A high-cleanliness plastic encapsulation device for semiconductor devices

Abstract

The utility model belongs to the technical field of semiconductor packaging, specifically related to a kind of high cleanness plastic package device for semiconductor device, including packaging table, upper die, lower die and the hydraulic cylinder of driving the upper die rises or falls, the lower die is arranged on the mesa of packaging table, it is characterized in that, the mesa of packaging table is slidably provided with cleaning assembly, the cleaning assembly is communicated with the external air power system, to be used to clean upper die and lower die, the cleaning assembly is provided with turnover assembly for changing the air angle of the cleaning assembly. The present application has the effect of all-around, dead-angle-free depth cleaning of mold cavity, plastic encapsulation cavity, cleaning mold gap, cavity corner residual solidified residue and tiny particle impurities.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor packaging, specifically relating to a high-cleanliness plastic encapsulation device for semiconductor devices. Background Technology

[0002] Semiconductor devices are core components in electronic devices such as integrated circuits, power electronics, and smart terminals. The packaging and molding process is a crucial step in ensuring the insulation, mechanical protection, moisture and oxidation prevention, and long-term stable operation of these devices. With the rapid iteration and application of third-generation semiconductors, high-end power devices, and precision chips, the market demands continuously increasing requirements for the packaging precision, appearance quality, reliability, and yield of semiconductor devices. A high-cleanliness molding environment has become a mandatory technical indicator for the production of high-end semiconductor devices. As a core step in semiconductor back-end packaging, the molding process must be completely free of contaminants such as dust particles, molding debris, moisture impurities, and electrostatically adsorbed particles. Otherwise, it can easily lead to quality problems such as short circuits at device leads, voids and cracks in the molding layer, chip oxidation failure, and packaging appearance defects. These issues directly reduce the lifespan of semiconductor devices and batch production yield, failing to meet the stringent standards of military, automotive, industrial control, and high-end consumer electronics industries.

[0003] Currently, existing semiconductor molding and encapsulation equipment generally adopts conventional open or semi-closed molding and encapsulation structures, relying solely on the overall cleanroom system to achieve environmental purification. In actual production applications, this has many inherent technical defects and is difficult to adapt to the high-cleanliness molding and encapsulation production requirements of high-precision and high-reliability semiconductor devices.

[0004] Traditional molding compounding devices employ limited cleaning methods, often relying on fixed air blowing or simple filter structures. These methods fail to achieve comprehensive, thorough cleaning of the mold cavity and molding compound chamber, leaving solidified residues and minute particulate impurities easily trapped in mold crevices and cavity edges. Therefore, there is an urgent need to develop a high-cleanliness molding compounding device for semiconductor devices that offers multi-directional, thorough purification, high stability, and is suitable for large-scale production, addressing the numerous shortcomings of existing technologies. Utility Model Content

[0005] This invention provides a high-cleanliness molding and encapsulation device for semiconductor devices, which solves the problem of difficulty in achieving comprehensive and thorough cleaning of mold cavities and molding and encapsulation cavities, and the easy retention of solidified residues and tiny particulate impurities in mold gaps and cavity corners.

[0006] The technical solution adopted in this utility model is as follows: A high-cleanliness molding and encapsulation device for semiconductor devices includes an encapsulation stage, an upper mold, a lower mold, and a hydraulic cylinder for driving the upper mold to rise or fall. The lower mold is disposed on the table surface of the encapsulation stage. A cleaning component is slidably disposed on the table surface of the encapsulation stage. The cleaning component is connected to an external pneumatic system for cleaning the upper mold and the lower mold. The cleaning component is provided with a flipping component for changing the air outlet angle of the cleaning component. The cleaning assembly includes multiple high-pressure nozzles, a drive assembly that drives the multiple high-pressure nozzles to rotate, and a housing. The drive assembly includes multiple drive gears, a central gear, an internal gear ring, and a drive component that drives the central gear to rotate. The central gear is located at the center of the housing and is rotatably connected to the housing. The drive gear meshes with both the central gear and the internal gear ring. The internal gear ring surrounds the drive gear and the central gear on its inner side and is fixedly connected to the housing. A connecting pipe is coaxially arranged on the drive gear. The high-pressure nozzle is located at one end of the connecting pipe. The housing covers the drive assembly inside and is connected to an external aerodynamic system.

