A temperature-controlled storage device for non-blood specimens

Abstract

The utility model relates to the field of hospital non-blood specimen temporary storage, especially non-blood specimen's temperature control storage device, including specimen storage box, guide cold block, semiconductor refrigeration spare, heat abstractor, heat preservation board, and heat preservation board surrounds semiconductor refrigeration spare outside and covers in the cold face domain of guide cold block and specimen storage box, temperature sensor and central processing unit, and the detection end of temperature sensor respectively contacts specimen storage box and heat abstractor, and central processing unit is connected with temperature sensor and semiconductor refrigeration spare electricity respectively, and through heat abstractor heat absorption and heat dissipation, avoid hot end heat accumulation problem, increase guide cold plate, realize the even distribution of cold quantity in the cavity of box, set up heat preservation board, reduce the leakage of cold quantity in the box to outside, also insulate external environment heat invasion, and temperature sensor detects cold quantity and heat, so that important processor adjusts the current size of semiconductor refrigeration spare in time, makes the temperature control in specimen storage box at target temperature.

Description

Technical Field

[0001] This utility model relates to the field of temporary storage of non-blood specimens in hospitals, and more particularly to a temperature-controlled storage device for non-blood specimens. Background Technology

[0002] In hospital diagnostic and testing procedures, there is a natural time lag between the collection and testing of non-blood specimens such as urine, stool, and body fluids (e.g., pleural effusion, ascites, cerebrospinal fluid, synovial fluid, etc.). After specimens are obtained from the ward / collection room, they need to undergo transportation, registration, and pretreatment (usually taking 1-4 hours) before entering the testing stage. The quality of this "temporary storage" directly determines the accuracy of the test results. The stability of the components of these non-blood specimens is extremely sensitive to temperature. For example, when urine is above 25℃ or below 15℃, the different microorganisms it contains will change, thus affecting the test results and interfering with disease diagnosis. Therefore, in hospital settings, the temporary storage of non-blood specimens must strictly maintain a constant temperature range of 20℃±1℃.

[0003] However, current technologies for temporary storage of non-blood specimens in hospitals either lack sufficient reliability in temperature control or suffer from deficiencies in detailed design, failing to meet the requirement of constant temperature control. This leads to increased specimen testing error rates and wasted medical resources. Therefore, developing a temporary storage technology for non-blood specimens suitable for hospital environments has become an urgent technical problem to be solved in this field. Utility Model Content

[0004] The purpose of this invention is to provide a temperature-controlled storage device for non-blood specimens, solving the problems of insufficient temperature control reliability and constant temperature control of 20℃±1℃.

[0005] To achieve this objective, the present invention adopts the following technical solution: A temperature-controlled storage device for non-blood specimens, comprising: Specimen storage box; A cooling block is in contact with the outside of the specimen storage box; A semiconductor cooling device, wherein the cold end of the semiconductor cooling device is in contact with the heat-conducting layer; A heat dissipation assembly, wherein the hot end of the semiconductor cooling element is in contact with the heat dissipation assembly; A heat insulation board surrounds the outside of the semiconductor cooling element and covers the cooling block and the cooled surface area of ​​the specimen storage box; The temperature sensor and the central processing unit are respectively connected. The detection end of the temperature sensor is in contact with the specimen storage box and the heat dissipation assembly. The central processing unit is electrically connected to the temperature sensor and the semiconductor cooling device.

[0006] Preferably, the first end face of the cooling block is attached to the outer bottom surface of the specimen storage box, and the second end face is attached to the cold end face of the semiconductor cooling element.

[0007] Preferably, a cooling block and a semiconductor cooling device form a queue, with at least two pairs of columns, and all pairs of columns are evenly distributed at the bottom of the specimen storage box.

[0008] Preferably, the insulation board has a first groove for mounting the semiconductor cooling component. The first groove extends through the top and bottom end faces of the insulation board. The second end face of the cooling block is attached to the end face of the insulation board and covers the first opening of the first groove, and contacts the cold end of the semiconductor cooling component.

