An integrated apparatus for substrate preparation prior to diamond film growth

Abstract

The utility model provides an integrated equipment for diamond film growth before substrate processing, including frame, transmission arm, grinding unit and detection unit, and the frame is equipped with guide rail, transmission arm is connected on the guide rail with sliding, has adsorption head, and adsorption head is used for sucking and shifting silicon substrate, grinding unit is used for grinding silicon substrate, detection unit includes light emitter, light reflection subassembly and light receiver, light reflection subassembly is used for guiding the light of light emitter to the silicon substrate surface, and the light of silicon substrate reflection is guided to light receiver, and light receiver is electrically connected with controller, and controller is used for judging the grinding end point according to the signal of light receiver output, the utility model provides an integrated equipment for diamond film growth before substrate processing, judges the grinding end point through detection unit, and the end point error rate is reduced significantly, and the silicon substrate surface diamond micro powder adhesion density is more even with grinding unit, and the overall processing efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of diamond film preparation technology, specifically relating to an integrated device for substrate treatment before diamond film growth. Background Technology

[0002] Diamond heat sinks are functional materials that utilize the excellent thermal conductivity and other properties of diamond to achieve efficient heat dissipation, and they have significant application value in the field of heat dissipation for electronic devices. The fabrication process primarily employs microwave plasma chemical vapor deposition (MPCVD) technology. By controlling parameters such as the composition, temperature, and pressure of the reactant gases, a diamond film is grown on a substrate, thereby producing the diamond heat sink.

[0003] To ensure good warpage during the early stages of diamond growth, a silicon substrate is typically used. In addition, to improve the quality of nucleation, the surface of the silicon substrate needs to be pretreated by grinding diamond micropowder with uniform particle size onto the surface of the silicon substrate.

[0004] In existing technologies, the pretreatment of silicon substrates typically employs a combination of manual mechanical grinding and ultrasonic treatment. Manual mechanical grinding creates scratches on the silicon substrate surface to increase its roughness, providing sites for carbon atom adhesion and diamond micropowder fixation. Ultrasonic treatment then cleans surface impurities and optimizes micropowder distribution. However, the determination of the grinding endpoint relies entirely on visual observation of the substrate surface by the operator, introducing significant subjective errors and failing to guarantee the quality of silicon substrate pretreatment, thus reducing the yield of diamond heat sink wafers. Furthermore, manual operation makes it difficult to control the uniformity of diamond micropowder distribution, leading to inconsistent nucleation density on the substrate surface, resulting in uneven diamond film growth. Additionally, manual operation is inefficient and cannot meet the demands of industrial-scale mass production. Utility Model Content

[0005] This utility model provides an integrated device for substrate treatment before diamond film growth, aiming to solve the technical problems in the prior art where manual operation cannot accurately determine the grinding endpoint, it is difficult to control the uniformity of diamond micro powder, and the overall processing efficiency is low.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: to provide an integrated device for substrate treatment before diamond film growth, comprising: The frame is equipped with horizontally extending guide rails; A transfer arm, slidably connected to the guide rail, has an adsorption head for picking up and transferring silicon substrates. A grinding unit, connected to the frame, is used to grind the silicon substrate adsorbed by the adsorption head; and A detection unit is connected to the frame and spaced apart from the polishing unit. The detection unit includes a light emitter, a light reflector, and a light receiver. The light reflector is used to guide the light emitted by the light emitter to the surface of the silicon substrate and to guide the light reflected by the silicon substrate to the light receiver. The light receiver is electrically connected to a controller, which is used to determine the polishing endpoint based on the signal output by the light receiver.

[0007] In one possible implementation, the detection unit further includes: A housing, connected to the rack, is housing the light emitter, the light reflector, and the light receiver; and A lid is placed over the top of the box body. The lid has a detection window that extends through its thickness and corresponds vertically to the light reflection component.

[0008] In some embodiments, the light-reflecting component includes: A plane mirror, mounted inside the housing via a first bracket, is used to reflect light emitted by the light emitter; and An optical beam splitter is mounted inside the housing via a second bracket and located above the plane mirror. It is used to guide the light reflected by the plane mirror to the detection window and to guide the light reflected from the detection window to the light receiver.

[0009] In some embodiments, the first support includes: The chassis is connected to the inner bottom wall of the housing; A U-shaped frame is connected to the chassis, and the plane mirror is rotatably connected to the U-shaped opening of the U-shaped frame via a connecting shaft; and The first locking element is connected to the U-shaped frame and is used to lock the connecting shaft.

[0010] In some embodiments, the second support includes: The mounting sleeve, fitted onto the outer periphery of the optical beam splitter, has two downwardly extending support rods; Two base sleeves are respectively connected to the inner bottom wall of the housing, and are slidably fitted onto the outer periphery of the two support rods; and Two second locking elements are respectively connected to the two base sleeves and are used to lock the axial position of the support rod and the base sleeve.

