A packaging structure suitable for large size screens

Abstract

A packaging structure for large-sized screens, comprising at least a packaging bag, the packaging bag being composed of a rear bag plate and a front bag face, the outer edges of the rear bag plate and the front bag face being bonded to each other in pairs to form a containing cavity; the front bag face being provided with at least a first window, so as to facilitate the integrated circuit board of an integrated screen placed in the containing cavity to be located at the first window; the rear bag plate and the front bag face are both made of a cushioning material, the cushioning coefficient of the cushioning material being greater than 0.65; the rear bag plate is provided with a second window corresponding to the first window of the front bag face; a packaging box, in which a plurality of packaging bags with integrated screens are sequentially stacked, the first window of a rear packaging bag being in close proximity to the second window of a front packaging bag, and the plurality of packaging bags being closely stacked in the same packaging box. The present patent only needs to rely on a low-cost packaging bag design, can realize high-protective packaging of integrated screens, allows a plurality of packaging bags to be closely stacked together, and realizes high-density packaging and transportation.

Description

Technical Field

[0001] This utility model relates to a packaging structure suitable for large-size screens. Background Technology

[0002] In the screen (specifically LCD screens and touch screens) production chain, the produced screens need to be packaged and transported. Previously, bubble wrap (cushioning bags) were designed for comprehensive packaging. However, in the early days, the screen and circuit were manufactured separately and then assembled for use. During transportation, only bubble wrap was needed to package the screen, while the circuit board was packaged and transported separately. As the industry develops, in the production of some medium or large screens, there is a tendency to integrate the integrated circuit board and the screen into one production process. This is especially true for screen products larger than 21 inches, where it is more troublesome to assemble the integrated circuits separately. Integrated molding production greatly simplifies the subsequent assembly process.

[0003] However, in the packaging and transportation of integrated screen products, it is necessary to ensure the overall safety of the screen product while also ensuring the protection of specific areas of the integrated circuit board, especially to prevent the integrated circuit board from being directly pressed onto the screen and causing damage. If all these requirements are taken into account, the packaging volume of a single screen will be too large, greatly increasing the packaging and transportation costs. Therefore, how to package and transport this type of screen product at low cost has become the problem that needs to be solved in this case. Utility Model Content

[0004] The primary objective of this invention is to develop a packaging structure that is simple in structure, provides excellent protection, and is suitable for large-sized products. The second objective of this invention is to provide a packaging structure that saves packaging space and increases packaging and transportation efficiency.

[0005] To achieve the purpose of this utility model, a packaging structure suitable for large-size screens is disclosed, comprising at least one packaging bag. The packaging bag consists of a back bag panel and a front bag surface. Three edges of the outer edges of the back bag panel and the front bag surface are bonded together in pairs to form a receiving cavity, and the other edge is separated to form an insertion entrance for the receiving cavity. The front bag surface has at least one first window to facilitate the placement of the integrated circuit board of the integrated screen into the receiving cavity at the first window. Both the back bag panel and the front bag surface are made of cushioning material with a cushioning coefficient greater than 0.65. The thickness of the material of the front bag surface is greater than the thickness of the integrated circuit board even after cushioning and compression.

[0006] Furthermore, the rear bag panel has a second opening at the location of the first opening on the front bag surface.

[0007] Furthermore, at the separated edge, the rear pocket panel is higher than the front pocket surface, and the height of the inserted screen is between the rear pocket panel and the front pocket surface.

[0008] Furthermore, the two sides of the front bag surface are curved to facilitate the formation of a certain gap between the front bag surface and the rear bag panel, so that the insertion opening has a certain width.

[0009] Furthermore, the integrated screen includes a one-piece molded screen, a flexible circuit, and an integrated circuit board. The flexible circuit is used to connect the integrated circuit board and the screen to form a complete liquid crystal display circuit.

[0010] Furthermore, the flexible circuit folds inward from the edge of the integrally formed screen to ensure that the integrated circuit board is located at the first opening.

[0011] Furthermore, the cushioning material is foamed polyethylene, bubble film, carbon nanotube-graphene hybrid structure, honeycomb cardboard, plant fiber, or foamed rubber.

