A ring-shaped target material for preventing spalling of sputter material
Patent Information
- Application Number
- CN202522023011.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-19
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-09-19
AI Technical Summary
但靶材组件对粗糙度的提升不显著，其对反溅射物的吸附能力仍然有限
[0031] The annular target provided by this utility model, through the specific structural design of the sputtering surface and the specific position design of the molten layer, enhances the adsorption effect of the anti-sputtered material, prevents the anti-sputtered material from peeling off, improves the sputtering life of the annular target, and improves product yield and quality.
Smart Images
Figure CN224754515U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of magnetron sputtering technology, and relates to a target material, particularly a ring-shaped target material for preventing the peeling off of backsputtered material. Background Technology
[0002] In integrated circuit manufacturing and semiconductor processes, physical vapor deposition (PVD) technology is widely used for the deposition of metal thin films to form metal interconnect layers, diffusion barrier layers, or other functional layers. Sputtering is a common technique in PVD. This process uses the ionization of an inert gas (such as argon) to generate high-energy ions, which bombard the surface of a cathode target, causing target atoms or ions to be sputtered and deposited on a substrate (such as a silicon wafer) to form the desired film layer.
[0003] However, during sputtering, some sputtered material from the target surface does not deposit onto the substrate. During sputtering, due to magnetic field confinement and particle trajectory, the movement direction of some metal atoms or ions changes, causing them to splash back and deposit on the target edge or the surface near the cathode. This deposited layer is called the backsputtering layer. As the target is used for an extended period, the backsputtering layer continues to accumulate and thicken, reaching thicknesses of tens to hundreds of micrometers. This layer has weak adhesion to the target substrate and exhibits internal stress concentration. When its thickness exceeds the target surface's ability to retain adhering materials, or when subjected to thermal stress or plasma disturbance, its surface layer is prone to peeling off, leading to particulate contamination during sputtering. These peeled fragments not only contaminate the process chamber but may also fall onto the silicon wafer surface, causing device short circuits, reduced yield, and equipment maintenance issues.
[0004] To mitigate the risk of anti-sputtering material detachment, a traditional solution is to sandblast the target surface. This involves using hard particles such as alumina or silicon carbide to impact the target surface, creating a certain roughness to enhance its adsorption capacity for anti-sputtering materials. However, the roughness achieved through sandblasting is limited by the process and is generally below 10 μm, offering limited improvement and surface morphology control. Its adsorption capacity is significantly insufficient for the thick anti-sputtering layers formed in high-power, long-cycle sputtering processes.
[0005] CN213772195U discloses a target assembly for preventing anti-sputtering material from peeling off. This target assembly reduces anti-sputtering material peeling off through a rounded corner design at the bends. However, the target assembly does not significantly improve roughness, and its adsorption capacity for anti-sputtering material remains limited.
[0006] Therefore, there is an urgent need to develop a target material that enhances adsorption strength and prevents the detachment of anti-sputtering materials. Utility Model Content
[0007] The purpose of this invention is to provide a ring-shaped target with a long sputtering life and to prevent the spatter from peeling off.
[0008] To achieve the objective of this utility model, the following technical solution is adopted:
[0009] This invention provides a ring-shaped target for preventing the spatter from peeling off, the ring-shaped target comprising a sputtering surface and a connecting surface;
[0010] From the inner circumference to the outer circumference of the annular target, the inner circumference of the sputtering surface is provided with a first inclined surface and a second inclined surface in sequence, and the outer circumference of the sputtering surface is provided with a first step and a second step in sequence, wherein the first step is higher than the second step;
[0011] A first molten layer, a second molten layer, a third molten layer, and a fourth molten layer are respectively provided on the surface of the first inclined surface, the surface of the second inclined surface, the side surface of the first step, and the surface of the second step, and the edges of the first molten layer and the second molten layer are connected.
