A continuous piercing die

CN224749890UActive Publication Date: 2026-09-15WANSHENGXING PRECISION TECH HUIZHOU CO LTD
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Patent Information

Application Number
CN202522073615.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-25
Publication Date
2026-09-15
Estimated Expiration
2035-09-25

AI Technical Summary

Technical Problem

在这种情况下,传统常规连续模具的设计方案难以适配,常常出现断冲针以及刀口无法及时排出冲压产生的废屑的情况

Benefits of technology

[0022] 1. This utility model provides a continuous punching die, which uses at least two punch structures to punch the material in stages, reducing damage to the punch structures during the punching process. A ejector unit is located below the first punch structure for material removal after initial punching, and a chip removal channel is located below the second punch structure to remove waste chips while fully completing the punching process. This design reduces the likelihood of punch breakage and facilitates timely chip removal, solving the risk of punch breakage when punching small holes with a thickness smaller than the material, improving production efficiency, and reducing die repair time and costs.

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Abstract

The utility model provides a kind of continuous punching die, including upper die seat, upper clamping plate, lower die plate and lower die seat that are sequentially arranged, and upper clamping plate and lower die plate form processing station, and upper clamping plate is connected with stop plate;Along processing order, stop plate is sequentially slid and is provided with first punch structure and second punch structure;First ejector unit and chip removal passage are equipped in the continuous punching die on the side of processing station away from upper die seat, and first ejector unit is opposite to first punch structure;Chip removal passage is opposite to second punch structure, and chip removal passage penetrates lower die plate and lower die seat, and the continuous punching die is optimized by setting at least two punch structures and respectively with different punch structure opposite ejector unit and chip removal passage, and punch structure is optimized, material plate step-by-step punching process is realized, to reduce the possibility of punch fracture damage and scrap accumulation in the case where punching diameter is less than material thickness.
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Description

Technical Field

[0001] This utility model belongs to the field of mold processing technology, specifically relating to a continuous punching mold. Background Technology

[0002] Progressive die stamping, as a key process for efficient mass production in modern manufacturing, is widely used in electronics, automobiles, hardware and other fields. It achieves integrated molding of products through multi-station continuous operation, which can significantly improve production efficiency and ensure product precision consistency. It is one of the indispensable core technologies in current large-scale production. Especially in the processing of hard materials (such as high-strength alloys, special steels, etc.), higher requirements are placed on the reliability and adaptability of the molds.

[0003] In progressive die stamping of hard materials, there is often a special structural requirement where the punch diameter is smaller than the material thickness. In this case, the design of traditional progressive dies is difficult to adapt, often resulting in broken punches and the inability of the cutting edge to remove the waste generated during stamping in a timely manner.

[0004] The above problems directly lead to two core technical pain points: First, the punches break frequently, requiring machine shutdown to replace the punches and adjust the molds, which greatly increases the frequency of mold repair and production costs; Second, after the waste chips clog the cutting edge, they will not only scratch the product surface and reduce the processing accuracy, but also force the production line to stop, seriously affecting the production progress, especially in high-speed continuous die application scenarios, where this problem is more prominent.

[0005] In summary, how to solve the problems of punch breakage and waste accumulation when the punch diameter is smaller than the material thickness is a problem that researchers in the field are currently facing. Summary of the Invention

[0006] To address at least one of the aforementioned problems, this invention provides a continuous punching die. This continuous punching die achieves a step-by-step punching process on the material plate by setting at least two punch structures and a material ejection unit and a chip removal channel that are respectively opposite to different punch structures. This reduces the possibility of punch breakage and chip accumulation when the punching diameter is smaller than the material thickness.

[0007] The technical effects to be achieved by this utility model are realized through the following technical aspects:

[0008] This utility model provides a continuous punching die, including an upper die base, an upper clamping plate, a lower template, and a lower die base arranged in sequence, with a processing station formed between the upper clamping plate and the lower template. The upper clamping plate is characterized in that a stop plate is provided on the side near the processing station; along the processing sequence, a first punch structure and a second punch structure are slidably passed through the stop plate in sequence.

[0009] A first ejector unit and a chip removal channel are provided on the side of the machining station away from the upper mold base. One end of the first ejector unit is used to abut against the material plate located at the machining station, and the first ejector unit is opposite to the first punch structure. The chip removal channel is opposite to the second punch structure, and the chip removal channel passes through the lower mold plate and the lower mold base.

