Wafer cutting apparatus

Abstract

The utility model relates to a kind of wafer cutting device, it is related to the technical field of cutting device, it includes rack, transmission is provided with conveyor belt between the rack, the upper surface of the conveyor belt is connected with sliding seat, the sliding seat is provided with the platform for placing wafer, the sliding seat is provided with abutting member;Lift assembly is provided between the cutting seat and the rack on the rack, sliding member is provided on the cutting seat, the cutting seat is connected with cutting table, a group of cutting motor is symmetrically provided on the cutting table, the driving shaft of the cutting motor is connected with cutting knife, adjusting assembly is provided on the cutting table, the surface of the platform is rotatably provided with rotary disc, rotary assembly is provided between the platform and rotary disc.The application has the advantages of realizing double cutting head synchronous cutting, reducing cutting time, improving cutting efficiency, convenient operation, high control precision.

Description

Technical Field

[0001] This utility model relates to the technical field of cutting devices, and in particular to a wafer cutting device. Background Technology

[0002] Wafers are the core material in semiconductor manufacturing, and their processing includes multiple steps such as cleaning, dicing, and die sorting. As semiconductor device sizes continue to shrink and integration levels increase, the precision and efficiency requirements for wafer dicing become increasingly stringent. Currently, wafer dicing technology mainly relies on high-precision mechanical cutting or laser cutting, with mechanical cutting being widely used due to its low cost and mature technology.

[0003] Mechanical cutting equipment designed in related technologies typically uses a single cutting blade, resulting in low cutting efficiency and difficulty in meeting the needs of large-scale production, thus requiring improvement. Utility Model Content

[0004] To achieve synchronous cutting with dual cutting heads, reduce cutting time, improve cutting efficiency, and provide convenient operation and high control precision, this application provides a wafer cutting device.

[0005] The wafer dicing apparatus provided in this application adopts the following technical solution: A wafer dicing apparatus includes a frame, a conveyor belt drivingly between the frames, a sliding seat connected to the upper surface of the conveyor belt, a stage for placing wafers on the sliding seat, and a clamping member for fixing the stage on the sliding seat; a dicing stand is mounted on the frame, a lifting assembly is provided between the dicing stand and the frame, the lifting assembly is used to drive the dicing stand to move vertically up and down on the frame, a sliding member is provided on the dicing stand, the sliding member is connected to a dicing table, the sliding member is used to drive the dicing table to slide along the length direction of the dicing stand; a set of dicing motors are symmetrically arranged on the dicing table, the drive shaft of the dicing motors is connected to a cutter, an adjusting assembly is provided on the dicing table, the adjusting assembly is connected to the dicing motors to control the two dicing motors to move towards each other; a rotating disk is rotatably mounted on the surface of the stage, and a rotating assembly is provided between the stage and the rotating disk.

[0006] By adopting the above technical solution, when the device is in use, several wafers are placed on a rotating disk. The sliding component drives the dicing table to slide on the dicing stand, controlling the dicing blade to slide above the wafers. Then, the adjusting component drives two dicing motors to move towards each other, which can change the distance between the two dicing blades. Then, the dicing motors are turned on, and the dicing motors drive the dicing blades to rotate. Finally, the lifting component moves the dicing stand closer to the frame, so that the rotating dicing blades come into contact with the wafers, and the two dicing blades can cut the wafers simultaneously. When different wafers need to be cut, the sliding stand can be moved by the conveyor belt to change the position of the stage, or the rotating component can drive the rotating disk to rotate, which can control the dicing blades to cut wafers at different positions. This realizes synchronous cutting with dual dicing heads, improves cutting efficiency, and can adapt to different processing needs.

[0007] Preferably, the lifting assembly includes a guide rod and a lead screw slide rail, which are symmetrically fixed on both sides of the frame. The guide rod is slidably connected to one end of the cutting seat, and the lead screw slide rail is slidably connected to the other end of the cutting seat.

[0008] By adopting the above technical solution, when it is necessary to control the vertical movement of the cutting table on the frame, the screw slide rail works and the guide rod guides the cutting table, which can accurately control the height of the cutting table on the frame, making it convenient for the cutter to perform high-precision cutting of wafers of different thicknesses.

