A kind of fixture for temperature sensor chip laser welding

Abstract

The utility model discloses a kind of for temperature sensor chip laser welding's fixture, including base assembly, still including clamp assembly, down-pressing assembly, the upper end of base assembly is provided with clamp assembly;The upper of clamp assembly is provided with down-pressing assembly;Base assembly includes base;The upper end center groove of base is provided with slide rail;The upper end both sides of slide rail are provided with sliding block;The upper end of each sliding block is provided with clamping block;The upper end of clamping block is provided with clamping piece;Two clamping blocks are provided with fixed limit seat between it.The utility model places temperature sensor chip by the groove of chip placing block, places cable using the groove of cable placing block, the wire of septum separates cable, promote the direction of fixed limit seat to clamping block, so that two pad block clamps cable and septum, keep the structural combination stability between pad block and septum, cable, chip, finally fixed septum and lead wire using press bar down-pressing.

Description

Technical Field

[0001] This utility model relates to the field of laser welding fixtures for exhaust temperature sensor chips, specifically a fixture for laser welding exhaust temperature sensor chips. Background Technology

[0002] In the field of electronics manufacturing, chip welding is of paramount importance. As electronic products continue to develop towards miniaturization and high performance, higher requirements are placed on the precision and reliability of chip welding. Laser welding technology, with its significant advantages such as concentrated energy, small heat-affected zone, high welding precision, and the ability to achieve automated production, has been increasingly widely used in chip welding. As a key auxiliary tool to ensure the quality of chip welding, laser welding fixtures can accurately position the chip and ensure that the chip position is fixed during the welding process, thereby achieving high-quality welding.

[0003] During frequent soldering operations, the contact points between the fixture and the chip and soldering equipment are prone to wear. For example, the positioning pin and positioning hole are used together for a long time, and the surface of the positioning pin will gradually wear down, resulting in a decrease in positioning accuracy and affecting the soldering quality of the chip. On the other hand, when some parts of the fixture are worn and need to be replaced, the operation is often difficult. Some fixtures are not designed reasonably, and the parts are installed tightly. The disassembly process may require the use of special tools, and a slight mistake may damage other parts of the fixture, increasing maintenance costs and time costs. In addition, since a certain amount of heat is generated during the soldering process, some fixtures made of poor materials are prone to heat deformation. Once the fixture is deformed, its positioning accuracy for the chip will be greatly reduced, resulting in deviations in the soldering position. In severe cases, it may even cause the chip to be scrapped, reducing production efficiency and product yield. Utility Model Content

[0004] The purpose of this invention is to provide a fixture for laser welding of temperature sensor chips, which has the advantages of more convenient workpiece clamping and fixing, and easier replacement and maintenance of parts. It solves the problems of easy wear, difficult replacement of parts, and easy deformation of existing chip laser welding fixtures.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A fixture for laser welding of temperature sensor chips includes a base assembly, a clamping assembly, and a pressing assembly. The clamping assembly is located at the upper end of the base assembly; the pressing assembly is located above the clamping assembly; the base assembly includes a base; a slide rail is located in the central groove at the upper end of the base, and the slide rail is fixedly connected to the base by screws; sliders are located on both sides of the upper end of the slide rail, and the sliders are slidably connected along the slide rail; a clamping block is located at the upper end of each slider, and the clamping block is fixedly connected to the slider; a clamping plate is located at the upper end of the clamping block; a fixed limiting seat is located between two clamping blocks, and the fixed limiting seat is fixedly connected to the base by screws; a partition is located at the center of the upper end of the fixed limiting seat; pads are located on both sides of the partition; cable placement blocks and chip placement blocks are located at the front and rear ends of the partition and pads respectively; a pressure rod is located above the partition.

[0006] Preferably, the cable placement block and the chip placement block are both fixedly connected to the fixed limiting seat by screws.

[0007] It is worth noting that the groove in the cable placement block is used to place cables, and the groove in the chip placement block is used to place the temperature sensor chip.

[0008] Preferably, a connecting block is provided at the rear end of the pressure rod, and the connecting block is rotatably connected to one end of the pressure rod.

