Chip suction nozzle structure and chip transfer clamp

Abstract

The application relates to a chip suction nozzle structure and a chip transfer clamp. Through high-precision control of suction nozzle pressure, the chip can be transported between different jigs, and the chip can be effectively protected during the transportation process; the design of the voice coil motor assembly cooperating with the suction nozzle gravity offset spring is beneficial to reducing the load of the voice coil motor of the voice coil motor assembly, thereby improving the working precision and stability of the voice coil motor, and improving the rapid positioning and accurate positioning of the suction nozzle vacuum adsorption mechanism; the design of the suction nozzle rotating mechanism cooperating with the suction nozzle vacuum adsorption mechanism is beneficial to increasing the rotating angle of the suction nozzle vacuum adsorption mechanism, realizing 360-degree controlled rotation, and achieving the design effect of conveniently and accurately sucking the chip; the design of the screw Z-axis assembly cooperating with the voice coil motor assembly is beneficial to balancing the rapid movement and accurate positioning of the suction nozzle vacuum adsorption mechanism in the Z-axis direction, protecting the sucked chip, and improving the work efficiency.

Description

Technical Field

[0001] This application relates to the field of automated production of laser chips, and in particular to chip nozzle structures and chip transfer fixtures. Background Technology

[0002] Laser chips, also known as laser devices, need to be moved between different fixtures during production and testing. Therefore, high-precision control of the nozzle pressure is required; otherwise, the laser chip may be damaged or crushed. Utility Model Content

[0003] Therefore, it is necessary to provide a chip suction nozzle structure and a chip transfer fixture.

[0004] One embodiment of this application is a chip suction nozzle structure, which includes a lead screw Z-axis assembly, a voice coil motor assembly, a suction nozzle gravity counteracting spring, a suction nozzle rotation mechanism, and a suction nozzle vacuum adsorption mechanism.

[0005] The lead screw Z-axis assembly drives the voice coil motor assembly to move along the Z-axis direction;

[0006] The suction nozzle gravity-offsetting spring is connected to the voice coil motor assembly to reduce the load on the voice coil motor in the voice coil motor assembly;

[0007] The suction nozzle rotation mechanism is connected to the voice coil motor assembly to follow the voice coil motor assembly in the Z-axis direction;

[0008] The suction nozzle vacuum adsorption mechanism is located below the suction nozzle rotation mechanism, so that it rotates perpendicular to the Z-axis direction under the drive of the suction nozzle rotation mechanism.

[0009] The aforementioned chip suction nozzle structure, through the coordinated operation of a lead screw Z-axis assembly, a voice coil motor assembly, a suction nozzle gravity-offsetting spring, a suction nozzle rotation mechanism, and a suction nozzle vacuum adsorption mechanism, achieves the function of precisely picking up chips. On one hand, high-precision control of the suction nozzle pressure enables the transfer of chips between different fixtures, effectively protecting the chips during transport and preventing them from being crushed or damaged. On the other hand, the design of the voice coil motor assembly in conjunction with the suction nozzle gravity-offsetting spring helps reduce the load on the voice coil motor, allowing it to operate under optimal load conditions, thereby improving the working accuracy and stability of the voice coil motor and further enhancing the rapid and precise positioning of the suction nozzle vacuum adsorption mechanism. Furthermore, the design of the suction nozzle rotation mechanism in conjunction with the suction nozzle vacuum adsorption mechanism allows for a larger rotation angle, achieving controlled 360-degree rotation, thus facilitating accurate chip pickup. Finally, the design of the lead screw Z-axis assembly in conjunction with the voice coil motor assembly helps balance the rapid movement and precise positioning of the suction nozzle vacuum adsorption mechanism in the Z-axis direction, protecting the picked-up chips while improving work efficiency.

[0010] In some embodiments, the voice coil motor assembly includes the voice coil motor and a voice coil motor mounting base;

[0011] The voice coil motor is mounted on the voice coil motor mounting base, the lead screw Z-axis assembly is driven and connected to the voice coil motor mounting base, and the suction nozzle gravity-counteracting spring is connected to the voice coil motor.

[0012] In some embodiments, the voice coil motor assembly further includes a push-pull force sensor disposed on the voice coil motor mounting base and connected to the voice coil motor.

[0013] In some embodiments, the voice coil motor mounting base is a cross ball guide assembly, which includes a fixing part, a cross ball guide, and a sliding part;

[0014] The lead screw Z-axis assembly drives the fixed part;

[0015] The voice coil motor and the cross ball bearing guide are respectively disposed on the fixed part, and the sliding part is slidably disposed on the cross ball bearing guide and connected to the voice coil motor;

[0016] The suction nozzle rotation mechanism is connected to the sliding part.

[0017] In some embodiments, the lead screw Z-axis assembly includes a Z-axis motion motor and a lead screw slide, the Z-axis motion motor drives the lead screw slide to move along the Z-axis direction, and the voice coil motor assembly is disposed on the lead screw slide.

[0018] In some embodiments, the suction nozzle gravity counteracting spring includes a guide screw and a lifting spring;

[0019] The voice coil motor assembly or the voice coil motor of the voice coil motor assembly has a mounting position, and the guide screw is screwed to the mounting position;

[0020] The lifting spring is located inside the mounting position and abuts against the guide screw.

[0021] In some embodiments, the nozzle rotation mechanism includes a rotary bearing, a rotary drive motor, a rotation origin sensor, a rotating wheel, and a base;

[0022] The base is connected to the voice coil motor assembly, and the rotary bearing, the rotary drive motor and the rotation origin sensor are respectively disposed on the base;

[0023] The rotary bearing is disposed below the rotating wheel and is axially connected to the rotating wheel, and the rotating wheel is coaxially connected to the suction nozzle vacuum adsorption mechanism;

[0024] The rotary drive motor drives the rotating wheel to rotate the suction nozzle vacuum adsorption mechanism.

[0025] The rotation origin sensor is used to sense the position of the rotating wheel in order to determine the rotation angle of the suction nozzle vacuum adsorption mechanism.

