Cleaning device for a polishing apparatus

Abstract

The embodiment of the present application relates to the polishing technical field, and discloses a cleaning device for polishing equipment.The cleaning device comprises a cylinder, a shielding piece and a cleaning piece.The cylinder is provided with a containing cavity and an opening communicated with the containing cavity.The shielding piece is arranged around the opening in a direction of orientation, and part of the shielding piece is located in the containing cavity.The shielding piece can be moved along the direction of orientation of the opening to cover at least part of the polishing head.The cleaning piece is connected with the cylinder, and the cleaning piece is provided with a fluid channel and a liquid jet opening communicated with the fluid channel.The cleaning liquid in the fluid channel can be sprayed to the surface of the polishing head covered by the shielding piece through the liquid jet opening to clean the polishing head and the wafer.The cleaning device for polishing equipment provided by the embodiment of the present application can prevent the crystallization of residual polishing liquid on the surface of the wafer and external pollution when the polishing head is waiting, and improve the polishing quality.

Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to a cleaning device for polishing equipment. Background Technology

[0002] During the chemical mechanical polishing (CMP) process of wafers, the polishing slurry is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, allowing the wafer to complete the CMP process through a combination of chemical and mechanical action. In practice, while the polishing head is waiting for the polishing pad cleaning device to clean the polishing pad, the residual polishing slurry on the wafer surface is prone to crystallization and may be contaminated by the environment, resulting in a decrease in polishing quality. Therefore, how to prevent the crystallization of residual polishing slurry and external contamination on the wafer surface while the polishing head is waiting, and thus improve polishing quality, is an important issue. Utility Model Content

[0003] The purpose of this application is to provide a cleaning device for polishing equipment, which can prevent the crystallization of residual polishing liquid and external contamination on the wafer surface while the polishing head is waiting, thereby improving the polishing quality.

[0004] To address the aforementioned technical problems, embodiments of this application provide a cleaning apparatus for polishing equipment. The cleaning apparatus includes a cylindrical body, a shielding member, and a cleaning member. The cylindrical body has a receiving cavity and an opening communicating with the receiving cavity. The shielding member is disposed around the orientation of the opening, and a portion of the shielding member is located within the receiving cavity. The shielding member is movable along the orientation of the opening to cover at least a portion of the polishing head. The cleaning member is connected to the cylindrical body and has a fluid channel and a spray nozzle communicating with the fluid channel. Cleaning fluid within the fluid channel can be sprayed through the spray nozzle onto the surface of the polishing head covered by the shielding member to clean the polishing head and the wafer.

[0005] The cleaning apparatus for polishing equipment provided in this application provides a specific area for cleaning the polishing head and wafer through a cylindrical body, and provides a space for containing the cleaning fluid. The polishing head can be moved to the cleaning area by other components, and the shielding member can move along the orientation direction of the opening of the cylindrical body after the polishing head is positioned in the cleaning area, thereby irradiating at least a portion of the polishing head. Then, under the action of the cleaning fluid in the fluid channel of the cleaning member, the polishing head and wafer are cleaned, thereby achieving cleaning of the polishing head and wafer, preventing the crystallization of residual polishing fluid on the wafer surface and preventing external contamination of the wafer while the polishing head is waiting, thus improving the polishing quality.

[0006] In some embodiments, the cleaning component includes a connected mounting portion and an extension portion. The mounting portion is connected to the wall of the receiving cavity, and a fluid channel is provided within the mounting portion and / or the extension portion. Thus, the cleaning component can be installed via the mounting portion, and the cleaning range of the cleaning component can be expanded via the extension portion.

[0007] In some embodiments, the mounting portion extends in the direction the opening faces, and the extension portion extends in a direction perpendicular to the direction the opening faces. In this way, by having the mounting portion and the extension portion extend in different directions, they can be cleaned in different areas.

[0008] In some embodiments, the cylinder body is further provided with a liquid inlet communicating with the receiving cavity, and the extension is provided with an inlet communicating with the fluid channel, with the inlet and the liquid inlet connected. In this way, the cleaning fluid inside the cleaning component can be easily replenished through the liquid inlet of the cylinder body and the inlet of the extension.

[0009] In some embodiments, the blocking member includes a first part and a second part connected together. The first part is movable within the receiving cavity, and a stepped surface opposite to the edge of the cylinder is provided at the connection between the first part and the second part. The second part is restricted outside the receiving cavity by the stepped surface. In this way, the moving position of the blocking member can be limited by the stepped surface, which facilitates the movement and positioning of the blocking member.

