Transfer device and wafer beveler

Abstract

The utility model provides a kind of transfer device and wafer chamfering machine, transfer device includes: transfer frame, is set on support base surface;Horizontal shift subassembly, horizontal shift subassembly is set in transfer frame and at least part is movably arranged along parallel to the first direction of support base surface;Transfer manipulator, the fixed end of the moving end of horizontal shift subassembly is connected with transfer manipulator, at least part of transfer manipulator is movably arranged along parallel to the second direction of support base surface and perpendicular to the third direction of support base surface and is rotatably arranged around third direction, to be used for taking and placing material, to solve the problem of lower processing efficiency of wafer chamfering machine in prior art.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a transfer device and a wafer chamfering machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer chamfering and grinding is one of the key steps to ensure chip quality and performance. Existing wafer chamfering machines typically employ single-station or low-station processing methods. In these processes, wafer handling, inspection, grinding, cleaning, and drying often need to be performed sequentially at different stations, and material transfer between these processes is usually completed by a single robotic arm. This results in limited overall equipment transfer and processing cycle time, leading to low processing efficiency. Utility Model Content

[0003] The main objective of this invention is to provide a transfer device and a wafer beveling machine to solve the problem of low processing efficiency in existing wafer beveling machines.

[0004] To achieve the above objectives, according to one aspect of the present invention, a transfer device is provided, comprising: a transfer frame disposed on a supporting base; a transverse moving assembly disposed within the transfer frame and at least partially movably disposed along a first direction parallel to the supporting base; and a transfer robot arm, wherein the moving end of the transverse moving assembly is connected to the fixed end of the transfer robot arm, and at least a portion of the transfer robot arm is movably disposed along a second direction parallel to the supporting base and a third direction perpendicular to the supporting base, and is rotatably disposed around the third direction for picking up and placing materials.

[0005] Furthermore, the transfer robot includes: a first moving module, at least a portion of which is movably arranged along a third direction; a rotating module, the moving part of the first moving module being connected to the fixed part of the rotating module, the rotating part of the rotating module being rotatably arranged about a predetermined axis parallel to the third direction; a second moving module, the rotating part of the rotating module being connected to the fixed part of the second moving module, the moving part of the second moving module being movably arranged along a second direction; and a pick-and-place arm, the moving part of the second moving module being connected to one end of the pick-and-place arm, the other end of which is used for picking up and placing materials.

[0006] Further, the first moving module includes: a first substrate; a first driving unit disposed on the first substrate; a first guide assembly with a guide rail disposed on the first substrate and the guide rail extending along a third direction; a lead screw and nut assembly with a lead screw extending along a third direction; the first driving unit being driven connected to the lead screw of the lead screw and nut assembly to drive the lead screw of the lead screw and nut assembly to rotate; and the slider of the first guide assembly being connected to the nut of the lead screw and nut assembly to move synchronously with the nut of the lead screw and nut assembly along the lead screw of the lead screw and nut assembly.

[0007] Furthermore, the first moving module includes: a second base plate, at least one of the slider of the first guide assembly and the nut of the lead screw nut assembly connected to the second base plate, a second driving part disposed on the second base plate; a third base plate, the second driving part being drivenly connected to the third base plate to drive the third base plate to move in a third direction, and the third base plate being connected to the fixed part of the rotating module to drive the rotating module to move in a third direction.

[0008] Furthermore, the rotating module includes: a rotating drive unit disposed on the third substrate; a rotating disk, the rotating drive unit being driven to rotate the rotating disk around a predetermined axis, and the rotating disk being connected to the fixed part of the second moving module.

[0009] Furthermore, the second moving module includes: a third driving unit, the rotating part of the rotating module being connected to the third driving unit; and a fourth substrate, the third driving unit being driven to the fourth substrate to drive the fourth substrate to move along the second direction, and the fourth substrate being connected to the pick-and-place arm.