[0009] Preferably, the sliding component is a linear drive electric cylinder, which is fixedly mounted on the cutting seat, and the telescopic shaft of the linear drive electric cylinder is connected to the cutting table.

[0010] By adopting the above technical solution, the piston rod of the linear drive electric cylinder can extend and retract, which can quickly control the sliding of the cutting table along the length of the cutting seat, change the position of the cutting table on the cutting seat, and accurately control the position of the cutter above the rotary table, so as to facilitate precise control of wafer cutting at different positions.

[0011] Preferably, the adjustment assembly includes an adjustment block, an adjustment motor, an adjustment rod, a first threaded segment, and a second threaded segment. The adjustment block is connected to the cutting motor. The adjustment block is slidably mounted on the cutting table. The adjustment rod is rotatably mounted on the cutting table. The adjustment motor is fixedly mounted on the cutting table. The drive shaft of the adjustment motor is connected to the adjustment rod. The first threaded segment and the second threaded segment are symmetrically arranged on the adjustment rod and have opposite screwing directions. One of the adjustment blocks is threadedly connected to the first threaded segment, and the other adjustment block is threadedly connected to the second threaded segment.

[0012] By adopting the above technical solution, the adjusting motor drives the adjusting rod to rotate. After the adjusting block is guided by the cutting table, one adjusting block slides on the first threaded section and the other adjusting block slides on the second threaded section. The two adjusting blocks are quickly controlled to move towards each other. By changing the distance between the two adjusting blocks, the distance between the two cutters can be quickly changed, which is convenient for high-precision cutting of wafers of different widths and improves the applicability of the device.

[0013] Preferably, the cutting motor is disposed on the lower surface of the adjusting block, and a dovetail block is fixedly disposed on the top of the cutting motor. The side wall of the adjusting block is provided with a dovetail groove for inserting the dovetail block, and the dovetail block and the dovetail groove are mutually adapted to each other.

[0014] By adopting the above technical solution and utilizing the fit between the dovetail block and the dovetail groove, the cutting motor and the adjusting block can be quickly disassembled and assembled, which facilitates the maintenance of the cutting motor.

[0015] Preferably, the adjusting block is also provided with a spray head for spraying deionized water, the surface of the conveyor belt is provided with a number of through holes, and a return plate is provided between the frames and below the conveyor belt.

[0016] By adopting the above technical solution, deionized water is sprayed onto the surface of the cutter by the spray head during cutting, which helps to improve product quality. After the deionized water flows on the conveyor belt, it drips into the return plate through the through holes, which facilitates the recycling and reuse of the deionized water and helps to reduce waste.

[0017] Preferably, the rotating assembly includes a rotating shaft, a gear, a rack, and a cylinder. The rotating disk is rotatably connected to the platform via the rotating shaft. The gear is mounted on the rotating shaft, and the cylinder is mounted on the platform. The piston rod of the cylinder is connected to the rack, and the gear and rack mesh with each other.

[0018] By adopting the above technical solution, the cylinder drives the rack to slide, and the rack abuts against the gear, which in turn drives the rotating shaft and the rotating disk to rotate, making it convenient to cut the wafer from different angles and helping to meet different processing needs.

[0019] Preferably, the clamping element is an electric clamp, and two electric clamps are symmetrically arranged on the sliding seat.

[0020] By adopting the above technical solution, the stage and the sliding seat can be disassembled. After the stage is placed on the sliding seat, the electric clamp quickly clamps the stage, making the operation convenient and quick.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting up a frame, conveyor belt, sliding base, stage, clamping component, cutting base, lifting component, sliding component, cutting table, cutting motor, cutting blade, adjusting component, rotary disk, and rotating component, the sliding component controls the cutting blade to slide above the wafer, the adjusting component drives to change the distance between the two cutting blades, the cutting motor drives the cutting blade to rotate, and finally the lifting component uses the rotating cutting blade to abut against the wafer, so that the two cutting blades can cut the wafer simultaneously. The conveyor belt drives the sliding base to slide to change the position of the stage, or the rotating component drives the rotary disk to rotate, so that the cutting blade can be controlled to cut the wafer at different positions, realizing synchronous cutting of dual cutting heads, improving cutting efficiency, and adapting to different processing needs; 2. By setting up an adjusting block, adjusting motor, adjusting rod, first threaded section, and second threaded section, the adjusting motor drives the adjusting rod to rotate. After the adjusting block is guided by the cutting table, one adjusting block slides on the first threaded section and the other adjusting block slides on the second threaded section. The two adjusting blocks are quickly controlled to move towards each other, and the distance between the two adjusting blocks is changed. This can quickly change the distance between the two cutters, which is convenient for high-precision cutting of wafers of different widths. 3. By setting up a rotating shaft, gears, racks, and cylinders, the cylinders drive the racks to slide, and the racks abut against the gears, which in turn drives the rotating shaft and the rotating disk to rotate, making it convenient to cut the wafers from different angles and helping to meet different processing needs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a wafer dicing apparatus provided in an embodiment of this application.

