A semiconductor chip polishing mechanism

Abstract

The utility model belongs to the technical field of semiconductor chip processing, especially a kind of semiconductor chip polishing mechanism, present and propose the following scheme, it includes base, the top fixed connection of base has positioning frame, the top fixed connection of positioning frame inner chamber has electric push rod, the output shaft fixed connection of electric push rod has polishing assembly, the top of base and located positioning frame inner chamber fixed connection has processing plate, the both sides of base inner chamber bottom are all fixedly connected with electric telescopic rod, the output shaft of electric telescopic rod penetrates base and is fixedly connected with L-shaped fixed plate, the number of L-shaped fixed plate is two, L-shaped fixed plate is fixedly connected with pressing plate away from the one end of electric telescopic rod, the number of pressing plate is two, this semiconductor chip polishing mechanism further includes: drive mechanism, in the utility model: by the cooperation of drive mechanism and cleaning mechanism, the waste chip on base and processing plate can be cleaned, avoid waste chip to influence the processing quality of chip.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing technology, and in particular to a semiconductor chip polishing mechanism. Background Technology

[0002] Semiconductor chip is short for integrated circuit. The material used in semiconductors is usually single-crystal silicon. Thousands or even hundreds of millions of tiny semiconductor components are designed and manufactured on one or more wafers and then packaged into a chip integrated circuit, which is what we now call a chip. A chip is not entirely made of semiconductors; it also contains a small number of other components such as resistors and capacitors.

[0003] Chinese patent application number 202121255613.1 discloses a conductor chip polishing machine, including a housing, a hydraulic cylinder fixedly connected inside the housing, a hydraulic rod movably connected to the output end of the hydraulic cylinder, a motor box fixedly connected to one end of the hydraulic rod, and a motor movably connected inside the motor box.

[0004] The current device cannot collect the debris after chip polishing, which affects the operating accuracy of the device and thus the chip polishing quality. Therefore, this invention proposes a semiconductor chip polishing mechanism to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to solve the problem that the device cannot collect the debris after chip grinding, which causes the debris generated during the grinding process to affect the operating accuracy of the device and thus easily affect the chip grinding quality. Therefore, a semiconductor chip grinding mechanism is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor chip polishing mechanism includes a base, a positioning frame fixedly connected to the top of the base, an electric push rod fixedly connected to the top of the inner cavity of the positioning frame, a polishing assembly fixedly connected to the output shaft of the electric push rod, a processing plate fixedly connected to the top of the base and within the inner cavity of the positioning frame, and electric telescopic rods fixedly connected to both sides of the bottom of the inner cavity of the base. The output shaft of the electric telescopic rod passes through the base and is fixedly connected to two L-shaped fixing plates. Two pressure plates are fixedly connected to the end of each L-shaped fixing plate away from the electric telescopic rod. The semiconductor chip polishing mechanism also includes: A drive mechanism is located inside the base cavity and is used to facilitate the cleaning of waste debris; A cleaning mechanism, located on top of the base, is used to clean up waste debris.

[0007] The drive mechanism includes: a motor, a lead screw, a threaded sleeve, a connecting plate, a horizontal plate, and a vertical plate; In a preferred embodiment of this utility model, the motor is fixedly installed on the left side of the base. The output end of the motor is fixedly connected to the lead screw. The right side of the lead screw passes through the left side of the base and is rotatably connected to the right side of the inner cavity of the base via a rotating shaft. Both sides of the surface of the lead screw are movably connected to the inner cavity of the threaded sleeve. The front side of the threaded sleeve is fixedly connected to a connecting plate. There are two connecting plates. Both sides of the rear side of the horizontal plate are fixedly connected to the end of the connecting plate away from the threaded sleeve. Both sides of the top of the horizontal plate are fixedly connected to vertical plates. There are two vertical plates. The top of the vertical plates passes through the base. As a preferred embodiment of this utility model, the cleaning mechanism includes: a scraper, an adapter plate, a vacuum cleaner, a vacuum hose, a flow guide box, and a vacuum head; The top of the two vertical plates on opposite sides is fixedly connected to the scraper, and the back of the vertical plates is fixedly connected to the adapter plate. There are two adapter plates. The vacuum cleaner is fixedly installed on the back of the inner cavity of the base. The top of the vacuum cleaner passes through the base and is connected to the suction pipe. The end of the suction pipe away from the vacuum cleaner is connected to the flow guide box. Both sides of the front of the flow guide box are fixedly connected to the back of the adapter plate. The bottom of the flow guide box is connected to the suction head. There are six suction heads.