[0010] The diameter of the punching end of the first punch structure is a, the diameter of the punching end of the second punch structure is b, and the target hole diameter is c. In the continuous punching die, there is a relationship: c = b > a > 0.

[0011] In some embodiments, the lower mold plate has a first chip guide channel that is connected to a second chip guide channel, the first chip guide channel and the second chip guide channel together form the chip removal channel, and the second chip guide channel passes through the lower mold base.

[0012] In some embodiments, the first chip guide channel includes a guide channel and a punch channel adapted to the punching end of the second punch structure, the guide channel connecting the punch channel and the second chip guide channel, and the diameter of the punch channel being smaller than the diameter of the guide channel.

[0013] In some embodiments, the first ejector unit includes a movable part and an ejector assembly, one end of the movable part being connected to the ejector assembly, and the other end of the movable part being driven away from or abutting against the material plate located at the processing station under the driving action of the ejector assembly.

[0014] In some embodiments, the top-feeding assembly includes a top-feeding pin, a spring, and a limiting member connected in sequence, wherein the top-feeding pin abuts against the movable member.

[0015] In some embodiments, a lower pad is provided between the lower template and the lower mold base, the movable member moves on the lower template, the ejector pin passes through the lower pad, and the spring and the limiting member are connected to the lower mold base.

[0016] In some embodiments, the stop plate is also slidably provided with a third punch structure, the third punch structure being located between the first punch structure and the second punch structure;

[0017] A second ejector unit is provided on the side of the processing station away from the upper mold base, and the second ejector unit is opposite to the third punch structure.

[0018] In some embodiments, the diameter of the stamping end of the third punch structure is d, and in the continuous punching die, there exists a relationship c = b > d > a > 0.

[0019] In some embodiments, an upper pad is provided between the upper mold base and the upper clamping plate, one end of the first punch structure and the second punch structure abuts against the upper pad, and both the first punch structure and the second punch structure are movably inserted through the upper clamping plate and the stop plate.

[0020] In some embodiments, the stop plate is also connected to a stripper plate on the side closest to the processing station.

[0021] In summary, this utility model has at least the following advantages:

[0022] 1. This utility model provides a continuous punching die, which uses at least two punch structures to punch the material in stages, reducing damage to the punch structures during the punching process. A ejector unit is located below the first punch structure for material removal after initial punching, and a chip removal channel is located below the second punch structure to remove waste chips while fully completing the punching process. This design reduces the likelihood of punch breakage and facilitates timely chip removal, solving the risk of punch breakage when punching small holes with a thickness smaller than the material, improving production efficiency, and reducing die repair time and costs. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the continuous punching die of Embodiment 1 of this utility model.

[0024] Figure 2 This is a schematic diagram of the continuous punching die of Embodiment 2 of this utility model.

[0025] Figure 3 for Figure 2 A magnified view of part A in the diagram.

[0026] Figure 4 for Figure 2 A magnified view of part B in the diagram.

[0027] Figure 5 This is a schematic diagram of the structure of the movable part and the limiting shell in Embodiment 2 of this utility model.

[0028] Figure 6 This is a schematic diagram of the continuous punching die of Embodiment 3 of this utility model.

[0029] Marked in the image:

[0030] 100. Upper mold base; 200. Upper clamping plate; 300. Lower mold plate; 400. Lower mold base; 500. Stop plate; 600. Lower pad plate; 700. Upper pad plate; 800. Stripper plate;

[0031] 1. First punch structure;

[0032] 2. Second punch structure;

[0033] 3. First ejector unit; 31. Movable component; 32. Ejector assembly; 321. Ejector pin; 322. Spring; 323. Limiting component; 33. Limiting housing; 331. Receiving cavity;

[0034] 4. Chip removal channel; 40. Punch guide; 41. First chip guide channel; 411. Guide channel; 412. Punch channel; 42. Second chip guide channel;

[0035] 5. Third punch structure;

[0036] 6. Second top material unit. Detailed Implementation

[0037] To facilitate understanding of the present invention, a more comprehensive description will be given below in conjunction with the accompanying drawings and specific embodiments. The drawings illustrate preferred embodiments of the invention. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0038] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0041] For ease of understanding, it should be noted that the X-axis in the graph represents the horizontal direction, the Y-axis represents the vertical direction, and the Z-axis represents the vertical direction.