[0011] In some embodiments, the optical receiver is connected to the housing via a lifting platform, the lifting platform comprising: The base plate is connected to the inner bottom wall of the box body; A support plate is disposed parallel to the base plate above it and is used to support the optical receiver; The first hinge arm has its lower end hinged to the top surface of the base plate and its upper end slidably connected to the bottom surface of the support plate. A second hinged arm is hinged to the first hinged arm, with its upper end hinged to the bottom surface of the support plate and its lower end slidably connected to the top surface of the base plate; and A driving component, connected between the support plate and the first hinge arm, is used to drive the first hinge arm to swing vertically so that the support plate can be raised or lowered.

[0012] In some embodiments, a dust cover is hinged to the upper surface of the box cover, and the eccentric part of the dust cover is rotatably connected to the box cover so that the dust cover can rotate horizontally to cover the detection window or expose the detection window.

[0013] In one possible implementation, the grinding unit includes: The grinding disc is rotatably connected to the frame; and A liquid supply arm, located on one side of the grinding disc, has several liquid supply nozzles for supplying a diamond powder suspension to the upper surface of the grinding disc.

[0014] In some embodiments, the polishing unit further includes an auxiliary polishing module, which is located on one side of the polishing disc and spaced apart from the liquid supply arm. The auxiliary polishing module is used to spray plasma onto the surface of the silicon substrate.

[0015] In one possible implementation, the integrated device for substrate treatment before diamond film growth further includes a cleaning unit, the cleaning unit comprising: A cleaning tank, connected to the frame, is used to hold cleaning fluid; and A dryer, connected to the frame and located outside the cleaning tank, has a nozzle facing one side of the cleaning tank for blowing nitrogen gas onto the surface of the silicon substrate to dry the silicon substrate.

[0016] The beneficial effects of the integrated equipment for substrate treatment before diamond film growth provided by this utility model are as follows: the optical system composed of a light emitter, a light reflection component and a light receiver in the detection unit collects the light reflection signal on the surface of the silicon substrate, and the controller determines the grinding endpoint according to a preset algorithm, which completely replaces the traditional manual visual judgment, significantly reduces the endpoint judgment error rate, avoids problems such as insufficient nucleation due to under-grinding or silicon substrate damage and micro powder accumulation due to over-grinding, and greatly improves the pass rate of silicon substrate treatment.

[0017] The adsorption head of the transfer arm reliably adsorbs the silicon substrate, ensuring that the silicon substrate does not shift during the grinding process. At the same time, the grinding unit can ensure constant grinding force and speed and other key parameters. Working together with the adsorption head, it avoids the uneven force and irregular trajectory caused by traditional manual grinding, resulting in differences in micro powder distribution. This makes the diamond micro powder adhesion density on the silicon substrate surface more uniform, providing a stable nucleation basis for the uniform growth of diamond film.

[0018] In addition, by integrating the grinding unit and the inspection unit on the frame, and using the movement of the transfer arm along the guide rail, the silicon substrate is automatically transferred between the loading, grinding, inspection and unloading stages, eliminating the need for manual handling. Moreover, during the silicon substrate grinding process, the silicon substrate can be transferred to the inspection unit for final inspection at any time using the transfer arm, eliminating the waiting time for offline transfer and inspection of silicon substrates in traditional processes, significantly shortening the pre-processing cycle of a single silicon substrate, improving the overall processing efficiency, and making it more suitable for the needs of industrial mass production. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of an integrated device for substrate treatment before diamond film growth provided in this embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the detection unit provided in an embodiment of the present utility model; Figure 3 This is a schematic diagram of the optical path of the detection unit provided in an embodiment of the present utility model; Figure 4 A schematic diagram of the lifting platform and optical receiver provided in this embodiment of the utility model; Figure 5 This is a schematic diagram of the structure of the plane mirror and the first support provided in an embodiment of the present utility model; Figure 6 A schematic diagram of the structure of the optical beam splitter and the second support provided in the embodiment of this utility model.

[0021] The following are the labeling elements in the figure: 1. Frame; 11. Guide rail; 2. Transfer arm; 21. Adsorption head; 3. Grinding unit; 31. Grinding disc; 32. Liquid supply arm; 4. Detection unit; 41. Light emitter; 42. Light reflection assembly; 421. Plane mirror; 422. Optical beam splitter; 43. Light receiver; 44. Housing; 45. Housing cover; 451. Detection window; 452. Dust cover; 46. First support; 461. Chassis; 462. U-shaped frame; 463. Connecting shaft; 464. First locking element; 47. Second bracket; 471. Mounting sleeve; 4711. Support rod; 472. Base sleeve; 473. Second locking element; 48. Lifting seat; 481. Base plate; 482. Support plate; 483. First hinge arm; 484. Second hinge arm; 485. Driving element; 5. Auxiliary grinding module; 6. Cleaning unit; 61. Cleaning tank; 62. Dryer; 10. Silicon substrate. Detailed Implementation

[0022] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0023] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or indirectly on the other element. It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a number" means two or more, unless otherwise explicitly specified.

