A vibration-damping polishing grinding head

Abstract

The utility model relates to a kind of damping type polishing grinding head, including support rod, buffer assembly and polishing head, the support rod and buffer assembly fixed connection, buffer assembly and the polishing head between being equipped with connecting plate, buffer assembly is fixed connection by the connecting plate and the polishing head. The design of the utility model can absorb and isolate harmful vibration in polishing process, impact force can also be absorbed, and the stability, precision and product surface quality of polishing process are effectively optimized.

Description

Technical Field

[0001] This utility model relates to the field of optical component processing technology, and in particular to a vibration-damping polishing head. Background Technology

[0002] Sapphire (α-Al2O3), commonly known as corundum, possesses excellent optical, thermal, dielectric, and mechanical properties, making it a multifunctional crystal material with superior comprehensive performance. The application of sapphire in consumer electronics has opened up new market opportunities for the sapphire industry beyond LED applications. Traditional rigid metal fixtures are prone to causing localized stress concentration, leading to edge chipping and microcracks; 3D curved workpieces (such as camera protective covers and curved watch lenses) have areas of abrupt curvature changes, and rigid fixtures often fail to provide adequate fit. For example, patent document CN111843798A, entitled "A Fixture Structure for Polishing Sapphire Mobile Phone Screens," discloses a fixture structure for polishing sapphire mobile phone screens. This structure uses a copper rod with multiple grooves containing polishing paste. During the polishing process of the 3D sapphire mobile phone screen, the polishing paste continuously flows out under the centrifugal force of the rotating copper rod, achieving high-quality polishing of the sapphire mobile phone screen.

[0003] However, the aforementioned rigid grinding head cannot reduce the chipping rate when processing sapphire grooves, and the copper rod cannot absorb high-frequency vibrations, resulting in a high risk of microcracks in the sapphire. Therefore, it is necessary to develop a newer technological design with a simple structure that is not limited to polishing external curved surfaces and can handle the processing of concave root surfaces, thereby solving the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a vibration-damping polishing head to solve the problems in the background technology, such as the inability of rigid grinding heads to reduce edge chipping rate when processing sapphire grooves, the inability of copper rods to absorb high-frequency vibrations, and the high risk of microcracks in sapphire.

[0005] This utility model provides the following technical solution: a vibration-damping polishing head, including a support rod, a buffer assembly and a polishing head, wherein the support rod and the buffer assembly are fixedly connected, a connecting plate is provided between the buffer assembly and the polishing head, and the buffer assembly is fixedly connected to the polishing head through the connecting plate.

[0006] Preferably, the buffer component is made of silicone.

[0007] Preferably, the polishing head is made of polyurethane.

[0008] Preferably, a first connecting component is provided on the support rod and the buffer assembly, and the support rod is fixedly connected to the buffer assembly through the first connecting component.

[0009] Preferably, the first connecting component includes a connecting protrusion and a connecting groove, the connecting protrusion and the connecting groove being matched, the connecting protrusion being disposed on the support rod and the connecting groove being disposed on the buffer component, or the connecting protrusion being disposed on the buffer component and the connecting groove being disposed on the support rod.

[0010] Preferably, a second connecting component is provided between the buffer component and the connecting plate, and the buffer component is fixedly connected to the connecting plate through the second connecting component.

[0011] Preferably, the second connecting component includes a second connecting protrusion and a second connecting groove, the second connecting protrusion and the second connecting groove being matched, the second connecting protrusion being disposed on the connecting plate and the second connecting groove being disposed on the buffer component, or the second connecting protrusion being disposed on the buffer component and the second connecting groove being disposed on the connecting plate.

[0012] Preferably, a third connecting component is provided between the connecting plate and the polishing head, and the connecting plate is connected to the polishing head through the third connecting component.

[0013] Preferably, the third connecting component includes a connecting protrusion three and a connecting hole, the connecting protrusion three and the connecting hole being matched, the connecting protrusion three being disposed on the connecting plate, and the connecting hole being disposed on the polishing head.