[0007] By adopting the above technical solution, the cleaning component is connected to an external aerodynamic system. The external aerodynamic system sprays high-pressure air from the cleaning component. At the same time, the tilting component changes the angle of the air sprayed from the self-cleaning component, so that when the cleaning component tilts downward, it can clean the lower mold, and when the cleaning component tilts upward, it can clean the upper mold. Therefore, there is no need to increase the number of cleaning components. The high-pressure air sprayed from the self-cleaning component can make dust particles, heat sealing debris and other debris fall off from the upper and lower molds, which can thoroughly clean dust particles and heat sealing debris, and make the packaging process highly clean. During the rotation of the central gear, the drive gear, which meshes with both the central gear and the internal gear ring, rotates on its own axis while also revolving around the central gear in the circumference. This causes the high-pressure nozzle to revolve synchronously with the drive gear, enabling the high-pressure nozzle to perform dynamic cleaning of the upper and lower molds. Compared to static cleaning, this improves the cleaning effect. At the same time, the housing can simultaneously supply air to multiple high-pressure nozzles, allowing the high-pressure nozzles to perform cleaning even during rotation.

[0008] Optionally, a sealing assembly is provided on the end face of the internal gear ring away from the housing. The sealing assembly includes a sealing disc and a sealing ring. The sealing disc is coaxially arranged with the central gear and covers the central gear on the inside. The sealing ring is rotatably connected to the housing. The high-pressure nozzle passes through the sealing ring. The sealing disc and the sealing ring rotate to seal each other.

[0009] By adopting the above technical solution, the central gear, drive gear, and internal gear ring are all enclosed inside the housing through the sealing disc and sealing ring, which also serves as a dynamic seal. This allows high-pressure air to be ejected normally from the nozzle when the external aerodynamic system supplies air into the housing. At the same time, it also provides support for the revolution and rotation of the drive gear, enhancing the stability of the cleaning component.

[0010] Optionally, the flipping assembly includes a flipping frame, a flipping rod, and a telescopic push-pull device. The cleaning assembly is rotatably connected to the flipping frame, the flipping frame is set on the packaging platform, one end of the flipping rod is fixedly connected to the cleaning assembly, and the other end of the flipping rod is rotatably connected to the output end of the telescopic push-pull device.

[0011] By adopting the above technical solution, the flipping frame is used to support the cleaning component. The flipping rod increases the distance between the telescopic push-pull device and the rotating shaft of the cleaning component, thereby facilitating the telescopic push-pull device to drive the cleaning component to flip. The flipping component enables the cleaning component to clean the upper mold and the lower mold separately, making the whole cleaning process more convenient and improving cleaning efficiency and cleaning effect.

[0012] Optionally, a slide rail is provided between the flipping frame and the packaging stage to move the cleaning component closer to or away from the lower mold.

[0013] By adopting the above technical solution, the sliding rail connects the flipping frame and the packaging stage, allowing the cleaning component to move closer to or further away from the upper and lower molds. This keeps the cleaning component away from the hot-pressing packaging work area during the hot-pressing process, preventing damage to the cleaning component at high temperatures. It also allows for adjustment of the cleaning position, enabling the cleaning component to accurately align with the upper or lower mold and perform cleaning, thus improving the cleaning effect.

[0014] Optionally, it also includes a dust collection component, which includes an air inlet on the surface of the packaging table, a dust collection box inside the packaging table, an aerodynamic device inside the dust collection box, and the dust collection box and the air inlet connected by a pipe.

[0015] By adopting the above technical solution, when the aerodynamic device is turned on, the powder particles and packaging debris blown out by the cleaning components are sucked into the dust collection box through the air inlet, thereby reducing the amount of powder particles and packaging debris scattered in the whole device. At the same time, the dust collection box can collect the powder particles and packaging debris, making it easy to clean.

[0016] Optionally, the dust collection box is equipped with a filter plate.

