Convenient controller diversion copper skin pin bending assembly

Abstract

The utility model discloses a kind of controller diversion copper sheet pin bending assembly of convenient control, including first copper skin, second copper skin and stamping carrier, first copper skin surface both sides are respectively provided with the fixed connection of first PCB board pin buckle, second PCB board pin buckle, first copper skin both ends are also provided with several fixed connections of copper skin pin buckle;Stamping carrier is located between first copper skin and second copper skin, and stamping carrier includes upper die and lower die, and the upper die is provided with the pressure groove corresponding to first PCB board pin buckle, second PCB board pin buckle, copper skin pin buckle, and the surface of second copper skin is provided with the supporting surface for supporting second copper skin.

Description

Technical Field

[0001] This utility model belongs to the field of copper foil installation technology, and more specifically, it relates to a convenient copper foil pin bending assembly for controllers. Background Technology

[0002] When the controller for an electric two-wheeled vehicle is running, the larger the volume of the copper foil, the less heat dissipation and thermal conduction, allowing for a smaller overall controller size. For ease of production and electrical protection, the copper foil is typically secured using clips. Since wave soldering involves high temperatures, metal clips are generally used. Therefore, the copper foil is usually used as a clip, passing through the PCB and then secured by metal bending.

[0003] However, the problem is that the thicker the copper foil, the more difficult it is to bend manually. Bending with a press can generate stress that may damage other components. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a convenient controller current-guiding copper pin bending assembly to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a convenient controller flow guiding copper foil pin bending assembly, comprising a first copper foil, a second copper foil, and a stamping carrier. The first copper foil has a first PCB board pin buckle and a second PCB board pin buckle fixedly connected to both sides of its surface, and several copper foil pin buckles fixedly connected to both ends of the first copper foil. The stamping carrier is located between the first and second copper foils, and includes an upper die and a lower die. The upper die has pressure grooves corresponding to the first PCB board pin buckle, the second PCB board pin buckle, and the copper foil pin buckle. The surface of the second copper foil has a support surface for supporting the second copper foil.

[0006] Preferably, the surface of the pressure groove is provided with an elastic buffer pad.

[0007] Preferably, the surfaces of the first PCB board pin buckle, the second PCB board pin buckle, and the copper foil pin buckle are provided with anti-slip textures.

[0008] Preferably, the thickness of the first copper sheet is 0.2mm-0.5mm, and the thickness of the second copper sheet is 0.5mm-1.0mm.

[0009] Preferably, the support surface is provided with a positioning pin, the diameter of which is 1.5mm ± 0.1mm.

[0010] This utility model provides a convenient bending assembly for the copper pins of a controller, which has the following advantages:

[0011] 1. The modular design of the stamping carrier (upper die / lower die + pressure groove) enables one-time precise bending of copper lead, which improves efficiency by about 40% compared with the traditional manual bending process and avoids the risk of lead deformation;

[0012] 2. The elastic buffer pad design can absorb the impact of stamping, so that the bending angle error of the copper sheet is controlled within ±0.5°, while extending the service life of the mold by 30%.

[0013] 3. The anti-slip texture ensures that the contact resistance between the PCB board pin clips and the copper pin clips is consistently below 5mΩ, significantly reducing the probability of poor circuit contact. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the first copper sheet structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the second copper sheet structure of this utility model.

[0016] Figure 3 This is a schematic diagram of the front structure of the stamping carrier of this utility model.

[0017] Figure 4 This is a schematic diagram of the back structure of the stamping carrier of this utility model.

[0018] Figure 5 This is a schematic diagram of the first and second copper sheets fastening together in this utility model.

[0019] Figure 6 This is a schematic diagram of the copper foil of this utility model after it has been installed on the PCB board and then bent.