[0026] In some embodiments, the nozzle rotation mechanism further includes a rotary drive belt, and the output end of the rotary drive motor is connected to the rotating wheel via the rotary drive belt; or...

[0027] The base is connected to the sliding part of the voice coil motor assembly, so as to move in the Z-axis direction under the drive of the voice coil motor, for adjusting the position of the suction nozzle vacuum adsorption mechanism in the Z-axis direction.

[0028] In some embodiments, the suction nozzle vacuum adsorption mechanism includes a negative pressure air pipe connector, a central control rotating shaft, and a suction nozzle;

[0029] The negative pressure air pipe connector is connected to the suction nozzle through the central control rotating shaft. The central control rotating shaft is located below the suction nozzle rotating mechanism so that it rotates perpendicular to the Z-axis direction under the drive of the suction nozzle rotating mechanism.

[0030] In some embodiments, a chip transfer fixture includes the chip suction nozzle structure described in any embodiment. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of one embodiment of the chip nozzle structure described in this application.

[0033] Figure 2 for Figure 1 A schematic diagram of the Z-axis lead screw assembly in the embodiment shown.

[0034] Figure 3 for Figure 1 A schematic diagram of the voice coil motor assembly in the embodiment shown.

[0035] Figure 4 for Figure 1 A schematic diagram of the suction nozzle gravity-counteracting spring in the embodiment shown.

[0036] Figure 5 for Figure 1 A schematic diagram of the suction nozzle rotation mechanism in the embodiment shown.

[0037] Figure 6 for Figure 1 A schematic diagram of the vacuum adsorption mechanism of the suction nozzle in the embodiment shown.

[0038] Reference numerals: chip nozzle structure 100, lead screw Z-axis assembly 200, voice coil motor assembly 300, nozzle gravity counteracting spring 400, nozzle rotation mechanism 500, nozzle vacuum adsorption mechanism 600, Z-axis direction 700;

[0039] Z-axis motion motor 210, lead screw slide 220, connecting cable terminal 230, fixing plate 240, voice coil motor 310, voice coil motor mounting base 320, fixing part 321, cross ball guide rail 322, sliding part 323, push-pull force sensor 330, mounting position 340, guide screw 410, lifting spring 420, rotary bearing 510, rotary drive motor 520, rotation origin sensor 540, rotating wheel 550, base 560, negative pressure air pipe connector 610, central control rotary shaft 620, suction nozzle 630. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0045] This application discloses a chip suction nozzle structure and a chip transfer fixture, which includes some or all of the technical features of the following embodiments; that is, the chip suction nozzle structure and the chip transfer fixture include some or all of the following structures. In one embodiment of this application, a chip suction nozzle structure includes a lead screw Z-axis assembly, a voice coil motor assembly, a suction nozzle gravity-offsetting spring, a suction nozzle rotation mechanism, and a suction nozzle vacuum adsorption mechanism; the lead screw Z-axis assembly drives the voice coil motor assembly to move along the Z-axis direction; the suction nozzle gravity-offsetting spring is connected to the voice coil motor assembly to reduce the load on the voice coil motor in the voice coil motor assembly; the suction nozzle rotation mechanism is connected to the voice coil motor assembly to follow the voice coil motor assembly to move in the Z-axis direction; the suction nozzle vacuum adsorption mechanism is disposed below the suction nozzle rotation mechanism to rotate perpendicular to the Z-axis direction under the drive of the suction nozzle rotation mechanism. The aforementioned chip suction nozzle structure, through the coordinated operation of a lead screw Z-axis assembly, a voice coil motor assembly, a suction nozzle gravity-counteracting spring, a suction nozzle rotation mechanism, and a suction nozzle vacuum adsorption mechanism, achieves precise chip suction. On one hand, high-precision control of the suction nozzle pressure enables the transfer of chips between different fixtures, effectively protecting the chips during transport and preventing damage. On the other hand, the design of the voice coil motor assembly in conjunction with the suction nozzle gravity-counteracting spring reduces the load on the voice coil motor, allowing it to operate under optimal load conditions, thus improving the motor's working accuracy and stability, further enhancing the rapid and precise positioning of the suction nozzle vacuum adsorption mechanism. Furthermore, the design of the suction nozzle rotation mechanism in conjunction with the suction nozzle vacuum adsorption mechanism increases the rotation angle of the vacuum adsorption mechanism, achieving controlled 360-degree rotation for accurate chip suction. Finally, the design of the lead screw Z-axis assembly in conjunction with the voice coil motor assembly balances the rapid movement and precise positioning of the suction nozzle vacuum adsorption mechanism in the Z-axis direction, protecting the picked-up chips while improving work efficiency. The following section will further elaborate on this. Figures 1 to 6 The chip suction nozzle structure and chip transfer fixture are described in detail.

[0046] In some embodiments, a chip nozzle structure 100 is as follows: Figure 1 As shown, it includes a lead screw Z-axis assembly 200, a voice coil motor assembly 300, a suction nozzle gravity-counteracting spring 400, a suction nozzle rotation mechanism 500, and a suction nozzle vacuum adsorption mechanism 600; the lead screw Z-axis assembly 200 drives the voice coil motor assembly 300 to move along the Z-axis direction 700; combined with Figure 3The suction nozzle gravity-relieving spring 400 is connected to the voice coil motor assembly 300 to reduce the load on the voice coil motor 310 in the voice coil motor assembly 300; the suction nozzle rotation mechanism 500 is connected to the voice coil motor assembly 300 to follow the voice coil motor assembly 300 in the Z-axis direction 700; the suction nozzle vacuum adsorption mechanism 600 is disposed below the suction nozzle rotation mechanism 500 to rotate perpendicular to the Z-axis direction 700 under the drive of the suction nozzle rotation mechanism 500.