[0008] As a preferred embodiment of this utility model, a limiting sleeve is fixedly connected to the bottom of the threaded sleeve, and a limiting rod is slidably connected to the inner cavity of the limiting sleeve. Both sides of the limiting rod are fixedly connected to the inner wall of the base.

[0009] As a preferred embodiment of this utility model, a collection box is slidably connected to the front side of the bottom of the base cavity, and the front side of the collection box passes through the base and is fixedly connected to a handle.

[0010] As a preferred embodiment of this utility model, the base has limit openings on the top and both sides of the processing plate, and the limit openings are adapted to the vertical plate.

[0011] As a preferred embodiment of this utility model, a chip discharge port is provided on the top of the base and on the front side of the processing plate, and the chip discharge port is adapted to the collection box.

[0012] Beneficial effects: 1. By turning on the motor to drive the lead screw to rotate, the lead screw drives the threaded sleeve and connecting plate to move, the connecting plate drives the horizontal plate and vertical plate to move, which in turn drives the cleaning mechanism to move, thus improving the cleaning effect of the cleaning mechanism; 2. When the vertical plate moves, it drives the scraper to move. As the scraper moves, it pushes the waste from the waste discharge port into the collection box. By turning on the vacuum cleaner and cooperating with the vacuum hose, the guide box and the vacuum head, the fine waste can be further adsorbed. In this invention, the combined use of the drive mechanism and the cleaning mechanism can clean up the waste on the base and the processing board, preventing the waste from affecting the processing quality of the chip. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a right view of the electric push rod and collection box of this utility model; Figure 3 This is a top view of the base and handle of this utility model; Figure 4 This is a top view of the motor and flow guide box of this utility model.

[0014] In the diagram: 1. Base; 2. Positioning frame; 3. Electric push rod; 4. Grinding assembly; 5. Processing plate; 6. Electric telescopic rod; 7. L-shaped fixing plate; 8. Pressure plate; 9. Motor; 10. Lead screw; 11. Threaded sleeve; 12. Connecting plate; 13. Horizontal plate; 14. Vertical plate; 15. Scraper; 16. Adapter plate; 17. Vacuum cleaner; 18. Vacuum hose; 19. Flow guide box; 20. Vacuum head; 21. Limiting sleeve; 22. Limiting rod; 23. Collection box; 24. Handle. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Example Reference Figures 1-4 A semiconductor chip polishing mechanism includes a base 1, a positioning frame 2 fixedly connected to the top of the base 1, an electric push rod 3 fixedly connected to the top of the inner cavity of the positioning frame 2, a polishing assembly 4 fixedly connected to the output shaft of the electric push rod 3, a processing plate 5 fixedly connected to the top of the base 1 and located within the inner cavity of the positioning frame 2, and electric telescopic rods 6 fixedly connected to both sides of the bottom of the inner cavity of the base 1. The output shaft of the electric telescopic rod 6 passes through the base 1 and is fixedly connected to an L-shaped fixing plate 7. There are two L-shaped fixing plates 7. A pressure plate 8 is fixedly connected to the end of the L-shaped fixing plate 7 away from the electric telescopic rod 6. There are two pressure plates 8. The semiconductor chip polishing mechanism also includes: The drive mechanism is located in the inner cavity of the base 1 and is used to facilitate the cleaning of waste debris. The cleaning mechanism is located on top of the base 1 and is used to clean up waste debris.

