A flexible aluminum-based copper clad plate

Abstract

The utility model discloses a kind of flexible aluminum-based copper-clad plate, the flexible aluminum-based copper-clad plate includes: aluminum substrate, insulating layer and copper cladding layer, insulating layer is set to one side surface of aluminum substrate, copper cladding layer is set to one side surface of insulating layer away from aluminum substrate, to form flexible aluminum-based copper-clad plate whole;Aluminum substrate is provided with reticular microstructure layer, reticular microstructure layer is set to the inside of aluminum substrate, to form reticular microstructure in the inside of aluminum substrate main body;Reticular microstructure layer is provided with uniform distribution micro mesh.This flexible aluminum-based copper-clad plate disclosed by the utility model is by setting reticular microstructure layer in aluminum substrate, to form reticular microstructure in the inside of aluminum substrate main body, in this way, reticular microstructure layer can greatly improve the flexibility and bending performance of flexible aluminum-based copper-clad plate while supporting insulating layer and copper cladding layer main body.

Description

Technical Field

[0001] This utility model relates to the field of aluminum-based copper clad laminate technology, and in particular to a flexible aluminum-based copper clad laminate. Background Technology

[0002] Flexible aluminum clad laminate (F-ALCL) is a special type of copper clad laminate with an aluminum substrate, exhibiting flexibility and adaptability. This material combines the thermal conductivity and flexibility of aluminum, making it suitable for electronic applications requiring high heat dissipation and flexibility, particularly in LED lighting, automotive electronics, and flexible electronic devices. Flexible aluminum-based copper clad laminates typically consist of an aluminum substrate layer, an insulating layer, and a copper foil layer. The aluminum substrate layer, based on high thermal conductivity aluminum, provides excellent thermal conductivity and serves as the core of the copper clad laminate, supporting the entire structure and thus enabling the copper clad laminate to have good heat dissipation and flexibility. The insulating layer is generally made of thermally conductive insulating materials such as polyimide or thermosetting resin to isolate the copper foil from the aluminum substrate, preventing current from flowing directly into the aluminum substrate layer, while also enabling rapid heat conduction to the aluminum substrate, thus providing both electrical insulation and thermal conductivity. The copper foil layer is usually made of electrolytic copper or rolled copper, and its thickness can be selected according to conductivity requirements. Common copper foil layer thicknesses are 18μm and 35μm, etc., serving as a conductive path. After patterning, the copper foil layer can form a circuit.

[0003] The main characteristics of existing flexible aluminum-based copper clad laminates are good thermal conductivity, flexibility and flexibility, as well as high mechanical strength, insulation and heat resistance. However, for applications that require high-frequency twisting and bending, the flexibility and bendability of existing flexible aluminum-based copper clad laminates are still insufficient and there is room for improvement. Utility Model Content

[0004] Therefore, it is necessary to provide a flexible aluminum-based copper clad laminate to address the technical problem of insufficient flexibility and bendability of existing flexible aluminum-based copper clad laminates when facing specific application scenarios.

[0005] A flexible aluminum-based copper-clad laminate includes an aluminum substrate, an insulating layer, and a copper cladding layer. The insulating layer is disposed on one side surface of the aluminum substrate, and the copper cladding layer is disposed on the side surface of the insulating layer opposite to the aluminum substrate, thereby forming a flexible aluminum-based copper-clad laminate as a whole. The aluminum substrate is provided with a mesh microstructure layer, which is disposed inside the aluminum substrate, thereby forming a mesh microstructure inside the main body of the aluminum substrate. The mesh microstructure layer is provided with uniformly arranged micro-mesh holes.

[0006] In one embodiment, the aluminum substrate is further provided with a nickel plating layer, which is plated on the side of the aluminum substrate facing away from the insulating layer.

[0007] In one embodiment, the aforementioned mesh microstructure layer is disposed inside the aluminum substrate, that is, thin walls are formed on both sides of the aluminum substrate to cover both sides of the mesh microstructure layer, thereby making the mesh microstructure layer embedded in the aluminum substrate to form a sandwich structure.

[0008] In one embodiment, the thickness of the aforementioned mesh microstructure layer is set to 0.1-0.3 mm.

[0009] In one embodiment, the thickness of the nickel plating layer is set to 10-20 μm.

[0010] In one embodiment, the aluminum substrate described above is made of 7075 aluminum alloy.

[0011] In one embodiment, a nano-thermal conductive layer is embedded inside the insulating layer, that is, the insulating layer and the nano-thermal conductive layer form a sandwich structure.

[0012] In one embodiment, the aforementioned nano-thermal conductive layer is made of boron nitride.

[0013] In one embodiment, the overall thickness of the insulating layer is set to 40-60 μm.