[0012] The annular target provided by this utility model, through the specific structural design of the sputtering surface and the specific position design of the molten layer, enhances the adsorption effect of the anti-sputtered material, prevents the anti-sputtered material from peeling off, improves the sputtering life of the annular target, and improves product yield and quality.
[0013] Preferably, the surface roughness of the first, second, third, and fourth molten layers is independently 25-35 μm, for example, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, or 35 μm, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0014] Preferably, the thicknesses of the first, second, third, and fourth molten layers are each independently 0.13-0.25 mm, for example, 0.13 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.22 mm, or 0.25 mm, but are not limited to the listed values. Other unlisted values within the range are also applicable.
[0015] Preferably, the first, second, third, and fourth spray layers are each independently an alumina spray layer.
[0016] Preferably, the ratio of the radial width of the first sputtering layer to the radial width of the first inclined surface is (0.7-0.85):1, for example, it can be 0.7:1, 0.72:1, 0.75:1, 0.78:1, 0.8:1, 0.82:1 or 0.85:1, but is not limited to the listed values. Other unlisted values within the range are also applicable. The radial direction is the direction of the plane where the first inclined surface is located.
[0017] Preferably, the radial width of the first molten layer is 2-4 mm, for example, it can be 2 mm, 2.5 mm, 3 mm, 3.5 mm or 4 mm, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0018] Preferably, the ratio of the radial width of the second sputtering layer to the radial width of the second inclined surface is (0.1-0.2):1, for example, it can be 0.1:1, 0.12:1, 0.15:1, 0.18:1 or 0.2:1, but is not limited to the listed values. Other unlisted values within the range are also applicable. The radial direction is the direction of the plane where the second inclined surface is located.
[0019] Preferably, the radial width of the second molten layer is 3-5 mm, for example, it can be 3 mm, 3.5 mm, 4 mm, 4.5 mm or 5 mm, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0020] Preferably, the angle between the first inclined plane and the horizontal direction is greater than the angle between the second inclined plane and the horizontal direction.
[0021] Preferably, the angle between the first inclined plane and the horizontal direction is 40-50°, for example, it can be 40°, 42°, 45°, 48° or 50°, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0022] Preferably, the angle between the second inclined plane and the horizontal direction is 20-30°, for example, it can be 20°, 22°, 25°, 28° or 30°, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0023] Preferably, the ratio of the height of the first inclined surface to the total height of the annular target is (0.1-0.2):1, for example, it can be 0.1:1, 0.12:1, 0.15:1, 0.18:1 or 0.2:1, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0024] Preferably, the ratio of the height of the second inclined surface to the total height of the annular target is (0.5-0.6):1, for example, it can be 0.5:1, 0.52:1, 0.55:1, 0.58:1 or 0.6:1, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0025] Preferably, the ratio of the height of the first step to the total height of the annular target is (0.2-0.3):1, for example, it can be 0.2:1, 0.22:1, 0.25:1, 0.28:1 or 0.3:1, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0026] Preferably, the ratio of the height of the second step to the total height of the annular target is (0.7-0.8):1, for example, it can be 0.7:1, 0.72:1, 0.75:1, 0.78:1 or 0.8:1, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0027] Preferably, the second inclined surface is connected to the first step via a third inclined surface.
[0028] Preferably, the angle between the third inclined plane and the horizontal direction is 40-50°, for example, it can be 40°, 42°, 45°, 48° or 50°, but is not limited to the listed values. Other unlisted values within the range are also applicable.
[0029] In this invention, the horizontal direction is the direction perpendicular to the thickness of the annular target material.