[0009] It is worth noting that the connecting block is used to rotate the connecting rod, and pressing down the rod facilitates the fixing of the cable.

[0010] Preferably, the clamping plate presses down and clamps the pad.

[0011] It is worth noting that the clamping plate is used for positioning and assembling the pad.

[0012] Preferably, a bracket is provided behind the cable placement block, and two brackets are provided.

[0013] It is worth noting that the bracket is used for cable placement.

[0014] Preferably, the two supports are arranged with a front-to-back gap between them.

[0015] It is worth noting that the V-shaped groove on the upper surface of the bracket is used for the placement and positioning of the MI-cable cable, improving the stability and convenience of cable fixation.

[0016] Preferably, each of the brackets has a V-shaped groove on its upper surface for storing wire harnesses.

[0017] It is worth noting that the V-shaped groove on the upper surface of the bracket is used for the placement and positioning of the MI-cable cable, improving the stability and convenience of cable fixation.

[0018] Preferably, the clamping plate and the clamping block are fixedly connected by screws.

[0019] It is worth noting that the movement of the clamping block drives the horizontal movement and adjustment of the clamping plate, which facilitates the feeding and unloading adjustment of the clamping plate, greatly improving the convenience of clamping and fixing the pad and the workpiece, making the assembly and disassembly of the pad more convenient and reducing the difficulty of maintenance and replacement.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention places the temperature sensor chip in the groove of the chip placement block, places the cable in the groove of the cable placement block, separates the cable wires with a spacer, pushes the clamping block toward the fixed limiting seat, so that the two pads clamp the cable and the spacer, and at the same time the clamping plate clamps and fixes the pads, maintaining the structural stability of the pads, spacers, cables and chips. Finally, the pressure rod is used to press down and fix the spacers and leads, thereby improving the stability of laser welding of the leads between the cable and the chip.

[0021] By setting up the slide rail, the slide rail is used to slide and adjust the slider and the structure above it as a whole, which facilitates the feeding and unloading adjustment of the clamping plate, greatly improves the convenience of clamping and fixing the pad and the workpiece, makes the assembly and disassembly of the pad more convenient, and reduces the difficulty of maintenance and replacement.

[0022] The bracket features a V-shaped groove on its upper surface for placing and positioning the MI-cable cable, improving its stability and ease of use. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the overall structure of this utility model; Figure 3 This is a schematic diagram of the combined structure of the base assembly and the pressing assembly of this utility model; Figure 4 This is a schematic diagram of the fixed limiting seat and its overall structure above it according to the present invention; Figure 5 This is a schematic diagram of the slider and its overall structure above it according to the present invention.