[0010] Furthermore, the pick-and-place arm includes a connecting arm and two pick-and-place arms, which are spaced apart. The first end of the connecting arm is connected to the moving part of the second moving module, and the first ends of the two pick-and-place arms are respectively connected to the second end of the connecting arm. The second ends of the two pick-and-place arms extend in a direction away from the connecting arm for picking up and placing materials.

[0011] Furthermore, the transverse assembly includes: a fixed plate, which is installed inside the transfer frame; a transverse transmission assembly, which is movably disposed inside the transfer frame along a first direction; a transverse drive unit, which is installed on the fixed plate and drivenly connected to the transverse transmission assembly to drive the transverse transmission assembly to move; a transverse guide assembly, whose guide rail is installed on the fixed plate, and whose slider is connected to the transverse transmission assembly to guide the movement of the transverse transmission assembly; and a transverse plate, which is connected to the transverse transmission assembly to drive the transverse plate to move along the first direction, and a transfer robot is installed on the transverse plate to move along the first direction with the transverse plate.

[0012] Furthermore, the transverse transmission assembly includes: a driving pulley, a driven pulley, and a transmission belt. The driving pulley and the driven pulley are spaced apart on the fixed plate along a first direction. The driving pulley and the driven pulley are rotatable relative to the fixed plate. The transmission belt is sleeved on the driving pulley and the driven pulley. The transverse drive unit is connected to the driving pulley to drive the driving pulley to rotate, thereby driving the transmission belt to move along the first direction. The transverse plate is mounted on the transmission belt.

[0013] Furthermore, the transverse assembly also includes a limiting part, which is disposed on the fixed plate and located at one end of the transverse plate in the direction of movement, so as to limit the movement of the transverse plate.

[0014] According to another aspect of the present invention, a wafer chamfering machine is provided, including a first hopper assembly and the aforementioned transfer device, wherein the first hopper assembly is disposed above the transfer device.

[0015] Applying the technical solution of this utility model, the transfer device includes: a transfer frame, disposed on a supporting base; a transverse moving component, disposed within the transfer frame and at least partially movably disposed along a first direction parallel to the supporting base; and a transfer robot, the moving end of the transverse moving component connected to the fixed end of the transfer robot, at least a portion of which is movably disposed along a second direction parallel to the supporting base and a third direction perpendicular to the supporting base, and rotatably disposed around the third direction for picking up and placing materials. Technically, the transfer frame of this utility model, as the supporting structure of the entire device, provides a stable supporting foundation, ensuring the accurate operation of the transverse moving component and the transfer robot. The transverse moving component, through its movement within the transfer frame, achieves efficient material transfer between different workstations, while the multi-degree-of-freedom design of the transfer robot allows for flexible material picking and placing, adapting to different processing requirements. In principle, the motion control of the transverse moving component and the transfer robot in this utility model ensures high precision and stability. In terms of effectiveness, this invention significantly improves the efficiency and accuracy of material transfer, solves the problem of low processing efficiency of existing wafer chamfering machines, reduces processing waiting time, and enhances the overall processing capacity of the equipment. Attached Figure Description

[0016] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. In the drawings:

[0017] Figure 1 A schematic diagram of an embodiment of the transfer device according to the present invention is shown;

[0018] Figure 2 It shows Figure 1The diagram shows the structure of the transfer robot in one direction of the transfer device.

[0019] Figure 3 It shows Figure 2 The diagram shown is a structural schematic of the transfer robot in another direction;

[0020] Figure 4 It shows Figure 2 The diagram shows the structure of the transfer robot in another direction.

[0021] Figure 5 It shows Figure 2 The diagram shown illustrates the structure of the transfer robot as it moves along a third direction.

[0022] Figure 6 A schematic diagram of an embodiment of the wafer chamfering machine according to the present invention is shown;

[0023] Figure 7 It shows Figure 6 The diagram shows a partial structure of the wafer chamfering machine.