[0024] Please refer to the following: Figures 1 to 6This invention provides an integrated device for substrate treatment before diamond film growth. The integrated device includes a frame 1, a transfer arm 2, a grinding unit 3, and a detection unit 4. The frame 1 has a horizontally extending guide rail 11. The transfer arm 2 is slidably connected to the guide rail 11 and has an adsorption head 21 for picking up and transferring a silicon substrate 10. The grinding unit 3 is connected to the frame 1 and is used to grind the silicon substrate 10 adsorbed by the adsorption head 21. The detection unit 4 is connected to the frame 1 and spaced apart from the grinding unit 3. The detection unit 4 includes a light emitter 41, a light reflection component 42, and a light receiver 43. The light reflection component 42 guides the light emitted by the light emitter 41 to the surface of the silicon substrate 10 and guides the light reflected by the silicon substrate 10 to the light receiver 43. The light receiver 43 is electrically connected to a controller, which determines the grinding endpoint based on the signal output by the light receiver 43.

[0025] This embodiment provides an integrated device for substrate treatment before diamond film growth. Compared with the prior art, the optical system composed of light emitter 41, light reflection component 42 and light receiver 43 in the detection unit 4 collects light reflection signals (such as light intensity and peak position of blue and purple light) on the surface of silicon substrate 10. The controller determines the grinding endpoint according to a preset algorithm (such as a machine learning model), which completely replaces the traditional manual visual judgment, significantly reduces the endpoint judgment error rate, avoids problems such as insufficient nucleation due to under-grinding or damage to silicon substrate 10 and accumulation of micro powder due to over-grinding, and greatly improves the pass rate of silicon substrate 10 processing.

[0026] The silicon substrate 10 is reliably adsorbed by the adsorption head 21 of the transmission arm 2, ensuring that the silicon substrate 10 does not shift during the grinding process. At the same time, the grinding unit 3 can ensure constant grinding force and speed and other key parameters. Working together with the adsorption head 21, it avoids the uneven force and irregular trajectory caused by traditional manual grinding, resulting in differences in the distribution of micro powder. This makes the diamond micro powder adhesion density on the surface of the silicon substrate 10 more uniform, providing a stable nucleation basis for the uniform growth of the diamond film.

[0027] In addition, by integrating the grinding unit 3 and the detection unit 4 onto the frame 1, and utilizing the movement of the transfer arm 2 along the guide rail 11, the silicon substrate 10 is automatically transferred between the loading, grinding, detection, and unloading stages, eliminating the need for manual handling. Moreover, during the grinding process of the silicon substrate 10, the silicon substrate 10 can be transferred to the detection unit 4 at any time using the transfer arm 2 for grinding endpoint detection, eliminating the waiting time for offline transfer and detection of silicon substrates in traditional processes, significantly shortening the pre-processing cycle of a single silicon substrate 10, improving overall processing efficiency, and better meeting the needs of industrial mass production.

[0028] In this embodiment, the frame 1 is a rectangular component, and the grinding unit 3 and the detection unit 4 are arranged at intervals along the length of the frame 1. The guide rail 11 is a linear guide rail 11 installed along the length of the frame 1, allowing the transmission arm 2 to move smoothly back and forth between the grinding unit 3 and the detection unit 4. A partition can be further provided between the grinding unit 3 and the detection unit 4 to prevent dust generated during grinding from entering the detection unit 4 and affecting the detection accuracy of the detection unit 4. It should be noted that the partition should not interfere with the movement of the transmission arm 2.

[0029] Specifically, the transmission arm 2 has two interconnected telescopic arms, a first telescopic arm and a second telescopic arm. The first telescopic arm is slidably connected to the guide rail 11 and has a degree of freedom to extend and retract along the width direction of the frame 1. The second telescopic arm is connected to the extended end of the first telescopic arm and has a free end to extend and retract in the vertical direction. The adsorption head 21 is connected to the lower end of the second telescopic arm. This structure gives the adsorption head 21 three degrees of freedom: along the length direction of the frame 1, the width direction of the frame 1, and the vertical direction, to adapt to the spacing of different functional units and ensure the transmission accuracy of the silicon substrate 10.

[0030] The adsorption head 21 is a vacuum adsorption design, connected to a vacuum pump via an air tube. The lower surface of the adsorption head 21 has multiple evenly distributed micro-adsorption holes. By using the vacuum pump to create a vacuum, a negative pressure is formed, firmly adsorbing the silicon substrate 10, ensuring a consistent grinding trajectory. The multiple adsorption holes ensure that the adsorption force evenly covers the silicon substrate 10, preventing excessive local pressure that could cause the silicon substrate 10 to crack. Furthermore, the adsorption head 21 has a built-in pressure sensor to monitor the adsorption pressure in real time, preventing the silicon substrate 10 from detaching during grinding or transport due to insufficient adsorption pressure, or from cracking due to excessive adsorption pressure, thus improving the performance of the equipment.