[0047] This structural design, through the cooperation of the lead screw Z-axis assembly 200, voice coil motor assembly 300, suction nozzle gravity-offsetting spring 400, suction nozzle rotation mechanism 500, and suction nozzle vacuum adsorption mechanism 600, achieves the function of precisely picking up chips. On the one hand, by controlling the suction nozzle pressure with high precision, it enables the mutual transfer of chips between different fixtures, and effectively protects the chips during the transfer process, preventing them from being crushed or damaged. On the other hand, the design of the voice coil motor assembly 300 in conjunction with the suction nozzle gravity-offsetting spring 400 helps to reduce the load on the voice coil motor 310 of the voice coil motor assembly 300, allowing the voice coil motor 310 to operate under optimal load conditions. This improves the working accuracy and stability of the voice coil motor 310, further enhancing the rapid and precise positioning of the suction nozzle vacuum adsorption mechanism 600. Furthermore, the design of the suction nozzle rotation mechanism 500 in conjunction with the suction nozzle vacuum adsorption mechanism 600 increases the rotation angle of the suction nozzle vacuum adsorption mechanism 600, achieving controlled 360-degree rotation, thus facilitating accurate chip pickup. Additionally, the design of the lead screw Z-axis assembly 200 in conjunction with the voice coil motor assembly 300 balances the rapid movement and precise positioning of the suction nozzle vacuum adsorption mechanism 600 in the Z-axis direction 700, protecting the picked-up chip while improving work efficiency.

[0048] In various embodiments, the lead screw Z-axis assembly 200 drives the voice coil motor assembly 300 to move along the Z-axis direction 700; in some embodiments, such as Figure 2 As shown, the lead screw Z-axis assembly 200 includes a Z-axis motion motor 210 and a lead screw slide 220. The Z-axis motion motor 210 drives the lead screw slide 220 to move along the Z-axis direction 700. The voice coil motor assembly 300 is disposed on the lead screw slide 220. To facilitate power connection of the Z-axis motion motor 210, as an example, ... Figure 2 As shown, the lead screw Z-axis assembly 200 also includes a connecting cable terminal 230, which is connected to the Z-axis motion motor 210 for convenient power supply to the Z-axis motion motor 210.

[0049] This structural design, on the one hand, allows the Z-axis motion motor 210 to directly drive the lead screw slide 220 to move along the Z-axis direction 700. This fully utilizes the high linear precision of lead screw transmission, effectively suppressing radial movement of the lead screw slide 220 during movement. This ensures that the positional deviation of the voice coil motor assembly 300 is smaller, providing a stable Z-axis movement foundation for the subsequent precise docking of the nozzle vacuum adsorption mechanism 600 with the chip, and avoiding chip misalignment due to insufficient Z-axis movement precision. On the other hand, integrating the voice coil motor assembly 300 onto the lead screw slide 220 shortens the transmission link, reduces assembly gaps caused by the dispersed installation of multiple components, and improves the rigidity of the overall structure. This allows the Z-axis drive response of the lead screw assembly 200 to the voice coil motor assembly 300 to be more timely, avoiding transmission lag from affecting the Z-axis movement efficiency of the nozzle vacuum adsorption mechanism 600. While ensuring positioning accuracy, this further adapts to the high-efficiency requirements of chip handling. On the other hand, the matching design of the connecting cable terminal 230 and the Z-axis motion motor 210 not only realizes convenient power access, eliminates complex wiring steps, and reduces the difficulty of installation and operation, but also allows for quick disconnection and connection of the power supply during later equipment maintenance or motor repair without disassembling core components such as the lead screw slide 220, thus reducing maintenance time. At the same time, the standardized terminal connection also reduces the risk of abnormal start-stop of the Z-axis motion motor 210 due to poor power contact, ensuring the operational stability of the lead screw Z-axis assembly 200 and indirectly providing support for the safety of chip handling.

[0050] To facilitate the overall fixing or installation of the chip nozzle structure 100, as an example, such as Figure 2 As shown, the lead screw Z-axis assembly 200 also includes a fixing plate 240, which is used to fix the lead screw Z-axis assembly 200 to the external environment. The Z-axis motion motor 210 is disposed on the fixing plate 240, that is, the chip suction nozzle structure 100 is fixed to the external environment through the fixing plate 240.

[0051] This structural design serves two purposes. First, the fixing plate 240 provides a unified and stable fixing reference for the lead screw Z-axis assembly 200, effectively suppressing the influence of external environmental vibrations on the lead screw Z-axis assembly 200. Second, it prevents the relative position of the Z-axis motion motor 210 and the lead screw slide 220 from shifting due to component loosening, ensuring that the accuracy of the lead screw slide 220 moving along the Z-axis direction 700 is not affected by unstable fixing. This, in turn, ensures the Z-axis positioning accuracy of the voice coil motor assembly 300 and the suction nozzle vacuum adsorption mechanism 600, reducing the risk of chip pick-up deviation or damage caused by loose fixing. On the other hand, integrating the Z-axis motion motor 210 into the fixed plate 240 simplifies the assembly process of the lead screw Z-axis assembly 200. It eliminates the need for a separate fixing reference for the Z-axis motion motor 210; precise alignment between the motor and the lead screw slide 220 can be achieved simply by relying on the fixed plate 240, reducing assembly errors and improving the overall assembly installation efficiency. Simultaneously, centralized fixing enhances the structural rigidity of the lead screw Z-axis assembly 200, reducing resonance during Z-axis motion motor 210 operation and ensuring the stability of its drive of the lead screw slide 220. Furthermore, the chip nozzle structure 100 is uniformly fixed to the external environment via the fixed plate 240, facilitating subsequent equipment debugging and maintenance. During debugging, the overall posture of the lead screw Z-axis assembly 200 can be quickly calibrated by adjusting the installation position of the fixed plate 240. During maintenance, there is no need to disassemble the internal components of the chip nozzle structure 100; only the connections on the fixed plate 240 need to be operated, reducing operational complexity and indirectly ensuring the continuous and stable operation of chip handling.