[0010] In some embodiments, the cylinder is further provided with a driving component, the output end of which is connected to a blocking component, allowing the blocking component to move under the drive of the driving component. This allows the blocking component to be driven by the driving component, facilitating automatic control.

[0011] In some embodiments, the receiving cavity includes a side surface adjacent to the opening and a bottom surface connected to the side surface, the bottom surface being inclined relative to the opening. This inclined bottom surface facilitates the collection of cleaning fluid after the cleaning process is completed.

[0012] In some embodiments, the cylinder is also provided with a drain outlet that connects the receiving cavity to the outside, and the drain outlet is located on the bottom surface at a position far from the opening. In this way, the cleaning fluid collected in the receiving cavity can be effectively discharged through the drain outlet.

[0013] In some embodiments, the cylindrical body includes a connected arcuate portion and a protruding portion. The arcuate portion has a notch, and the protruding portion connects to the notch, forming a receiving cavity with the arcuate portion. In this way, the arcuate portion can adapt to the shape of the polishing head, while the protruding portion can avoid affecting the polishing head's entry into the appropriate cleaning area.

[0014] In some embodiments, the mounting portion is positioned adjacent to the protruding portion. This allows the mounting portion to be located in a position that does not interfere with the polishing head, ensuring that the polishing head and wafer are effectively cleaned. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0016] Figure 1 This is a three-dimensional structural diagram of a cleaning device for polishing equipment provided in some embodiments of this application when it is in a non-working state; Figure 2 This is a cross-sectional structural diagram of a cleaning device for polishing equipment provided in some embodiments of this application when it is in a non-working state; Figure 3 This is a schematic diagram of the surface structure of a cleaning device for polishing equipment provided in some embodiments of this application when it is in operation. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of this application to enable readers to better understand this application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in this application can be implemented. The division of the various embodiments below is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0019] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0020] Chemical mechanical polishing (CMP) is an ultra-precision surface finishing technique that achieves global planarization. In CMP, the wafer is typically held against the bottom surface of a polishing head, with the other side of the wafer pressed against the upper surface of a polishing pad. The polishing head rotates in the same direction as the polishing pad under the actuation of a drive assembly, applying a downward load to the wafer. Simultaneously, polishing fluid is supplied to the upper surface of the polishing pad and distributed between the wafer and the pad, allowing the wafer to undergo chemical and mechanical polishing through a combination of chemical and mechanical processes. CMP typically requires multiple polishing steps.

[0021] Multiple polishing processes are usually achieved using polishing pads and polishing fluids of different materials. Before the polishing head enters different polishing processes, it is necessary to wait for the polishing pad cleaning device to clean the polishing pad. At this time, the polishing fluid remaining on the wafer surface is prone to crystallization and may be contaminated by the environment if exposed, resulting in a decline in polishing quality.

[0022] To prevent residual polishing slurry crystallization and external contamination on the wafer surface while the polishing head is waiting, and to improve polishing quality, some embodiments of this application provide a cleaning apparatus for polishing equipment. The cleaning apparatus uses a cleaning component to rinse the wafer surface and the polishing head surface, and uses a shielding component to shield the cleaning slurry, preventing splashing during the cleaning process. This achieves thorough cleaning of the wafer and polishing head, preventing residual polishing slurry crystallization on the wafer surface and external contamination of the wafer while the polishing head is waiting, thus improving polishing quality.

[0023] The following is combined with Figures 1 to 3 This application describes a cleaning apparatus for polishing equipment provided in some embodiments.

[0024] like Figures 1 to 3 As shown in some embodiments of this application, a cleaning apparatus for polishing equipment includes a cylindrical body 11, a shielding member 12, and a cleaning member 13. The cylindrical body 11 has a receiving cavity 101 and an opening 102 communicating with the receiving cavity 101. The shielding member 12 is arranged around the orientation direction of the opening 102, and a portion of the shielding member 12 is located within the receiving cavity 101. The shielding member 12 can move along the orientation direction of the opening 102 to cover at least a portion of the polishing head 20. The cleaning member 13 is connected to the cylindrical body 11 and has a fluid channel 131 and a spray nozzle 132 communicating with the fluid channel 131. Cleaning fluid in the fluid channel 131 can be sprayed through the spray nozzle 132 onto the surface of the polishing head 20 covered by the shielding member 12 to clean the polishing head 20 and the wafer.

[0025] The cylinder 11 is the part of the cleaning device that provides the cleaning area. The receiving cavity 101 of the cylinder 11 provides a cleaning area and a space for the cleaning fluid, so that the cleaning fluid can be collected in the receiving cavity 101 after the cleaning work is completed. The opening 102 of the cylinder 11 facilitates the entry of the polishing head 20 into the cleaning area. The polishing head 20 can reach the cleaning position at the opening 102 as the polishing arm swings.