[0017] In this utility model, the driving mechanism includes: a motor 9, a lead screw 10, a threaded sleeve 11, a connecting plate 12, a horizontal plate 13, and a vertical plate 14; Motor 9 is fixedly installed on the left side of base 1. The output end of motor 9 is fixedly connected to lead screw 10. The right side of lead screw 10 passes through the left side of base 1 and is rotatably connected to the right side of the inner cavity of base 1 through a rotating shaft. Both sides of the surface of lead screw 10 are movably connected to the inner cavity of threaded sleeve 11. The front side of threaded sleeve 11 is fixedly connected to connecting plate 12. There are two connecting plates 12. Both sides of the rear side of horizontal plate 13 are fixedly connected to the end of connecting plate 12 away from threaded sleeve 11. Both sides of the top of horizontal plate 13 are fixedly connected to vertical plate 14. There are two vertical plates 14. The top of vertical plate 14 passes through base 1. By turning on motor 9, lead screw 10 is driven to rotate. Then lead screw 10 drives threaded sleeve 11 and connecting plate 12 to move. Connecting plate 12 drives horizontal plate 13 and vertical plate 14 to move, which in turn drives cleaning mechanism to move, improving the cleaning effect of cleaning mechanism.

[0018] In this utility model, the cleaning mechanism includes: a scraper 15, an adapter plate 16, a vacuum cleaner 17, a vacuum hose 18, a flow guide box 19, and a vacuum head 20; The top of the two vertical plates 14 on opposite sides is fixedly connected to the scraper 15. The rear side of the vertical plates 14 is fixedly connected to the adapter plate 16. There are two adapter plates 16. The vacuum cleaner 17 is fixedly installed on the rear side of the inner cavity of the base 1. The top of the vacuum cleaner 17 passes through the base 1 and is connected to the suction pipe 18. The end of the suction pipe 18 away from the vacuum cleaner 17 is connected to the guide box 19. Both sides of the front side of the guide box 19 are fixedly connected to the rear side of the adapter plate 16. The bottom of the guide box 19 is connected to the suction head 20. There are six suction heads 20. When the vertical plates 14 move, they drive the scraper 15 to move. When the scraper 15 moves, it pushes the waste from the waste discharge port into the collection box 23. By turning on the vacuum cleaner 17 and cooperating with the suction pipe 18, the guide box 19 and the suction head 20, fine waste can be further adsorbed.

[0019] In this invention, in order to improve the stability of the movement of the threaded sleeve 11, Figure 4 The bottom of the threaded sleeve 11 is fixedly connected to a limiting sleeve 21, and the inner cavity of the limiting sleeve 21 is slidably connected to a limiting rod 22. Both sides of the limiting rod 22 are fixedly connected to the inner wall of the base 1, thereby achieving the purpose of improving the stability of the threaded sleeve 11 when it moves.

[0020] In this invention, to facilitate the collection of waste materials by workers, Figure 3 A collection box 23 is slidably connected to the front side of the bottom of the inner cavity of the base 1 shown. The front side of the collection box 23 passes through the base 1 and is fixedly connected to the handle 24, thereby achieving the purpose of collecting waste.

[0021] In this utility model, in order to facilitate the movement of the vertical plate 14, Figure 3The base 1 shown has limit openings on its top and on both sides of the processing plate 5. The limit openings are adapted to the vertical plate 14, thereby facilitating the movement of the vertical plate 14.

[0022] In this utility model, in order to facilitate the removal of waste chips, Figure 3 The base 1 shown has a chip discharge port on its top and in front of the processing plate 5. The chip discharge port is adapted to the collection box 23, thereby achieving the purpose of conveniently removing waste chips.

[0023] It should be noted that all electrical equipment used in this application is powered by an external power source. The specific models of electric push rod 3, grinding assembly 4, vacuum cleaner 17, motor 9, and electric telescopic rod 6 used can be selected by those skilled in the art. Furthermore, the electric push rod 3, grinding assembly 4, vacuum cleaner 17, motor 9, and electric telescopic rod 6 mentioned above are all existing technologies, and will not be elaborated upon in this solution.