[0014] In one embodiment, the insulating layer is further provided with a high voltage withstand layer, which is disposed on the side surface of the insulating layer body facing the copper cladding, thereby making the insulating layer as a whole form a multi-layer insulating structure.

[0015] In one embodiment, the high pressure-resistant layer described above is made of either PPS or PEEK.

[0016] In one embodiment, the aluminum substrate is further provided with an anodized coating, which is applied to both sides of the aluminum substrate, that is, the anodized coating is disposed between the aluminum substrate and the nickel plating layer and the insulating layer.

[0017] In one embodiment, the thickness of the anodic oxide coating is set to 5-10 μm.

[0018] The aforementioned flexible aluminum-based copper-clad laminate (CCL) incorporates a mesh microstructure layer within the aluminum substrate, creating a mesh microstructure within the substrate body. This mesh microstructure layer supports the insulating layer and the copper cladding layer while significantly enhancing the flexibility and bending performance of the flexible CCL. Specifically, the mesh microstructure layer features uniformly arranged micro-mesh holes. Based on the inherent flexibility and bending properties of the aluminum substrate, these micro-mesh holes can deform to a certain extent during bending, adapting to the bending and torsion of the substrate. This allows for greater freedom in selecting the bending angle and degree, effectively expanding the bending limit and deformation recovery capability of the aluminum substrate. Furthermore, it ensures the thermal conductivity of the aluminum substrate while achieving weight reduction. Attached Figure Description

[0019] Figure 1 This is a schematic cross-sectional view of a flexible aluminum-based copper-clad laminate in one embodiment. Detailed Implementation

[0020] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0021] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0026] Please see Figure 1This utility model discloses a flexible aluminum-based copper-clad laminate, which includes an aluminum substrate 100, an insulating layer 200, and a copper cladding layer 300. The insulating layer 200 is disposed on one side surface of the aluminum substrate 100, and the copper cladding layer 300 is disposed on the side surface of the insulating layer 200 facing away from the aluminum substrate 100, thereby forming a flexible aluminum-based copper-clad laminate. The aluminum substrate 100 is provided with a mesh microstructure layer 110, which is disposed inside the aluminum substrate 100, thereby forming a mesh microstructure within the main body of the aluminum substrate 100. Thus, the mesh microstructure layer 110, while supporting the insulating layer 200 and the main body of the copper cladding layer 300, can greatly improve the flexibility and bending performance of the flexible aluminum-based copper-clad laminate. Specifically, the mesh microstructure layer 110 is provided with uniformly arranged micro-mesh holes a. Based on the flexibility and bending performance of the aluminum substrate 100 itself, the micro-mesh holes a can deform to a certain extent during the bending process of the aluminum substrate 100, thereby adapting to the bending and twisting of the aluminum substrate 100. This allows the aluminum substrate 100 to more freely select the bending angle and degree of bending, effectively expanding the bending limit and deformation recovery capability of the aluminum substrate 100. While ensuring the thermal conductivity of the aluminum substrate 100, it can also achieve the weight reduction of the aluminum substrate 100. More specifically, the aluminum substrate 100 is also provided with a nickel plating layer 120. The nickel plating layer 120 is plated on the side of the aluminum substrate 100 facing away from the insulating layer 200. Therefore, based on the good ductility, leveling type and chemical resistance of the nickel plating layer 120, the nickel plating layer 120 can improve the surface hardness of the aluminum substrate 100 while maintaining the flexibility and bendability of the aluminum substrate 100, thereby improving the wear resistance and corrosion resistance of the aluminum substrate 100.

[0027] Furthermore, the mesh microstructure layer 110 is disposed inside the aluminum substrate 100, that is, thin walls are formed on both sides of the aluminum substrate 100 to cover both sides of the mesh microstructure layer 110, thereby embedding the mesh microstructure layer 110 into the aluminum substrate 100 to form a sandwich structure. Thus, the aluminum substrate 100 can effectively prevent external particles from embedding into the mesh of the mesh microstructure layer 110 and causing a decrease in its bending performance, while ensuring good flexibility and bending performance, and improving the adhesion strength of the insulating layer 200 and the nickel plating layer 120 on both sides of the aluminum substrate 100. In one embodiment, the thickness of the mesh microstructure layer 110 is set to 0.1-0.3 mm. In another embodiment, the thickness of the nickel plating layer 120 is set to 10-20 μm.

