Carrier loading device

Abstract

The utility model belongs to chip processing technical field discloses a kind of loading device of carrier plate.The loading device of carrier plate includes bearing module and feeding module, bearing module includes drive assembly and bearing platform, and bearing platform is used to bear carrier plate, and feeding module includes main body, transfer assembly and sensor being set on main body, transfer assembly is used to adsorb chip and drive chip and move feeding to carrier plate along first direction, and sensor is fixed to main body;Adopt bearing platform to bear carrier plate, and drive assembly drives bearing platform to move along second direction or third direction on the plane where it is, to make sensor and bearing platform relative movement, and then utilize sensor to carry out flatness scanning to bearing platform or carrier plate, detect and identify recessed or protruding uneven position, to control chip in first direction's moving distance to realize dynamic compensation when chip feeding, to guarantee the effect and precision of chip arranging process.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a carrier plate loading device. Background Technology

[0002] In semiconductor manufacturing, inspection and sorting equipment is a specialized device used for automated testing and classification. During the carrier loading stage, chips need to be transferred from storage or transport carriers to the carrier of the inspection and sorting equipment.

[0003] In existing technologies, a drive structure is typically used to drive the carrier board to move and adjust its position on a plane. Then, the chip is transferred along a direction perpendicular to the carrier board and placed on the carrier board. When the carrier board is not installed in an uneven position or the surface of the carrier board is uneven, if different chips are transferred to the carrier board at equal distances, it is easy to cause misalignment of the chip arrangement, which will affect the chip arrangement effect and accuracy.

[0004] Therefore, there is an urgent need to provide a substrate loading device that can detect uneven positions such as depressions or protrusions, so that the chip can be moved by different distances during loading to achieve dynamic compensation, thereby ensuring the effect and accuracy of the chip arrangement process. Utility Model Content

[0005] The purpose of this invention is to provide a carrier board loading device that can detect uneven positions such as depressions or protrusions, so that the chip can be moved by different distances during loading to achieve dynamic compensation, thereby ensuring the effect and accuracy of the chip arrangement process.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a carrier plate loading device, which includes a carrier module and a loading module. The carrier module includes a driving component and a carrier platform. The carrier platform is used to carry the carrier plate. The loading module includes a main body, a transfer component disposed on the main body, and a sensor. The transfer component is used to adsorb a chip and drive the chip to move along a first direction to load it onto the carrier plate. The sensor is fixed to the main body. The first direction, the second direction, and the third direction intersect at a point and are perpendicular to each other. The driving component drives the carrier platform to move along the second direction or the third direction in its own plane, so that the sensor can scan the flatness of the carrier platform or the carrier plate.

[0008] As an optional technical solution for a carrier plate loading device, the sensor can be detachably fixed to the main body.

[0009] As an optional technical solution for a carrier plate loading device, the loading module includes a first mounting plate, the bottom of which is detachably fixed to the main body, and the sensor is fixed to the top of the first mounting plate.

[0010] As an optional technical solution for a carrier plate loading device, the loading module further includes a first fastener. The first mounting plate is provided with a first oblong hole. The first fastener passes through the first oblong hole and is threadedly connected to the main body. The first fastener can move in the first direction within the first oblong hole.

[0011] As an optional technical solution for the carrier plate loading device, the loading module further includes a second mounting plate, the second mounting plate including a connecting plate and a support plate connected to the connecting plate, the plane where the bearing platform is located, the plane where the connecting plate and the plane where the support plate are located are perpendicular to each other, the connecting plate is at least partially attached to and fixed to the top of the first mounting plate, and the sensor is fixed to the support plate.

[0012] As an optional technical solution for the carrier plate loading device, the loading module further includes a second fastener. The connecting plate is provided with a second oblong hole. The second fastener passes through the second oblong hole and is threadedly connected to the first mounting plate. The second fastener can move in the second direction within the second oblong hole.

[0013] As an optional technical solution for the carrier plate loading device, the loading module further includes an extension pad, and the sensor is fixed to the support plate through the extension pad.