[0024] The above figures include the following reference numerals:

[0025] 81. Transfer frame;

[0026] 82. Lateral movement assembly; 821. Fixed plate; 822. Lateral movement transmission assembly; 8221. Driving pulley; 8222. Driven pulley; 8223. Transmission belt; 823. Lateral movement drive unit; 824. Lateral movement guide assembly; 825. Lateral movement plate; 826. Limiting part;

[0027] 83. Transfer robot; 831. First moving module; 8311. First base plate; 8312. First drive unit; 8313. First guide assembly; 8314. Lead screw and nut assembly; 8315. Second base plate; 8316. Second drive unit; 8317. Third base plate; 832. Rotating module; 8321. Rotating drive unit; 8322. Rotating disk; 833. Second moving module; 8331. Third drive unit; 8332. Fourth base plate; 834. Pick-and-place arm; 8341. Connecting arm; 8342. Pick-and-place arm;

[0028] 100. First hopper assembly; 300. Transfer device. Detailed Implementation

[0029] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] like Figures 1 to 5As shown, this utility model provides a transfer device, including: a transfer frame 81, disposed on a supporting base; a transverse component 82, disposed within the transfer frame 81 and at least partially movably disposed along a first direction parallel to the supporting base; and a transfer robot 83, the movable end of the transverse component 82 being connected to the fixed end of the transfer robot 83, at least a portion of the transfer robot 83 being movably disposed along a second direction parallel to the supporting base and a third direction perpendicular to the supporting base, and rotatably disposed around the third direction for picking up and placing materials.

[0031] Technically, the transfer frame 81 of this invention serves as the supporting structure for the entire device, providing a stable foundation and ensuring the accurate operation of the transverse component 82 and the transfer robot 83. The transverse component 82, through its movement within the transfer frame 81, achieves efficient material transfer between different workstations, while the multi-degree-of-freedom design of the transfer robot 83 allows for flexible material handling, adapting to various processing requirements. In principle, the motion control of the transverse component 82 and the transfer robot 83 in this invention ensures high precision and stability. In terms of effectiveness, this invention significantly improves the efficiency and accuracy of material transfer, solves the problem of low processing efficiency in existing wafer chamfering machines, reduces processing waiting time, and enhances the overall processing capacity of the equipment.

[0032] like Figures 2 to 5 As shown, the transfer robot 83 includes: a first moving module 831, at least a portion of which is movably disposed along a third direction; a rotating module 832, the moving part of the first moving module 831 being connected to the fixed part of the rotating module 832, the rotating part of the rotating module 832 being rotatably disposed about a predetermined axis parallel to the third direction; a second moving module 833, the rotating part of the rotating module 832 being connected to the fixed part of the second moving module 833, the moving part of the second moving module 833 being movably disposed along a second direction; and a pick-and-place arm 834, the moving part of the second moving module 833 being connected to one end of the pick-and-place arm 834, the other end of which is used for picking up and placing materials.

[0033] Technically, the first moving module 831, the rotating module 832, and the second moving module 833 of this invention constitute the three-dimensional motion capability of the transfer robot 83, enabling it to accurately position and pick up / place materials in space. In principle, the motion control of each module in this invention ensures high-precision motion control. In terms of effectiveness, the transfer robot 83 of this invention can respond quickly, improve material handling speed, and reduce the risk of wafer damage caused by the movement of the transfer robot 83.

[0034] like Figures 2 to 5As shown, the first moving module 831 includes: a first substrate 8311, a first driving unit 8312 disposed on the first substrate 8311; a first guide component 8313 with a guide rail disposed on the first substrate 8311 and the guide rail extending along a third direction; a lead screw and nut assembly 8314 with a lead screw extending along a third direction; the first driving unit 8312 is drivenly connected to the lead screw of the lead screw and nut assembly 8314 to drive the lead screw of the lead screw and nut assembly 8314 to rotate; and the slider of the first guide component 8313 is connected to the nut of the lead screw and nut assembly 8314 to move synchronously with the nut of the lead screw and nut assembly 8314 along the lead screw of the lead screw and nut assembly 8314.