[0052] To quickly and accurately assemble the voice coil motor 310, in some embodiments, such as Figure 3 As shown, the voice coil motor assembly 300 includes a voice coil motor 310 and a voice coil motor mounting base 320. The voice coil motor 310 is mounted on the voice coil motor mounting base 320, and the lead screw Z-axis assembly 200 is driven and connected to the voice coil motor mounting base 320. The suction nozzle gravity-offsetting spring 400 is connected to the voice coil motor 310. The voice coil motor 310, also known as a voice coil motor, can convert electrical energy into linear motion and is suitable for short-stroke precision control. It is especially suitable for use in conjunction with the long-stroke rapid control of the Z-axis motion motor 210, greatly improving the position control efficiency of the suction nozzle vacuum adsorption mechanism 600 connected to the suction nozzle rotation mechanism 500, thereby realizing the chip suction nozzle structure 100 using a voice coil motor for closed-loop force control. As an example, the suction nozzle gravity-offsetting spring 400 is connected to the voice coil motor assembly 300, or the suction nozzle gravity-offsetting spring 400 is connected to the voice coil motor 310 of the voice coil motor assembly 300. As an example, the voice coil motor mounting base 320 is connected to the nozzle rotation mechanism 500.

[0053] This structural design serves several purposes. First, the voice coil motor mounting base 320 provides a unified and precise assembly reference for the voice coil motor 310, effectively preventing misalignment during assembly and ensuring linear accuracy when the lead screw Z-axis assembly 200 drives the voice coil motor assembly 300 to move along the Z-axis 700. Second, it simplifies the assembly process of the voice coil motor 310, eliminating the need for repeated calibration of the motor position and significantly improving assembly efficiency. Furthermore, the fixed voice coil motor 310 is less prone to displacement due to vibration, providing structural protection for its short-stroke precision control characteristics and indirectly reducing the positioning deviation of the suction nozzle vacuum adsorption mechanism 600. On the other hand, the voice coil motor 310's characteristic of converting electrical energy into linear motion complements the long-stroke and short-stroke control of the Z-axis motion motor 210: the Z-axis motion motor 210 achieves long-distance and rapid movement through the lead screw slide 220, quickly approaching the chip position; while the voice coil motor 310 is responsible for precise fine-tuning within the short stroke. The two work together to greatly improve the position control efficiency of the suction nozzle vacuum adsorption mechanism 600, especially suitable for the dual requirements of rapid positioning and precise pick-up when transferring chips between different fixtures. On the other hand, the design of the suction nozzle gravity offset spring 400 directly connected to the voice coil motor 310, together with the stable support of the voice coil motor mounting base 320, can more evenly offset part of the gravity of the voice coil motor 310, the suction nozzle rotation mechanism 500, and the suction nozzle vacuum adsorption mechanism 600. This avoids uneven load offset caused by spring connection point offset, ensuring that the voice coil motor 310 always works under optimal load conditions, further enhancing its closed-loop force control performance. When the suction nozzle vacuum adsorption mechanism 600 contacts the chip, the voice coil motor 310 can accurately control the pressure, effectively preventing the chip from being damaged by pressure, while ensuring force control response speed and improving chip handling safety. On the other hand, the design of the voice coil motor mounting base 320 connecting the nozzle rotation mechanism 500 shortens the transmission path between the voice coil motor 310 and the nozzle rotation mechanism 500, reduces the error caused by transmission gap, and enables the linear motion accuracy of the voice coil motor 310 and the 360-degree controlled rotation of the nozzle rotation mechanism 500 to work together. This ensures that the nozzle vacuum adsorption mechanism 600 can still accurately dock with the chip under the dual actions of Z-axis fine adjustment and rotational alignment, ultimately achieving an efficient combination of closed-loop force control and high-precision positioning of the chip nozzle structure 100.

[0054] In some of these embodiments, such as Figure 3 As shown, the voice coil motor assembly 300 also includes a push-pull force sensor 330, which is disposed on the voice coil motor mounting base 320 and connected to the voice coil motor 310. The push-pull force sensor 330, in conjunction with the embodiment having a guide screw 410 and a lifting spring 420, provides effective positioning and sensing feedback for the voice coil motor 310, thereby effectively improving the positioning accuracy and motion acceleration of the voice coil motor 310.

[0055] This structural design, on the one hand, fixes the push-pull force sensor 330 to the voice coil motor mounting base 320 and connects to the voice coil motor 310. With the precise guiding effect of the guide screw 410, it can capture the position deviation of the voice coil motor 310 in real time and provide positioning feedback. This avoids the positional shift of the voice coil motor 310 due to assembly gaps, vibration, or load changes, greatly improving its positioning accuracy. It ensures that when the voice coil motor 310 drives the nozzle rotation mechanism 500 and the nozzle vacuum adsorption mechanism 600, the chip will not be misaligned or the pressure will run out of control during contact due to positional deviation. From the feedback perspective, this further ensures the safety of chip handling. On the other hand, the push-pull force sensor 330, combined with the elastic support of the lifting spring 420, can sense the force changes of the voice coil motor 310 in real time during its movement. When the voice coil motor 310 drives the nozzle vacuum adsorption mechanism 600 to approach or contact the chip, the sensor can quickly capture subtle changes in force and transmit signals, dynamically adjusting the motor output power to avoid sudden increases or decreases in acceleration. This allows the voice coil motor 310 to move more smoothly in short-stroke precision control, reducing the impact on the chip caused by acceleration fluctuations. Furthermore, the push-pull force sensor 330, in conjunction with the guide screw 410 and the lifting spring 420, further works in synergy with the nozzle gravity offset spring 400. This reduces the basic load on the voice coil motor 310 through gravity offset and optimizes the motor's motion parameters through sensor feedback, enabling the voice coil motor 310 to operate under optimal load and stable acceleration. This indirectly improves the rapid positioning efficiency of the nozzle vacuum adsorption mechanism 600, further enhancing the reliability of the closed-loop force control of the chip nozzle structure 100.

[0056] To improve the positional accuracy of the nozzle rotation mechanism 500 and its connected nozzle vacuum adsorption mechanism 600, in some embodiments, the voice coil motor mounting base 320 is a cross ball bearing guide assembly, which includes a fixed part 321, a cross ball bearing guide 322, and a sliding part 323; the lead screw Z-axis assembly 200 drives and connects to the fixed part 321; the voice coil motor 310 and the cross ball bearing guide 322 are respectively disposed on the fixed part 321, and the sliding part 323 is slidably disposed on the cross ball bearing guide 322 and connected to the voice coil motor 310; the nozzle rotation mechanism 500 is connected to the sliding part 323.