[0017] By adopting the above technical solution, after the air containing powder particles and packaging debris enters the dust collection box, the powder particles and packaging debris can be filtered out by the filter plate, thereby reducing the impact of powder particles and packaging debris on the aerodynamic device, reducing the amount of powder particles and packaging debris in the exhaust air, reducing secondary air pollution, and reducing the secondary impact of powder particles and packaging debris on the cleanliness of the packaging.

[0018] Optionally, the side wall of the dust collection box is provided with an opening for removing the filter plate.

[0019] By adopting the above technical solution, the filter plate can be removed from the opening after the cleaning process, which facilitates the cleaning or replacement of the filter plate, improves the filtration and collection effect of the dust collection box on airborne powder particles and packaging debris, and improves the cleanliness of the plastic seal.

[0020] Due to the adoption of the above technical solution, the beneficial effects achieved by this utility model are as follows: 1. The cleaning component is connected to an external aerodynamic system. The external aerodynamic system sprays high-pressure air from the cleaning component. At the same time, the tilting component changes the angle of the air sprayed from the self-cleaning component, so that when the cleaning component tilts downward, it can clean the lower mold, and when it tilts upward, it can clean the upper mold. Therefore, there is no need to increase the number of cleaning components. The high-pressure air sprayed from the self-cleaning component can make dust particles, heat sealing debris and other debris fall off the upper and lower molds, which can thoroughly clean dust particles and heat sealing debris, and make the encapsulation process highly clean.

[0021] 2. During the rotation of the central gear, the drive gear, which meshes with both the central gear and the internal gear ring, rotates on its own axis while also revolving around the central gear in the circumference. This causes the high-pressure nozzle to revolve synchronously with the drive gear, enabling the high-pressure nozzle to perform dynamic cleaning of the upper and lower molds. Compared with static cleaning, this improves the cleaning effect. At the same time, the housing can supply air to multiple high-pressure nozzles simultaneously, allowing the high-pressure nozzles to perform cleaning even during rotation.

[0022] 3. By using a sealing disc and sealing ring, the central gear, drive gear, and internal gear ring are completely enclosed inside the housing, which also serves as a dynamic seal. This allows high-pressure air to be ejected normally from the nozzle when the external aerodynamic system supplies air into the housing. It also provides support for the revolution and rotation of the drive gear, enhancing the stability of the cleaning components.

[0023] 4. The flipping frame is used to support the cleaning component. The flipping rod increases the distance between the telescopic push-pull device and the rotating shaft of the cleaning component, which makes it easier for the telescopic push-pull device to drive the cleaning component to flip. By flipping the component, the cleaning component can clean the upper mold and the lower mold separately, making the whole cleaning process more convenient and improving cleaning efficiency and cleaning effect. Attached Figure Description

[0024] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of a high-cleanliness plastic encapsulation device for semiconductor devices according to this application.

[0025] Figure 2 This is a schematic diagram of the cleaning component mechanism in an embodiment of this application.

[0026] Figure 3 This is a cross-sectional view of the cleaning component in an embodiment of this application.

[0027] Figure 4 This is a schematic diagram of the flip component structure in an embodiment of this application.

[0028] Figure 5 This is a schematic diagram of the dust collection component structure in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures: 1. Packaging platform; 11. Upper mold; 12. Lower mold; 13. Hydraulic cylinder; 2. Cleaning assembly; 21. High-pressure nozzle; 22. Drive assembly; 221. Drive gear; 222. Center gear; 223. Internal gear ring; 224. Drive component; 225. Connecting pipe; 23. Housing; 24. Sealing assembly; 241. Sealing disc; 242. Sealing ring; 3. Tilting assembly; 31. Tilting frame; 32. Tilting rod; 33. Telescopic push-pull device; 4. Slide rail; 5. Dust collection assembly; 51. Air inlet; 52. Dust collection box; 53. Filter plate. Detailed Implementation