[0023] Figure 2 yes Figure 1 Enlarged view of section A.

[0024] Figure 3 This is a schematic diagram illustrating the rotating component in the embodiments of this application.

[0025] Explanation of reference numerals in the attached drawings: 1. Frame; 11. Conveyor belt; 111. Through hole; 12. Return plate; 2. Sliding seat; 21. Platform; 22. Rotary disk; 3. Cutting seat; 31. Cutting table; 32. Cutting motor; 33. Cutting blade; 41. Guide rod; 42. Lead screw guide rail; 5. Linear drive electric cylinder; 61. Adjusting block; 62. Adjusting motor; 63. Adjusting rod; 64. First threaded section; 65. Second threaded section; 71. Dovetail block; 72. Dovetail groove; 8. Spray head; 91. Rotating shaft; 92. Gear; 93. Rack; 94. Cylinder; 10. Electric clamp. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0027] This application discloses a wafer dicing apparatus. (Refer to...) Figure 1 The system includes a frame 1, with a conveyor belt 11 connecting the frames. The conveyor belt 11 is driven by a motor and roller tensioning mechanism. A support frame is also provided between the frames 1 to abut against the conveyor belt 11, keeping it horizontal. A sliding seat 2 is connected to the upper surface of the conveyor belt 11. The sliding seat 2 is horizontally positioned and has a stage 21 for placing wafers. The sliding seat 2 has a clamping element for fixing the stage 21; this clamping element is an electric clamp 10. Two electric clamps 10 are symmetrically arranged on the sliding seat 2. The stage 21 can be detached from the sliding seat 2. After the stage 21 is placed on the sliding seat 2, the electric clamp 10 quickly clamps the stage 21, making operation convenient and quick.

[0028] Reference Figure 1 and Figure 2 A cutting stand 3 is mounted on the frame 1, with its length aligned with the width of the frame 1. A lifting assembly is installed between the cutting stand 3 and the frame 1. A sliding component is mounted on the cutting stand 3, and a cutting table 31 is connected to the sliding component. The cutting table 31 can slide along the length of the cutting stand 3. A set of cutting motors 32 are symmetrically arranged on the cutting table 31, and the drive shafts of the cutting motors 32 are connected to cutters 33. In use, the wafer is placed on the stage 21, and the sliding component drives the cutting table 31 to slide on the cutting stand 3. The cutter 33 is controlled to slide above the wafer. Then, the cutting motors 32 are turned on, causing the cutter 33 to rotate. Finally, the lifting assembly moves the cutting stand 3 closer to the frame 1, so that the rotating cutter 33 comes into contact with the wafer. The two cutters 33 can cut the wafer simultaneously.

[0029] Reference Figure 1 and Figure 2The lifting assembly includes a guide rod 41 and a lead screw slide rail 42, which are symmetrically fixed on both sides of the frame 1. Both the guide rod 41 and the lead screw slide rail 42 are vertically oriented. The guide rod 41 is slidably connected to one end of the cutting seat 3, and the lead screw slide rail 42 is slidably connected to the other end of the cutting seat 3. When it is necessary to control the vertical lifting of the cutting seat 3 on the frame 1, the lead screw slide rail 42 operates, and the guide rod 41 guides the cutting seat 3, enabling precise control of the height of the cutting seat 3 on the frame 1. This facilitates high-precision cutting of wafers of different thicknesses by the cutter 33. The sliding component is a linear drive electric cylinder 5, which is fixedly mounted on the cutting seat 3. The telescopic shaft of the linear drive electric cylinder 5 is connected to the cutting table 31. The extension and retraction of the piston rod of the linear drive electric cylinder 5 can quickly control the cutting table 31 to slide along the length direction of the cutting seat 3, change the position of the cutting table 31 on the cutting seat 3, and accurately control the position of the cutter 33 above the rotary disk 22, so as to facilitate precise control of wafer cutting at different positions.

