A new low-speed polishing machine for jewelry setting

Abstract

The utility model relates to the technical field of polisher, disclose a kind of novel jewelry inlay with low-speed polisher, including polishing mechanism, collection mechanism and protection mechanism, the polishing mechanism is located inside protection mechanism, the collection mechanism is located the both sides of polishing mechanism. The polishing mechanism includes rotating stand, the surface of rotating stand is threadedly connected with lifting ring, the lower end of rotating stand is fixedly connected with motor, the upper end of lifting ring is equipped with sliding slot, the inner wall of sliding slot is slidably connected with sliding frame, the inner wall of sliding frame is rotatably connected with rotating press plate, the both sides of rotating press plate are rotatably connected with limit frame. The utility model is driven by the design of lifting ring lifting on the surface of rotating stand to drive multiple rotating press plates to rotate, realizes the purpose of the convenient drive multiple rotating press plates to clamp and fix abrasive paper, when the operation of subsequent need to replace abrasive paper is more convenient, improves the practicality of device.

Description

Technical Field

[0001] This utility model relates to the field of polishing machine technology, and in particular to a novel low-speed polishing machine for jewelry setting. Background Technology

[0002] Jewel setting is a crucial technique in jewelry making, involving the precise processing and joining of gemstones and metals. As a key piece of equipment in jewelry setting, low-speed polishing machines are primarily used to grind, polish, and finish the surfaces of gemstones and metals, ensuring the luster, precision, and beauty of the jewelry. Low-speed polishing machines provide fine surface treatments and are essential tools for achieving high-quality jewelry setting.

[0003] However, when using a low-speed polishing machine for jewelry setting, there are sometimes situations where it is inconvenient to change the sandpaper when it is necessary to adjust the grit, which results in more time being spent on its installation and thus affects the overall processing efficiency. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a new type of low-speed polishing machine for jewelry setting.

[0005] This utility model is achieved by the following technical solution: a novel low-speed polishing machine for jewelry setting, comprising a polishing mechanism, a collecting mechanism and a protective mechanism, wherein the polishing mechanism is located inside the protective mechanism and the collecting mechanism is located on both sides of the polishing mechanism;

[0006] The polishing mechanism includes a rotating frame, a lifting ring threadedly connected to the surface of the rotating frame, a motor fixedly connected to the lower end of the rotating frame, a sliding groove opened at the upper end of the lifting ring, a sliding frame slidably connected to the inner wall of the sliding groove, a rotating pressure plate rotatably connected to the inner wall of the sliding frame, limit frames rotatably connected to both sides of the rotating pressure plate, sandpaper clamped to the surface of the rotating pressure plate, the limit frames located at the upper end of the sliding frame, the side ends of the limit frames fixedly connected to the surface of the rotating frame, and the sandpaper located at the upper end of the rotating frame.

[0007] The above technical solution uses a lifting ring to lift and lower on the surface of the rotating frame to drive multiple rotating pressure plates to rotate. This design achieves the purpose of conveniently driving multiple rotating pressure plates to clamp and fix the sandpaper, making it easier to replace the sandpaper later and improving the practicality of the device.

[0008] As a further improvement to the above solution, the collection mechanism includes a pull-out cabinet, a pull rod is fixedly connected to the side end of the pull-out cabinet, a screen is snapped into the upper end of the pull-out cabinet, a fixing frame is fixedly connected to the side end of the pull-out cabinet, and a rotating plate is snapped into the inner wall of the fixing frame. As a further improvement to the above solution, the fixing frame is located on both sides of the pull rod.

[0009] The above technical solution uses a pull-out cabinet to collect jewelry debris, and the design of rotating plates on both sides to limit the pull-out cabinet prevents it from falling off during the debris collection process, making the device more convenient to use.

[0010] As a further improvement to the above solution, the protective mechanism includes a grinding machine body, with a supporting leg fixedly connected to the lower end of the grinding machine body. Mounting grooves are provided on both sides of the grinding machine body, with the inner wall of the mounting groove slidably connected to the surface of the pull-out cabinet. The two sides of the grinding machine body are rotatably connected to the surface of the rotating plate. The surface of the motor is fixedly connected to the inner wall of the grinding machine body, and the surface of the rotating frame is rotatably connected to the inner wall of the grinding machine body.