[0035] Technically, the use of the lead screw and nut assembly 8314 in this invention ensures precise positioning and efficient movement of the first moving module 831 in the third direction. In principle, the lead screw and nut assembly 8314 in this invention uses a servo motor to drive the lead screw to rotate, thereby moving the nut along the lead screw to achieve precise linear motion. In terms of effect, this invention provides stable vertical movement, enhancing the overall performance of the transfer robot 83, especially when handling heavy wafers, ensuring sufficient support and stability.

[0036] like Figures 2 to 5 As shown, the first moving module 831 includes: a second substrate 8315, at least one of the slider of the first guide assembly 8313 and the nut of the lead screw nut assembly 8314 connected to the second substrate 8315; a second driving part 8316 disposed on the second substrate 8315; and a third substrate 8317, the second driving part 8316 being drivenly connected to the third substrate 8317 to drive the third substrate 8317 to move along a third direction, the third substrate 8317 being connected to the fixed part of the rotating module 832 to drive the rotating module 832 to move along a third direction.

[0037] Technically, the introduction of the second substrate 8315 and the third substrate 8317 in this invention increases the movement levels of the first moving module 831, enabling more precise control of vertical movement and increasing the vertical movement distance. It also provides a stable mounting foundation for the subsequent rotating module 832. In principle, the second drive unit 8316 in this invention indirectly controls the vertical movement of the rotating module 832 by driving the third substrate 8317, achieving multi-degree-of-freedom coordinated control. In terms of effect, this invention enhances the vertical flexibility of the transfer robot 83, enabling it to quickly switch positions and improving the adaptability and processing efficiency of the wafer chamfering machine.

[0038] like Figures 2 to 5As shown, the rotating module 832 includes: a rotating drive unit 8321, which is disposed on the third substrate 8317; and a rotating disk 8322, which is drivenly connected to the rotating drive unit 8321 to drive the rotating disk 8322 to rotate around a predetermined axis. The rotating disk 8322 is connected to the fixed part of the second moving module 833.

[0039] Technically, the combination of the rotary drive unit 8321 and the rotating disk 8322 in this invention endows the transfer robot 83 with rotational capability in a third direction, enabling it to pick up and place wafers at different angles. In principle, the rotary drive unit 8321 in this invention drives the rotating disk 8322 to rotate via a motor, achieving wafer rotational positioning. In terms of effectiveness, this invention allows the transfer robot 83 to adapt to various motion requirements, avoiding positional errors in the wafer processing.

[0040] like Figures 2 to 5 As shown, the second moving module 833 includes: a third driving part 8331, the rotating part of the rotating module 832 is connected to the third driving part 8331; and a fourth substrate 8332, the third driving part 8331 is drivingly connected to the fourth substrate 8332 to drive the fourth substrate 8332 to move along the second direction, and the fourth substrate 8332 is connected to the pick-and-place arm 834.

[0041] Technically, the addition of the second moving module 833 in this invention enables the transfer robot 83 to move in a direction parallel to the supporting base, expanding its operating range. In principle, the third drive unit 8331 in this invention drives the fourth substrate 8332 via a servo motor, achieving precise horizontal movement of the pick-and-place arm 834. In terms of effect, this invention improves the horizontal movement speed and accuracy of the transfer robot 83, enabling it to transfer wafers faster, reducing processing waiting time, and increasing the utilization rate of the wafer chamfering machine.

[0042] like Figures 2 to 5 As shown, the pick-and-place arm 834 includes a connecting arm 8341 and two pick-and-place arms 8342, which are spaced apart. The first end of the connecting arm 8341 is connected to the moving part of the second moving module 833, and the first ends of the two pick-and-place arms 8342 are respectively connected to the second end of the connecting arm 8341. The second ends of the two pick-and-place arms 8342 extend in a direction away from the connecting arm 8341 for picking up and placing materials.