[0031] For details regarding detection unit 4, please refer to [link / reference]. Figure 3The light emitter 41 provides a light source covering the blue-violet light band of 400-490nm. Due to the short wavelength of blue-violet light, it can detect surface changes on the silicon substrate 10 at the nanometer to micrometer level, resulting in significant differences in its reflection / scattering signals. This provides a recognizable signal basis for the accurate detection of the surface condition of the silicon substrate 10. The light reflection component 42 guides the light emitted by the light emitter 41 to the surface of the silicon substrate 10, and simultaneously guides the light reflected from the silicon substrate 10 to the light receiver 43, achieving separation of the "incident" and "reflected" light paths. The light receiver 43 can specifically be a spectrometer, which can convert the received light signal into an electrical signal through spectral analysis and output quantitative data such as the intensity distribution, spectral peak position, and peak width of the reflected light. The controller has a pre-stored mapping model of the light signal characteristics and the surface condition of the silicon substrate 10. By intelligently recognizing the blue-violet light characteristic data output by the spectrometer, it determines whether the current light signal characteristics match the preset grinding endpoint standard and finally outputs a conclusion on whether the grinding endpoint has been reached.

[0032] In the actual processing, the adsorption head 21 picks up the back side (non-processed surface) of the silicon substrate 10. At this time, the lower surface of the silicon substrate 10 is the surface to be processed. The grinding unit 3 grinds the lower surface of the silicon substrate 10. After grinding for a certain period of time, the transfer arm 2 moves the silicon substrate 10 to the detection unit 4. The light reflection component 42 directly guides the light emitted by the light emitter 41 to the lower surface of the silicon substrate 10 for detection. If the detection result is that the grinding endpoint has not been reached, the transfer arm 2 drives the silicon substrate 10 back to the grinding unit 3 to continue grinding until the grinding endpoint is reached during the next detection. The above process realizes online detection of the silicon substrate 10, eliminating the need to remove the silicon substrate 10 from the equipment for offline detection. This significantly shortens the preprocessing cycle of a single silicon substrate 10, improves the overall processing efficiency, and ensures the yield of diamond heat sink wafers.

[0033] In some embodiments, the detection unit 4 described above may employ, for example... Figure 2 and Figure 3 The structure shown. See also Figure 2 and Figure 3 The detection unit 4 also includes a housing 44 and a cover 45. The housing 44 is connected to the frame 1. The light emitter 41, the light reflector 42 and the light receiver 43 are respectively located inside the housing 44. The cover 45 covers the top of the housing 44. The cover 45 has a detection window 451 that penetrates its thickness. The detection window 451 corresponds vertically to the light reflector 42.

[0034] The enclosure 44 and the cover 45 provide a closed protective space for precision optical components such as the light emitter 41, the light reflector 42, and the light receiver 43. This prevents the surface of each optical component from being contaminated by impurities from the external environment (such as dust and metal debris) that could cause light scattering. At the same time, it blocks external airflow disturbances from interfering with the beam transmission path, ensuring the stability of the optical components during the detection process.

[0035] The setting of the detection window 451 on the cover 45 ensures the optical path between the light reflection component 42 and the silicon substrate 10, which not only prevents stray light from entering the box 44 from the non-detection area and interfering with the optical signal acquisition, but also ensures that the detection light can be transmitted and reflected without obstruction, thus guaranteeing the purity and integrity of the optical signal acquisition.

[0036] Specifically, the area of ​​the detection window 451 needs to be larger than the surface area of ​​the silicon substrate 10 so that the detection area can cover the entire silicon substrate 10 and ensure the accuracy of the detection results.

[0037] In some embodiments, the light-reflecting component 42 described above may employ, for example... Figure 2 and Figure 3 The structure shown. See also Figure 2 and Figure 3 The light reflection assembly 42 includes a plane mirror 421 and an optical beam splitter 422. The plane mirror 421 is mounted inside the housing 44 via a first bracket 46 and is used to reflect the light emitted by the light emitter 41. The optical beam splitter 422 is mounted inside the housing 44 via a second bracket 47 and is located above the plane mirror 421. It is used to guide the light reflected by the plane mirror 421 to the detection window 451 and to guide the light reflected from the detection window 451 to the light receiver 43.

[0038] The plane mirror 421 can accurately reflect the initial beam emitted by the light emitter 41, realizing the initial redirection of the optical path (such as turning the horizontally emitted beam into a vertically upward beam), laying the foundation for the subsequent light to be guided to the detection window 451. The optical beam splitter 422 is located above the plane mirror 421. On the one hand, it can further guide the beam transmitted from the plane mirror 421 to the detection window 451, ensuring that the light is perpendicularly irradiated onto the surface of the silicon substrate 10. On the other hand, it can efficiently receive the beam reflected back from the silicon substrate 10 through the detection window 451 and redirect it to the light receiver 43, realizing the effect of separate transmission of incident light and reflected light along the same path, avoiding mutual interference between the two types of light, and providing an optical path basis for the accuracy of the grinding endpoint judgment.