[0011] The above technical solutions provide stable connections and protection for the internal components of the device, making the device more stable in use.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This invention features a polishing mechanism. Specifically, it involves selecting appropriate sandpaper based on the desired polishing level, placing the sandpaper on the upper part of a rotating frame, and then rotating a lifting ring to raise it above the rotating frame. At this time, the angle of the rotating pressure plate changes under the limiting frame's control. Simultaneously, the sliding frame located on the inner wall of the upper groove of the lifting ring slides outward under the action of the rotating pressure plate, thereby driving the upper end of the rotating pressure plate downward to press down on the sandpaper, thus fixing its position. An external power source can then be connected to start the motor, which rotates the sandpaper to facilitate manual polishing of jewelry. The design of using a lifting ring to raise and lower multiple rotating pressure plates on the rotating frame surface achieves the convenient purpose of clamping and fixing the sandpaper, making subsequent sandpaper replacements more convenient and improving the device's practicality.

[0014] This invention features a collection mechanism: during jewelry polishing, the resulting debris falls to the top of the polishing machine. Simply sweeping the debris to both sides moves it to a screen, where it falls into a pull-out cabinet for collection. To remove the debris, a rotating plate separates it from the fixed frame, releasing the frame's restriction. Pulling the lever then extends the cabinet, and removing the screen allows the debris to be emptied, thus completing the debris recovery process. The pull-out cabinet's design, along with the rotating plates on both sides to limit its movement, prevents the cabinet from falling off during debris collection, making the device more convenient to use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the grinding mechanism of this utility model;

[0017] Figure 3 This is a schematic diagram of the specific parts structure of the grinding mechanism of this utility model;

[0018] Figure 4 This is a schematic diagram of the collection mechanism structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the protective mechanism structure of this utility model.

[0020] Explanation of key symbols:

[0021] 1. Grinding mechanism; 101. Rotating frame; 102. Lifting ring; 103. Motor; 104. Slide groove; 105. Sliding frame; 106. Rotating pressure plate; 107. Limiting frame; 108. Sandpaper; 2. Collection mechanism; 201. Pull-out cabinet; 202. Pull rod; 203. Screen; 204. Fixing frame; 205. Rotating clamping plate; 3. Protective mechanism; 301. Grinding machine body; 302. Support legs; 303. Mounting slot. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0023] Example:

[0024] Please combine Figure 1-5 This embodiment of a novel low-speed polishing machine for jewelry setting includes a polishing mechanism 1, a collecting mechanism 2, and a protective mechanism 3. The polishing mechanism 1 is located inside the protective mechanism 3, and the collecting mechanism 2 is located on both sides of the polishing mechanism 1.

[0025] The grinding mechanism 1 includes a rotating frame 101, with a lifting ring 102 threadedly connected to the surface of the rotating frame 101. A motor 103 is fixedly connected to the lower end of the rotating frame 101. A sliding groove 104 is provided at the upper end of the lifting ring 102. A sliding frame 105 is slidably connected to the inner wall of the sliding groove 104. A rotating pressure plate 106 is rotatably connected to the inner wall of the sliding frame 105. Limiting frames 107 are rotatably connected to both sides of the rotating pressure plate 106. Sandpaper 108 is clamped onto the surface of the rotating pressure plate 106. The design of using the lifting ring 102 to lift and lower the surface of the rotating frame 101 to drive the multiple rotating pressure plates 106 to rotate achieves the purpose of conveniently driving multiple rotating pressure plates 106 to clamp and fix the sandpaper 108, making the subsequent replacement of the sandpaper 108 more convenient and improving the practicality of the device.

[0026] The limiting frame 107 is located at the upper end of the sliding frame 105, and the side end of the limiting frame 107 is fixedly connected to the surface of the rotating frame 101. The sandpaper 108 is located at the upper end of the rotating frame 101.

[0027] The collection mechanism 2 includes a pull-out cabinet 201. A pull rod 202 is fixedly connected to the side of the pull-out cabinet 201. A screen 203 is snapped into the upper end of the pull-out cabinet 201. A fixing frame 204 is fixedly connected to the side of the pull-out cabinet 201. A rotating plate 205 is snapped into the inner wall of the fixing frame 204. The design of using the pull-out cabinet 201 to collect jewelry debris and the rotating plates 205 on both sides to limit the pull-out cabinet 201 achieves the purpose of preventing the pull-out cabinet 201 from falling off during the collection of debris, making the device more convenient to use.

[0028] The fixing bracket 204 is located on both sides of the pull rod 202.

[0029] The protective mechanism 3 includes a grinding machine body 301, with a support leg 302 fixedly connected to the lower end of the grinding machine body 301, and mounting grooves 303 opened on both sides of the grinding machine body 301.

[0030] The inner wall of the mounting groove 303 is slidably connected to the surface of the pull-out cabinet 201, and the two sides of the grinding machine body 301 are rotatably connected to the surface of the rotating plate 205.

[0031] The surface of the motor 103 is fixedly connected to the inner wall of the grinding machine body 301, and the surface of the rotating frame 101 is rotatably connected to the inner wall of the grinding machine body 301.