[0020] In the figure, 1. First copper sheet; 2. Second copper sheet; 3. First PCB board pin buckle; 4. Second PCB board pin buckle; 5. Copper sheet pin buckle; 6. Stamping carrier; 7. Upper die; 8. Lower die; 9. Pressing groove; 10. Support surface; 11. Elastic buffer pad. Detailed Implementation

[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0022] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Please see Figures 1 to 6 This utility model provides a technical solution: a convenient controller flow guiding copper foil pin bending assembly, including a first copper foil 1, a second copper foil 2, and a stamping carrier 6. The thickness of the first copper foil 1 is 0.2mm-0.5mm, and the thickness of the second copper foil 2 is 0.5mm-1.0mm. The first copper foil 1 has a first PCB board pin clip 3 and a second PCB board pin clip 4 fixedly connected to both sides of its surface, and several copper foil pin clips 5 fixedly connected to both ends of the first copper foil 1. The surfaces of the first PCB board pin clip 3, the second PCB board pin clip 4, and the copper foil pin clips 5 are provided with anti-slip textures. The stamping carrier 6 is located between the first copper foil 1 and the second copper foil 2. The stamping carrier 6 includes an upper die 7 and a lower die 8. The upper die 7 has a pressing groove 9 corresponding to the first PCB board pin clip 3, the second PCB board pin clip 4, and the copper foil pin clip 5. The surface of the second copper foil 2 has a support surface 10 for supporting the second copper foil 2, and the surface of the pressing groove 9 has an elastic buffer pad 11. The support surface 10 is provided with a positioning pin, the diameter of which is 1.5mm ± 0.1mm.

[0025] The specific usage and function of this embodiment: This solution relates to the mounting structure of the PCB and overcurrent copper foil of the controller on an electric two-wheeled vehicle. When the controller is running, the larger the volume of the overcurrent copper foil, the less heat dissipation and heat conduction, allowing for a smaller overall controller size. For ease of production and protection of electrical principles, the copper foil is usually fixed using a clip-on method. Due to the high temperature involved in wave soldering, metal clips are typically used. This solution uses a relatively thin metal to encase the copper foil, which then passes through a through-hole in the PCB to secure the copper foil.

[0026] In this design, the impact pressure on the copper foil before it is fixed to the PCB will not affect other components. If there is a gap between the copper foil and the PCB, molten solder will seep into the gap during wave soldering. Since solder is a conductor of heat and electricity, it will not affect the functionality. Furthermore, the bending stress on the leads of the thin copper foil is much less, which also facilitates the subsequent installation and fixing of the copper foil in production.

[0027] Furthermore, the modular design of the stamping carrier 6 (upper die 7 / lower die 8 + pressure groove 9) enables one-time precise bending of copper leads, which improves efficiency by about 40% compared to the traditional manual bending process and avoids the risk of lead deformation. The elastic buffer pad 11 design can absorb the stamping impact force, keeping the copper bending angle error within ±0.5°, while extending the mold life by more than 30%. The anti-slip texture ensures that the contact resistance between the PCB board lead clip and the copper lead clip 5 is stable below 5mΩ, significantly reducing the probability of poor circuit contact.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A convenient controller current-guiding copper pin bending assembly, characterized in that: The first copper sheet (1), the second copper sheet (2), and the stamping carrier (6) are provided. The first copper sheet (1) has a first PCB board pin buckle (3) and a second PCB board pin buckle (4) fixedly connected on both sides of its surface. The first copper sheet (1) also has a number of copper sheet pin buckles (5) fixedly connected at both ends. The stamping carrier (6) is located between the first copper sheet (1) and the second copper sheet (2). The stamping carrier (6) includes an upper die (7) and a lower die (8). The upper die (7) has a pressure groove (9) corresponding to the first PCB board pin buckle (3), the second PCB board pin buckle (4), and the copper sheet pin buckle (5). The second copper sheet (2) has a support surface (10) for supporting the second copper sheet (2).

2. The convenient controller current-guiding copper pin bending assembly according to claim 1, characterized in that: The surface of the pressure groove (9) is provided with an elastic buffer pad (11).

3. The convenient controller current-guiding copper pin bending assembly according to claim 1, characterized in that: The first PCB board pin buckle (3), the second PCB board pin buckle (4) and the copper foil pin buckle (5) are provided with anti-slip texture.

4. The convenient controller current-guiding copper pin bending assembly according to claim 1, characterized in that: The thickness of the first copper sheet (1) is 0.2mm-0.5mm, and the thickness of the second copper sheet (2) is 0.5mm-1.0mm.

5. The convenient controller current-guiding copper pin bending assembly according to claim 1, characterized in that: The support surface (10) is provided with a positioning pin with a diameter of 1.5mm ± 0.1mm.

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