[0039] Specifically, the arrangement of the first bracket 46 and the second bracket 47 reliably fixes the plane mirror 421 and the optical beam splitter 422 in preset positions within the housing 44, preventing component displacement and optical path misalignment caused by vibrations during equipment operation. Simultaneously, by adjusting the installation positions of the first bracket 46 and the second bracket 47, the optical path can be adjusted, improving the practicality of the light reflection assembly 42.

[0040] The optical beam splitter 422 utilizes the physical properties of light to split an incident beam into two beams according to specific rules. Its working principle is existing technology and will not be described in detail here. In this embodiment, the optical beam splitter 422 can both guide the light reflected by the light reflecting component 42 in a straight line to the detection window 451 and guide the light reflected by the silicon substrate 10 horizontally to the light receiver 43 after being redirected.

[0041] The combined design of the plane mirror 421 and the optical beam splitter 422 realizes a complete optical path layout from the light emitter 41 to the detection window 451 and then to the light receiver 43, effectively optimizing the spatial structure of the detection unit 4 and adapting to the compact design requirements of integrated equipment; at the same time, it helps to simplify the optical path complexity, reduce the assembly and maintenance difficulty of each optical component, and improve the overall reliability and industrial adaptability of the detection unit 4.

[0042] In some embodiments, the first support 46 described above can be adopted as follows: Figure 5 The structure shown. See also Figure 5 The first bracket 46 includes a chassis 461, a U-shaped frame 462, and a first locking member 464. The chassis 461 is connected to the inner bottom wall of the housing 44; the U-shaped frame 462 is connected to the chassis 461, and the plane reflector 421 is rotatably connected to the U-shaped opening of the U-shaped frame 462 through a connecting shaft 463; the first locking member 464 is connected to the U-shaped frame 462 and is used to lock the connecting shaft 463.

[0043] The chassis 461 can be connected to the inner bottom wall of the housing 44 by magnetic attraction or bolt connection, providing a stable bottom support for the plane mirror 421, preventing the plane mirror 421 from shifting and ensuring the accuracy of the detection optical path.

[0044] The plane mirror 421 is rotatably connected to the U-shaped opening of the U-shaped frame 462 via the connecting shaft 463, allowing the plane mirror 421 to flexibly adjust its reflection angle around the connecting shaft 463. This ensures that the reflected beam can be accurately guided to the optical beam splitter 422 and is compatible with the emission port height of different light emitters 41. At the same time, the first locking member 464 is sleeved on the outer periphery of the connecting shaft 463. After the plane mirror 421 is adjusted to the correct angle, the connecting shaft 463 can be fixed by the first locking member 464 to prevent the plane mirror 421 from shifting its angle during subsequent use and to ensure the stability of the optical path.

[0045] In this embodiment, the first locking member 464 is a locking block connected to the U-shaped frame 462, having a clamping hole through which the connecting shaft 463 passes. The locking block has two locking parts located on both sides of the clamping hole, and locking bolts are provided through the two locking parts. Tightening the locking bolts can drive the two locking parts to move closer to each other, thereby causing the clamping hole to grip the connecting shaft 463 to fix the connecting shaft 463.

[0046] Optionally, the first locking element 464 can also be a set screw threaded onto the U-shaped bracket 462, the inner end of which can abut against the outer peripheral wall of the connecting shaft 463 to restrict the rotation of the connecting shaft 463.

[0047] In some embodiments, the second support 47 described above can be adopted as follows: Figure 6 The structure shown. See also Figure 6 The second bracket 47 includes a mounting sleeve 471, two base sleeves 472, and two second locking elements 473. The mounting sleeve 471 is fitted around the outer periphery of the optical beam splitter 422 and has two downwardly extending support rods 4711. The two base sleeves 472 are respectively connected to the inner bottom wall of the housing 44 and are slidably fitted around the outer periphery of the two support rods 4711. The two second locking elements 473 are respectively connected to the two base sleeves 472 and are used to lock the axial position of the support rods 4711 and the base sleeves 472.

[0048] The mounting sleeve 471 can be precisely fitted to the outer contour of the optical beam splitter 422, achieving all-round wrapping and fixing of the optical beam splitter 422. At the same time, the base sleeve 472 can be connected to the inner bottom wall of the housing 44 by magnetic attraction or bolt connection, providing a stable bottom support for the optical beam splitter 422, preventing the optical beam splitter 422 from shifting and ensuring the accuracy of the detection optical path.

[0049] The optical beam splitter 422 is height-adjustable through the sliding engagement of the support rod 4711 and the base sleeve 472. Specifically, during the equipment assembly and calibration stage, the support rod 4711 is moved up and down according to the height requirements of the plane mirror 421 or the position requirements of the light receiver 43, so that the mounting sleeve 471 and the optical beam splitter 422 move synchronously until the optical beam splitter 422 reaches the optimal height for accurately receiving and turning the light beam. After adjustment, the axial relative position of the support rod 4711 and the base sleeve 472 is locked by the second locking member 473 to prevent the optical beam splitter 422 from shifting in height due to vibration or other factors during subsequent use, thus ensuring the stability of the optical path.