[0024] Figure label: 1. Base assembly; 2. Clamp assembly; 3. Pressing assembly; 101. Base; 102. Slide rail; 103. Bracket; 201. Fixed limit seat; 202. Spacer; 203. Chip placement block; 204. Clamping block; 205. Clamping piece; 206. Slider; 207. Pad; 208. Cable placement block; 301. Connecting block; 302. Pressure rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In the electronics manufacturing industry, chip soldering is a core process, and its quality directly determines the performance and reliability of electronic products. With the rapid development of consumer electronics, industrial control, artificial intelligence, and other fields, electronic products are continuously evolving along the path of miniaturization and high performance. This evolutionary trend places more stringent requirements on chip soldering processes, requiring not only higher soldering precision to meet the assembly needs of tiny chips, but also stronger reliability to ensure the long-term stable operation of equipment under complex working conditions. Laser welding technology, as a key process for addressing these challenges, is seeing its applications expand in the field of chip welding. The working principle of laser welding is to use a focused high-intensity laser beam to locally melt the materials being welded, forming a weld joint. Compared to traditional welding techniques, laser welding offers highly concentrated energy, generating sufficient heat within a very small area to complete the weld. This significantly reduces the heat-affected zone, effectively minimizing the risk of heat-related damage to the chip. Furthermore, the precision of laser welding can be controlled at the micrometer level, meeting the requirements for precise connections between microchip pins and the substrate. In addition, the laser welding process is easily automated and can be integrated with vision positioning systems, motion control systems, etc., to form highly efficient automated production lines. This is crucial for improving production efficiency and ensuring consistent weld quality. As a key auxiliary component in laser welding systems, the performance of laser welding fixtures directly affects the final quality of chip welding. During the welding process, the fixture needs to achieve precise positioning and stable clamping of workpieces such as chips and substrates. Precise positioning ensures accurate alignment of the welding points on the chip and substrate, avoiding defects such as incomplete or incorrect soldering caused by positional deviations; stable clamping prevents damage to welding precision due to workpiece movement during welding, while also reducing damage to the chip caused by welding stress. The structural design of the fixture needs to be matched with the specific chip packaging form and substrate type, providing stable process conditions for welding through reasonable positioning benchmarks and clamping methods. In long-term, high-frequency welding operations, wear is inevitable at the contact points between the fixture, the chip, and the welding equipment. This wear is closely related to factors such as the material properties of the contact points, contact pressure, and relative motion frequency. Taking the fit between a locating pin and a locating hole as an example, in each welding operation, the locating pin needs to be inserted into the locating hole for positioning, during which friction and compression occur. With increased use, wear marks gradually appear on the surface of the locating pin, and its diameter may slightly decrease. The inner wall of the locating hole may also become larger or irregular in shape due to wear. This wear leads to an increase in the clearance between the locating pin and the locating hole, thereby reducing the positioning accuracy of the fixture. When the positioning accuracy drops to a certain level, the relative position of the chip and the substrate will deviate, affecting the accuracy of the welding point position. This can lead to insufficient welding strength, poor electrical connection, and in severe cases, even rendering the entire chip unusable. Besides wear and tear, the difficulty of replacing fixture parts is also a significant factor affecting production efficiency and increasing costs. Some fixtures, in their design, prioritize structural compactness to fit into confined workspaces, neglecting the ease of parts replacement. These fixtures have complex internal structures, and the connections between various parts may employ non-removable or difficult-to-remove designs, such as welding or interference fits. When a part wears out and needs replacement, operators often need to spend a considerable amount of time disassembling the fixture. Moreover, due to the compact installation of parts, disassembly may require the use of special tools, and improper handling can damage other surrounding components. For example, disassembling a worn gripper may require removing several adjacent parts first, and excessive force during removal may deform adjacent positioning plates, affecting the overall accuracy of the fixture. In such cases, not only does replacing the part itself take a long time, but damage to other parts may increase maintenance costs, and the fixture's downtime is prolonged, affecting normal production schedules. Furthermore, the heat generated during welding also poses a serious challenge to the stability of the fixture. Although laser welding has a relatively small heat-affected zone, it still generates heat during the welding process, which is transferred to the fixture through the workpiece. Simultaneously, the welding equipment also generates heat during prolonged operation, some of which is conducted to the fixture. If the fixture is made of a material with poor thermal conductivity or heat resistance, it is prone to thermal deformation under continuous heat. Different materials have different coefficients of thermal expansion. When the materials of different parts of the fixture are inconsistent, the varying degrees of expansion or contraction during temperature changes can generate internal stress, which may also lead to fixture deformation. Thermal deformation of the fixture may manifest as overall bending, localized bulges, or depressions. Once the fixture deforms, its original positioning reference and clamping dimensions change, making precise chip positioning impossible. For example, if the positioning plane of the fixture bulges due to thermal deformation, the chip will tilt when placed on it, causing the welding point to shift. If the clamping mechanism deforms, it may no longer be able to hold the chip securely, potentially causing slight movement of the chip during welding and affecting the welding quality. The decreased positioning accuracy caused by thermal deformation directly leads to welding position deviations, increasing product defect rates and reducing production efficiency. Moreover, fixtures that have undergone thermal deformation are often difficult to restore to their original accuracy and may require repair or replacement, which further increases production costs. To address the aforementioned issues, multiple factors need to be comprehensively considered during the design and manufacturing of jigs. In material selection, materials with good wear resistance, high heat resistance, and low coefficient of thermal expansion, such as high-strength alloys and ceramics, should be prioritized to reduce the impact of wear and thermal deformation. In structural design, while ensuring structural compactness, the ease of component replacement should be fully considered. Modular design and standard connectors should be adopted to make disassembly and installation of components simpler and faster. Simultaneously, optimizing the jig's heat dissipation structure, such as adding heat dissipation holes and using materials with good heat dissipation performance, can improve the jig's heat dissipation capacity and reduce deformation caused by heat accumulation. Furthermore, establishing a comprehensive jig maintenance system, regularly inspecting, cleaning, and calibrating the jig, and promptly identifying and replacing worn components can effectively extend the jig's service life, ensure its positioning accuracy and stability, thereby ensuring the reliability of chip soldering quality, improving production efficiency, and reducing production costs. Against the backdrop of the continuous development of the electronics manufacturing industry, the requirements for laser welding fixtures will continue to increase. In the future, as chip sizes further shrink and integration levels increase, fixtures will need to possess higher positioning accuracy and more stable performance. Simultaneously, to adapt to the demands of flexible manufacturing, fixtures also need to have better versatility and adjustability, enabling them to quickly adapt to the welding needs of different types of chips. This requires fixture manufacturers to continuously innovate in design concepts, material selection, and manufacturing processes to meet the evolving needs of the electronics manufacturing industry. From the perspective of the entire industry chain, the quality of laser welding fixtures not only affects the quality of downstream electronic products but also relates to the market competitiveness of midstream welding equipment manufacturers. Therefore, all links in the industry chain should strengthen collaboration to jointly promote the advancement of laser welding fixture technology. Upstream material suppliers should develop high-performance materials more suitable for fixture manufacturing; midstream fixture manufacturers should strengthen communication with downstream electronic manufacturing companies and optimize fixture design based on actual production needs; downstream electronic manufacturing companies should also promptly report problems encountered during fixture use, providing a basis for fixture improvement. Through the collaborative efforts of all links in the industry chain, the performance of laser welding fixtures can be continuously improved, thereby driving technological upgrading and quality improvement throughout the entire electronic manufacturing industry. In summary, laser welding fixtures, as key auxiliary tools in the chip welding process, directly impact the quality, production efficiency, and production costs of chip welding. Current issues encountered during fixture use, such as wear, difficulty in replacing parts, and thermal deformation, require effective solutions from multiple aspects, including design, materials, manufacturing, and maintenance. Only by continuously improving the performance and reliability of fixtures can we better meet the increasingly demanding requirements of the electronics manufacturing industry for chip welding processes, providing strong support for the miniaturization and high-performance development of electronic products.