[0026] The shielding member 12 is partially located within the receiving cavity 101, serving to shield the cleaning fluid. After the polishing head 20 reaches the cleaning position, the shielding member 12 can move along the orientation direction of the opening 102 to cover at least a portion of the polishing head 20, that is, to surround at least a portion of the polishing head 20. During the cleaning process of the cleaning fluid on the polishing head 20 and the wafer, it will splash to the surroundings. Under the shielding effect of the shielding member 12, the cleaning fluid can be prevented from splashing into the surrounding environment outside the receiving cavity 101.

[0027] The cleaning component 13 is the part of the cleaning apparatus that performs the cleaning function. The cleaning component 13 is connected to the cylinder 11 and can be partially or entirely located within the cylinder wall of the cylinder 11. The fluid channel 131 within the cleaning component 13 provides flow and containment space for the cleaning fluid. Simultaneously, the cleaning component 13 is provided with a spray nozzle 132, which can be connected to a nozzle 130. The cleaning fluid within the fluid channel 131 can be sprayed onto the surface of the polishing head 20 through the spray nozzle 132, thereby cleaning the polishing head 20 and the wafer.

[0028] The cleaning apparatus for polishing equipment provided in some embodiments of this application provides a specific area for cleaning the polishing head 20 and the wafer through a cylinder 11, and provides a space for containing the cleaning fluid. The polishing head 20 can be moved to the cleaning area by other components, and the shielding member 12 can move along the orientation direction of the opening 102 of the cylinder 11 after the polishing head 20 is in place in the cleaning area, thereby irradiating at least a portion of the polishing head 20. Then, under the action of the cleaning fluid in the fluid channel 131 of the cleaning member 13, the polishing head 20 and the wafer are cleaned, thereby achieving the cleaning of the polishing head 20 and the wafer, preventing the crystallization of residual polishing fluid on the wafer surface and the wafer from being contaminated by external sources while the polishing head 20 is waiting, thus improving the polishing quality.

[0029] In some embodiments, the cleaning component 13 may include a mounting portion 133 and an extension portion 134 connected together. The mounting portion 133 is connected to the cavity wall of the receiving cavity 101, and a fluid channel 131 is provided in the mounting portion 133 and / or the extension portion 134.

[0030] The mounting portion 133 connects the cleaning component 13 to the cylinder 11, and the extension portion 134 extends the cleaning range of the cleaning component 13. At least one of the mounting portion 133 and the extension portion 134 may be provided with a fluid channel 131. Simultaneously, at least one of the mounting portion 133 and the extension portion 134 may be provided with a spray nozzle 132. That is, the cleaning fluid can flow within the mounting portion 133 or the extension portion 134, or it can be sprayed onto the surface of the polishing head 20 from the spray nozzle 132 on the mounting portion 133 or the spray nozzle 132 on the extension portion 134.

[0031] like Figure 2 and Figure 3 As shown, both the mounting portion 133 and the extension portion 134 are provided with spray nozzles 132. The spray nozzles 132 on the mounting portion 133 and the extension portion 134 spray cleaning fluid towards different positions on the surface of the polishing head 20. The mounting portion 133 can have one spray nozzle 132, and the extension portion 134 can have four spray nozzles 132. When the cleaning fluid is sprayed from different spray nozzles 132, it forms a water curtain, thereby covering the polishing head 20 and the wafer. During the cleaning process, the polishing head 20 can be slowly rotated so that different positions on the polishing head 20 and the wafer can be cleaned.

[0032] The mounting part 133 and the extension part 134 can be integrally formed, or they can be separate structures and fitted together to form the cleaning part 13.

[0033] In addition, the mounting portion 133 may be provided to extend in the direction of the opening 102, and the extension portion 134 may be provided to extend in the direction perpendicular to the direction of the opening 102.

[0034] In other words, the mounting portion 133 is disposed adjacent to the side wall of the cylinder 11, and the extension portion 134 is disposed adjacent to the bottom wall of the cylinder 11. In this way, after the polishing head 20 moves to the cleaning area, the spray nozzle 132 on the mounting portion 133 can spray cleaning fluid toward the side 1011 of the polishing head 20, and the spray nozzle 132 on the extension portion 134 can spray cleaning fluid toward the bottom surface 1012 of the polishing head 20.

[0035] Meanwhile, to accommodate the cleaning of the polishing head 20 and the wafer, the number and space occupied by the spray nozzles 132 on the mounting portion 133 and the extension portion 134 can be appropriately increased. This ensures that all areas on the polishing head 20 and the wafer that require cleaning can be cleaned.