[0014] As an optional technical solution for a carrier plate loading device, the driving assembly includes a first base, a second base slidably disposed on the first base, and a third base slidably disposed on the second base. The carrying platform is fixed to the third base. A first driving structure is provided on the first base, and a second driving structure is provided on the second base. The first driving structure drives the second base and the third base to slide along the third direction, and the second driving structure drives the third base to slide along the second direction.

[0015] As an optional technical solution for a carrier plate loading device, the first driving structure includes a first driving member, a first lead screw, and a first nut. The first lead screw is rotatably mounted on the first base and extends along the third direction. The first nut is connected to the second base and threadedly connected to the first lead screw. The first driving member is used to drive the first lead screw to rotate, thereby moving the first nut, the second base, and the third base.

[0016] As an optional technical solution for a carrier plate loading device, the sensor includes a laser rangefinder sensor.

[0017] Beneficial effects:

[0018] This utility model provides a carrier plate loading device, which includes a carrier module and a loading module. The carrier module includes a drive component and a carrier platform. The carrier platform is used to carry the carrier plate. The loading module includes a main body, a transfer component and a sensor disposed on the main body. The transfer component is used to adsorb the chip and drive the chip to move along a first direction to load it onto the carrier plate. The sensor is fixed to the main body. The first direction, the second direction and the third direction intersect at a point and are perpendicular to each other. The drive component drives the carrier platform to move along the second direction or the third direction in its own plane so that the sensor can scan the flatness of the carrier platform or the carrier plate. A transfer component and a sensor are mounted on the main body. The transfer component is used to adsorb the chip and move the chip along the first direction. The sensor is fixed to the main body. A carrier platform is used to carry the carrier board. The drive component drives the carrier platform to move along the second or third direction on its own plane, so that the carrier platform moves relative to the sensor. Then, the sensor is used to scan the flatness of the carrier platform or the carrier board on the carrier platform to detect and identify uneven positions such as depressions or protrusions. This allows for dynamic compensation by controlling the movement distance of the chip in the first direction when the chip is loaded using the transfer component, thereby ensuring the effect and accuracy of the chip stacking process. Attached Figure Description

[0019] Figure 1 This is a partial structural schematic diagram of the carrier plate loading device provided in this embodiment of the utility model;

[0020] Figure 2 This is a partial side view of the carrier plate loading device provided in this embodiment of the utility model;

[0021] Figure 3 This is a partial structural schematic diagram of the feeding module provided in this embodiment of the utility model;

[0022] Figure 4 This is a partial structural schematic diagram of the carrier module provided in an embodiment of this utility model.

[0023] In the picture:

[0024] 10. Bearing module; 11. Drive assembly; 111. First base; 112. First drive structure; 112a. First lead screw; 112b. First nut; 113. Second base; 114. Second drive structure; 115. Third base; 12. Bearing platform; 13. Carrier plate;

[0025] 20. Feeding module; 21. Main body; 22. Transfer assembly; 23. Sensor; 24. First mounting plate; 241. First oblong hole; 25. Second mounting plate; 251. Connecting plate; 252. Support plate; 253. Second oblong hole; 26. Extension pad. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0027] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0030] like Figures 1 to 4As shown, this embodiment provides a carrier plate loading device, which includes a carrier module 10 and a loading module 20. The carrier module 10 includes a drive component 11 and a carrier platform 12. The carrier platform 12 is used to carry a carrier plate 13. The loading module 20 includes a main body 21, a transfer component 22 disposed on the main body 21, and a sensor 23. The transfer component 22 is used to adsorb the chip and drive the chip to move along a first direction to load it onto the carrier plate 13. The sensor 23 is fixed to the main body 21. The first direction, the second direction, and the third direction intersect at a point and are perpendicular to each other. The drive component 11 drives the carrier platform 12 to move along the second direction or the third direction in its own plane so that the sensor 23 can scan the flatness of the carrier platform 12 or the carrier plate 13.

