Anti-static ic material pipe

Abstract

The utility model discloses a kind of anti-static IC material pipes, it relates to IC material pipe technical field, including anti-static pipe body, the anti-static pipe body includes IC material pipe, the inner wall of the IC material pipe is provided with conductive base material layer, the surface of the IC material pipe is provided with anti-static coating;Dustproof mechanism, the dustproof mechanism includes sealing edge, the sealing edge is set on the surface of IC material pipe.The utility model is through the conductive base material layer of IC material pipe inner wall and the surface anti-static coating, even in dry workshop can quickly dissipate static electricity, significantly reduce the damage rate of sensitive IC chip due to electrostatic breakdown;While aging-resistant nitrile rubber gasket of sealing edge is tightly attached when transparent PET dustproof cover is covered, can completely block the dust in turnover process into card slot, reduce IC pin dust adhesion rate, avoid the risk of false welding when patch processing.

Description

Technical Field

[0001] This utility model relates to the field of IC tubing technology, specifically to an anti-static IC tubing. Background Technology

[0002] Traditional IC tubing is widely used in the electronics manufacturing industry, covering IC chip production, warehousing, transportation, and automated surface mount technology (SMT) processes. Its core purpose is to provide independent storage space for IC chips, preventing collisions between chips that could cause pin deformation or package damage. It also adapts to the automated pick-and-place rhythm of SMT machines, ensuring efficient chip flow between various production processes. It is an indispensable packaging and turnover carrier in the mass production of electronic components.

[0003] However, in high-static-occurrence scenarios such as drying workshops and when handling batches of IC chips of various specifications, traditional tubing lacks a dedicated anti-static structure. Static electricity easily accumulates in the dry environment, and when discharged, it can easily damage the internal circuitry of the IC chip, leading to an increased damage rate of sensitive chips. At the same time, the dustproof design is simple, and dust can easily enter the slot and adhere to the pins during handling, causing poor soldering problems during surface mount processing. Furthermore, the fixed structure has a fixed size and can only accommodate a single specification of chip. Replacing a chip requires customizing the tubing again, which increases packaging costs and reduces the efficiency of process connections. Utility Model Content

[0004] This invention provides an anti-static IC tubing to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] An antistatic IC tube includes an antistatic tube body, wherein the antistatic tube body includes an IC tube, the inner wall of the IC tube is provided with a conductive substrate layer, and the surface of the IC tube is provided with an antistatic coating; a dustproof mechanism, the dustproof mechanism including a sealing edge, the sealing edge being disposed on the surface of the IC tube, and a sealing gasket being fixedly connected to one side of the sealing edge; and a fixing mechanism, the fixing mechanism including an elastic clip and a spring, one side of the elastic clip being fixedly connected to one end of the spring, and the other end of the spring being fixedly connected to the inner wall of the IC tube.

[0007] A further improvement of the present invention is that: a locking block is provided at one end of the IC tube, a dust cover is provided at the end of the IC tube, and an engagement groove is provided on the inner wall of the dust cover, the inner wall of the engagement groove overlapping the surface of the locking block.

[0008] A further improvement of this utility model is that the conductive substrate layer is made of carbon fiber woven fabric with a thickness of 0.1-0.2 mm and a surface resistivity of 10. 3 -10 5Ω is completely bonded to the inner wall of the IC tube using hot melt adhesive.

[0009] A further improvement of this utility model is that the antistatic coating is a water-based antistatic resin coating with a thickness of 0.05-0.1 mm and a surface resistivity of 10 Ω·cm. 6 -10 9 Ω, static dissipation time ≤0.1s.

[0010] A further improvement of this utility model is that the sealing gasket is made of aging-resistant nitrile rubber with a thickness of 1-2mm and a width consistent with the sealing edge. When the dust cover is closed, the sealing gasket fits tightly against the inner wall of the dust cover, thereby achieving a sealed dustproof seal at the end of the IC tube.

[0011] A further improvement of this utility model is that the dust cover is made of transparent PET material with a thickness of 0.3-0.5mm and a light transmittance of ≥90%.

[0012] A further improvement of this utility model is that the IC tube body is made of glass fiber reinforced PP material, with 15%-20% glass fiber added, and an impact strength ≥18kJ / m. 2 Temperature resistance range: -40℃ to 80℃.

[0013] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0014] This invention provides an anti-static IC tubing. Through the conductive substrate layer on the inner wall of the IC tubing and the anti-static coating on the surface, static electricity can be quickly dissipated even in a dry workshop, significantly reducing the damage rate of sensitive IC chips due to electrostatic discharge. Simultaneously, the aging-resistant nitrile rubber sealing gasket on the sealing edge and the transparent PET dust cover fit tightly together, completely preventing dust from entering the slot during handling, reducing dust adhesion to IC pins, and avoiding the risk of poor soldering during surface mount processing. The fixing mechanism composed of elastic clips and springs can flexibly adapt to ICs of different specifications, eliminating the need for custom tubing, significantly reducing packaging costs, and balancing protection and economy. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the dust cover of this utility model in the open state.