[0009] Preferably, one end face of the insulation board is coaxially extended with the first groove to form a second groove, and the cooling block is installed in the second groove.

[0010] Preferably, the height of the second groove is lower than or equal to the height of the cooling block.

[0011] Preferably, the other end face of the insulation board is provided with a wiring groove that communicates with the second opening of the first groove, and one end of the wiring groove extends beyond the projection area of ​​the heat dissipation component onto the insulation board.

[0012] Preferably, the heat dissipation assembly includes a fan and a finned heat dissipation pipe, the hot end of the semiconductor cooling element is in contact with the outer wall of the finned heat dissipation pipe, and the fan is located at the pipe opening of the finned heat dissipation pipe.

[0013] Preferably, the fan is electrically connected to the central processing unit.

[0014] Preferably, the specimen storage box, the cooling block, and the finned heat dissipation pipe are all made of aluminum or copper.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This application provides a temperature-controlled storage device for non-blood specimens, including a specimen storage box; a cooling block that contacts the outside of the specimen storage box; a semiconductor cooling element whose cold end contacts the cooling layer; a heat dissipation assembly whose hot end contacts the heat dissipation assembly; a heat insulation plate that surrounds the outside of the semiconductor cooling element and covers the cooling block and the cooled surface area of ​​the specimen storage box; a temperature sensor and a central processing unit, wherein the detection end of the temperature sensor contacts the specimen storage box and the heat dissipation assembly respectively, and the central processing unit contacts the temperature sensor and the semiconductor cooling element respectively. The thermoelectric connection of the thermoelectric cooler is achieved; heat dissipation components contact the hot end of the thermoelectric cooler to absorb and dissipate heat, avoiding heat accumulation and ensuring continuous and stable operation of the cooler; a cold-conducting plate is added to diffuse the cooling energy of the thermoelectric cooler from a "point" to a "surface", achieving uniform distribution of cooling energy within the chamber; an insulation plate is installed to reduce the leakage of cooling energy from the chamber to the outside and to isolate external heat intrusion, reducing the workload of the thermoelectric cooler and minimizing cooling energy loss; a temperature sensor detects the cooling and heating energy so that critical processors can adjust the current to the thermoelectric cooler in a timely manner, keeping the temperature inside the specimen storage chamber at the target temperature. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0018] Figure 1 A schematic diagram of the overall structure of a temperature-controlled storage device for non-blood specimens; Figure 2 An explosion diagram of a temperature-controlled storage device for non-blood specimens; Figure 3 A schematic diagram of a wiring channel in a temperature-controlled storage device for a non-blood specimen; Figure 4 Another schematic diagram of the wiring channel in a temperature-controlled storage device for a non-blood specimen; Illustration: 10. Specimen storage box; 20. Cooling block; 30. Semiconductor cooling component; 40. Heat dissipation assembly; 41. Finned heat dissipation pipe; 42. Fan; 50. Insulation board; 51. First slot; 52. Second slot; 53. Wiring trough. Detailed Implementation

[0019] To make the technical objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0021] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0022] Please see Figure 1-4 .

[0023] This invention provides a temperature-controlled storage device for non-blood specimens.

[0024] The device includes a specimen storage box 10, a cooling block 20, a thermoelectric cooler 30, a heat dissipation assembly 40, an insulation plate 50, a temperature sensor, and a central processing unit. The cooling block 20 is in contact with the outside of the specimen storage box 10. The cold end of the thermoelectric cooler 30 is in contact with the cooling layer. The hot end of the thermoelectric cooler 30 is in contact with the heat dissipation assembly 40. The insulation plate 50 surrounds the outside of the thermoelectric cooler 30 and covers the cooling block 20 and the cooled surface area of ​​the specimen storage box 10. The detection end of the temperature sensor is in contact with the specimen storage box 10 and the heat dissipation assembly 40, respectively. The central processing unit is electrically connected to the temperature sensor and the thermoelectric cooler 30, respectively.