[0012] Furthermore, there is another packaging box containing multiple packaging bags with integrated screens stacked inside. The front of the next packaging bag is close to the back panel of the previous packaging bag, and the first window of the next packaging bag is close to the second window of the previous packaging bag. The second window of the previous packaging bag further ensures that the integrated circuit board inside the next packaging bag is not squeezed. Multiple packaging bags are tightly stacked in the same packaging box.

[0013] With the above structure, this patent can achieve highly protective packaging for an integrated screen by relying on low-cost packaging bag design. In particular, when stacked in the packaging box, the clever window design places the integrated circuit board in the two-layer window (the first window and the second window of the front bag), which best avoids squeezing the integrated circuit board. At the same time, due to the clever design, multiple packaging bags can be tightly stacked together, that is, a single packaging box can achieve high-density packaging and transportation, which greatly reduces the packaging and transportation costs of the entire batch. It satisfies both the protection effect and the cost reduction, and has strong practicality. Attached Figure Description

[0014] The specific description given as a non-limiting example better explains what this utility model includes and how it can be implemented. Furthermore, this description refers to the accompanying drawings, in which: Figure 1-3 This is a schematic diagram of the packaging bag according to Embodiment 1 of this utility model; Figure 4-7 This is a schematic diagram of the packaging bags being stacked into a packaging box according to Embodiment 1 of this utility model; Label Explanation: Packaging bags 1a, 1b; back bag panels 11a, 11b; second windows 111a, 111b; front bag face 12a, 12b; receiving cavity 13; placement entrance 131; first windows 121a, 121b; curvature 132; integrated screens 2a, 2b; one-piece molded screens 21a, 21b; flexible circuits 22a, 22b; integrated circuit boards 23a, 23b. Detailed Implementation

[0015] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0016] like Figure 1-7 As shown, a packaging structure suitable for large-size screens includes at least one packaging bag 1a, which is composed of a back bag panel 11a and a front bag surface 12a. Three edges of each of the outer edges of the back bag panel 11a and the front bag surface 12a are bonded together to form a receiving cavity 13a, and the other edge is separated to form an insertion entrance 131 of the receiving cavity 13. The front bag surface 12a has at least one first opening 121a to facilitate the placement of the integrated circuit board 23a of the integrated screen 2a into the receiving cavity 13 at the first opening 121a. Both the back bag panel 11a and the front bag surface 12a are made of cushioning material with a cushioning coefficient greater than 0.65; in this embodiment, bubble wrap is used. The material thickness of the front bag surface 12a is greater than the thickness of the integrated circuit board 23a even after cushioning and compression.

[0017] In this embodiment, the rear bag panel 11a is provided with a second window 111a at the first window 121a corresponding to the front bag surface 12a; in some other embodiments, multiple first windows and second windows are allowed to be further opened according to the number and position of integrated circuit boards, so as to facilitate the packaging and bulk transportation of different types of integrated screens.

[0018] At the separated edge, the rear pocket panel 11a is higher than the front pocket surface 12a, and the height of the integrated screen 2a is between the rear pocket panel 11a and the front pocket surface 12a, as shown below. Figure 2 As shown, this design facilitates the removal and placement of the integrated screen 2a, and also protects the integrated screen 2a. The back pocket 11a fully covers its area, providing excellent protection for the integrated screen 2a.

[0019] The two sides of the front bag surface 12a are curved to a certain degree 132, which facilitates the formation of a certain gap between the front bag surface 12a and the rear bag plate 11a, so that the insertion entrance 131 has a certain width.

[0020] The integrated screen 2a includes an integrally formed screen 21a, a flexible circuit 22a, and an integrated circuit board 23a. The flexible circuit 22a is used to connect the integrated circuit board 23a and the integrally formed screen 21a to form a complete liquid crystal display circuit.

[0021] The flexible circuit 22a folds inward from the edge of the integrally formed screen 21a to ensure that the integrated circuit board 23a is located at the first window 121a.