[0017] Figure 3 This is a side view of the present invention.

[0018] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0019] Figure 5 This is a cross-sectional structural diagram of the present invention.

[0020] In the diagram: 11. IC tubing; 12. Conductive substrate layer; 13. Antistatic coating; 21. Sealing edge; 22. Sealing gasket; 23. Clamping block; 24. Dust cover; 25. Engaging groove; 31. Elastic clamping strip; 32. Spring. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to embodiments:

[0022] Example 1, as Figures 1-5 As shown, this utility model provides an antistatic IC tube, including an antistatic tube body, the antistatic tube body including an IC tube 11, the inner wall of the IC tube 11 is provided with a conductive substrate layer 12, the surface of the IC tube 11 is provided with an antistatic coating 13; a dustproof mechanism, the dustproof mechanism including a sealing edge 21, the sealing edge 21 is provided on the surface of the IC tube 11, and a sealing gasket 22 is fixedly connected to one side of the sealing edge 21.

[0023] The fixing mechanism includes an elastic clamp 31 and a spring 32. One side of the elastic clamp 31 is fixedly connected to one end of the spring 32, and the other end of the spring 32 is fixedly connected to the inner wall of the IC tube 11.

[0024] In this embodiment, by applying external force to the dust cover 24, the engagement groove 25 on the inner wall of the dust cover disengages from the locking block 23 at the end of the IC tube 11, and the dust cover is pulled open along the tube axis. The IC chips to be loaded are placed one by one into the slots of the IC tube 11. When the chip is placed, the elastic clips 31 on both sides are squeezed, pushing the elastic clips to rotate outward from the slots, while compressing the spring 32 connected to them. The spring 32 generates a reverse elastic force when compressed, which drives the elastic clips 31 to fit tightly against both sides of the chip. Through adaptive adjustment of the elastic force, it can adapt to IC chips of different widths.

[0025] Example 2, as Figures 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, one end of the IC tube 11 is provided with a locking block 23, and the end of the IC tube 11 is provided with a dust cover 24. The inner wall of the dust cover 24 has an engagement groove 25, and the inner wall of the engagement groove 25 overlaps with the surface of the locking block 23. The conductive substrate layer 12 is made of carbon fiber woven fabric with a thickness of 0.1-0.2 mm and a surface resistivity of 10 Ω·cm. 3 -10 5 The Ω is completely bonded to the inner wall of the IC tube 11 by hot melt adhesive. The antistatic coating 13 is a water-based antistatic resin coating with a thickness of 0.05-0.1mm and a surface resistivity of 10. 6 -109 Ω, static dissipation time ≤0.1s.

[0026] In this embodiment, by pushing the dust cover 24 back along the tube axial direction, the engagement groove 25 and the locking block 23 are re-engaged, thereby achieving the limiting and fixing of the dust cover. At this time, the aging-resistant nitrile rubber sealing gasket 22 on the sealing edge 21 of the IC tube 11 is completely attached to the end of the dust cover 24 to form a sealing structure, preventing dust in the air from entering the slot during turnover and preventing dust from adhering to the IC pins. At the same time, the conductive substrate layer on the inner wall of the IC tube 11 can conduct the static electricity generated by the tube or chip in real time, and then quickly dissipate the static electricity through the water-based antistatic resin coating on the surface of the tube, avoiding electrostatic breakdown of the internal circuit of the chip in scenarios such as drying workshops.

[0027] Example 3, as Figures 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the sealing gasket 22 is made of aging-resistant nitrile rubber with a thickness of 1-2 mm and a width consistent with the sealing edge 21. When the dust cover 24 is closed, the sealing gasket 22 is tightly fitted to the inner wall of the dust cover 24, achieving a sealed dustproof seal at the end of the IC tube 11. The dust cover 24 is made of transparent PET material with a thickness of 0.3-0.5 mm and a light transmittance ≥90%. The IC tube 11 body is made of glass fiber reinforced PP material with 15%-20% glass fiber added, and an impact strength ≥18kJ / m. 2 Temperature resistance range: -40℃ to 80℃.

[0028] In this embodiment, the IC tube 11 body is made of glass fiber reinforced PP material with 15%-20% added glass fiber, and its impact strength is ≥18kJ / m. 2 It can withstand minor collisions during handling; the elastic clip 31 continuously clamps the chip under the elastic force of the spring 32 to prevent the chip from shifting or the pins from bending due to transportation bumps; the dust cover 24 is kept closed by the overlapping structure of the engagement groove 25 and the card block 23, and the sealing gasket 22 continuously blocks dust to ensure that the chip is not contaminated or damaged by static electricity during long-distance handling.