[0030] Reference Figure 1 and Figure 2 An adjustment assembly is provided on the cutting table 31. The adjustment assembly includes an adjustment block 61, an adjustment motor 62, an adjustment rod 63, a first threaded section 64, and a second threaded section 65. The adjustment block 61 is connected to the cutting motor 32 and is slidably mounted on the cutting table 31. The adjustment rod 63 is rotatably mounted on the cutting table 31, and its length direction is along the width direction of the frame 1. The adjustment motor 62 is fixedly mounted on the cutting table 31 by bolts, and its drive shaft is connected to the adjustment rod 63. The first threaded section 64 and the second threaded section 65 are symmetrically arranged on the adjustment rod 63 and have opposite screwing directions. One adjustment block 61 is threadedly connected to the first threaded section 64, and the other adjustment block 61 is threadedly connected to the second threaded section 65. The adjusting motor 62 drives the adjusting rod 63 to rotate. After the adjusting block 61 is guided by the cutting table 31, one adjusting block 61 slides on the first threaded section 64 and the other adjusting block 61 slides on the second threaded section 65, so that the two adjusting blocks 61 move towards each other. This can change the distance between the two adjusting blocks 61, thereby quickly adjusting the distance between the two cutters 33. This facilitates high-precision cutting of wafers of different widths and improves the applicability of the device.

[0031] Reference Figure 2 The cutting motor 32 is mounted on the lower surface of the adjusting block 61. A dovetail block 71 is fixedly mounted on the top of the cutting motor 32. A dovetail groove 72 is provided on the side wall of the adjusting block 61 for the dovetail block 71 to be inserted. The dovetail block 71 and the dovetail groove 72 are mutually compatible. By utilizing the cooperation between the dovetail block 71 and the dovetail groove 72, the cutting motor 32 and the adjusting block 61 can be quickly disassembled and assembled, which facilitates the maintenance of the cutting motor 32. Reference Figure 1 and Figure 3 A rotating disk 22 is rotatably mounted on the surface of the stage 21. A rotating assembly is provided between the stage 21 and the rotating disk 22. The rotating assembly includes a rotating shaft 91, a gear 92, a rack 93, and a cylinder 94. The rotating disk 22 is rotatably connected to the stage 21 via the rotating shaft 91. The gear 92 is fixedly mounted on the rotating shaft 91 and is coaxial with the rotating shaft 91. The cylinder 94 is mounted on the stage 21. The piston rod of the cylinder 94 is connected to the rack 93. The gear 92 and the rack 93 mesh with each other. The cylinder 94 drives the rack 93 to slide, and the rack 93 abuts against the gear 92, thereby driving the rotating shaft 91 and the rotating disk 22 to rotate. This facilitates wafer cutting from different angles and helps meet different processing requirements.

[0032] Reference Figure 1 and Figure 2 The adjusting block 61 is also equipped with a spray head 8 for spraying deionized water. While cutting, the spray head 8 sprays deionized water onto the surface of the cutter 33, which helps to improve product quality. Several through holes 111 are provided through the surface of the conveyor belt 11. A return plate 12 is provided between the frames 1 and below the conveyor belt 11. After the deionized water flows on the conveyor belt 11, it drips into the return plate 12 through the through holes 111, which facilitates the recycling and reuse of the deionized water and helps to reduce waste.

[0033] The implementation principle of the wafer dicing device in this application embodiment is as follows: When the device is in use, several wafers are placed on the rotary disk 22. The linear drive electric cylinder 5 drives the dicing table 31 to slide on the dicing seat 3, controlling the cutter 33 to slide above the wafer. Then, the adjustment component drives two dicing motors 32 to move towards each other, which can change the distance between the two cutters 33. Then, the dicing motors 32 are turned on, and the dicing motors 32 drive the cutter 33 to rotate. Finally, the lifting component drives the dicing seat 3 to move closer to the frame 1, so that the rotating cutter 33 abuts against the wafer. The two cutters 33 can cut the wafer simultaneously. When different wafers need to be cut, the conveyor belt 11 can drive the sliding seat 2 to slide to change the position of the stage 21, or the rotary component can drive the rotary disk 22 to rotate, which can control the cutter 33 to cut the wafers at different positions. This realizes synchronous cutting of dual cutting heads, improves cutting efficiency, and has high control precision, which can adapt to different processing needs.