[0022] like Figure 4-7 As shown, several packaging bags 1a and 1b are stacked into a packaging box 3 of corresponding size. The front bag face 12a of the first packaging bag 1a is close to the back bag face 11b of the second packaging bag 1b. The first window 121a of the first packaging bag 1a is located at the second window 111b of the second packaging bag 1b. Thus, the integrated circuit board 23a of the first packaging bag 1a is protected from compression at the first window 121a because the window provides space. It is further protected from compression at the second window 111b of the preceding packaging bag 1b. In this way, even if multiple packaging bags 1a and 1b are tightly stacked one by one in the same packaging box 3, each integrated circuit board 23a and 23b can be well protected from compression. While using cushioning materials to protect the integrated screens 2a and 2b, the packaging space is greatly reduced, and the packaging and transportation costs are lowered.

[0023] The technical solution described in this patent is applicable to embodiments of integrated screens of different sizes and shapes. This technical solution is basically the same as the aforementioned technical solution and will not be repeated here.

[0024] The above embodiments and illustrations are not intended to limit the product form and style of this utility model. Any appropriate changes and modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. A packaging structure suitable for large-size screens, characterized in that: The package includes at least one packaging bag (1a, 1b), which is composed of a back bag panel (11a, 11b) and a front bag face (12a, 12b). Three edges of the outer edges of the back bag panel (11a, 11b) and the front bag face (12a, 12b) are bonded together to form a receiving cavity (13), and the other edge is separated to form an insertion entrance (131) of the receiving cavity (13). The front bag face (12a, 12b) is provided with at least one first opening (121a, 121b). 1b), so that the integrated circuit boards (23a, 23b) of the integrated screen (2a, 2b) placed into the receiving cavity (13) are located at the first opening (121a, 121b); the rear pocket board (11a, 11b) and the front pocket surface (12a, 12b) are both made of cushioning material, and the cushioning coefficient of the cushioning material is greater than 0.65; the material thickness of the front pocket surface (12a, 12b) is greater than the thickness of the integrated circuit board (23a, 23b) after cushioning and compression.

2. The packaging structure suitable for large-size screens as described in claim 1, characterized in that: The rear bag panel (11a, 11b) has a second opening (111a, 111b) at the first opening (121a, 121b) of the front bag surface (12a, 12b).

3. The packaging structure suitable for large-size screens as described in claim 1, characterized in that: At the separated edges, the rear pocket panels (11a, 11b) are higher than the front pocket surfaces (12a, 12b), and the height of the integrated screens (2a, 2b) placed into the receiving cavity (13) is between the rear pocket panels (11a, 11b) and the front pocket surfaces (12a, 12b).

4. The packaging structure suitable for large-size screens as described in claim 1, characterized in that: The two sides of the front bag surface (12a, 12b) form a curvature (132), which facilitates the formation of a gap between the front bag surface (12a, 12b) and the rear bag panel (11a, 11b), so that the insertion opening (131) has a width.

5. A packaging structure suitable for large-size screens as described in claim 1, characterized in that: The integrated screen (2a, 2b) includes an integrally formed screen (21a, 21b), a flexible circuit (22a, 22b), and an integrated circuit board (23a, 23b). The flexible circuit (22a, 22b) is used to connect the integrated circuit board (23a, 23b) and the integrally formed screen (21a, 21b) to form a complete liquid crystal display circuit.

6. A packaging structure suitable for large-size screens as described in claim 5, characterized in that: The flexible circuits (22a, 22b) are folded inward from the edge of the integrally formed screen (21a, 21b) to ensure that the integrated circuit board (23a, 23b) is located at the first window (121a, 121b).

7. A packaging structure suitable for large-size screens as described in claim 1, characterized in that: The cushioning material is foamed polyethylene, bubble film, carbon nanotube-graphene hybrid structure, honeycomb cardboard, plant fiber, or foamed rubber.

8. A packaging structure suitable for large-size screens as described in claim 1, characterized in that: Another packaging box (3) contains multiple packaging bags (1a, 1b) containing an integrated screen stacked in sequence. The front bag face (12a) of the packaging bag (1a) is close to the back bag panel (11b) of the previous packaging bag (1b). The first window (121a) of the packaging bag (1a) is close to the second window (111b) of the previous packaging bag (1b). The second window (111b) of the previous packaging bag (1b) further ensures that the integrated circuit board (23a) inside the packaging bag (1a) is not squeezed. Multiple packaging bags (1a, 1b) are tightly stacked in the same packaging box (3).

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