[0025] In this embodiment, the specimen storage box 10 serves as a container for storing specimens and a carrier for non-blood specimens. It has an internal chamber with an open top, and a lid that can be closed over the top of the chamber. Understandably, in the specific environment of a hospital, the indoor temperature is generally around 20 degrees Celsius, which is comfortable for the human body. When the lid is closed, the chamber becomes a sealed space, and the temperature inside the chamber will be higher than the indoor temperature. This will adversely affect the non-blood specimens and further interfere with disease diagnosis.

[0026] Based on this, this embodiment uses a semiconductor cooling device 30 to cool the specimen storage box 10. The semiconductor cooling device 30, based on the Peltier effect, achieves a "cooling at one end (cold end) and heat generation at the other end (hot end)" effect when energized. The cold end provides cooling to the specimen storage box 10, while the hot end needs to dissipate heat to maintain cooling efficiency. Non-blood specimens are highly sensitive to temperature fluctuations. Given the requirement of a narrow difference between the target temperature and room temperature, the semiconductor cooling device 30 eliminates the need for a compressor's start-stop cycle; the cooling output can be precisely controlled by adjusting the input current.

[0027] To avoid excessive local temperature differences in the specimen storage box 10, a cooling block 20 is provided to evenly transfer the cold energy from the cold end of the semiconductor cooling element 30 to the specimen storage box 10. To further maintain the cooling effect and increase the heat preservation time, an insulation plate 50 is provided to cover the cooled area of ​​the specimen storage box 10, preventing the cold energy from dissipating and the heat from penetrating.

[0028] On the other hand, to ensure continuous cooling, a heat dissipation component 40 is installed to dissipate heat from the hot end of the semiconductor cooling component 30, which can improve the cooling efficiency of the cold end. It should be noted that when the target temperature is 20℃, the temperature of the hot end usually only needs to be controlled at 30-40℃, which is a small temperature difference from the room temperature. Therefore, the requirements for the heat dissipation component 40 are low, and it is sufficient to avoid severe heat accumulation at the hot end.

[0029] In terms of temperature control, a temperature sensor and a central processing unit (not shown in the figure) are provided. Two temperature sensors can be provided to detect the temperature of the specimen storage box 10 and the heat dissipation component 40 respectively, and transmit the obtained temperature data to the central processing unit synchronously. If the central processing unit detects abnormal temperature data, it adjusts the current input to the semiconductor cooling chip accordingly in order to effectively control the temperature of the specimen storage box 10.

[0030] For example, when the temperature of the specimen storage box 10 is detected to be lower than the set temperature, the current input is reduced; if the temperature of the specimen storage box 10 is normal, but the temperature of the heat dissipation component 40 is high, the current input is reduced to avoid long-term impact on the performance of the semiconductor cooling chip; when the temperature of the specimen storage box 10 is detected to be high, the current input is increased.

[0031] In another embodiment, the first end face of the cooling block 20 is attached to the outer bottom surface of the specimen storage box 10, and the second end face is attached to the cold end face of the semiconductor cooling element 30.

[0032] In this embodiment, the cooling block 20 serves as the dedicated conductive medium for the semiconductor cooling component 30, which can effectively reduce the thermal resistance of cold transfer and allow the cold to be evenly diffused throughout the specimen storage box 10. On the other hand, in the scenarios of moving and using the specimen storage box 10, the cooling block 20 can also serve as a buffer medium between the semiconductor cooling component 30 and the specimen storage box 10, providing isolation and buffer protection for the semiconductor cooling component 30.

[0033] Understandably, thermal interface materials such as thermal grease are coated between the specimen storage box 10, the cooling block 20, and the semiconductor cooling component 30 to fill microscopic gaps and improve the efficiency of cold transfer.

[0034] In another embodiment, a cooling block 20 and a semiconductor cooling element 30 form a queue, with at least two pairs of columns, all of which are evenly distributed at the bottom of the specimen storage box 10.