[0042] Example 1:

[0043] Please refer to the reference. Figure 1 This embodiment provides a continuous punching die, which reduces the possibility of punch breakage and helps to remove waste in a timely manner. It solves the risk of punch breakage when punching small holes with a thickness smaller than the material, improves production efficiency, and reduces die repair time and cost.

[0044] Specifically, the continuous punching die includes an upper die base 100, an upper clamping plate 200, a lower die template 300, and a lower die base 400 arranged sequentially from top to bottom, with a processing station formed between the upper clamping plate 200 and the lower die template 300. A stop plate 500 is also provided on the side of the upper clamping plate 200 near the processing station; along the processing sequence, a first punch structure 1 and a second punch structure 2 are slidably passed through the stop plate 500. In this embodiment, both the first punch structure 1 and the second punch structure 2 are fixedly connected to the upper clamping plate 200, and a sliding clearance exists between the first punch structure 1 and the second punch structure 2 and the stop plate 500. This sliding clearance allows the stop plate 500 to limit the first punch structure 1 and the second punch structure 2 while ensuring the accuracy of the continuous punching die. During the punching operation, the sliding clearance also prevents the punches from breaking due to the strong punching force.

[0045] Meanwhile, on the side of the machining station away from the upper die holder 100, the continuous punching die is equipped with a first ejector unit 3 and a chip removal channel 4. The first ejector unit 3 is opposite to the first punch structure 1 and is used to abut against the material plate located at the machining station. After the first punch structure 1 completes the initial punching, it lifts the material to be processed, achieving material removal. The chip removal channel 4 is opposite to the second punch structure 2 and extends through the lower die plate 300 and the lower die holder 400. After the second punch structure 2 completes the full punching of the material plate, the waste chips fall off and can be discharged promptly through the chip removal channel 4 to avoid chip accumulation.

[0046] Specifically, the diameter of the stamping end of the first punch structure 1 is a, the diameter of the stamping end of the second punch structure 2 is b, and the target hole diameter is c. In the continuous punching die, there is a relationship: c = b > a > 0. By setting the diameter of the stamping end, it is possible to effectively prevent the stamping end from breaking due to excessive punching force during each punching process.

[0047] In this embodiment, the complete punching process is as follows: When the first punch structure 1 acts on the material plate, it acts on a portion of the material plate thickness, achieving preliminary punching, which is equivalent to forming a punching point. At this time, the material plate is not completely punched through. Subsequently, the first ejector unit 3 lifts and acts on the material plate, causing the material plate to separate from the lower template 300, achieving material removal. Then, the second punch structure 2 further performs punching operations based on the preliminary punching, completing the final punching process, at which point the material plate is punched through. The waste generated during the punching process is discharged in a timely manner along the chip removal channel 4 at the lower template 300 under the action of the second punch structure 2.

[0048] The continuous punching die provided in this embodiment optimizes the number of punching steps and limits the punch structure to ensure smooth punching of small holes with a diameter smaller than the material thickness and to maintain die precision.

[0049] Example 2:

[0050] This embodiment makes further structural optimizations based on Embodiment 1. Please refer to... Figure 1 Based on the above, refer to Figures 2 to 5 .

[0051] In this embodiment, the stop plate 500 is also slidably provided with a third punch structure 5, which is located between the first punch structure 1 and the second punch structure 2. Similar to the first punch structure 1, on the side of the processing station away from the upper die holder 100, the continuous punching die is provided with a second ejector unit, which is opposite to the third punch structure 5. The second ejector unit is used to abut against the material plate located at the processing station.

[0052] In this embodiment, the material plate passes through the first punch structure 1, the second punch structure 2, and the third punch structure 5 in sequence to complete the punching process. After the second punch structure 2 completes the punching, the second ejector unit 6 lifts the material plate to achieve unloading.

[0053] In this embodiment, the complete punching process is as follows: When the first punch structure 1 acts on the material plate, the punching depth is one-third of the material plate thickness, achieving preliminary punching. At this time, the material plate is not completely punched through. Subsequently, the first ejector unit 3 lifts and acts on the material plate, causing the material plate to separate from the lower template 300, achieving material removal. Based on the first punching, the third punch structure 5 punches the material plate again, increasing the punching depth by one-third of the material plate thickness. The second ejector unit 6 acts on the material plate, removing the material plate from the lower template 300. The second punch structure 2 further punches based on the punching of the third punch structure 5, completing the final punching process. At this time, the material plate is punched through. The waste generated during the punching process is discharged in a timely manner along the chip removal channel 4 at the lower template 300 under the action of the second punch structure 2.