[0014] Preferably, the support rod is a bakelite rod.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model discloses a vibration-damping polishing head, comprising a support rod, a buffer assembly, and a polishing head. The support rod and the buffer assembly are fixedly connected, and a connecting plate is provided between the buffer assembly and the polishing head. The buffer assembly is fixedly connected to the polishing head through the connecting plate. The buffer assembly can absorb and isolate harmful vibrations during the polishing process, as well as absorb impact forces, effectively optimizing the stability, precision, and surface quality of the polishing process.

[0016] 2. The vibration-damping polishing head of this invention uses silicone as the buffer component. The damping properties of silicone help absorb vibrations and impacts generated during polishing, making the polishing process smoother and contributing to a smoother surface finish. It also buffers polishing pressure, preventing localized overpressure that could scratch or dent the glass surface. During the polishing of three-dimensional curved surfaces, the elasticity of the silicone allows for a slight, flexible displacement of the polishing head. This flexible displacement better conforms to the curvature changes of the glass surface, preventing excessive or insufficient localized polishing pressure.

[0017] 3. The vibration-damping polishing head of this utility model is made of polyurethane. Polyurethane polishing heads have excellent wear resistance, allowing them to maintain their working condition for extended periods and reducing wear.

[0018] 4. The vibration-damping polishing head of this utility model has a first connecting component on the support rod and the buffer assembly. The support rod is fixedly connected to the buffer assembly through the first connecting component. The first connecting component includes a connecting protrusion and a connecting groove, which are matched. The connecting protrusion is disposed on the support rod, and the connecting groove is disposed on the buffer assembly, or the connecting protrusion is disposed on the buffer assembly, and the connecting groove is disposed on the support rod. Through this arrangement, the connecting protrusion is engaged in the connecting groove, which can fix the support rod and the buffer assembly together, and the structure is simple.

[0019] 5. The vibration-damping polishing head of this utility model has a second connecting component between the buffer component and the connecting plate. The buffer component is fixedly connected to the connecting plate through the second connecting component. The second connecting component includes a second connecting protrusion and a second connecting groove. The second connecting protrusion and the second connecting groove are matched. The second connecting protrusion is disposed on the connecting plate, and the second connecting groove is disposed on the buffer component, or the second connecting protrusion is disposed on the buffer component, and the second connecting groove is disposed on the connecting plate. Through this arrangement, the second connecting protrusion is engaged in the second connecting groove, thereby achieving a fixed connection between the buffer component and the connecting plate, making the connection between the buffer component and the connecting plate firm.

[0020] 6. The vibration-damping polishing head of this utility model has a third connecting component between the connecting plate and the polishing head. The connecting plate is connected to the polishing head through the third connecting component. The third connecting component includes a connecting protrusion and a connecting hole. The connecting protrusion and the connecting hole are matched. The connecting protrusion is set on the connecting plate, and the connecting hole is set on the polishing head. Through this setting, the connecting protrusion is engaged in the connecting hole, realizing the connection between the connecting plate and the polishing head. The connection is firm and facilitates the replacement of the polishing head.

[0021] 7. The vibration-damping polishing head of this utility model has a support rod made of bakelite. Bakelite rods have good insulation, high temperature resistance, and corrosion resistance. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional schematic diagram of the vibration-damping polishing head of this utility model; Figure 2This is a cross-sectional view of the vibration-damping polishing head of this utility model; Figure 3 The explosion of the vibration-damping polishing head of this utility model Figure 1 ; Figure 4 The explosion of the vibration-damping polishing head of this utility model Figure 2 .

[0024] In each of the attached figures, 1 is the support rod; 2 is the buffer assembly; 3 is the polishing head; 4 is the connecting plate; 5 is the first connecting assembly, 51 is the first connecting protrusion, and 52 is the first connecting groove; 6 is the second connecting assembly, 61 is the second connecting protrusion, and 62 is the second connecting groove; 7 is the third connecting assembly, 71 is the third connecting protrusion, and 72 is the connecting hole. Detailed Implementation

[0025] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0026] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0030] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0031] Furthermore, in this application, the technical features described in an open-ended manner include both closed technical solutions composed of the listed features and open technical solutions that include the listed features.