[0034] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer cutting apparatus comprising a frame (1), characterized in that: A conveyor belt (11) is provided between the racks (1). A sliding seat (2) is connected to the upper surface of the conveyor belt (11). A stage (21) for placing wafers is provided on the sliding seat (2). A clamping member for fixing the stage (21) is provided on the sliding seat (2). A dicing seat (3) is provided on the rack (1). A lifting assembly is provided between the dicing seat (3) and the rack (1). The lifting assembly is used to drive the dicing seat (3) to move vertically up and down on the rack (1). A sliding member is provided on the dicing seat (3). A cutting table (31) is connected, and the sliding member is used to drive the cutting table (31) to slide along the length direction of the cutting seat (3); a set of cutting motors (32) are symmetrically arranged on the cutting table (31), and the drive shaft of the cutting motor (32) is connected to a cutter (33); an adjustment component is provided on the cutting table (31), and the adjustment component is connected to the cutting motors (32) to control the two cutting motors (32) to move towards each other; a rotating disk (22) is rotatably provided on the surface of the platform (21), and a rotating component is provided between the platform (21) and the rotating disk (22).

2. The wafer dicing apparatus according to claim 1, characterized in that: The lifting assembly includes a guide rod (41) and a lead screw slide rail (42). The guide rod (41) and the lead screw slide rail (42) are symmetrically fixed on both sides of the frame (1). The guide rod (41) is slidably connected to one end of the cutting seat (3), and the lead screw slide rail (42) is slidably connected to the other end of the cutting seat (3).

3. The wafer dicing apparatus according to claim 1, characterized in that: The sliding component is a linear drive electric cylinder (5), which is fixedly mounted on the cutting seat (3). The telescopic shaft of the linear drive electric cylinder (5) is connected to the cutting table (31).

4. The wafer dicing apparatus according to claim 1, characterized in that: The adjustment assembly includes an adjustment block (61), an adjustment motor (62), an adjustment rod (63), a first threaded section (64), and a second threaded section (65). The adjustment block (61) is connected to the cutting motor (32). The adjustment block (61) is slidably mounted on the cutting table (31). The adjustment rod (63) is rotatably mounted on the cutting table (31). The adjustment motor (62) is fixedly mounted on the cutting table (31). The drive shaft of the adjustment motor (62) is connected to the adjustment rod (63). The first threaded section (64) and the second threaded section (65) are symmetrically mounted on the adjustment rod (63) and rotate in opposite directions. One adjustment block (61) is threadedly connected to the first threaded section (64), and the other adjustment block (61) is threadedly connected to the second threaded section (65).

5. A wafer dicing apparatus according to claim 4, characterized in that: The cutting motor (32) is disposed on the lower surface of the adjusting block (61). A dovetail block (71) is fixedly disposed on the top of the cutting motor (32). A dovetail groove (72) is provided on the side wall of the adjusting block (61) for inserting the dovetail block (71). The dovetail block (71) and the dovetail groove (72) are mutually compatible.

6. A wafer dicing apparatus according to claim 4, characterized in that: The regulating block (61) is also provided with a spray head (8) for spraying deionized water. The surface of the conveyor belt (11) is provided with a number of through holes (111). A return plate (12) is provided between the frames (1) and below the conveyor belt (11).

7. A wafer dicing apparatus according to claim 1, characterized in that: The rotating assembly includes a rotating shaft (91), a gear (92), a rack (93), and a cylinder (94). The rotating disk (22) is rotatably connected to the platform (21) via the rotating shaft (91). The gear (92) is mounted on the rotating shaft (91), and the cylinder (94) is mounted on the platform (21). The piston rod of the cylinder (94) is connected to the rack (93), and the gear (92) and the rack (93) mesh with each other.

8. A wafer dicing apparatus according to claim 1, characterized in that: The clamping element is an electric clamp (10), and two electric clamps (10) are symmetrically arranged on the sliding seat (2).

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