[0054] Furthermore, the lower template 300 is provided with a punch guide 40, which passes through a first chip guide channel 41. The first chip guide channel 41 is connected to a second chip guide channel 42. The first chip guide channel 41 and the second chip guide channel 42 form a chip discharge channel 4. The second chip guide channel 42 passes through the lower mold base 400 to discharge waste chips after passing through the lower template 300 and the lower mold base 400.

[0055] It should be noted that the first chip guide channel 41 includes a guide channel 411 and a punch channel 412 adapted to the punching end of the second punch structure 2. The guide channel 411 connects the punch channel 412 and the second chip guide channel 42, and the diameter of the punch channel 412 is smaller than the diameter of the guide channel 411. When the second punch structure 2 performs punching, the generated waste chips enter the punch channel 412 under the punching action of the second punch structure 2, and then enter the guide channel 411. Since the diameter of the guide channel 411 is larger than that of the punch channel 412, waste material is less likely to accumulate. In this embodiment, the punch channel 412 has a maximum length of 2.0 mm, further preventing the punch from being broken due to the easy blockage of the small hole by waste chips.

[0056] Furthermore, the first ejector unit 3 includes a movable member 31 and an ejector assembly 32. One end of the movable member 31 is connected to the ejector assembly 32. Under the driving action of the ejector assembly 32, the other end of the movable member 31 moves away from or abuts against the material plate located at the processing station. When the movable member 31 abuts against the material plate, it can cause the material plate to be demolded from the lower template 300. In this embodiment, the first ejector unit 3 also includes a limiting housing 33. The limiting housing 33 is located at the lower template 300 and has a receiving cavity 331 that extends through to the upper and lower surfaces of the lower template 300. The movable member 31 moves within the receiving cavity 331. In particular, in this embodiment, the movable member 31 is composed of two parts with different cross-sectional widths, with the upper part having a smaller cross-sectional width than the lower part. The cross-sectional shapes of the upper and lower parts can be cylindrical, cuboid, or other structures, and are not limited here. The shape of the receiving cavity 331 of the limiting housing 33 is adapted to the movable member 31. Since the upper and lower parts of the movable part 31 have different cross-sectional widths, when the movable part 31 is moved upward by the top material assembly 32, the upper part of the movable part 31 can abut against the material plate, causing the material plate to separate from the lower template 300, and the top of the lower part abuts against the inner surface of the limiting housing 33 in the accommodating cavity 331, ensuring the stability of the structure of the first top material unit 3.

[0057] Specifically, the ejector assembly 32 includes an ejector pin 321, a spring 322, and a limiting member 323 connected in sequence. The top of the ejector pin 321 abuts against the movable member 31, and the spring 322 is connected below it. The spring 322 is connected to the lower mold base 400 through the limiting member 323. In this embodiment, the limiting member 323 is a stop screw. When the mold is closed, the spring 322 is in a compressed state, storing elastic potential energy; when the mold is opened, the spring 322 releases its elastic potential energy, pushing the ejector pin 321 upward and acting on the material plate, ejecting the material plate from the molding cavity of the lower mold plate 300, thereby completing the stripping process.

[0058] It should be noted that the structure of the second top material unit 6 is the same as that of the first top material unit 3.

[0059] Furthermore, a lower backing plate 600 is provided between the lower template 300 and the lower mold base 400. The movable part 31 is movable within the lower template 300, the ejector pin 321 passes through the lower backing plate 600, and the spring 322 and the limiting part 323 are connected to the lower mold base 400. At the same time, the lower backing plate 600 is provided with a channel connecting the first chip guide channel 41 and the second chip guide channel 42.

[0060] Preferably, the diameter of the stamping end of the third punch structure 5 is d. In the continuous punching die, there is a relationship: c = b > d > a > 0. The purpose is to reduce the punching force on the punch structure during each punching process and reduce the damage to the punch structure.

[0061] Example 3:

[0062] This embodiment makes further structural optimizations based on embodiment 2. Please refer to... Figures 2-5 Based on the above, refer to Figure 6 .