[0031] A transfer component 22 and a sensor 23 are provided on the main body 21. The transfer component 22 is used to adsorb the chip and drive the chip to be fed along the first direction. The sensor 23 is fixed to the main body 21. A carrier platform 12 is used to carry the carrier plate 13. The drive component 11 drives the carrier platform 12 to move along the second or third direction on its own plane, so that the carrier platform 12 moves relative to the sensor 23. Then, the sensor 23 is used to scan the flatness of the carrier platform 12 or the carrier plate 13 on the carrier platform 12 to detect and identify uneven positions such as depressions or protrusions. In order to control the movement distance of the chip in the first direction to achieve dynamic compensation when the chip is loaded using the transfer component 22, thereby ensuring the effect and accuracy of the chip stacking process.

[0032] Optionally, sensor 23 includes a laser rangefinder. Using a laser rangefinder for non-contact flatness scanning avoids scratches and wear on the surface being measured, unlike contact measurements. It also offers high-precision measurement capabilities, continuous scanning, and recording of relevant data from the surface, ensuring long-term stability and reliability. In other embodiments, infrared or ultrasonic sensors may also be used.

[0033] In this embodiment, the first direction is the Z direction, the second direction is the Y direction, and the third direction is the X direction. The transfer component 22 includes a motor and an adsorption structure. The adsorption structure is disposed on the main body 21. The nozzle of the adsorption structure picks up and adsorbs the chip, and the motor drives the nozzle to move along the Z direction to approach the carrier plate 13, so as to drive the chip to be fed onto the carrier plate 13 along the Z direction. The motor is a cam motor. The moving distance of the nozzle along the Z direction is controlled by the control system. The specific structure of the transfer component 22 can be designed with reference to the prior art, and the principle of controlling the moving distance of the nozzle is also the prior art.

[0034] The laser rangefinder is used to measure distance and record relevant data of the surface to be measured, such as establishing a planar coordinate system to record the XY coordinates. Before the carrier plate 13 is placed on the carrier platform 12, the laser rangefinder is used to scan the flatness of the carrier platform 12 and identify the location of the concave or protruding defects on the surface of the carrier platform 12, so as to correct the chip placement distance according to the defect location. Furthermore, after the carrier plate 13 is installed on the carrier platform 12, the laser rangefinder can be used to scan the flatness of the installation position on the surface of the carrier plate 13 and identify the location of the concave or protruding defects. When the chip arrangement is in an abnormal position, the suction nozzle of the adsorption structure is controlled to achieve distance compensation, ensuring the effect and accuracy of the chip arrangement.

[0035] Among them, the flatness scanning of the laser rangefinder means that the laser rangefinder emits a laser to the surface to be measured (such as the surface of the bearing platform 12 or the surface of the carrier plate 13), and calculates the distance by receiving the reflected light signal, thereby identifying the uneven positions of the surface to be measured, such as depressions or protrusions.

[0036] Optionally, the sensor 23 can be detachably fixed to the main body 21. By detachably mounting the sensor 23 on the main body 21, the sensor 23 can be removed after use, avoiding space occupation and affecting subsequent processing.

[0037] Furthermore, the feeding module 20 includes a first mounting plate 24, the bottom of which is detachably fixed to the main body 21, and the sensor 23 is fixed to the top of the first mounting plate 24. Detachably fixing the bottom of the first mounting plate 24 to the main body 21 and fixing the sensor 23 to the top of the second mounting plate 25 ensures that the setting position of the sensor 23 will not affect the normal use of the transfer component 22, and the first mounting plate 24 and the sensor 23 can be removed together after use.

[0038] Optionally, the feeding module 20 also includes a first fastener. The first mounting plate 24 has a first oblong hole 241. The first fastener passes through the first oblong hole 241 and is threadedly connected to the main body 21. The first fastener can move in the Z direction within the first oblong hole 241. By providing the first oblong hole 241 on the first mounting plate 24 and fixing it to the main body 21 with the first fastener, the first fastener can be loosened to quickly adjust the installation position of the first mounting plate 24 in the Z direction, changing the distance between the sensor 23 on the first mounting plate 24 and the support platform 12 in the Z direction. Alternatively, the first fastener can be tightened to ensure the installation stability of the first mounting plate 24.

[0039] Furthermore, the feeding module 20 also includes a second mounting plate 25, which includes a connecting plate 251 and a support plate 252 connected to the connecting plate 251. The plane where the bearing platform 12 is located, the plane where the connecting plate 251 and the plane where the support plate 252 are located are perpendicular to each other. The connecting plate 251 is at least partially attached to the top of the first mounting plate 24, and the sensor 23 is fixed on the support plate 252.