[0030] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0032] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this utility model, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] This application discloses a high-cleanliness encapsulation apparatus for semiconductor devices. (Refer to...) Figures 1-5A high-cleanliness molding and encapsulation device for semiconductor devices includes an encapsulation stage 1, an upper mold 11, a lower mold 12, and a hydraulic cylinder 13 for raising or lowering the upper mold 11. The lower mold 12 is fixedly mounted on the surface of the encapsulation stage 1 to cooperate with the upper mold 11 for encapsulation. A cleaning component 2 is slidably mounted on the surface of the encapsulation stage 1. The cleaning component 2 is connected to an external aerodynamic system for cleaning the upper mold 11 and the lower mold 12. It should be noted that this application does not impose specific limitations on the specific structure of the external aerodynamic system, and any structure that can provide aerodynamics in the prior art can be used. A flipping component 3 is provided between the cleaning component 2 and the encapsulation stage 1. The cleaning component 2 changes its angle through the flipping component 3, thereby facilitating the cleaning of the upper mold 11 and the lower mold 12 by the cleaning component 2. At the same time, the angle change can also make the cleaning process more dynamic and improve the cleaning effect.

[0036] The cleaning component 2 is connected to an external aerodynamic system. The external aerodynamic system sprays high-pressure air from the cleaning component 2. At the same time, the tilting component 3 changes the angle of the air sprayed from the cleaning component 2, so that when the cleaning component 2 tilts downward, it can clean the lower mold 12, and when the cleaning component 2 tilts upward, it can clean the upper mold 11. Therefore, there is no need to increase the number of cleaning components 2. The high-pressure air sprayed from the cleaning component 2 can make dust particles, heat sealing debris and other debris fall off the upper mold 11 and the lower mold 12, which can thoroughly clean dust particles and heat sealing debris, and make the packaging process highly clean.

[0037] Specifically, the cleaning assembly 2 includes multiple high-pressure nozzles 21, a drive assembly 22 that drives the multiple high-pressure nozzles 21 to rotate, and a housing 23. The drive assembly 22 includes multiple drive gears 221, a central gear 222, an internal gear ring 223, and a drive member 224 that drives the central gear 222 to rotate. The drive gears 221 mesh with both the central gear 222 and the internal gear ring 223. The central gear 222 is located at the center of the housing 23 and is coaxially fixed to the output end of the drive member 224 and rotatably connected to the housing 23. The internal gear ring 223 surrounds the central gear 222 and the multiple drive gears 221 on its inner side and is fixedly connected inside the housing 23. A connecting pipe 225 is coaxially provided for the drive gears 221, and the drive gears 221 are rotatably connected to the housing 23 through the connecting pipe 225. A high-pressure nozzle 21 is located at one end of a connecting pipe 225, the other end of which is connected to the interior of the housing 23. This allows air from inside the housing 23 to flow through the connecting pipe 225 into the high-pressure nozzle 21 and be ejected. The front end of the housing 23 is open, while the rear end is closed. The rear end of the housing 23 encloses the drive assembly 22 and is connected to an external aerodynamic system.

[0038] A sealing assembly 24 is provided on the end face of the internal gear ring 223 facing away from the housing 23. More specifically, the sealing assembly 24 is rotatably connected to the housing 23. The sealing assembly 24 includes a sealing disc 241 and a sealing ring 242. The sealing disc 241 is coaxially arranged with and rotatably connected to the central gear 222, and the central gear 222 is covered between the sealing disc 241 and the housing 23. The sealing ring 242 is rotatably connected to the housing 23. The high-pressure nozzle 21 passes through the sealing ring 242 and is rotatably connected to the sealing ring along with the drive gear 221. The diameter of the sealing disc 241 is slightly larger than the diameter of the inner ring of the sealing ring 242, and the sealing disc 241 and the sealing ring 242 overlap each other. The sealing disc 241 and the sealing ring 242, as well as the sealing ring 242 and the housing 23, provide rotatable seals, thereby reducing the leakage of high-pressure air from the connection gaps.

[0039] During the rotation of the central gear 222, the drive gear 221, which meshes with both the central gear 222 and the internal gear ring 223, rotates around its own axis while also revolving around the central gear 222 in the circumference. This causes the high-pressure nozzle 21 to revolve synchronously with the drive gear 221, thereby enabling the high-pressure nozzle 21 to perform dynamic cleaning on the upper mold 11 and the lower mold 12. Compared with static cleaning, this improves the cleaning effect. At the same time, the housing 23 can simultaneously supply air to multiple high-pressure nozzles 21, allowing the high-pressure nozzles 21 to perform cleaning even during rotation.