[0032] To further understand the utility model content, features, and effects of this application, the following embodiments are provided, and detailed descriptions are given below in conjunction with the accompanying drawings: like Figure 1-4 As shown, the vibration-damping polishing head includes a support rod 1, a buffer assembly 2, and a polishing head 3. The support rod 1 and the buffer assembly 2 are fixedly connected. A connecting plate 4 is provided between the buffer assembly 2 and the polishing head 3, and the buffer assembly 2 is fixedly connected to the polishing head 3 through the connecting plate 4. In this embodiment, the buffer assembly can absorb and isolate harmful vibrations during the polishing process, as well as absorb impact forces, effectively optimizing the stability, precision, and surface quality of the polishing process. Of course, it is not limited to this; other components capable of absorbing and isolating vibrations can be used.

[0033] Specifically, the buffer component 2 is made of silicone. In this embodiment, the damping properties of silicone help absorb vibrations and impacts generated during polishing, making the polishing process smoother and contributing to a smoother surface finish. It also buffers polishing pressure, preventing localized overpressure that could cause scratches or edge collapse on the glass surface. During the polishing of three-dimensional curved surfaces, the elasticity of silicone allows the polishing head to have a certain degree of flexible displacement. This flexible displacement better conforms to the curvature changes of the glass surface, preventing excessive or insufficient polishing pressure in certain areas. Excessive polishing pressure can lead to over-polishing or scratches, while insufficient polishing pressure can result in incomplete polishing. Of course, the material of the buffer component is not limited to this; it can be any other material capable of absorbing and isolating harmful vibrations during polishing and conforming to the curvature changes of the glass surface.

[0034] Specifically, the polishing head 3 is made of polyurethane. In this embodiment, the polyurethane polishing head has good wear resistance, allowing it to maintain its working condition for a long time and reducing wear. Of course, the material of the polishing head is not limited to this; it can be any other material with good wear resistance.

[0035] Specifically, a first connecting component 5 is provided on the support rod 1 and the buffer assembly 2, and the support rod 1 is fixedly connected to the buffer assembly 2 through the first connecting component 5. The first connecting component 5 includes a connecting protrusion 51 and a connecting groove 52, which are matched. The connecting protrusion 51 is disposed on the support rod 1, and the connecting groove 52 is disposed on the buffer assembly 2, or the connecting protrusion 51 is disposed on the buffer assembly 2, and the connecting groove 52 is disposed on the support rod 1. In this embodiment, the connecting protrusion is disposed on the support rod, and the connecting groove is disposed on the buffer assembly. With this arrangement, the connecting protrusion is engaged in the connecting groove, which can fix the support rod and the buffer assembly together, and the structure is simple. Of course, it is not limited to this; it can be any structure that can make the support rod and the buffer assembly firmly connected.

[0036] Specifically, a second connecting component 6 is provided between the buffer component 2 and the connecting plate 4, and the buffer component 2 is fixedly connected to the connecting plate 4 through the second connecting component 6. The second connecting component 6 includes a second connecting protrusion 61 and a second connecting groove 62. The second connecting protrusion 61 and the second connecting groove 62 are matched. The second connecting protrusion 61 is disposed on the connecting plate 4, and the second connecting groove 62 is disposed on the buffer component 2, or the second connecting protrusion 61 is disposed on the buffer component 2, and the second connecting groove 62 is disposed on the connecting plate 4. In this embodiment, the second connecting protrusion is disposed on the connecting plate, and the second connecting groove is disposed on the buffer component. Through this arrangement, the second connecting protrusion is engaged in the second connecting groove, thereby achieving a fixed connection between the buffer component and the connecting plate, making the connection between the buffer component and the connecting plate firm. Of course, it is not limited to this; any other component that can make the buffer component and the connecting plate firm can be used.

[0037] Specifically, a third connecting component 7 is provided between the connecting plate 4 and the polishing head 3, and the connecting plate 4 is connected to the polishing head 3 through the third connecting component 7. The third connecting component 7 includes a connecting protrusion 71 and a connecting hole 72. The connecting protrusion 71 and the connecting hole 72 are matched. The connecting protrusion 71 is disposed on the connecting plate 4, and the connecting hole 72 is disposed on the polishing head 3. In this embodiment, through this arrangement, the connecting protrusion is inserted into the connecting hole, realizing the connection between the connecting plate and the polishing head. The connection is firm and facilitates the replacement of the polishing head. Of course, it is not limited to this; any other component that can make the connection between the connecting plate and the polishing head firm and facilitate the replacement of the polishing head can be used.