[0035] In this embodiment, whether multiple queues of cooling blocks 20 and semiconductor cooling components 30 are needed depends on the size and specifications of the specimen storage box 10. When there are at least two queues, their even distribution can effectively avoid the problem of large local temperature differences and effectively improve the cooling speed and uniformity of the entire area.

[0036] In another embodiment, the insulation plate 50 is provided with a first groove 51 for mounting the semiconductor cooling component 30. The first groove 51 penetrates the top and bottom end faces of the insulation plate 50. The second end face of the cooling block 20 is attached to the end face of the insulation plate 50 and covers the first opening of the first groove 51 and contacts the cold end of the semiconductor cooling component 30.

[0037] In this embodiment, the first groove 51 provides an embedded installation space for the semiconductor cooling component 30 on the insulation plate 50. The cold end of the semiconductor cooling component 30 corresponds to the first opening and the hot end corresponds to the second opening. At the same time, the insulation plate 50 wraps around the side of the semiconductor cooling component 30 through the first groove 51, thereby isolating the cold end and the hot end, further preventing the reverse loss of cold energy and the reverse intrusion of heat, and enhancing the uniformity and stability of the entire box.

[0038] In another embodiment, one end face of the insulation board 50 is coaxially extended with the first groove 51 to form a second groove 52, and the cooling block 20 is installed in the second groove 52.

[0039] In this embodiment, the second groove 52 is coaxially arranged with the first groove 51 to provide an accurate positioning and installation position for the cooling block 20, reducing assembly errors, and the second groove 52 enhances the anti-vibration displacement capability.

[0040] In another embodiment, the height of the second groove 52 is lower than or equal to the height of the cooling block 20.

[0041] In this embodiment, if the height of the second groove 52 is lower than that of the cooling block 20 (e.g., the groove height is 5mm and the cooling block 20 height is 6mm), the cooling block 20 will protrude 1mm from the end face of the insulation board 50 after being embedded. During assembly, the cooling block 20 protruding from the groove will be naturally "pressed" by the box body, forming an "interference fit" and eliminating the microscopic gap between the first end face of the cooling block 20 and the box body. If the height of the second groove 52 is equal to that of the cooling block 20, thermally conductive silicone grease is used for auxiliary sealing, so that the insulation board 50 can also be directly attached to the specimen storage box 10, providing it with better insulation effect.

[0042] In another embodiment, the other end face of the insulation board 50 is provided with a wiring groove 53 that communicates with the second opening of the first groove 51, and one end of the wiring groove 53 extends beyond the positive projection area of ​​the heat dissipation component 40 on the insulation board 50.

[0043] In this embodiment, combined with Figure 4 The wiring trough 53 is elongated, and the insulation board 50 has a notch that connects the wiring trough 53 to the second opening. The wiring trough 53 serves as the routing path for the wires of the semiconductor cooling component 30. Some wires are embedded in the insulation to avoid direct contact with the heat dissipation component 40, thus preventing overheating of the wires and potential circuit problems. On the other hand, by extending one end of the wiring trough 53 beyond the area of ​​the heat dissipation component 40, interference from the heat dissipation component 40 with the wiring is avoided, and the wires can effectively bypass the heat dissipation component 40.

[0044] In another embodiment, the heat dissipation assembly 40 includes a fan 42 and a finned heat dissipation pipe 41. The hot end of the semiconductor cooling element 30 is in contact with the outer wall of the finned heat dissipation pipe 41, and the fan 42 is disposed at the pipe opening of the finned heat dissipation pipe 41. The fan 42 is electrically connected to the central processing unit.

[0045] In this embodiment, the "finned heat dissipation pipe 41" serves as the core heat transfer medium, and the fan 42 at the pipe opening provides forced convection power. Through intelligent control by the central processing unit (CPU), dynamic matching between heat dissipation intensity and the heat generation demand at the hot end is achieved. The fins within the finned heat dissipation pipe 41 expand the heat conduction area, accelerating heat transfer, while the fan 42 provides forced convection, enhancing heat dissipation. Through the cooperation of the temperature sensor, fan 42, and central processing unit, the fan speed can be adjusted as needed to meet the target temperature control requirements.