[0050] In this embodiment, the second locking member 473 is a tightening screw, which is threaded onto the base sleeve 472. Its inner end can abut against the outer peripheral wall of the support rod 4711 to restrict the support rod 4711 from moving up and down along the base sleeve 472, thereby fixing the position of the optical beam splitter 422.

[0051] Optionally, the second locking member 473 can also adopt a locking block structure to hold the outer periphery of the support rod 4711. The specific locking method is the same as that of the locking block embodiment of the first locking member 464, and will not be described again here.

[0052] In some embodiments, see Figure 2 and Figure 4 The optical receiver 43 is connected to the housing 44 via a lifting seat 48. The lifting seat 48 includes a base plate 481, a support plate 482, a first hinge arm 483, a second hinge arm 484, and a driving component 485. The base plate 481 is connected to the inner bottom wall of the housing 44. The support plate 482 is arranged parallel above the base plate 481 and is used to support the optical receiver 43. The lower end of the first hinge arm 483 is hinged to the top surface of the base plate 481, and the upper end is slidably connected to the bottom surface of the support plate 482. The second hinge arm 484 is hinged to the first hinge arm 483. The upper end of the second hinge arm 484 is hinged to the bottom surface of the support plate 482, and the lower end is slidably connected to the top surface of the base plate 481. The driving component 485 is connected between the support plate 482 and the first hinge arm 483 and is used to drive the first hinge arm 483 to swing vertically so that the support plate 482 can be raised or lowered.

[0053] In this embodiment, the base plate 481 can be connected to the inner bottom wall of the housing 44 via a detachable connection method such as magnetic attraction or bolt connection, for easy assembly. The support plate 482 is arranged parallel to the base plate 481, ensuring a stable support for the optical receiver 43.

[0054] The cross-hinged design of the first hinge arm 483 and the second hinge arm 484 forms a stable parallelogram lifting structure. When the driving component 485 drives the first hinge arm 483 to swing vertically, it can drive the support plate 482 and the optical receiver 43 to achieve smooth and vertical lifting movements, ensuring that the optical receiver 43 always remains horizontal during the height adjustment process, avoiding the offset of the receiving optical path due to tilting, and ensuring the stability of optical signal acquisition.

[0055] The optical receiver 43 achieves height adjustability through the lifting base 48, which can flexibly adapt to different detection scenario requirements and ensure that its receiving window can always be precisely aligned with the reflected beam. When the optical receiver 43 is replaced with a different specification or when the optical path is slightly offset after long-term use, it can be quickly calibrated through the lifting base 48 to ensure that the optical receiver 43 is always in the best receiving position, thereby improving detection accuracy.

[0056] Specifically, the driving component 485 is an adjusting screw rotatably connected to the support plate 482. A slider is hinged to the upper end of the first hinge arm 483, and the slider is slidably connected to the bottom surface of the support plate 482 and threadedly connected to the adjusting screw. Rotating the adjusting screw, utilizing the threaded transmission principle, causes the slider to slide along the bottom surface of the support plate 482, thereby driving the first hinge arm 483 to swing vertically, realizing the raising and lowering of the support plate 482. In the above driving method, due to the high precision of the threaded transmission and its self-locking performance, the support plate 482 can be stably maintained at a preset height, thus ensuring the stability of the position of the optical receiver 43.

[0057] In some embodiments, see Figure 2 A dust cover 452 is hinged to the upper surface of the box cover 45. The eccentric part of the dust cover 452 is rotatably connected to the box cover 45 so that the dust cover 452 can rotate horizontally to cover the detection window 451 or expose the detection window 451.

[0058] When the detection unit 4 is not in operation (such as when the grinding unit 3 is working, or when the entire equipment is shut down or under maintenance), the detection window 451 can be easily covered by rotating the dust cover 452, effectively preventing external dust and impurities from entering the housing 44 and contaminating the optical components. When the detection unit 4 needs to start detection, the detection window 451 can be quickly exposed by simply rotating the dust cover 452 horizontally. The operation is convenient and does not affect the normal transmission of the detection optical path, ensuring detection efficiency and improving the convenience of overall equipment operation and maintenance.

[0059] In some embodiments, the grinding unit 3 described above may employ, for example... Figure 1 The structure shown. See also Figure 1 The grinding unit 3 includes a grinding disc 31 and a liquid supply arm 32. The grinding disc 31 is rotatably connected to the frame 1. The liquid supply arm 32 is located on one side of the grinding disc 31 and has several liquid supply nozzles for supplying diamond powder suspension to the upper surface of the grinding disc 31.