[0038] Specifically, support rod 1 is a bakelite rod. In this embodiment, the bakelite rod has good insulation, high temperature resistance, and corrosion resistance, thus improving the safety performance of the polishing head. Of course, the material of the support rod is not limited to this; it can be any material that has good insulation, high temperature resistance, and corrosion resistance.

[0039] Working Principle: By directly installing a buffer component on the support rod and connecting plate, the buffer component is made of silicone. The damping properties of silicone help absorb vibrations and impacts generated during polishing, making the polishing process smoother and contributing to a smoother surface finish. It buffers polishing pressure, preventing localized overpressure that could scratch or collapse the glass surface. During the polishing of curved glass, the elasticity of the silicone allows the support rod to have slight flexible displacement in the axial and radial directions. This flexible displacement helps the grinding head better conform to the local curvature changes of the glass surface, homogenizing the contact pressure between the curved glass surface and the polishing head. When the polishing head moves to different positions on the curved surface, the contact pressure will change. The elastic deformation of the silicone plays a role in buffering and pressure equalization, helping to maintain a more uniform and stable contact pressure between the grinding head and the glass, avoiding excessive or insufficient localized pressure.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A vibration-damping polishing head, characterized in that: It includes a support rod (1), a buffer assembly (2) and a polishing head (3). The support rod (1) and the buffer assembly (2) are fixedly connected. A connecting plate (4) is provided between the buffer assembly (2) and the polishing head (3). The buffer assembly (2) is fixedly connected to the polishing head (3) through the connecting plate (4).

2. The vibration-damping polishing head according to claim 1, characterized in that: The buffer component (2) is made of silicone.

3. The vibration-damping polishing head according to claim 2, characterized in that: The polishing head (3) is made of polyurethane.

4. The vibration-damping polishing head according to claim 3, characterized in that: A first connecting component (5) is provided on the support rod (1) and the buffer assembly (2), and the support rod (1) is fixedly connected to the buffer assembly (2) through the first connecting component (5).

5. The vibration-damping polishing head according to claim 4, characterized in that: The first connecting component (5) includes a connecting protrusion (51) and a connecting groove (52), the connecting protrusion (51) and the connecting groove (52) are matched, the connecting protrusion (51) is disposed on the support rod (1) and the connecting groove (52) is disposed on the buffer component (2), or the connecting protrusion (51) is disposed on the buffer component (2) and the connecting groove (52) is disposed on the support rod (1).

6. The vibration-damping polishing head according to any one of claims 2-5, characterized in that: A second connecting component (6) is provided between the buffer component (2) and the connecting plate (4), and the buffer component (2) is fixedly connected to the connecting plate (4) through the second connecting component (6).

7. The vibration-damping polishing head according to claim 6, characterized in that: The second connecting component (6) includes a second connecting protrusion (61) and a second connecting groove (62), the second connecting protrusion (61) and the second connecting groove (62) are matched, the second connecting protrusion (61) is disposed on the connecting plate (4) and the second connecting groove (62) is disposed on the buffer component (2), or the second connecting protrusion (61) is disposed on the buffer component (2) and the second connecting groove (62) is disposed on the connecting plate (4).

8. The vibration-damping polishing head according to claim 7, characterized in that: A third connecting component (7) is provided between the connecting plate (4) and the polishing head (3), and the connecting plate (4) is connected to the polishing head (3) through the third connecting component (7).

9. The vibration-damping polishing head according to claim 8, characterized in that: The third connecting component (7) includes a connecting protrusion three (71) and a connecting hole (72), the connecting protrusion three (71) and the connecting hole (72) are matched, the connecting protrusion three (71) is disposed on the connecting plate (4), and the connecting hole (72) is disposed on the polishing head (3).

10. The vibration-damping polishing head according to any one of claims 7-9, characterized in that: The support rod (1) is a bakelite rod.

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