[0040] By using the sealing disc 241 and sealing ring 242 to completely enclose the center gear 222, drive gear 221 and internal gear ring 223 inside the housing 23, a dynamic seal is achieved. This allows high-pressure air to be ejected normally from the nozzle when the external aerodynamic system supplies air into the housing 23. It also provides support for the revolution and rotation of the drive gear 221, enhancing the stability of the cleaning assembly 2.

[0041] Specifically, the flipping assembly 3 includes a flipping frame 31, a flipping rod 32, and a telescopic push-pull device 33. In this application, the telescopic push-pull device 33 is hydraulically driven. The cleaning assembly 2 is rotatably connected to the flipping frame 31. The bottom end of the flipping frame 31 is fixedly connected to the table surface on the packaging stage 1. One end of the flipping rod 32 is fixedly connected to the cleaning assembly 2. More specifically, the flipping rod 32 is fixedly connected to the housing 23. The other end of the flipping rod 32 extends away from the housing 23 and is rotatably connected to the output end of the telescopic push-pull device 33. More specifically, in this application, there are two flipping rods 32. A rotating shaft is fixedly connected between the ends of the two flipping rods 32 away from the housing 23. The output end of the telescopic push-pull device 33 is rotatably connected to the flipping rod 32 through the rotating shaft. The tail end of the telescopic push-pull device 33 is rotatably connected to the flipping frame 31. A slide rail 4 is provided between the flipping frame 31 and the packaging stage 1. The slide rail 4 drives the cleaning assembly 2 to move closer to or away from the lower mold 12.

[0042] The flipping frame 31 is used to support the cleaning component 2. The flipping rod 32 increases the distance between the telescopic push-pull device 33 and the rotating shaft of the cleaning component 2, thereby facilitating the telescopic push-pull device 33 to drive the cleaning component 2 to flip. The flipping component 3 enables the cleaning component 2 to clean the upper mold 11 and the lower mold 12 respectively, making the whole cleaning process more convenient and improving cleaning efficiency and cleaning effect.

[0043] The slide rail 4 is used to slide the flipping frame 31 and the packaging stage 1, thereby allowing the cleaning component 2 to move closer to or further away from the upper mold 11 and the lower mold 12. This keeps the cleaning component 2 away from the hot-pressing packaging working area during the hot-pressing process, preventing damage to the cleaning component 2 at high temperatures. At the same time, the cleaning position can be adjusted so that the cleaning component 2 can accurately correspond to the upper mold 11 or the lower mold 12 and clean it, thereby improving the cleaning effect.

[0044] Specifically, the high-cleanliness encapsulation device for semiconductor devices also includes a dust collection assembly 5. The dust collection assembly 5 includes an air inlet 51 on the surface of the encapsulation stage 1. A dust collection box 52 is fixedly installed inside the encapsulation stage 1. One end of the dust collection box 52 has an air inlet, and the other end has an air outlet. An aerodynamic device is initially fixedly installed at the air outlet of the dust collection box 52. In this application, the aerodynamic device is exemplified by a fan. The dust collection box 52 is connected to the air inlet 51 via a pipe, thereby enabling the aerodynamic device to draw out blown powder particles and encapsulation debris into the air inlet 51. A filter plate 53 is installed in the dust collection box 52, with the surface of the filter plate 53 perpendicular to the line connecting the air inlet and the air outlet. An opening for removing the filter plate 53 is provided on the side wall of the dust collection box 52. It should be noted that this application does not impose specific limitations on the fixing method between the filter plate 53 and the dust collection box 52; it can be any of the following: clamping, bolting, or snap-fit ​​fixing.

[0045] When the aerodynamic device is turned on, the powder particles and packaging debris blown out by the cleaning component 2 are sucked into the dust collection box 52 through the air inlet 51, which reduces the amount of powder particles and packaging debris scattered in the whole device. At the same time, the dust collection box 52 can collect the powder particles and packaging debris for easy cleaning.