[0060] In this embodiment, the polishing disc 31 is connected to a rotary drive component, which can drive the polishing disc 31 to rotate at a speed of 1000-2000 rpm. At the same time, the adsorption head 21 and the transmission arm 2 are also rotatably connected. During the polishing process, the adsorption head 21 can rotate at a low speed of 20-200 rpm and can apply downward pressure to the silicon substrate 10, so that its lower surface remains in contact with the polishing disc 31. By utilizing the speed difference between the adsorption head 21 and the polishing disc 31, the mechanical polishing effect on the silicon substrate 10 is achieved. At the same time, the liquid supply arm 32 supplies diamond powder suspension to the polishing disc 31, achieving the effect of uniformly "planting" diamond micropowder on the silicon substrate 10.

[0061] Compared to traditional manual grinding, by precisely controlling the downward pressure of the adsorption head 21 (e.g., 0.1-1 MPa) and the rotation speed of the grinding disc 31, and by uniformly supplying diamond powder suspension to the grinding disc 31 through multiple liquid supply nozzles, the consistency of surface grinding of silicon substrates 10 in the same batch can be guaranteed, ensuring nucleation quality and improving grinding efficiency and stability.

[0062] In some embodiments, see Figure 1 The grinding unit 3 also includes an auxiliary grinding module 5, which is located on one side of the grinding disk 31 and spaced apart from the liquid supply arm 32. The auxiliary grinding module 5 is used to spray plasma onto the surface of the silicon substrate 10.

[0063] It is important to understand that the auxiliary polishing module 5 integrates a radio frequency low-temperature plasma generator, with the working gas being a mixture of Ar and H2, where H2 accounts for 5-10%. Before polishing the silicon substrate 10, its surface is subjected to plasma treatment for 1-3 minutes: the H2 plasma can selectively etch the oxide layer (SiO2) on the surface of the silicon substrate 10, while forming dangling bonds on its surface to enhance the adhesion between the diamond micropowder and the silicon substrate 10; the sputtering effect of Ar ions can pre-form a nanoscale uneven structure on the surface of the silicon substrate 10, providing directional scratch guidance for subsequent polishing and avoiding the generation of subsurface cracks.

[0064] Integrating the auxiliary polishing module 5 into the polishing unit 3 enables rapid connection between plasma pretreatment and polishing processes, shortens the transfer path of the transfer arm 2 to the silicon substrate 10, further improves the integration and processing efficiency of the polishing unit 3, and provides a more reliable silicon substrate surface condition for the subsequent uniform growth of diamond film.

[0065] In some embodiments, see Figure 1 An integrated device for substrate treatment before diamond film growth also includes a cleaning unit 6. The cleaning unit 6 includes a cleaning tank 61 and a dryer 62. The cleaning tank 61 is connected to the frame 1 and is used to contain cleaning liquid. The dryer 62 is connected to the frame 1 and is located outside the cleaning tank 61. It has a nozzle facing the cleaning tank 61 and is used to blow nitrogen gas onto the surface of the silicon substrate 10 to dry the silicon substrate 10.

[0066] In this embodiment, the cleaning tank 61 can be spaced apart on one side of the detection unit 4, which facilitates the transfer arm 2 to quickly transfer the silicon substrate 10 from the detection unit 4 to the cleaning unit 6, thereby improving the transfer efficiency. The cleaning tank 61 is equipped with an ultrasonic generator, which uses ultrasonic vibration to generate tiny bubbles in the cleaning fluid and cause it to vibrate violently, thereby improving the cleaning efficiency of the silicon substrate 10.

[0067] Specifically, the cleaning solution is a suspension prepared by mixing diamond micro powder and anhydrous ethanol at a mass ratio of 1:100. The anhydrous ethanol is used to effectively clean the silicon substrate 10, and the diamond micro powder in the cleaning solution can replenish the diamond micro powder that has been detached from the surface of the silicon substrate 10 due to ultrasonic vibration. At the same time, the cleaning tank 61 is also equipped with a stirring device, which agitates the cleaning solution during the cleaning process to ensure that the suspension is evenly dispersed.

[0068] The silicon substrate 10 after grinding is cleaned by the cleaning solution in the cleaning tank 61, which effectively removes the grinding debris and other impurities remaining on its surface, and avoids these residues from affecting the uniformity of subsequent diamond film nucleation or causing film defects. Nitrogen gas is blown into the cleaning tank 61 by the nozzle of the dryer 62, which can quickly dry the cleaned silicon substrate 10 and avoid watermark residue.

[0069] In addition, the cleaning unit 6, grinding unit 3, and inspection unit 4 are integrated on the frame 1, enabling the silicon substrate 10 to achieve automated connection between grinding, inspection, cleaning, and drying processes through the transfer arm 2. This eliminates the need for manual transfer, improves overall processing efficiency, reduces the risk of contamination from manual contact, and further improves the integration of the silicon substrate 10 pretreatment equipment, providing reliable surface quality for the subsequent growth of diamond films.