[0036] In practice, the cleaning component 13 can also be set in a ring shape or other irregular shape.

[0037] like Figure 3As shown, the cylinder 11 may also be provided with a liquid inlet 103 communicating with the receiving cavity 101, and the extension 134 is provided with an inlet 135 communicating with the fluid channel 131, and the inlet 135 is communicating with the liquid inlet 103.

[0038] This allows for easy connection between the fluid channel 131 inside the cleaning component 13 and the device providing cleaning fluid outside the cylinder 11, facilitating the entry of cleaning fluid from outside the cylinder 11 into the fluid channel 131 of the cleaning component 13 surrounded by the cylinder 11. Furthermore, it allows for replenishment of the cleaning fluid within the fluid channel 131 of the cleaning component 13, enabling effective cleaning of the polishing head 20 and the wafer.

[0039] In practice, pipe fittings can be connected to the inlet 135 and the liquid inlet 103 respectively, and the pipe 136 can be connected through the pipe fittings.

[0040] In some embodiments, the shielding member 12 may include a first part 121 and a second part 122 connected together. The first part 121 is movable within the receiving cavity 101. A stepped surface 123 opposite to the edge of the cylinder 11 is provided at the connection between the first part 121 and the second part 122. The second part 122 is restricted outside the receiving cavity 101 via the stepped surface 123.

[0041] In other words, the shielding member 12 may include a first portion 121 that moves within the receiving cavity 101 and a second portion 122 that moves outside the receiving cavity 101. At least a portion of the outer contour of the second portion 122 extends beyond the outer contour of the first portion 121, thereby forming a stepped surface 123 at the connection between the first portion 121 and the second portion 122. The first portion 121, being within the receiving cavity 101, ensures that the cleaning fluid shielded by the shielding member 12 can flow into the receiving cavity 101, thereby preventing the cleaning fluid from splashing out of the receiving cavity 101. The second portion 122 can shield the cleaning fluid when it moves to cover at least a portion of the polishing head 20, preventing cleaning fluid splashing. At the same time, the second portion 122 can be limited at the stepped surface 123, allowing the shielding member 12 to accurately return to its initial position during reset.

[0042] In practice, the bottom of the blocking member 12 can also be used for limiting the position. During the resetting process of the blocking member 12, the bottom of the blocking member 12 contacts the bottom of the cylinder 11, thereby completing the repositioning.

[0043] like Figure 1 As shown, the cylinder 11 may also be provided with a driving member 14, the output end of the driving member 14 is connected to the blocking member 12, and the blocking member 12 can move under the drive of the driving member 14.

[0044] The drive unit 14 facilitates the movement of the shielding member 12. When cleaning of the polishing head 20 and the wafer is required, the drive unit 14 activates, causing the shielding member 12 to move along the orientation of the opening 102, thus covering at least a portion of the polishing head 20. After cleaning of the polishing head 20 and the wafer is completed, or when cleaning of the polishing head 20 and the wafer is no longer required, the drive unit 14 can return the shielding member 12 to its initial position. The drive unit 14 can be a cylinder, motor, or other component with a driving function.

[0045] Additionally, the receiving cavity 101 may include a side surface 1011 adjacent to the opening 102 and a bottom surface 1012 connected to the side surface 1011, the bottom surface 1012 being inclined relative to the opening 102.

[0046] By setting the bottom surface 1012 of the receiving cavity 101 to be inclined at an angle, it can be ensured that the cleaning fluid can flow to a specific area of ​​the receiving cavity 101 so as to collect the cleaning fluid after the cleaning work is completed.

[0047] Alternatively, an inclined groove can be provided at the bottom surface 1012 of the receiving cavity 101 to guide the cleaning fluid, allowing the collected cleaning fluid to flow to a specific area.

[0048] like Figure 3 As shown, the cylinder 11 may also be provided with an outlet 104 that connects the receiving cavity 101 to the outside. The outlet 104 is located on the bottom surface 1012 at a position far from the opening 102.

[0049] The cleaning fluid can be easily discharged through the outlet 104. The inclined bottom surface 1012 of the receiving cavity 101 allows the cleaning fluid collected in the receiving cavity 101 to be effectively discharged.

[0050] In some embodiments, the cylindrical body 11 may include an arcuate portion 111 and a protruding portion 112 connected together. The arcuate portion 111 is provided with a notch, and the protruding portion 112 is connected to the notch and together with the arcuate portion 111 forms a receiving cavity 101.