[0043] The pick-and-place arm 8342 in this invention achieves stable wafer pick-and-place via vacuum adsorption. In terms of effectiveness, this invention enables the transfer robot 83 to stably pick up and place wafers, reducing wafer pick-and-place time and significantly improving the processing cycle of the wafer chamfering machine. In other embodiments, by increasing the suction control of the pick-and-place arm 8342, adaptive pick-and-place of wafers with different thicknesses and hardness can be achieved, solving the compatibility problem during wafer pick-and-place.

[0044] like Figure 1 As shown, the transverse movement assembly 82 includes: a fixed plate 821, which is installed inside the transfer frame 81; a transverse movement transmission assembly 822, which is movably disposed inside the transfer frame 81 along a first direction; a transverse movement drive unit 823, which is installed on the fixed plate 821 and drivenly connected to the transverse movement transmission assembly 822 to drive the transverse movement transmission assembly 822 to move; a transverse movement guide assembly 824, whose guide rail is installed on the fixed plate 821, and whose slider is connected to the transverse movement transmission assembly 822 to guide the movement of the transverse movement transmission assembly 822; a transverse movement plate 825, which is connected to the transverse movement transmission assembly 822 to drive the transverse movement plate 825 to move along the first direction; and a transfer robot 83, which is installed on the transverse movement plate 825 to move along the first direction with the transverse movement plate 825.

[0045] Technically, the design of the transverse component 82 in this invention ensures that the transfer robot 83 can move smoothly along the first direction, improving the continuity and efficiency of material transfer. In principle, the transverse drive unit 823 in this invention drives the transverse transmission component 822, thereby moving the transverse plate 825 and driving the transfer robot 83 to perform horizontal material transfer. In terms of effect, this invention provides stable horizontal movement capability, enhancing the material handling capacity of the wafer chamfering machine, especially when processing large quantities of wafers, maintaining a high transfer rate.

[0046] like Figure 1 As shown, the transverse transmission assembly 822 includes: a driving pulley 8221, a driven pulley 8222, and a transmission belt 8223. The driving pulley 8221 and the driven pulley 8222 are spaced apart on the fixed plate 821 along a first direction. The driving pulley 8221 and the driven pulley 8222 are rotatable relative to the fixed plate 821. The transmission belt 8223 is sleeved on the driving pulley 8221 and the driven pulley 8222. The transverse drive unit 823 is connected to the driving pulley 8221 to drive the driving pulley 8221 to rotate, thereby driving the transmission belt 8223 to move along the first direction. The transverse plate 825 is mounted on the transmission belt 8223.

[0047] Technically, the use of the transverse transmission assembly 822 in this invention ensures the smooth movement of the transverse plate 825, improving the continuity and stability of material transfer. In principle, the transverse drive unit 823 in this invention drives the drive pulley 8221, which in turn drives the transmission belt 8223 and the transverse plate 825 to move along a first direction, realizing the horizontal transfer of the transfer robot 83. In terms of effectiveness, this invention provides reliable horizontal movement capability, especially when handling heavy or long wafers, maintaining stable transfer speed and accuracy.

[0048] like Figure 1 As shown, the transverse assembly 82 further includes a limiting part 826, which is disposed on the fixed plate 821 and located at one end of the transverse plate 825 in the moving direction, so as to limit the movement of the transverse plate 825.

[0049] Technically, the limiting part 826 of this invention ensures boundary control of the transverse plate 825 during movement, preventing overshoot or collision and improving the safety and reliability of the equipment. In principle, the limiting part 826 in this invention detects the position of the transverse plate 825 through sensing or mechanical means. Once a predetermined position is reached, a stop signal is triggered, achieving precise control of the movement range of the transverse plate 825. In terms of effectiveness, this invention enhances the safety performance of the transverse assembly 82, especially in high-speed operation or emergency situations, effectively preventing excessive movement of the transverse plate 825 and protecting the wafer chamfering machine and wafers from damage.