[0070] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated device for substrate treatment before diamond film growth, characterized in that, include: The frame (1) is provided with horizontally extending guide rails (11); The transfer arm (2) is slidably connected to the guide rail (11) and has an adsorption head (21) for picking up and transferring the silicon substrate (10). A grinding unit (3) is connected to the frame (1) and is used to grind the silicon substrate (10) adsorbed by the adsorption head (21); as well as A detection unit (4) is connected to the frame (1) and spaced apart from the polishing unit (3). The detection unit (4) includes a light emitter (41), a light reflection component (42), and a light receiver (43). The light reflection component (42) is used to guide the light emitted by the light emitter (41) to the surface of the silicon substrate (10) and to guide the light reflected by the silicon substrate (10) to the light receiver (43). The light receiver (43) is electrically connected to a controller, which is used to determine the polishing endpoint based on the signal output by the light receiver (43).

2. The integrated equipment for substrate treatment before diamond film growth as described in claim 1, characterized in that, The detection unit (4) further includes: A housing (44) is connected to the frame (1), and the light emitter (41), the light reflector (42), and the light receiver (43) are respectively disposed inside the housing (44); and A lid (45) is placed on top of the box body (44). The lid (45) has a detection window (451) that extends through its thickness. The detection window (451) corresponds vertically to the light reflection component (42).

3. The integrated equipment for substrate treatment before diamond film growth as described in claim 2, characterized in that, The light-reflecting component (42) includes: A plane mirror (421), mounted inside the housing (44) via a first bracket (46), is used to reflect the light emitted by the light emitter (41); and An optical beam splitter (422) is installed inside the housing (44) via a second bracket (47) and is located above the plane mirror (421). It is used to guide the light reflected by the plane mirror (421) to the detection window (451) and to guide the light reflected from the detection window (451) to the light receiver (43).

4. The integrated equipment for substrate treatment before diamond film growth as described in claim 3, characterized in that, The first support (46) includes: The chassis (461) is connected to the inner bottom wall of the housing (44); A U-shaped frame (462) is connected to the chassis (461), and the plane mirror (421) is rotatably connected to the U-shaped opening of the U-shaped frame (462) via a connecting shaft (463); and A first locking element (464) is connected to the U-shaped frame (462) and is used to lock the connecting shaft (463).

5. The integrated equipment for substrate treatment before diamond film growth as described in claim 3, characterized in that, The second support (47) includes: The mounting sleeve (471) is fitted around the outer periphery of the optical beam splitter (422) and has two downwardly extending support rods (4711). Two base sleeves (472) are respectively connected to the inner bottom wall of the housing (44), and are slidably fitted onto the outer periphery of the two support rods (4711); and Two second locking elements (473) are respectively connected to the two base sleeves (472) for locking the axial position of the support rod (4711) and the base sleeves (472).

6. The integrated equipment for substrate treatment before diamond film growth as described in claim 3, characterized in that, The optical receiver (43) is connected to the housing (44) via a lifting base (48), the lifting base (48) comprising: The base plate (481) is connected to the inner bottom wall of the box (44); A support plate (482) is disposed parallel to the base plate (481) above it and is used to support the optical receiver (43). The first hinge arm (483) is hinged at its lower end to the top surface of the base plate (481) and slidably connected at its upper end to the bottom surface of the support plate (482). A second hinge arm (484) is hinged to the first hinge arm (483). The upper end of the second hinge arm (484) is hinged to the bottom surface of the support plate (482), and the lower end is slidably connected to the top surface of the base plate (481). A drive unit (485) is connected between the support plate (482) and the first hinge arm (483) for driving the first hinge arm (483) to swing vertically so that the support plate (482) can be raised or lowered.

7. The integrated equipment for substrate treatment before diamond film growth as described in claim 2, characterized in that, A dust cover (452) is hinged to the upper surface of the box cover (45). The eccentric part of the dust cover (452) is rotatably connected to the box cover (45) so that the dust cover (452) can rotate horizontally to cover the detection window (451) or expose the detection window (451).

8. The integrated equipment for substrate treatment before diamond film growth as described in claim 1, characterized in that, The grinding unit (3) includes: Grinding disc (31), rotatably connected to the frame (1); and The liquid supply arm (32) is located on one side of the grinding disc (31) and has several liquid supply nozzles for supplying diamond powder suspension to the upper surface of the grinding disc (31).

9. The integrated equipment for substrate treatment before diamond film growth as described in claim 8, characterized in that, The grinding unit (3) further includes an auxiliary grinding module (5), which is located on one side of the grinding disk (31) and spaced apart from the liquid supply arm (32). The auxiliary grinding module (5) is used to spray plasma onto the surface of the silicon substrate (10).

10. The integrated equipment for substrate treatment before diamond film growth as described in claim 1, characterized in that, The integrated equipment for substrate treatment before diamond film growth further includes a cleaning unit (6), the cleaning unit (6) comprising: A cleaning tank (61), connected to the frame (1), is used to hold cleaning fluid; and A dryer (62) is connected to the frame (1) and located outside the cleaning tank (61). It has a nozzle facing the cleaning tank (61) for blowing nitrogen gas onto the surface of the silicon substrate (10) to dry the silicon substrate (10).

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