0001] This invention relates to a novel electronic component solder joint inspection device, specifically a novel electronic component solder joint inspection device that uses a vision inspection system to inspect electronic component solder joints and automatically removes defective products using a robotic arm. Background Technology

[0002] In the production of electronic components, soldering is essential due to manufacturing processes, and the solder joints must be inspected to ensure they meet standards. Current methods for inspecting electronic component solder joints primarily rely on manual labor, specifically using a microscope while wearing insulated gloves to place the electronic component under the microscope. These existing methods have the following drawbacks: Firstly, the solder joints are relatively small, making manual inspection under a microscope slow and resulting in inconsistent production efficiency. Secondly, the large number of electronic components means that manual inspection using a microscope requires significant manpower. Thirdly, electronic components are easily damaged, and handling them manually while wearing insulated gloves increases the risk of damage, leading to rework and impacting production efficiency. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a novel electronic component solder joint inspection device that uses a vision inspection system to inspect electronic component solder joints and automatically removes defective products by a robotic arm.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a novel electronic component solder joint inspection equipment, including a chassis, a robot arm placed at the center of the top of the chassis, a conveyor belt placed on the lower side of the top of the chassis, a defective electronic component placement tray placed at the upper right corner of the top of the chassis, the conveyor belt connected to an electronic component placement carrier, a vision inspection system placed above the electronic component placement carrier, a customized light source placed below the vision inspection system, and the robot arm connected to an electronic component picking module.

[0005] The beneficial effects of this invention are that it changes the existing methods of electronic component solder joint inspection. This invention provides a novel electronic component solder joint inspection device that can achieve rapid and stable inspection. While ensuring stable inspection results, it improves production efficiency, further increases production line uptime (UPH), reduces operating costs, and achieves the goal of lean manufacturing. Compared with traditional manual electronic component solder joint inspection, this invention reduces labor costs, shortens operation time, and greatly improves operational efficiency while ensuring inspection quality. Attached Figure Description

[0006] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0007] Figure 1 This is a front view structural diagram of Embodiment 1 of the present invention.

[0008] Figure 2 This is a top view of Embodiment 1 of the present invention.

[0009] In the diagram: 1. Defective electronic component placement tray, 2. Robotic arm, 3. Conveyor belt, 4. Electronic component placement carrier, 5. Vision inspection system, 6. Custom light source, 7. Electronic component picking module, 8. Chassis, 9. Left caster wheel, 10. Right caster wheel, 11. Right foot, 12. Left foot. Detailed Implementation

[0010] exist Figure 1 and Figure 2 In the embodiment shown, there are a defective electronic component placement tray (1), a robot arm (2), a conveyor belt (3), an electronic component placement carrier (4), a vision inspection system (5), a custom light source (6), an electronic component picking module (7), a chassis (8), a left caster wheel (9), a right caster wheel (10), a right foot (11), and a left foot (12).

[0011] A novel electronic component solder joint inspection device according to the present invention includes a chassis (8), a robot arm (2) is placed at the center of the top of the chassis (8), a conveyor belt (3) is placed on the lower side of the top of the chassis (8), a defective electronic component placement tray (1) is placed at the upper right corner of the top of the chassis (8), the conveyor belt (3) is connected to an electronic component placement carrier (4), a vision inspection system (5) is placed above the electronic component placement carrier (4), a custom light source (6) is placed below the vision inspection system (5), and the robot arm (2) is connected to an electronic component picking module (7).

[0012] A novel electronic component solder joint testing device according to the present invention has a left universal wheel (9) and a right universal wheel (10) installed at the rear bottom of the chassis (8), and a right foot (11) and a left foot (12) installed at the front bottom of the chassis (8).

[0013] The novel electronic component solder joint inspection equipment of the present invention operates as follows: electronic components are placed in an electronic component placement carrier and moved to the underside of a vision inspection system via a conveyor belt. The vision inspection system triggers a customized light source. After the customized light source is triggered, the electronic component solder joints are inspected. Good products flow into the next process via the conveyor belt, while defective products are picked up by a robotic arm that drives the electronic component picking module. After the robotic arm drives the electronic component picking module to pick up the defective products, they are placed in an electronic component defective product placement tray.

[0014] This invention provides a novel electronic component solder joint inspection device. Different types of electronic component solder joint inspection programs can be imported into this invention, allowing for the establishment of different inspection programs for different types of electronic component solder joints. This greatly improves the versatility and flexibility of the invention, thereby further enhancing the core competitiveness of enterprises.

[0015] This invention provides a novel electronic component solder joint inspection device that revolutionizes existing solder joint inspection methods. This device offers rapid and stable inspection capabilities, ensuring consistent inspection results while improving production efficiency, increasing production line uptime (UPH), reducing operating costs, and achieving lean manufacturing goals. Compared to traditional manual solder joint inspection, this invention reduces labor costs, shortens operation time, and significantly improves operational efficiency while maintaining inspection quality.

[0016] The invention has proven to be very effective.

Claims

1. A novel electronic component solder joint inspection device, comprising a chassis (8), characterized in that, A robotic arm (2) is placed at the center of the top of the chassis (8), a conveyor belt (3) is placed on the lower side of the top of the chassis (8), a defective electronic component placement tray (1) is placed at the upper right corner of the top of the chassis (8), the conveyor belt (3) is connected to the electronic component placement carrier (4), a vision inspection system (5) is placed above the electronic component placement carrier (4), a custom light source (6) is placed below the vision inspection system (5), and the robotic arm (2) is connected to the electronic component picking module (7).

2. The novel electronic component solder joint inspection equipment according to claim 1, characterized in that, The bottom rear of the chassis (8) is fitted with a left caster wheel (9) and a right caster wheel (10), and the bottom front of the chassis (8) is fitted with a right foot (11) and a left foot (12).

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