[0024] The working principle of this utility model is as follows: In use, the worker places the unpolished chip on the processing board 5. Then, the electric telescopic rod 6 is activated, moving the L-shaped fixing plate 7 and the pressure plate 8 to fix the chip. Subsequently, the electric push rod 3 is activated, driving the polishing assembly 4 to polish the chip. After polishing, the electric push rod 3 and the electric telescopic rod 6 are reset. The worker then removes the chip. Then, the motor 9 and the vacuum cleaner 17 are simultaneously powered on. First, the motor 9 drives the lead screw 10 to rotate, and then the lead screw 10 drives the threaded sleeve 11 and... The connecting plate 12 moves, which in turn moves the horizontal plate 13 and the vertical plate 14. When the vertical plate 14 moves, it drives the scraper 15 to move. When the scraper 15 moves, it pushes the waste from the waste discharge port into the collection box 23. Then, by turning on the vacuum cleaner 17 and cooperating with the vacuum pipe 18, the guide box 19 and the vacuum head 20, the fine waste can be further adsorbed. In addition, through the cooperation of the drive mechanism and the cleaning mechanism, the waste on the base 1 and the processing plate 5 can be cleaned to prevent the waste from affecting the processing quality of the chip.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip polishing mechanism, comprising a base (1), a positioning frame (2) fixedly connected to the top of the base (1), an electric push rod (3) fixedly connected to the top of the inner cavity of the positioning frame (2), a polishing assembly (4) fixedly connected to the output shaft of the electric push rod (3), a processing plate (5) fixedly connected to the top of the base (1) and located in the inner cavity of the positioning frame (2), and electric telescopic rods (6) fixedly connected to both sides of the bottom of the inner cavity of the base (1), the output shaft of the electric telescopic rod (6) passing through the base (1) and fixedly connected to an L-shaped fixing plate (7), the number of L-shaped fixing plates (7) being two, and a pressure plate (8) fixedly connected to the end of the L-shaped fixing plate (7) away from the electric telescopic rod (6), the number of pressure plates (8) being two, characterized in that, The semiconductor chip polishing mechanism also includes: The drive mechanism is located in the inner cavity of the base (1). The drive mechanism is used to facilitate the cleaning of waste. The drive mechanism includes: a motor (9), a lead screw (10), a threaded sleeve (11), a connecting plate (12), a horizontal plate (13), and a vertical plate (14). The motor (9) is fixedly installed on the left side of the base (1). The output end of the motor (9) is fixedly connected to the lead screw (10). The right side of the lead screw (10) passes through the left side of the base (1) and is rotatably connected to the right side of the inner cavity of the base (1) through the rotating shaft. Both sides of the surface of the lead screw (10) are movably connected to the inner cavity of the threaded sleeve (11). The front side of the threaded sleeve (11) is fixedly connected to the connecting plate (12). There are two connecting plates (12). Both sides of the rear side of the horizontal plate (13) are fixedly connected to the end of the connecting plate (12) away from the threaded sleeve (11). Both sides of the top of the horizontal plate (13) are fixedly connected to the vertical plate (14). There are two vertical plates (14). The top of the vertical plate (14) passes through the base (1). The cleaning mechanism is located on the top of the base (1) and is used to clean up waste. The cleaning mechanism includes: a scraper (15), an adapter plate (16), a vacuum cleaner (17), a suction pipe (18), a flow guide box (19), and a suction head (20). The top of the two vertical plates (14) on opposite sides is fixedly connected to the scraper (15), and the rear side of the vertical plate (14) is fixedly connected to the adapter plate (16). There are two adapter plates (16). The vacuum cleaner (17) is fixedly installed on the rear side of the inner cavity of the base (1). The top of the vacuum cleaner (17) passes through the base (1) and is connected to the suction pipe (18). The end of the suction pipe (18) away from the vacuum cleaner (17) is connected to the guide box (19). Both sides of the front side of the guide box (19) are fixedly connected to the rear side of the adapter plate (16). The bottom of the guide box (19) is connected to the suction head (20). There are six suction heads (20).

2. The semiconductor chip polishing mechanism according to claim 1, characterized in that, The bottom of the threaded sleeve (11) is fixedly connected to the limiting sleeve (21), and the inner cavity of the limiting sleeve (21) is slidably connected to the limiting rod (22). Both sides of the limiting rod (22) are fixedly connected to the inner wall of the base (1).

3. The semiconductor chip polishing mechanism according to claim 1, characterized in that, A collection box (23) is slidably connected to the front side of the bottom of the inner cavity of the base (1). The front side of the collection box (23) passes through the base (1) and is fixedly connected to a handle (24).

4. The semiconductor chip polishing mechanism according to claim 1, characterized in that, Limiting openings are provided on the top of the base (1) and on both sides of the processing plate (5), and the limiting openings are adapted to the vertical plate (14).

5. A semiconductor chip polishing mechanism according to claim 1, characterized in that, A chip discharge port is provided on the top of the base (1) and in front of the processing plate (5), and the chip discharge port is adapted to the collection box (23).

Images