[0050] like Figure 6 and Figure 7 According to the present invention, one aspect provides a wafer chamfering machine, including a first hopper assembly 100 and the aforementioned transfer device, wherein the first hopper assembly 100 is disposed above the transfer device.

[0051] Technically, this wafer chamfering machine integrates a first hopper assembly 100 and a transfer device, forming a complete wafer processing system capable of automatically completing a series of processing steps, including wafer loading / unloading, inspection, chamfering, cleaning, and spin-drying. In principle, the first hopper assembly 100, through the transfer device, enables efficient wafer transfer between different workstations. The multi-degree-of-freedom design of the transfer device allows for precise positioning and loading / unloading of wafers in space. In terms of effectiveness, this invention significantly improves processing efficiency and wafer quality, reduces manual intervention, and lowers production costs.

[0052] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0053] The transfer device of this utility model includes: a transfer frame 81, disposed on a supporting base; a transverse moving component 82, disposed within the transfer frame 81 and at least partially movably disposed along a first direction parallel to the supporting base; and a transfer robot 83, the moving end of the transverse moving component 82 connected to the fixed end of the transfer robot 83, at least a portion of the transfer robot 83 being movably disposed along a second direction parallel to the supporting base and a third direction perpendicular to the supporting base, and rotatably disposed around the third direction for picking up and placing materials. Technically, the transfer frame 81 of this utility model serves as the supporting structure of the entire device, providing a stable supporting foundation and ensuring the accurate operation of the transverse moving component 82 and the transfer robot 83. The transverse moving component 82, through its movement within the transfer frame 81, achieves efficient material transfer between different workstations, while the multi-degree-of-freedom design of the transfer robot 83 allows for flexible material picking and placing, adapting to different processing requirements. In principle, the motion control of the transverse moving component 82 and the transfer robot 83 in this utility model ensures high precision and stability. In terms of effectiveness, this invention significantly improves the efficiency and accuracy of material transfer, solves the problem of low processing efficiency of existing wafer chamfering machines, reduces processing waiting time, and enhances the overall processing capacity of the equipment.

[0054] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0055] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0056] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0057] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0058] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0059] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A transfer device, characterized in that, include: The transfer frame (81) is set on the support base surface; A transverse component (82) is disposed within the transfer frame (81) and is at least partially movably disposed along a first direction parallel to the support base surface; A transfer robot (83) is provided, wherein the moving end of the transverse component (82) is connected to the fixed end of the transfer robot (83), and at least a portion of the transfer robot (83) is movably arranged along a second direction parallel to the support base and a third direction perpendicular to the support base, and is rotatably arranged around the third direction for picking up and placing materials.

2. The transfer device according to claim 1, characterized in that, The transfer robot (83) includes: A first mobile module (831) is provided, at least a portion of which is movably disposed along the third direction; A rotating module (832) is provided, wherein the moving part of the first moving module (831) is connected to the fixed part of the rotating module (832), and the rotating part of the rotating module (832) is rotatably arranged around a predetermined axis, the predetermined axis being parallel to the third direction; The second moving module (833) has a rotating part of the rotating module (832) connected to a fixed part of the second moving module (833), and the moving part of the second moving module (833) is movably arranged along the second direction; The picking and placing arm (834) has a moving part of the second moving module (833) connected to one end of the picking and placing arm (834), and the other end of the picking and placing arm (834) is used to pick up and place materials.

3. The transfer device according to claim 2, characterized in that, The first mobile module (831) includes: First substrate (8311). A first driving unit (8312) is disposed on the first substrate (8311); A first guide component (8313) has a guide rail disposed on the first substrate (8311), and the guide rail of the first guide component (8313) extends along the third direction. A lead screw and nut assembly (8314) is provided, wherein the lead screw of the lead screw and nut assembly (8314) extends along the third direction, a first driving unit (8312) is driven to drive the lead screw of the lead screw and nut assembly (8314) to rotate, and a slider of the first guide assembly (8313) is connected to the nut of the lead screw and nut assembly (8314) to move synchronously with the nut of the lead screw and nut assembly (8314) along the lead screw of the lead screw and nut assembly (8314).