[0029] The working principle of this anti-static IC tube will be explained in detail below.

[0030] like Figures 1-5As shown, the operator applies external force to the dust cover 24, causing the engagement groove 25 on the inner wall of the dust cover to disengage from the locking block 23 at the end of the IC tube 11, and pulls the dust cover open axially along the tube body. The IC chips to be loaded are then placed one by one into the slots of the IC tube 11. When the chips are placed, the elastic clips 31 on both sides are squeezed, pushing the elastic clips to rotate outwards from the slots, while simultaneously compressing the spring 32 connected to them. The compressed spring 32 generates a reverse elastic force, causing the elastic clips 31 to tightly adhere to both sides of the chip. Through adaptive adjustment of the elastic force, it adapts to IC chips of different widths. After loading is complete, the dust cover 24 is pushed back axially along the tube body, causing the engagement groove 25 to re-engage with the locking block 23. This achieves the limiting and fixing of the dust cover; at this time, the aging-resistant nitrile rubber sealing gasket 22 on the sealing edge 21 of the IC tube 11 is completely fitted with the end of the dust cover 24 to form a sealing structure, preventing dust in the air from entering the slot during turnover and preventing dust from adhering to the IC pins; at the same time, the conductive substrate layer on the inner wall of the IC tube 11 can conduct the static electricity generated by the tube or chip in real time, and then quickly dissipate the static electricity through the water-based antistatic resin coating on the surface of the tube, avoiding static electricity breakdown of the internal circuit of the chip in scenarios such as dry workshops. The body of the IC tube 11 is made of glass fiber reinforced PP material with 15%-20% glass fiber added, with an impact strength ≥18kJ / m 2 It can withstand minor collisions during handling; the elastic clip 31 continuously clamps the chip under the elastic force of the spring 32 to prevent the chip from shifting or the pins from bending due to transportation bumps; the dust cover 24 is kept closed by the overlapping structure of the engagement groove 25 and the card block 23, and the sealing gasket 22 continuously blocks dust to ensure that the chip is not contaminated or damaged by static electricity during long-distance handling.

[0031] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. An antistatic IC tubing, characterized in that: include An antistatic tube body, the antistatic tube body includes an IC tube (11), the inner wall of the IC tube (11) is provided with a conductive substrate layer (12), and the surface of the IC tube (11) is provided with an antistatic coating (13). The dustproof mechanism includes a sealing edge (21), which is disposed on the surface of the IC tube (11), and a sealing gasket (22) is fixedly connected to one side of the sealing edge (21). The fixing mechanism includes an elastic clamp (31) and a spring (32). One side of the elastic clamp (31) is fixedly connected to one end of the spring (32), and the other end of the spring (32) is fixedly connected to the inner wall of the IC tube (11).

2. The antistatic IC tubing according to claim 1, characterized in that: One end of the IC tube (11) is provided with a locking block (23), and the end of the IC tube (11) is provided with a dust cover (24). The inner wall of the dust cover (24) is provided with an engagement groove (25), and the inner wall of the engagement groove (25) overlaps with the surface of the locking block (23).

3. The antistatic IC tubing according to claim 1, characterized in that: The conductive substrate layer (12) is made of carbon fiber woven fabric with a thickness of 0.1-0.2 mm and a surface resistivity of 10. 3 -10 5 Ω is completely bonded to the inner wall of IC tube (11) by hot melt adhesive.

4. The antistatic IC tubing according to claim 1, characterized in that: The antistatic coating (13) is a water-based antistatic resin coating with a thickness of 0.05-0.1 mm and a surface resistivity of 10 Ω·cm. 6 -10 9 Ω, static dissipation time ≤0.1s.

5. The antistatic IC tubing according to claim 1, characterized in that: The sealing gasket (22) is made of aging-resistant nitrile rubber with a thickness of 1-2 mm and a width consistent with the sealing edge (21). When the dust cover (24) is closed, the sealing gasket (22) fits tightly against the inner wall of the dust cover (24), thus achieving a sealed dustproof end of the IC tube (11).

6. The antistatic IC tubing according to claim 2, characterized in that: The dust cover (24) is made of transparent PET material with a thickness of 0.3-0.5mm and a light transmittance of ≥90%.

7. The antistatic IC tubing according to claim 1, characterized in that: The IC tube (11) body is made of glass fiber reinforced PP material with 15%-20% glass fiber added, and has an impact strength ≥18kJ / m. 2 Temperature resistance range: -40℃ to 80℃.

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