[0063] Preferably, an upper pad 700 is provided between the upper die holder 100 and the upper clamping plate 200. The upper ends of the first punch structure 1, the second punch structure 2, and the third punch structure 5 abut against the upper pad 700. When the punch presses the material, a concentrated impact force is generated. The upper pad 700 can evenly transmit the force to the upper die holder 100, preventing the upper die holder 100 from deforming or being damaged due to excessive local force. At the same time, it can help fix the punch and reduce punch shaking. Meanwhile, the first punch structure 1, the second punch structure 2, and the third punch structure 5 are all movably inserted through the upper clamping plate 200 and the stop plate 500.

[0064] Preferably, on the side near the processing station, the stop plate 500 is also connected to a stripper plate 800. The stripper plate 800 is used to assist the material plate in separating from the stamping end of the punch structure.

[0065] The above description is merely an example and illustration of the structure of this invention, and while the description is specific and detailed, it should not be construed as limiting the scope of this invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this invention, and these obvious substitutions all fall within the protection scope of this invention.

Claims

1. A continuous punching die, comprising an upper die holder (100), an upper clamping plate (200), a lower die template (300), and a lower die holder (400) arranged sequentially, wherein a processing station is formed between the upper clamping plate (200) and the lower die template (300), characterized in that, The upper clamping plate (200) is also provided with a stop plate (500) on the side near the processing station; along the processing sequence, the stop plate (500) is slidably provided with a first punch structure (1) and a second punch structure (2). A first ejector unit (3) and a chip removal channel (4) are provided on the side of the processing station away from the upper mold base (100). One end of the first ejector unit (3) is used to abut against the material plate located at the processing station, and the first ejector unit (3) is opposite to the first punch structure (1). The chip removal channel (4) is opposite to the second punch structure (2), and the chip removal channel (4) passes through the lower template (300) and the lower mold base (400). The diameter of the stamping end of the first punch structure (1) is a, the diameter of the stamping end of the second punch structure (2) is b, and the target hole diameter is c. In the continuous punching die, there is a relationship: c = b > a > 0.

2. The continuous punching die according to claim 1, characterized in that, The lower template (300) is penetrated by a first chip guide channel (41), the first chip guide channel (41) is connected to a second chip guide channel (42), the first chip guide channel (41) and the second chip guide channel (42) form the chip discharge channel (4), and the second chip guide channel (42) penetrates the lower mold base (400).

3. The continuous punching die according to claim 2, characterized in that, The first chip guide channel (41) includes a guide channel (411) and a punch channel (412) adapted to the punching end of the second punch structure (2). The guide channel (411) connects the punch channel (412) and the second chip guide channel (42). The diameter of the punch channel (412) is smaller than the diameter of the guide channel (411).

4. The continuous punching die according to claim 3, characterized in that, The first top-feeding unit (3) includes a movable part (31) and a top-feeding assembly (32). One end of the movable part (31) is connected to the top-feeding assembly (32). Under the driving action of the top-feeding assembly (32), the other end of the movable part (31) moves away from or abuts against the material plate located at the processing station.

5. The continuous punching die according to claim 4, characterized in that, The top material assembly (32) includes a top material pin (321), a spring (322) and a limiting member (323) connected in sequence, and the top material pin (321) abuts against the movable member (31).

6. The continuous punching die according to claim 5, characterized in that, A lower pad (600) is provided between the lower template (300) and the lower mold base (400). The movable part (31) moves on the lower template (300). The ejector pin (321) passes through the lower pad (600). The spring (322) and the limiting part (323) are connected to the lower mold base (400).

7. The continuous punching die according to any one of claims 1-6, characterized in that, The stop plate (500) is also slidably provided with a third punch structure (5), which is located between the first punch structure (1) and the second punch structure (2); A second ejector unit (6) is provided on the side of the processing station away from the upper mold base (100), and the second ejector unit (6) is opposite to the third punch structure (5).

8. The continuous punching die according to claim 7, characterized in that, The diameter of the stamping end of the third punch structure (5) is d, and there is a relationship c = b > d > a > 0 in the continuous punching die.

9. The continuous punching die according to claim 1, characterized in that, An upper pad (700) is provided between the upper mold base (100) and the upper clamping plate (200). One end of the first punch structure (1) and the second punch structure (2) abuts against the upper pad (700), and the first punch structure (1) and the second punch structure (2) are movably inserted through the upper clamping plate (200) and the stop plate (500).

10. The continuous punching die according to claim 1, characterized in that, On the side near the processing station, the stop plate (500) is also connected to a stripper plate (800).