[0046] In another embodiment, the specimen storage box 10, the cooling block 20, and the finned heat dissipation pipe 41 are all made of aluminum or copper.

[0047] In this embodiment, aluminum or copper is used because of its good thermal conductivity, which meets the requirements for rapid response in cooling and heat dissipation and temperature control. On the other hand, this type of material can improve the corrosion resistance and safety of each component and is easy to mold, which is conducive to production and preparation.

[0048] It should also be noted that the specimen storage box 10 can be a box structure with a lid (not shown) for sealing specimen storage, and the side walls of its non-directly cooled areas are provided with heat-insulating material; alternatively, the whole body is also provided with a protective shell (not shown), and heat-insulating material can be provided between the shell and the specimen storage box 10, and the shell can be provided with a lid to seal the specimen storage box 10; in addition, most of the components in this application are connected by screws and screw holes, which are firmly assembled and easy to disassemble.

[0049] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A temperature-controlled storage device for non-blood specimens, characterized in that, Specimen storage box (10); Cooling block (20), which is in contact with the outside of specimen storage box (10); A semiconductor cooling element (30) has its cold end in contact with the cooling block (20). Heat dissipation assembly (40), the hot end of the semiconductor cooling element (30) is in contact with the heat dissipation assembly (40); The insulation plate (50) surrounds the outside of the semiconductor cooling element (30) and covers the cooling surface area of ​​the cooling block (20) and the specimen storage box (10); The temperature sensor and the central processing unit are respectively connected to the specimen storage box (10) and the heat dissipation component (40) at the detection end of the temperature sensor, and the central processing unit is electrically connected to the temperature sensor and the semiconductor cooling component (30).

2. The temperature-controlled storage device for non-blood specimens according to claim 1, characterized in that, The first end face of the cooling block (20) is attached to the outer bottom surface of the specimen storage box (10), and the second end face is attached to the cold end face of the semiconductor cooling element (30).

3. The temperature-controlled storage device for non-blood specimens according to claim 1, characterized in that, A cooling block (20) and a semiconductor cooling element (30) form a queue, with at least two pairs of columns, all of which are evenly distributed at the bottom of the specimen storage box (10).

4. The temperature-controlled storage device for non-blood specimens according to claim 1, characterized in that, The insulation plate (50) is provided with a first groove (51) for installing the semiconductor cooling component (30). The first groove (51) penetrates the top and bottom end faces of the insulation plate (50). The second end face of the cooling block (20) is attached to the end face of the insulation plate (50) and covers the first opening of the first groove (51) and contacts the cold end of the semiconductor cooling component (30).

5. The temperature-controlled storage device for non-blood specimens according to claim 4, characterized in that, One end face of the insulation board (50) is coaxially extended with the first groove (51) to form a second groove (52), and the cooling block (20) is installed in the second groove (52).

6. The temperature-controlled storage device for non-blood specimens according to claim 5, characterized in that, The height of the second groove (52) is lower than or equal to the height of the cooling block (20).

7. The temperature-controlled storage device for non-blood specimens according to claim 4, characterized in that, The other end face of the insulation board (50) is provided with a wiring groove (53) that communicates with the second opening of the first groove (51). One end of the wiring groove (53) extends to the area outside the orthographic projection of the heat dissipation component (40) on the insulation board (50).

8. The temperature-controlled storage device for non-blood specimens according to claim 1, characterized in that, The heat dissipation component (40) includes a fan (42) and a finned heat dissipation pipe (41). The hot end of the semiconductor cooling component (30) is in contact with the outer wall of the finned heat dissipation pipe (41), and the fan (42) is located at the pipe opening of the finned heat dissipation pipe (41).

9. The temperature-controlled storage device for non-blood specimens according to claim 8, characterized in that, The fan (42) is electrically connected to the central processing unit.

10. The temperature-controlled storage device for non-blood specimens according to claim 8, characterized in that, The specimen storage box (10), the cooling block (20), and the finned heat dissipation pipe (41) are all made of aluminum or copper.

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