[0057] This structural design, on the one hand, uses a cross ball bearing guide 322 in the voice coil motor mounting base 320, which has the characteristics of high precision and low friction, and can provide a stable sliding path for the sliding part 323. When the sliding part 323 moves along the cross ball bearing guide 322, it can effectively suppress radial movement and shaking, and ensure the linear displacement accuracy of the voice coil motor 310 driving the sliding part 323. This allows for more precise positional movement of the nozzle rotation mechanism 500 and the nozzle vacuum adsorption mechanism 600, avoiding chip misalignment or uneven pressure during contact due to movement deviation, thus ensuring the safety of chip handling from a structural perspective. On the other hand, the fixed part 321 serves as the foundation of the cross ball guide rail assembly. It not only supports the drive of the lead screw Z-axis assembly 200, but also provides a unified installation reference for the voice coil motor 310 and the cross ball guide rail 322. This achieves precise connection between the long-stroke movement of the lead screw and the short-stroke fine adjustment of the cross ball guide rail: after the lead screw Z-axis assembly 200 drives the fixed part 321 to quickly approach the target position, the voice coil motor 310 drives the sliding part 323 to make short-stroke precision adjustments along the cross ball guide rail 322. The combined precision of the two significantly improves the position control efficiency of the suction nozzle vacuum adsorption mechanism 600. On the other hand, the nozzle rotation mechanism 500 is connected to the sliding part 323. The stability of the cross ball guide rail 322 can prevent the sliding part 323 from interfering with the nozzle rotation mechanism 500 when it moves. While the nozzle rotation mechanism 500 moves with the sliding part 323, it can still achieve stable 360-degree controlled rotation. This ensures that when it drives the nozzle vacuum adsorption mechanism 600 to adjust the suction angle, the angle alignment will not be damaged due to movement deviation. This further ensures the accuracy of chip suction and effectively improves the overall working stability of the chip nozzle structure 100.

[0058] In various embodiments, the suction nozzle gravity-relieving spring 400 is connected to the voice coil motor assembly 300 to reduce the load on the voice coil motor 310 in the voice coil motor assembly 300; in some embodiments, such as Figure 4 As shown, the suction nozzle gravity-counteracting spring 400 includes a guide screw 410 and a lifting spring 420; combined with Figure 3 The voice coil motor assembly 300 or the voice coil motor 310 of the voice coil motor assembly 300 has a mounting position 340, and the guide screw 410 is screwed to the mounting position 340; the lifting spring 420 is located inside the mounting position 340 and abuts against the guide screw 410. The guide screw 410 connects and fixes the lifting spring 420 to ensure that the guide screw 410 is correctly aligned during installation, prevents the guide screw 410 from being misaligned, thereby improving assembly accuracy and ensuring the positioning accuracy of the voice coil motor 310 as much as possible.

[0059] This structural design, on the one hand, effectively prevents screw misalignment during assembly through the guiding characteristics of the guide screw 410, which not only directly improves the assembly accuracy of the suction nozzle gravity offset spring 400, but also ensures that the lifting spring 420 is centered and abuts inside the mounting position 340, with uniform force and no deviation. This avoids the gravity offset effect being reduced due to spring force imbalance, thereby more stably reducing the load on the voice coil motor 310, allowing the voice coil motor 310 to always work under optimal load conditions, further ensuring the positioning accuracy of its short-stroke precision control, and laying the foundation for the precise movement of the suction nozzle vacuum adsorption mechanism 600. On the other hand, the design of the lifting spring 420 built into the mounting position 340 can isolate the spring from external dust, debris and collision interference, reduce spring wear, and extend the service life of the suction nozzle gravity counteracting spring 400; at the same time, the stable contact in the enclosed space can keep the gravity counteracting force constant, and with the closed-loop force control of the voice coil motor 310, the pressure control when the suction nozzle vacuum adsorption mechanism 600 contacts the chip is more precise, effectively avoiding chip damage, and further enhancing the safety and stability of the chip suction nozzle structure 100 in handling chips.

[0060] In various embodiments, the nozzle rotation mechanism 500 is connected to the voice coil motor assembly 300 to follow the movement of the voice coil motor assembly 300 in the Z-axis direction 700; in some embodiments, such as Figure 5 As shown, the nozzle rotation mechanism 500 includes a rotary bearing 510, a rotary drive motor 520, a rotation origin sensor 540, a rotating wheel 550, and a base 560. The base 560 is connected to the voice coil motor assembly 300. The rotary bearing 510, the rotary drive motor 520, and the rotation origin sensor 540 are respectively disposed on the base 560. The rotary bearing 510 is disposed below the rotating wheel 550 and is axially connected to the rotating wheel 550. The rotating wheel 550 is coaxially connected to the nozzle vacuum adsorption mechanism 600. The rotary drive motor 520 drives the rotating wheel 550 to rotate the nozzle vacuum adsorption mechanism 600. The rotation origin sensor 540 is used to sense the position of the rotating wheel 550 to determine the rotation angle of the nozzle vacuum adsorption mechanism 600. In some embodiments, the nozzle rotation mechanism 500 further includes a rotation drive belt 530, and the output end of the rotation drive motor 520 is connected to the rotating wheel 550 through the rotation drive belt 530.