[0027] To address the issues of easy wear, difficulty in replacing parts, and easy deformation in existing chip laser welding fixtures, the following technical solution is proposed. Please refer to [link / reference]. Figure 1-5 ; A fixture for laser welding of temperature sensor chips includes a base assembly 1, a clamping assembly 2, and a pressing assembly 3. The clamping assembly 2 is located at the upper end of the base assembly 1; the pressing assembly 3 is located above the clamping assembly 2; the base assembly 1 includes a base 101; a slide rail 102 is located in the central groove at the upper end of the base 101, and the slide rail 102 is fixedly connected to the base 101 by screws; sliders 206 are provided on both sides of the upper end of the slide rail 102, and the sliders 206 are slidably connected along the slide rail 102; each slider 206 has a [missing information - likely a typo or incomplete sentence]. A clamping block 204 is fixedly connected to a slider 206; a clamping plate 205 is provided at the upper end of the clamping block 204; a fixed limiting seat 201 is provided between the two clamping blocks 204, and the fixed limiting seat 201 is fixedly connected to the base 101 by screws; a partition 202 is provided at the upper center of the fixed limiting seat 201; pads 207 are provided on both sides of the partition 202; cable placement blocks 208 and chip placement blocks 203 are respectively provided at the front and rear ends of the partition 202 and the pads 207; a pressure rod 302 is provided above the partition 202.