[0030] Compared with the prior art, the present invention has the following beneficial effects:
[0031] The annular target provided by this utility model, through the specific structural design of the sputtering surface and the specific position design of the molten layer, enhances the adsorption effect of the anti-sputtered material, prevents the anti-sputtered material from peeling off, improves the sputtering life of the annular target, and improves product yield and quality. Attached Figure Description
[0032] Figure 1 A schematic diagram of the cross-sectional structure of the annular target material for preventing the spatter from peeling off, provided in Example 1;
[0033] Figure 2 A top view of the annular target material for preventing spalling provided in Example 1;
[0034] Wherein, 1 is the first inclined plane; 11 is the first molten layer; 2 is the second inclined plane; 21 is the second molten layer; 3 is the third inclined plane; 4 is the first step; 41 is the third molten layer; 5 is the second step; and 51 is the fourth molten layer. Detailed Implementation
[0035] It should be understood that in the description of this utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0036] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0037] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0038] Example 1
[0039] This embodiment provides a method such as Figure 1 and 2 The ring-shaped target shown is designed to prevent the spalling of projectiles.
[0040] The annular target includes a sputtering surface and a connecting surface.
[0041] From the inner circumference to the outer circumference of the annular target, the sputtering surface is sequentially provided with a first inclined surface 1, a second inclined surface 2, a third inclined surface 3, a first step 4, and a second step 5.
[0042] A first molten layer 11, a second molten layer 21, a third molten layer 41, and a fourth molten layer 51 are respectively provided on the surface of the first inclined surface 1, the surface of the second inclined surface 2, the side of the first step 4, and the surface of the second step 5.
[0043] The edges of the first molten layer 11 and the second molten layer 21 are connected.
[0044] The ratio of the radial width of the first molten layer 11 to the radial width of the first inclined surface 1 is 0.8:1, and the radial width is 3mm.
[0045] The ratio of the radial width of the second molten layer 21 to the radial width of the second inclined surface 2 is 0.15:1, and the radial width is 4mm.
[0046] The third molten layer 41 covers the entire area of the side surface of the first step 4.
[0047] The fourth melt-spray layer 51 covers the entire surface area of the second step 5.
[0048] The surface roughness of the first molten layer 11, the second molten layer 21, the third molten layer 31 and the fourth molten layer 41 are all 30 μm, and the thickness is 0.2 mm.
[0049] The angle between the first inclined plane 1 and the horizontal direction is 45°, and the ratio of the height of the first inclined plane 1 to the total height of the annular target is 0.18:1.
[0050] The angle between the second inclined plane 2 and the horizontal direction is 22°, and the ratio of the height of the second inclined plane 2 to the total height of the annular target is 0.53:1.
[0051] The angle between the third inclined plane 3 and the horizontal direction is 45°.
[0052] The first step, 4, is higher than the second step, 5.
[0053] The ratio of the height of the first step 4 to the total height of the annular target is 0.22:1.
[0054] The ratio of the height of the second step 5 to the total height of the annular target is 0.78:1.
[0055] Example 2
[0056] This embodiment provides a ring-shaped target material to prevent the spatter from peeling off.
[0057] The annular target includes a sputtering surface and a connecting surface.
[0058] From the inner circumference to the outer circumference of the annular target, the sputtering surface is sequentially provided with a first inclined surface 1, a second inclined surface 2, a third inclined surface 3, a first step 4, and a second step 5.
[0059] A first molten layer 11, a second molten layer 21, a third molten layer 41, and a fourth molten layer 51 are respectively provided on the surface of the first inclined surface 1, the surface of the second inclined surface 2, the side of the first step 4, and the surface of the second step 5.
[0060] The edges of the first molten layer 11 and the second molten layer 21 are connected.
[0061] The ratio of the radial width of the first molten layer 11 to the radial width of the first inclined surface 1 is 0.7:1, and the radial width is 2mm.
[0062] The ratio of the radial width of the second molten layer 21 to the radial width of the second inclined surface 2 is 0.2:1, and the radial width is 5mm.
[0063] The third molten layer 41 covers the entire area of the side surface of the first step 4.
[0064] The fourth melt-spray layer 51 covers the entire surface area of the second step 5.
[0065] The surface roughness of the first molten layer 11, the second molten layer 21, the third molten layer 31 and the fourth molten layer 41 are all 25 μm, and the thickness is 0.13 mm.