[0046] When air containing powder particles and packaging debris enters the dust collection box 52, the powder particles and packaging debris can be filtered out by the filter plate 53, thereby reducing the impact of powder particles and packaging debris on the aerodynamic device, reducing the amount of powder particles and packaging debris in the exhaust air, reducing secondary air pollution, and reducing the secondary impact of powder particles and packaging debris on the cleanliness of the packaging.

[0047] After the cleaning process, the filter plate 53 can be removed from the opening, which facilitates the cleaning or replacement of the filter plate 53, improves the filtration and collection effect of the dust collection box 52 on airborne powder particles and packaging debris, and improves the cleanliness of the plastic seal.

[0048] For any parts not mentioned in this utility model, existing technologies can be used or referenced.

[0049] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0050] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A high-cleanliness molding and encapsulation apparatus for semiconductor devices, comprising an encapsulation stage (1), an upper mold (11), a lower mold (12), and a hydraulic cylinder (13) for raising or lowering the upper mold (11), wherein the lower mold (12) is disposed on the platform of the encapsulation stage (1), characterized in that, A cleaning component (2) is slidably disposed on the surface of the packaging platform (1). The cleaning component (2) is connected to an external aerodynamic system for cleaning the upper mold (11) and the lower mold (12). A flipping component (3) is disposed on the cleaning component (2) for changing the air outlet angle of the cleaning component (2). The cleaning assembly (2) includes multiple high-pressure nozzles (21), a drive assembly (22) that drives the multiple high-pressure nozzles (21) to rotate, and a housing (23). The drive assembly (22) includes multiple drive gears (221), a central gear (222), an internal gear ring (223), and a drive member (224) that drives the central gear (222) to rotate. The central gear (222) is located at the center of the housing (23) and is rotatably connected to the housing (23). The drive gears (221, 222, 223, 224, 225, 226, 227, 228, 229, 220 ... 1) It meshes with the central gear (222) and the internal gear ring (223) at the same time. The internal gear ring (223) surrounds the drive gear (221) and the central gear (222) on the inner side and is fixedly connected to the housing (23). The drive gear (221) is coaxially provided with a connecting pipe (225). The high-pressure nozzle (21) is provided at one end of the connecting pipe (225). The housing (23) covers the drive assembly (22) inside and is connected to the external aerodynamic system.

2. The high-cleanliness encapsulation device for semiconductor devices according to claim 1, characterized in that, A sealing assembly (24) is provided on the end face of the internal gear ring (223) away from the housing (23). The sealing assembly (24) includes a sealing disc (241) and a sealing ring (242). The sealing disc (241) is coaxially arranged with the central gear (222) and covers the central gear (222) inside. The sealing ring (242) is rotatably connected to the housing (23). The high-pressure nozzle (21) passes through the sealing ring (242). The sealing disc (241) and the sealing ring (242) are rotatably sealed.

3. The high-cleanliness encapsulation device for semiconductor devices according to claim 1, characterized in that, The flipping assembly (3) includes a flipping frame (31), a flipping rod (32), and a telescopic push-pull device (33). The cleaning assembly (2) is rotatably connected to the flipping frame (31). The flipping frame (31) is set on the packaging platform (1). One end of the flipping rod (32) is fixedly connected to the cleaning assembly (2), and the other end of the flipping rod (32) is rotatably connected to the output end of the telescopic push-pull device (33).

4. The high-cleanliness encapsulation device for semiconductor devices according to claim 3, characterized in that, A slide rail (4) is provided between the flipping frame (31) and the packaging platform (1) to drive the cleaning component (2) to move closer to or away from the lower mold (12).

5. A high-cleanliness encapsulation device for semiconductor devices according to claim 1, characterized in that, It also includes a dust collection component (5), which includes an air inlet (51) on the surface of the packaging platform (1). A dust collection box (52) is provided inside the packaging platform (1), and an aerodynamic device is provided in the dust collection box (52). The dust collection box (52) is connected to the air inlet (51) through a pipe.

6. A high-cleanliness encapsulation device for semiconductor devices according to claim 5, characterized in that, The dust collection box (52) is equipped with a filter plate (53).

7. A high-cleanliness encapsulation device for semiconductor devices according to claim 6, characterized in that, The side wall of the dust collection box (52) is provided with an opening for removing the filter plate (53).

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