[0051] In other words, the cylinder 11 is configured with an irregular shape with protruding portions 112. This provides space for the placement of the cleaning component 13 and avoids obstructing the polishing head 20.

[0052] In addition, the shape of the shielding member 12 can correspond to that of the cylinder 11. That is, the shielding member 12 can also be provided as a columnar body with a protruding portion, so as to match the shape of the cylinder 11.

[0053] like Figure 2 As shown, the mounting part 133 can be disposed adjacent to the protruding part 112.

[0054] By placing the mounting part 133 near the protrusion 112, it is possible to avoid affecting the polishing head 20's entry into the appropriate cleaning position. At the same time, the cleaning fluid sprayed from the nozzle 132 on the mounting part 133 can clean the side 1011 of the polishing head 20.

[0055] The cleaning apparatus provided in some embodiments of this application may have two states in actual use. For example... Figure 2 In the non-working state shown, i.e., when not in the cleaning state, the supply of cleaning fluid at the inlet 103 can be stopped by the control device. The drive unit 14 drives the shielding member 12 to descend to the initial position.

[0056] In such Figure 3 In the operating state shown, i.e., during the cleaning process, the polishing arm swings, moving the polishing head 20 to the cleaning position. The drive unit 14 causes the shielding member 12 to rise, thus shielding at least a portion of the polishing head 20. The control device controls the supply of cleaning fluid at the inlet 103. The cleaning fluid is supplied to the nozzle 130 through the pipe 136, connector, and fluid channel 131 within the cleaning member 13. The nozzle 130 sprays out a water curtain that covers the wafer and polishing head 20. At this time, the polishing head 20 rotates slowly for cleaning and moisturizing. The cleaning fluid washes over the polishing head 20 and, after being shielded by the shielding member 12, converges at the bottom of the receiving cavity 101. Finally, it is discharged from the outlet 104.

[0057] Those skilled in the art will understand that the above embodiments are specific implementations of this application, and in practical applications, various changes can be made in form and detail without departing from the spirit and scope of this application.

Claims

1. A cleaning device for polishing equipment, characterized in that, include: The cylindrical body is provided with a receiving cavity and an opening communicating with the receiving cavity; A shielding member is disposed around the orientation direction of the opening, and a portion of the shielding member is located in the receiving cavity. The shielding member is movable along the orientation direction of the opening to cover at least a portion of the polishing head inside. A cleaning component is connected to the cylinder. The cleaning component is provided with a fluid channel and a spray nozzle communicating with the fluid channel. The cleaning fluid in the fluid channel can be sprayed through the spray nozzle onto the surface of the polishing head covered by the shielding component to clean the polishing head and the wafer.

2. The cleaning device for polishing equipment according to claim 1, characterized in that: The cleaning component includes a connected mounting portion and an extension portion. The mounting portion is connected to the cavity wall of the receiving cavity, and the fluid channel is provided in the mounting portion and / or the extension portion.

3. The cleaning device for polishing equipment according to claim 2, characterized in that: The mounting portion extends along the orientation direction of the opening, and the extension portion extends in a direction perpendicular to the orientation direction of the opening.

4. The cleaning device for polishing equipment according to claim 2, characterized in that: The cylinder is also provided with a liquid inlet communicating with the receiving cavity, and the extension is provided with an inlet communicating with the fluid channel. The inlet is connected to the liquid inlet.

5. The cleaning device for polishing equipment according to claim 1, characterized in that: The shielding member includes a first part and a second part connected together. The first part is movable within the receiving cavity. A stepped surface opposite to the edge of the cylinder is provided at the connection between the first part and the second part. The second part is restricted outside the receiving cavity via the stepped surface.

6. The cleaning device for polishing equipment according to claim 1, characterized in that: The cylinder is also provided with a driving component, the output end of which is connected to the blocking component, and the blocking component can move under the drive of the driving component.

7. The cleaning device for polishing equipment according to claim 1, characterized in that: The receiving cavity includes a side surface adjacent to the opening and a bottom surface connected to the side surface, the bottom surface being inclined relative to the opening.

8. The cleaning apparatus for polishing equipment according to claim 7, characterized in that: The cylinder is also provided with an outlet that connects the receiving cavity to the outside, and the outlet is located on the bottom surface at a position far from the opening.

9. The cleaning device for polishing equipment according to claim 2, characterized in that: The cylindrical body includes a connected arc-shaped portion and a protruding portion. The arc-shaped portion has a notch, and the protruding portion is connected to the notch and together with the arc-shaped portion forms the receiving cavity.

10. The cleaning apparatus for polishing equipment according to claim 9, characterized in that: The mounting portion is disposed adjacent to the protruding portion.

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