[0061] This structural design, on the one hand, uses the base 560 to provide a unified installation benchmark, effectively ensuring the coaxiality and relative positional accuracy of each component. This avoids positional deviations caused by the dispersed installation of components, ensuring that the rotating wheel 550 and the suction nozzle vacuum adsorption mechanism 600 rotate coaxially. This reduces eccentric shaking of the suction nozzle vacuum adsorption mechanism 600 during rotation from the structural source, providing stable support for precise chip pickup and preventing chip misalignment due to shaking. On the other hand, the design of the rotary bearing 510 connecting the rotating wheel 550, relying on its high precision and low friction characteristics, can significantly reduce the rotational resistance and wear of the rotating wheel 550, allowing the rotating wheel 550 to drive the suction nozzle vacuum adsorption mechanism 600 to rotate more smoothly. This avoids chip displacement during pickup due to rotational jamming and reduces the additional load on the rotary drive motor 520, enabling the motor to output power more efficiently. Combined with the short-stroke control of the voice coil motor assembly 300, this further improves the collaborative efficiency of the suction nozzle vacuum adsorption mechanism 600. On the other hand, the rotary drive motor 520 is connected to the rotating wheel 550 via the rotary drive belt 530, which has a significant buffering and vibration reduction effect: it can isolate the vibration of the motor during operation and prevent the vibration from being transmitted to the rotating wheel 550, affecting the rotation accuracy of the suction nozzle vacuum adsorption mechanism 600; at the same time, the belt drive can flexibly adapt to the installation position of the motor and the rotating wheel 550, reducing the difficulty of structural layout, and only the belt needs to be replaced during later maintenance, without disassembling core components such as the base 560, reducing maintenance time and cost. On the other hand, the rotation origin sensor 540 senses the position of the rotating wheel 550 to determine the rotation angle of the suction nozzle vacuum adsorption mechanism 600, which can realize the origin calibration after each rotation—avoiding the cumulative angle error caused by long-term use, ensuring that the suction nozzle vacuum adsorption mechanism 600 can accurately dock with chip fixtures at different angles, especially suitable for multi-directional chip handling scenarios; at the same time, the real-time sensing feedback of the sensor can quickly correct the rotation deviation, allowing the suction nozzle vacuum adsorption mechanism 600 to maintain high precision during 360-degree controlled rotation.

[0062] To facilitate precise adjustment of the positions of the base 560 and the suction nozzle vacuum adsorption mechanism 600 connected to the base 560, in some embodiments, such as Figure 3 and Figure 5 As shown, the base 560 is connected to the sliding part 323 of the voice coil motor assembly 300, and moves along the Z-axis 700 under the drive of the voice coil motor 310 to adjust the position of the suction nozzle vacuum adsorption mechanism 600 along the Z-axis 700. As an example, the base 560 engages with the sliding part 323 to allow for quick replacement of different bases 560, thereby facilitating the rapid replacement of suction nozzle vacuum adsorption mechanisms 600 of different specifications to adapt to various chip sizes.

[0063] This structural design allows the base 560 to connect to the sliding part 323 of the voice coil motor assembly 300. Relying on the high-precision sliding characteristics of the sliding part 323 along the cross ball bearing guide 322, and in conjunction with the short-stroke precision control of the voice coil motor 310, it can drive the suction nozzle vacuum adsorption mechanism 600 to make fine position adjustments along the Z-axis direction 700. This can precisely control the contact distance between the suction nozzle and the chip, avoiding excessive pressure that could damage the chip or insufficient pressure that could lead to unstable suction. At the same time, it continues the low-friction advantage of the cross ball bearing guide assembly, ensuring a smooth and stable Z-axis adjustment process without any movement. This further improves the position control accuracy of the suction nozzle vacuum adsorption mechanism 600, providing adaptability for the safe handling of chips of different thicknesses. On the other hand, the snap-fit ​​design between the base 560 and the sliding part 323 eliminates the disassembly and assembly steps of the traditional bolt connection, allowing for quick replacement of the base 560 equipped with vacuum adsorption mechanism 600 with different specifications of suction nozzles. When handling chips of different sizes and package types, there is no need to disassemble the voice coil motor assembly 300 or the cross ball guide assembly; replacement can be completed simply through the snap-fit ​​structure, which greatly shortens the equipment changeover time, improves the adaptability to multiple specifications of chips, and reduces production downtime losses.

[0064] In various embodiments, the suction nozzle vacuum adsorption mechanism 600 is disposed below the suction nozzle rotation mechanism 500, so as to rotate perpendicular to the Z-axis direction 700 under the drive of the suction nozzle rotation mechanism 500; in some embodiments, such as Figure 6 As shown, the vacuum suction mechanism 600 includes a negative pressure air pipe connector 610, a central control rotating shaft 620, and a suction nozzle 630. The negative pressure air pipe connector 610 is connected to the suction nozzle 630 via the central control rotating shaft 620. The central control rotating shaft 620 is positioned below the suction nozzle rotating mechanism 500, allowing it to rotate perpendicularly to the Z-axis direction 700 under the drive of the suction nozzle rotating mechanism 500. The negative pressure air pipe connector 610 is used to connect to a negative pressure generating device to create negative pressure at the suction nozzle 630, thereby effectively suctioning the chip. As an example, the negative pressure air pipe connector 610 is bearing connected to the central control rotating shaft 620. When the central control rotating shaft 620 rotates with the rotating wheel 550, the negative pressure air pipe connector 610 remains stationary, which can also be understood as not rotating at all to avoid affecting the connection of negative pressure. The suction nozzle 630 rotates with the central control rotating shaft 620 to adjust the angle position of the suction nozzle 630, thereby changing the angle position of the chip sucked by the suction nozzle 630.

[0065] This structural design, on the one hand, ensures stable transmission of negative pressure through the path design of the negative pressure air pipe connector 610 connected to the suction nozzle 630 via the central control rotating shaft 620. After the negative pressure generating device inputs negative pressure through the negative pressure air pipe connector 610, the central control rotating shaft 620 can rotate while preventing leakage of negative pressure during transmission, ensuring that a uniform and stable negative pressure field is formed at the suction nozzle 630. This ensures reliable chip suction without damaging the chip surface due to excessive negative pressure or causing the chip to fall off during handling due to insufficient negative pressure. It perfectly meets the core requirement of safe chip handling. Together with the closed-loop force control of the voice coil motor 310, it forms an effective combination of force control and negative pressure, further reducing the risk of chip damage. On the other hand, the central control rotating shaft 620 is set under the nozzle rotating mechanism 500 and rotates with it perpendicular to the Z-axis direction 700. It can accurately support the 360-degree controlled rotation function of the nozzle rotating mechanism 500. When the rotation drive motor 520 of the nozzle rotating mechanism 500 drives the central control rotating shaft 620 to rotate through the rotating wheel 550, the nozzle 630 can adjust its angle synchronously to adapt to the placement angle of the chip on different fixtures. Without adjusting the position of the fixture, precise docking can be achieved by fine-tuning the angle of the nozzle 630, which greatly improves the adaptability of chip handling between different fixtures, especially suitable for production scenarios of multi-specification and multi-angle chips, indirectly improving the overall work efficiency. On the other hand, the bearing connection design between the negative pressure air pipe connector 610 and the central control rotating shaft 620 is key to ensuring stable negative pressure and flexible rotation: when the central control rotating shaft 620 rotates at high speed with the rotating wheel 550 to adjust the angle of the nozzle 630, the negative pressure air pipe connector 610 can remain stationary, which avoids damage and leakage caused by the air pipe being entangled or pulled due to the rotation of the shaft, and ensures the continuity and stability of the negative pressure input, without interrupting the negative pressure supply due to the rotation action; at the same time, the low friction characteristics of the bearing connection can reduce the rotational resistance of the central control rotating shaft 620, reduce the load on the rotary drive motor 520 in the nozzle rotation mechanism 500, make the angle adjustment smoother, and further improve the response speed and accuracy of the nozzle 630 angle positioning.