4. The transfer device according to claim 3, characterized in that, The first mobile module (831) includes: The second substrate (8315) is connected to at least one of the slider of the first guide assembly (8313) and the nut of the lead screw nut assembly (8314). The second driving unit (8316) is disposed on the second substrate (8315); The third substrate (8317) is driven by the second driving unit (8316) to drive the third substrate (8317) to move along the third direction. The third substrate (8317) is connected to the fixed part of the rotating module (832) to drive the rotating module (832) to move along the third direction.

5. The transfer device according to claim 4, characterized in that, The rotating module (832) includes: A rotation drive unit (8321) is disposed on the third substrate (8317); A rotating disk (8322) is driven by a rotating drive unit (8321) to drive the rotating disk (8322) to rotate around the predetermined axis. The rotating disk (8322) is connected to the fixed part of the second moving module (833).

6. The transfer device according to claim 2, characterized in that, The second mobile module (833) includes: The third drive unit (8331) is connected to the rotating part of the rotating module (832); The fourth substrate (8332) is driven to be connected to the third driving unit (8331) to drive the fourth substrate (8332) to move along the second direction, and the fourth substrate (8332) is connected to the pick-and-place arm (834).

7. The transfer device according to claim 2, characterized in that, The pick-and-place arm (834) includes a connecting arm (8341) and two pick-and-place arms (8342), which are spaced apart. The first end of the connecting arm (8341) is connected to the moving part of the second moving module (833), and the first ends of the two pick-and-place arms (8342) are respectively connected to the second end of the connecting arm (8341). The second ends of the two pick-and-place arms (8342) extend in a direction away from the connecting arm (8341) for picking up and placing materials.

8. The transfer device according to claim 1, characterized in that, The lateral movement component (82) includes: A fixing plate (821) is installed inside the transfer frame (81); A transverse transmission assembly (822) is movably disposed within the transfer frame (81) along the first direction; A transverse drive unit (823) is mounted on the fixed plate (821) and drivenly connected to the transverse transmission assembly (822) to drive the transverse transmission assembly (822) to move; A transverse guide assembly (824) has a guide rail mounted on the fixed plate (821), and a slider of the transverse guide assembly (824) is connected to the transverse transmission assembly (822) to guide the movement of the transverse transmission assembly (822). A transverse plate (825) is connected to the transverse transmission assembly (822) to drive the transverse plate (825) to move along the first direction. The transfer robot (83) is mounted on the transverse plate (825) to move along the first direction with the transverse plate (825).

9. The transfer device according to claim 8, characterized in that, The lateral transmission assembly (822) includes: The drive pulley (8221), driven pulley (8222), and transmission belt (8223) are provided. The drive pulley (8221) and driven pulley (8222) are spaced apart on the fixed plate (821) along the first direction. The drive pulley (8221) and driven pulley (8222) are rotatable relative to the fixed plate (821). The transmission belt (8223) is sleeved on the drive pulley (8221) and driven pulley (8222). The lateral drive unit (823) is connected to the drive pulley (8221) to drive the drive pulley (8221) to rotate, thereby driving the transmission belt (8223) to move along the first direction. The lateral plate (825) is mounted on the transmission belt (8223).

10. The transfer device according to claim 8, characterized in that, The lateral movement component (82) further includes: A limiting part (826) is provided on the fixed plate (821) and located at one end of the moving direction of the transverse plate (825) to limit the movement of the transverse plate (825).

11. A wafer chamfering machine, characterized in that, It includes a first hopper assembly (100) and a transfer device according to any one of claims 1 to 10, wherein the first hopper assembly (100) is disposed above the transfer device.

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