[0028] Furthermore, the aluminum substrate 100 is made of 7075 aluminum alloy, thereby improving the overall thermal conductivity of the aluminum substrate 100 while ensuring its mechanical properties. Correspondingly, a nano-thermal conductive layer 210 is embedded inside the insulating layer 200, that is, the insulating layer 200 and the nano-thermal conductive layer 210 form a sandwich structure, thereby improving the thermal conductivity of the insulating layer 200. Based on this, the aluminum substrate 100 combined with the insulating layer 200 can effectively improve the overall thermal conductivity of the flexible aluminum-based copper-clad laminate, thereby improving the heat dissipation performance of the copper clad layer 300 in practical applications and enhancing operational stability. In one embodiment, the nano-thermal conductive layer 210 is made of boron nitride, thereby greatly improving the overall thermal conductivity of the insulating layer 200. In another embodiment, the overall thickness of the insulating layer 200 is set to 40-60 μm, further improving the thermal conductivity between the copper clad layer 300 and the aluminum substrate 100 while ensuring its pressure resistance.

[0029] Furthermore, the insulating layer 200 is also provided with a high-voltage withstand layer 220, which is disposed on the surface of the main body of the insulating layer 200 facing the copper cladding layer 300, thereby making the insulating layer 200 form a multi-layer insulating structure and improving the overall dielectric strength of the insulating layer 200. In one embodiment, the high-voltage withstand layer 220 is made of either PPS or PEEK to improve the high-voltage withstand performance of the insulating layer 200.

[0030] Furthermore, the aluminum substrate 100 is also provided with an anodized coating 130, which is applied to both sides of the aluminum substrate 100. That is, the anodized coating 130 is disposed between the aluminum substrate 100 and the nickel plating layer 120 and the insulating layer 200, thereby improving the salt spray resistance of the aluminum substrate 100. In one embodiment, the thickness of the anodized coating 130 is set to 5-10 μm.

[0031] In summary, the flexible aluminum-based copper-clad laminate disclosed in this invention forms a mesh microstructure layer within the aluminum substrate, thereby significantly improving the flexibility and bending performance of the flexible aluminum-based copper-clad laminate while supporting the insulating layer and the copper cladding layer. Specifically, the mesh microstructure layer has uniformly arranged micro-mesh holes. Based on the inherent flexibility and bending performance of the aluminum substrate, the micro-mesh holes can deform to a certain extent during the bending process of the aluminum substrate, thus adapting to the bending and torsion of the aluminum substrate. This allows the aluminum substrate to more freely select the bending angle and degree of bending, effectively expanding the bending limit and deformation recovery capability of the aluminum substrate. While ensuring the thermal conductivity of the aluminum substrate, it also achieves lightweighting of the aluminum substrate.

[0032] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A flexible aluminum-based copper-clad laminate, characterized in that, include: The flexible aluminum-based copper-clad laminate comprises an aluminum substrate, an insulating layer, and a copper cladding layer. The insulating layer is disposed on one side surface of the aluminum substrate, and the copper cladding layer is disposed on the side surface of the insulating layer opposite to the aluminum substrate, thereby forming the entire flexible aluminum-based copper-clad laminate. The aluminum substrate is provided with a mesh microstructure layer, which is disposed inside the aluminum substrate, thereby forming a mesh microstructure inside the main body of the aluminum substrate. The mesh microstructure layer is provided with uniformly arranged micro-mesh holes.

2. The flexible aluminum-based copper-clad laminate according to claim 1, characterized in that, The aluminum substrate is further provided with a nickel plating layer, which is plated on the side surface of the aluminum substrate facing away from the insulating layer.

3. The flexible aluminum-based copper-clad laminate according to claim 2, characterized in that, The mesh microstructure layer is disposed inside the aluminum substrate.

4. The flexible aluminum-based copper-clad laminate according to claim 3, characterized in that, The thickness of the mesh microstructure layer is set to 0.1-0.3 mm.

5. The flexible aluminum-based copper-clad laminate according to claim 4, characterized in that, The thickness of the nickel plating layer is set to 10-20 μm.

6. The flexible aluminum-based copper-clad laminate according to claim 5, characterized in that, The aluminum substrate is made of 7075 aluminum alloy.

7. The flexible aluminum-based copper-clad laminate according to claim 6, characterized in that, A nano-thermal conductive layer is embedded inside the insulating layer.

8. The flexible aluminum-based copper-clad laminate according to claim 7, characterized in that, The nano-thermal conductive layer is made of boron nitride.

9. The flexible aluminum-based copper-clad laminate according to claim 8, characterized in that, The overall thickness of the insulating layer is set to 40-60 μm.

10. The flexible aluminum-based copper-clad laminate according to claim 9, characterized in that, The insulating layer is further provided with a high voltage-resistant layer, which is disposed on the surface of the main body of the insulating layer facing the copper cladding, thereby making the insulating layer as a whole form a multi-layer insulating structure.

Images