[0066] In an embodiment with the rotary bearing 510 and the rotating wheel 550, as an example, the central control rotary shaft 620 is disposed under the rotary bearing 510 and coaxially connected to the rotating wheel 550, so that it rotates coaxially and synchronously with the rotating wheel 550 under the drive of the rotating wheel 550. That is, the central control rotary shaft 620 can not only rotate 360 ​​degrees or even larger angles, but also rotate at the same angle as the rotating wheel 550. Therefore, the rotation angle and speed of the central control rotary shaft 620 can be controlled or adjusted by the rotation angle and speed of the rotating wheel 550, thereby quickly and accurately controlling or adjusting the position of the suction nozzle 630, and accurately picking up the chip to achieve the design function of handling. At the same time, due to the accurate position, the chip is not damaged due to problems such as the suction position and angle.

[0067] This structural design ensures that, on the one hand, the central control rotating shaft 620 and the rotating wheel 550 rotate synchronously and coaxially, guaranteeing that their rotation angles and speeds are completely consistent. The central control rotating shaft 620 can be directly controlled via the rotating wheel 550 without additional calibration of the transmission ratio, significantly simplifying the adjustment process of the nozzle 630's angle and speed. This allows the nozzle 630 to quickly adapt to the placement angles of chips on different fixtures, avoiding alignment delays caused by transmission deviations and efficiently achieving the design functions of chip picking and handling, meeting the efficiency requirements of precision handling scenarios. On the other hand, the central control rotating shaft 620 is positioned under the rotating bearing 510. Utilizing the low friction and high stability characteristics of the rotating bearing 510, radial movement and jamming during the rotation of the central control rotating shaft 620 can be effectively suppressed, allowing for smoother rotation at 360 degrees or even larger angles. This prevents the nozzle 630 from detaching chips or experiencing uneven pressure during contact due to shaking, and reduces the additional load on the rotary drive motor 520, enabling the motor to output power more stably and further improving the accuracy and response speed of the nozzle 630's angle adjustment. On the other hand, the coaxial synchronous design, together with the rotation origin sensor 540 sensing the position of the rotating wheel 550, can synchronously obtain the real-time position of the central control rotating shaft 620. There is no need to set a separate positioning component for the central control rotating shaft 620, which simplifies the structure and reduces the sources of error. This ensures that the suction nozzle 630 picks up the chip with accurate position and angle, and avoids chip scratches and pressure damage caused by position deviation from the root cause. This further enhances the safety and reliability of the chip suction nozzle structure 100 in handling chips.

[0068] The following will continue to combine Figures 1 to 6 The following example illustrates the chip suction nozzle structure 100. In some embodiments, the chip suction nozzle structure 100 includes a lead screw Z-axis assembly 200, a voice coil motor assembly 300, a suction nozzle gravity-offsetting spring 400, a suction nozzle rotation mechanism 500, and a suction nozzle vacuum adsorption mechanism 600. The suction nozzle gravity-offsetting spring 400 is the gravity-offsetting spring of the suction nozzle mechanism, and the suction nozzle rotation mechanism 500 can also be referred to as a suction nozzle 360° rotation mechanism.

[0069] The lead screw Z-axis assembly 200 drives the lead screw slide 220 and other structural components through the Z-axis motion motor 210 to drive the suction nozzle 630 to move up and down, thus completing the functions of picking up the chip and adjusting its direction.

[0070] The voice coil motor assembly 300 includes a voice coil motor 310 and a voice coil motor mounting base 320. The voice coil motor 310 is mounted via the voice coil motor mounting base 320. The voice coil motor 310 is used to support the nozzle rotation mechanism 500 and the nozzle vacuum adsorption mechanism 600. When the nozzle 630 is subjected to external force in the Z-axis direction 700, the current value of the voice coil motor 310 is monitored and converted into the pressure of the nozzle 630 on the chip. The voice coil motor mounting base 320 may include cross ball bearing guides and pressure sensors, among other components.

[0071] The suction nozzle gravity offset spring 400, in conjunction with the lifting spring 420, is used to offset the load on the voice coil motor 310 in the voice coil motor assembly 300. The purpose is to reduce the load on the voice coil motor 310, allowing it to operate under optimal load conditions, thereby improving the working accuracy and stability of the voice coil motor 310.

[0072] The nozzle rotation mechanism 500 includes a rotary bearing 510, a rotary drive motor 520, a rotation origin sensor 540, a rotating wheel 550, and a base 560, enabling the nozzle 630 of the nozzle vacuum adsorption mechanism 600 to achieve 360° rotation.

[0073] The suction nozzle vacuum adsorption mechanism 600 includes a negative pressure air pipe connector 610, a central control rotating shaft 620, and a suction nozzle 630 connected to each other. The suction nozzle 630 is designed to be hollow, and while having a 360° rotation function, it can also achieve the design function of negative pressure suction through the negative pressure air pipe connector 610, thereby picking up chips and realizing the function of handling.