[0032] The implementation principle of a novel low-speed polishing machine for jewelry setting in this application embodiment is as follows: When using the polishing machine, first select the appropriate sandpaper 108 according to the required polishing degree. After selection, place the sandpaper 108 on the upper end of the rotating frame 101. Then, rotate the lifting ring 102 to make it rise on the surface of the rotating frame 101. At this time, the angle of the rotating pressure plate 106 changes under the limit of the limiting frame 107. At the same time, the sliding frame 105 located on the inner wall of the upper sliding groove 104 of the lifting ring 102 slides outward under the action of the rotating pressure plate 106, thereby driving the upper end of the rotating pressure plate 106 to press down, thereby pressing the upper sandpaper 108 and fixing the position of the sandpaper 108. Then, the external power supply can be connected to start the motor 103 to rotate, thereby driving the sandpaper 108 to rotate to cooperate with manual polishing of jewelry. The design of using the lifting ring 102 to lift and lower on the surface of the rotating frame 101 to drive the rotation of multiple rotating pressure plates 106 achieves convenience. The device uses multiple rotating pressure plates 106 to clamp and fix the sandpaper 108, making subsequent replacement of the sandpaper 108 more convenient and improving the practicality of the device. During jewelry polishing, the debris falling from the jewelry falls to the top of the polishing machine body 301. Simply sweeping it to both sides moves the debris to the screen 203, where it falls into the drawer 201 for collection. When it needs to be removed, rotating the clamp... The plate 205 is used to separate it from the fixed frame 204, thereby releasing the restriction on the fixed frame 204. At this time, the pull rod 202 can be pulled to bring out the drawer cabinet 201. Then, the screen 203 can be removed to pour out the debris, thus completing the recycling of the debris. The design of using the drawer cabinet 201 to collect jewelry debris and the rotating plates 205 on both sides to limit the drawer cabinet 201 prevents the drawer cabinet 201 from falling off during the collection of debris, making the device more convenient to use.

[0033] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A novel low-speed polishing machine for jewelry setting, characterized in that, It includes a polishing mechanism (1), a collecting mechanism (2) and a protective mechanism (3), wherein the polishing mechanism (1) is located inside the protective mechanism (3) and the collecting mechanism (2) is located on both sides of the polishing mechanism (1); The grinding mechanism (1) includes a rotating frame (101), a lifting ring (102) is threadedly connected to the surface of the rotating frame (101), a motor (103) is fixedly connected to the lower end of the rotating frame (101), a sliding groove (104) is provided at the upper end of the lifting ring (102), a sliding frame (105) is slidably connected to the inner wall of the sliding groove (104), a rotating pressure plate (106) is rotatably connected to the inner wall of the sliding frame (105), a limit frame (107) is rotatably connected to both sides of the rotating pressure plate (106), and sandpaper (108) is clamped to the surface of the rotating pressure plate (106).

2. The novel low-speed polishing machine for jewelry setting as described in claim 1, characterized in that: The limiting frame (107) is located at the upper end of the sliding frame (105), and the side end of the limiting frame (107) is fixedly connected to the surface of the rotating frame (101). The sandpaper (108) is located at the upper end of the rotating frame (101).

3. The novel low-speed polishing machine for jewelry setting as described in claim 2, characterized in that: The collection mechanism (2) includes a pull-out cabinet (201), a pull rod (202) is fixedly connected to the side end of the pull-out cabinet (201), a screen (203) is snapped into the upper end of the pull-out cabinet (201), a fixing frame (204) is fixedly connected to the side end of the pull-out cabinet (201), and a rotating plate (205) is snapped into the inner wall of the fixing frame (204).

4. The novel low-speed polishing machine for jewelry setting as described in claim 3, characterized in that: The fixing frame (204) is located on both sides of the pull rod (202).

5. A novel low-speed polishing machine for jewelry setting as described in claim 4, characterized in that: The protective mechanism (3) includes a grinding machine body (301), the lower end of which is fixedly connected to a support leg (302), and mounting grooves (303) are provided on both sides of the grinding machine body (301).

6. A novel low-speed polishing machine for jewelry setting as described in claim 5, characterized in that: The inner wall of the mounting groove (303) is slidably connected to the surface of the pull-out cabinet (201), and the two sides of the grinding machine body (301) are rotatably connected to the surface of the rotating plate (205).

7. A novel low-speed polishing machine for jewelry setting as described in claim 6, characterized in that: The surface of the motor (103) is fixedly connected to the inner wall of the grinding machine body (301), and the surface of the rotating frame (101) is rotatably connected to the inner wall of the grinding machine body (301).

Images