[0040] By setting the connecting plate 251 and the support plate 252 as the second mounting plate 25, the planes of the bearing platform 12, the connecting plate 251 and the support plate 252 are perpendicular to each other, so that the connecting plate 251 can be at least partially attached to the top of the first mounting plate 24, so that the connecting plate 251 is firmly connected to the first mounting plate 24, and the support plate 252 stably supports and fixes the sensor 23.

[0041] Optionally, the feeding module 20 also includes a second fastener. The connecting plate 251 is provided with a second oblong hole 253. The second fastener passes through the second oblong hole 253 and is threadedly connected to the first mounting plate 24. The second fastener can move in the Y direction within the second oblong hole 253.

[0042] By providing a first oblong hole 241 on the second mounting plate 25 and fixing it to the first mounting plate 24 with a second fastener, the installation position of the second mounting plate 25 along the Y direction can be quickly adjusted by loosening the second fastener, so that the sensor 23 on the first mounting plate 24 is adapted to the position of the carrier platform 12 in the Y direction. This ensures that when the carrier platform 12 moves, the sensor 23 can meet the scanning requirements of the surface of the carrier platform 12 or the surface of the carrier plate 13 in the Y direction. At the same time, the second fastener can be tightened to ensure the installation stability of the second mounting plate 25.

[0043] In this embodiment, the first mounting plate 24 is a flat plate, and two first waist-shaped holes 241 are spaced apart along the Z direction, where the Z direction is the length direction of the first waist-shaped holes 241. The first fastener is correspondingly set with the first waist-shaped holes 241. The second mounting plate 25 is an integral L-shaped plate, and the connecting plate 251 is spaced apart along the Z direction with three second waist-shaped holes 253. The Y direction is the length direction of the second waist-shaped holes 253. The second fastener is correspondingly set with the second waist-shaped holes 253.

[0044] Optionally, the feeding module 20 also includes an extension pad 26, through which the sensor 23 is fixed to the support plate 252. By setting the extension pad 26 on the support plate 252, the sensor 23 is fixed using the extension pad 26. The extension pad 26 is larger than the support plate 252, which can distribute the force. Alternatively, the support plate 252 and the extension pad 26 can be designed to be made of different materials according to actual needs.

[0045] In this embodiment, the extension pad 26 is a flat plate, and the extension pad 26 is detachably fixed to the support plate 252 by a third fastener. The first, second, and third fasteners are all bolts.

[0046] To drive the carrier platform 12 to move, the drive assembly 11 includes a first base 111, a second base 113, and a third base 115. The second base 113 is slidably disposed on the first base 111, and the third base 115 is slidably disposed on the second base 113. The carrier platform 12 is fixed to the third base 115. A first drive structure 112 is provided on the first base 111, and a second drive structure 114 is provided on the second base 113. The first drive structure 112 drives the second base 113 and the third base 115 to slide along the X direction, and the second drive structure 114 drives the third base 115 to slide along the Y direction. By setting the first base 111, the second base 113, and the third base 115, and using the first drive structure 112 and the second drive structure 114 to drive them, the position of the third base 115 in the X and Y directions is adjustable, thereby enabling the carrier platform 12 to move to a specific position in the X and Y directions.

[0047] Specifically, the first drive structure 112 includes a first drive member, a first lead screw 112a and a first nut 112b. The first lead screw 112a is rotatably mounted on the first base 111 and extends in the X direction. The first nut 112b is connected to the second base 113 and threadedly connected to the first lead screw 112a. The first drive member is used to drive the first lead screw 112a to rotate, so as to move the first nut 112b and the second base 113.

[0048] By setting the first lead screw 112a and the first nut 112b to cooperate, the first drive member drives the first lead screw 112a to rotate, causing the first nut 112b to move. The movement of the first nut 112b drives the second base 113 and the third base 115 to move along the X direction, so as to adjust the position of the second base 113 and the third base 115 in the X direction.