[0028] The cable placement block 208 and the chip placement block 203 are both fixedly connected to the fixed limit seat 201 by screws.

[0029] A connecting block 301 is provided at the rear end of the pressure rod 302, and the connecting block 301 is rotatably connected to one end of the pressure rod 302.

[0030] The clamping plate 205 presses down and clamps the pad 207.

[0031] A bracket 103 is provided behind the cable placement block 208, and there are two brackets 103.

[0032] The two brackets 103 are arranged with a front-to-back interval between them.

[0033] Each bracket 103 has a V-shaped groove on its upper surface for storing wire harnesses.

[0034] The clamping plate 205 and the clamping block 204 are fixedly connected by screws.

[0035] Working principle: The temperature sensor chip is placed in the groove of the chip placement block 203, and the cable is placed in the groove of the cable placement block 208. The cable wires are separated by the partition 202. The clamping block 204 is pushed towards the fixed limit seat 201, so that the two pads 207 clamp the cable and the partition 202. At the same time, the clamping plate 205 clamps and fixes the pads 207, maintaining the structural stability of the pads 207, partitions 202, cables, and chips. Finally, the pressure rod 302 is used to press down and fix the partitions 202 and the leads, thereby improving the stability of the laser welding of the leads between the cable and the chip. The slide rail 102 is used for the sliding adjustment of the slider 206 and the structure above it, which facilitates the feeding and unloading adjustment of the clamping plate 205, greatly improving the convenience of clamping and fixing the pads 207 and the workpiece, making the assembly and disassembly of the pads 207 more convenient and reducing the difficulty of maintenance and replacement.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A fixture for laser welding of temperature sensor chips, comprising a base assembly (1), characterized in that, It also includes a clamping assembly (2) and a pressing assembly (3). The clamping assembly (2) is provided on the upper end of the base assembly (1); the pressing assembly (3) is provided above the clamping assembly (2); the base assembly (1) includes a base (101); a slide rail (102) is provided at the center groove of the upper end of the base (101), and the slide rail (102) and the base (101) are fixedly connected by screws; sliders (206) are provided on both sides of the upper end of the slide rail (102), and the sliders (206) are slidably connected along the slide rail (102); a clamping block (204) is provided on the upper end of each slider (206), and the clamping block (204) is slidably connected along the slide rail (102). 04) Fixed connection with slider (206); clamping plate (205) is provided at the upper end of clamping block (204); fixed limit seat (201) is provided between the two clamping blocks (204), and fixed limit seat (201) is fixedly connected to base (101) by screws; partition plate (202) is provided at the upper center of fixed limit seat (201); pads (207) are provided on both sides of partition plate (202); cable placement block (208) and chip placement block (203) are provided at the front and rear ends of the partition plate (202) and pads (207) respectively; pressure rod (302) is provided above partition plate (202).

2. The fixture for laser welding of temperature sensor chips according to claim 1, characterized in that, The cable placement block (208) and the chip placement block (203) are both fixedly connected to the fixed limiting seat (201) by screws.

3. The fixture for laser welding of temperature sensor chips according to claim 1, characterized in that, The rear end of the pressure rod (302) is provided with a connecting block (301), and the connecting block (301) is rotatably connected to one end of the pressure rod (302).

4. The fixture for laser welding of temperature sensor chips according to claim 1, characterized in that, The clamping plate (205) presses down and clamps the pad (207).

5. A fixture for laser welding of temperature sensor chips according to claim 1, characterized in that, A bracket (103) is provided behind the cable placement block (208), and there are two brackets (103).

6. A fixture for laser welding of temperature sensor chips according to claim 5, characterized in that, The two supports (103) are arranged with a front-to-back gap between them.

7. A fixture for laser welding of temperature sensor chips according to claim 5, characterized in that, Each of the brackets (103) has a V-shaped groove on its upper surface for storing wire harnesses.

8. A fixture for laser welding of temperature sensor chips according to claim 1, characterized in that, The clamping plate (205) and the clamping block (204) are fixedly connected by screws.

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