[0074] With this structural design, the chip suction nozzle structure 100 can achieve high-precision control of the pressure of the suction nozzle 630 when the chip is transferred between different fixtures, which can effectively protect the chip and avoid crushing or damage. At the same time, it has the function of negative pressure adsorption of the chip, also known as vacuum adsorption of the chip. The suction nozzle 630 also has a 360° rotation function, which is convenient and easy to use.

[0075] In some embodiments, a chip transfer fixture includes the chip suction nozzle structure 100 described in any embodiment. As an example, the chip transfer fixture includes a fixture body, the chip suction nozzle structure 100 is disposed on the fixture body, or the lead screw Z-axis assembly 200 of the chip suction nozzle structure 100 is disposed on the fixture body, or the fixing plate 240 of the lead screw Z-axis assembly 200 is disposed on the fixture body. It is understood that, due to the use of the chip suction nozzle structure 100 described in any embodiment, the chip transfer fixture also possesses the beneficial technical effects of the chip suction nozzle structure 100, which will not be elaborated upon here.

[0076] It should be noted that other embodiments of this application also include a chip suction nozzle structure and a chip transfer fixture formed by combining the technical features of the above embodiments.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip nozzle structure (100), characterized in that It includes a lead screw Z-axis assembly (200), a voice coil motor assembly (300), a nozzle gravity counteracting spring (400), a nozzle rotation mechanism (500), and a nozzle vacuum adsorption mechanism (600). The lead screw Z-axis assembly (200) drives the voice coil motor assembly (300) to move along the Z-axis direction (700); The suction nozzle gravity-offsetting spring (400) is connected to the voice coil motor assembly (300) to reduce the load on the voice coil motor (310) in the voice coil motor assembly (300); The nozzle rotation mechanism (500) is connected to the voice coil motor assembly (300) to follow the voice coil motor assembly (300) in the Z-axis direction (700); The suction nozzle vacuum adsorption mechanism (600) is disposed below the suction nozzle rotation mechanism (500) so that it rotates perpendicular to the Z-axis direction (700) under the drive of the suction nozzle rotation mechanism (500).

2. The chip suction mouth structure (100) according to claim 1, characterized in that The voice coil motor assembly (300) includes the voice coil motor (310) and the voice coil motor mounting base (320). The voice coil motor (310) is mounted on the voice coil motor mounting base (320), the lead screw Z-axis assembly (200) is driven and connected to the voice coil motor mounting base (320), and the suction nozzle gravity counteracting spring (400) is connected to the voice coil motor (310).

3. The chip suction mouth structure (100) according to claim 2, characterized in that The voice coil motor assembly (300) also includes a push-pull force sensor (330), which is disposed on the voice coil motor mounting base (320) and connected to the voice coil motor (310).

4. The chip suction mouth structure (100) according to claim 2, characterized in that The voice coil motor mounting base (320) is a cross ball guide assembly, which includes a fixing part (321), a cross ball guide (322), and a sliding part (323). The lead screw Z-axis assembly (200) is driven and connected to the fixing part (321); The voice coil motor (310) and the cross ball guide rail (322) are respectively disposed on the fixed part (321), and the sliding part (323) is slidably disposed on the cross ball guide rail (322) and connected to the voice coil motor (310). The nozzle rotation mechanism (500) is connected to the sliding part (323).

5. The chip suction mouth structure (100) according to claim 1, characterized in that, The lead screw Z-axis assembly (200) includes a Z-axis motion motor (210) and a lead screw slide (220). The Z-axis motion motor (210) drives the lead screw slide (220) to move along the Z-axis direction (700). The voice coil motor assembly (300) is disposed on the lead screw slide (220).

6. The chip suction mouth structure (100) according to claim 1, characterized in that The suction nozzle gravity counteracting spring (400) includes a guide screw (410) and a lifting spring (420). The voice coil motor assembly (300) or the voice coil motor (310) of the voice coil motor assembly (300) has a mounting position (340), and the guide screw (410) is screwed to the mounting position (340); The lifting spring (420) is located inside the mounting position (340) and abuts against the guide screw (410).

7. The chip suction mouth structure (100) according to claim 1, characterized in that The nozzle rotation mechanism (500) includes a rotary bearing (510), a rotary drive motor (520), a rotation origin sensor (540), a rotating wheel (550), and a base (560). The base (560) is connected to the voice coil motor assembly (300), and the rotary bearing (510), the rotary drive motor (520) and the rotation origin sensor (540) are respectively disposed on the base (560); The rotary bearing (510) is disposed under the rotating wheel (550) and is axially connected to the rotating wheel (550). The rotating wheel (550) is coaxially connected to the suction nozzle vacuum adsorption mechanism (600). The rotary drive motor (520) drives the rotating wheel (550) to rotate the suction nozzle vacuum adsorption mechanism (600) through the rotating wheel (550); The rotation origin sensor (540) is used to sense the position of the rotating wheel (550) to determine the rotation angle of the suction nozzle vacuum adsorption mechanism (600).

8. The chip suction mouth structure (100) according to claim 7, characterized in that The nozzle rotation mechanism (500) further includes a rotation drive belt (530), and the output end of the rotation drive motor (520) is connected to the rotating wheel (550) through the rotation drive belt (530); or, The base (560) is connected to the sliding part (323) of the voice coil motor assembly (300) so as to move in the Z-axis direction (700) under the drive of the voice coil motor (310) to adjust the position of the suction nozzle vacuum adsorption mechanism (600) in the Z-axis direction (700).

9. The chip suction mouth structure (100) according to any one of claims 1 to 8, characterized in that The vacuum adsorption mechanism (600) includes a negative pressure air pipe connector (610), a central control rotating shaft (620), and a suction nozzle (630). The negative pressure air pipe connector (610) is connected to the suction nozzle (630) through the central control rotating shaft (620). The central control rotating shaft (620) is located under the suction nozzle rotating mechanism (500) so that it can rotate perpendicular to the Z-axis direction (700) under the drive of the suction nozzle rotating mechanism (500).

10. A die transfer clamp characterized by, Includes the chip nozzle structure (100) as described in any one of claims 1 to 9.

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