[0049] In this embodiment, the first driving component is a motor; a first slide rail extending along the X direction is provided on the first base 111; a first slider is fixed to the bottom of the second base 113, and the second base 113 slides in cooperation with the first slide rail of the first base 111 via the first slider; a second slide rail extending along the Y direction is provided on the second base 113; a second slider is fixed to the bottom of the third base 115, and the third base 115 slides in cooperation with the second slide rail on the second base 113 via the second slide rail; the bearing platform 12 is fixed to the third base 115 by bolts; the second driving structure 114 has the same structure as the first driving structure 112. By setting the corresponding slide rails and sliders, when the second base 113 or the third base 115 moves, the slider moves on the corresponding slide rail, thereby further accurately limiting the direction of movement and ensuring the smoothness of movement.

[0050] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A carrier plate loading device, characterized in that, The system includes a carrier module (10) and a loading module (20). The carrier module (10) includes a drive component (11) and a carrier platform (12). The carrier platform (12) is used to carry a carrier plate (13). The loading module (20) includes a main body (21), a transfer component (22) disposed on the main body (21), and a sensor (23). The transfer component (22) is used to adsorb the chip and drive the chip to move along a first direction to load it onto the carrier plate (13). The sensor (23) is fixed to the main body (21). The first direction, the second direction, and the third direction intersect at a point and are perpendicular to each other. The drive component (11) drives the carrier platform (12) to move along the second direction or the third direction in its own plane so that the sensor (23) can scan the flatness of the carrier platform (12) or the carrier plate (13).

2. The carrier plate loading device according to claim 1, characterized in that, The sensor (23) is detachably fixed to the main body (21).

3. The carrier plate loading device according to claim 2, characterized in that, The feeding module (20) includes a first mounting plate (24), the bottom of which is detachably fixed to the main body (21), and the sensor (23) is fixed to the top of the first mounting plate (24).

4. The carrier plate loading device according to claim 3, characterized in that, The feeding module (20) also includes a first fastener. The first mounting plate (24) is provided with a first waist-shaped hole (241). The first fastener passes through the first waist-shaped hole (241) and is threadedly connected to the main body (21). The first fastener can move in the first direction within the first waist-shaped hole (241).

5. The carrier plate loading device according to claim 3, characterized in that, The feeding module (20) further includes a second mounting plate (25), which includes a connecting plate (251) and a support plate (252) connected to the connecting plate (251). The plane of the bearing platform (12), the plane of the connecting plate (251) and the plane of the support plate (252) are perpendicular to each other. The connecting plate (251) is at least partially attached to the top of the first mounting plate (24), and the sensor (23) is fixed on the support plate (252).

6. The carrier plate loading device according to claim 5, characterized in that, The feeding module (20) also includes a second fastener. The connecting plate (251) is provided with a second waist-shaped hole (253). The second fastener passes through the second waist-shaped hole (253) and is threadedly connected to the first mounting plate (24). The second fastener can move in the second direction within the second waist-shaped hole (253).

7. The carrier plate loading device according to claim 5, characterized in that, The feeding module (20) also includes an extension pad (26), and the sensor (23) is fixed to the support plate (252) through the extension pad (26).

8. The carrier plate loading device according to any one of claims 1-7, characterized in that, The drive assembly (11) includes a first base (111), a second base (113) slidably disposed on the first base (111), and a third base (115) slidably disposed on the second base (113). The support platform (12) is fixed to the third base (115). The first base (111) is provided with a first drive structure (112), and the second base (113) is provided with a second drive structure (114). The first drive structure (112) drives the second base (113) and the third base (115) to slide along the third direction, and the second drive structure (114) drives the third base (115) to slide along the second direction.

9. The carrier plate loading device according to claim 8, characterized in that, The first drive structure (112) includes a first drive member, a first lead screw (112a) and a first nut (112b). The first lead screw (112a) is rotatably mounted on the first base (111) and extends along the third direction. The first nut (112b) is connected to the second base (113) and threadedly connected to the first lead screw (112a). The first drive member is used to drive the first lead screw (112a) to rotate, so as to move the first nut (112b), the second base (113) and the third base (115).

10. The carrier plate loading device according to any one of claims 1-7, characterized in that, The sensor (23) includes a laser rangefinder.

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