[0066] The angle between the first inclined plane 1 and the horizontal direction is 40°, and the ratio of the height of the first inclined plane 1 to the total height of the annular target is 0.1:1.
[0067] The angle between the second inclined plane 2 and the horizontal direction is 20°, and the ratio of the height of the second inclined plane 2 to the total height of the annular target is 0.6:1.
[0068] The angle between the third inclined plane 3 and the horizontal direction is 40°.
[0069] The first step, 4, is higher than the second step, 5.
[0070] The ratio of the height of the first step 4 to the total height of the annular target is 0.3:1.
[0071] The ratio of the height of the second step 5 to the total height of the annular target is 0.7:1.
[0072] Example 3
[0073] This embodiment provides a ring-shaped target material to prevent the spatter from peeling off.
[0074] The annular target includes a sputtering surface and a connecting surface.
[0075] From the inner circumference to the outer circumference of the annular target, the sputtering surface is sequentially provided with a first inclined surface 1, a second inclined surface 2, a third inclined surface 3, a first step 4, and a second step 5.
[0076] A first molten layer 11, a second molten layer 21, a third molten layer 41, and a fourth molten layer 51 are respectively provided on the surface of the first inclined surface 1, the surface of the second inclined surface 2, the side of the first step 4, and the surface of the second step 5.
[0077] The edges of the first molten layer 11 and the second molten layer 21 are connected.
[0078] The ratio of the radial width of the first molten layer 11 to the radial width of the first inclined surface 1 is 0.85:1, and the radial width is 4mm.
[0079] The ratio of the radial width of the second molten layer 21 to the radial width of the second inclined surface 2 is 0.1:1, and the radial width is 3mm.
[0080] The third molten layer 41 covers the entire area of the side surface of the first step 4.
[0081] The fourth melt-spray layer 51 covers the entire surface area of the second step 5.
[0082] The surface roughness of the first molten layer 11, the second molten layer 21, the third molten layer 31 and the fourth molten layer 41 are all 35 μm, and the thickness is 0.25 mm.
[0083] The angle between the first inclined plane 1 and the horizontal direction is 50°, and the ratio of the height of the first inclined plane 1 to the total height of the annular target is 0.2:1.
[0084] The angle between the second inclined plane 2 and the horizontal direction is 30°, and the ratio of the height of the second inclined plane 2 to the total height of the annular target is 0.5:1.
[0085] The angle between the third inclined plane 3 and the horizontal direction is 50°.
[0086] The first step, 4, is higher than the second step, 5.
[0087] The ratio of the height of the first step 4 to the total height of the annular target is 0.2:1.
[0088] The ratio of the height of the second step 5 to the total height of the annular target is 0.8:1.
[0089] The annular targets provided in Examples 1-3 have a molten sputtering layer at specific locations, such as the junction of the first and second inclined surfaces and the step. Through the molten sputtering layer structure on both the inner and outer circumferences of the annular target, the molten sputtering layer has a high surface roughness, which improves the adsorption of anti-sputtering material by the target during sputtering, prevents anti-sputtering material from peeling off during long-term sputtering use, improves product yield, and has a large effective sputtering area, thus improving the sputtering service life of the annular target.
[0090] Comparative Example 1
[0091] This comparative example provides a ring-shaped target material, which, compared with Example 1, does not have a first, second, third, and fourth molten spray layer, but is otherwise the same as Example 1.
[0092] Comparative Example 2
[0093] This comparative example provides a ring-shaped target material for preventing the spatter from peeling off. Compared with Example 1, the first, second, third, and fourth molten spray layers are all set as sandblasted surfaces, and the surface roughness of the sandblasted surfaces is 10 μm.
[0094] In Comparative Example 1, no sputtering layer was installed, and the target material lacked the ability to adsorb anti-sputtering materials. Prolonged use resulted in the anti-sputtering materials peeling off, affecting product quality. In Comparative Example 2, sandblasting was used to treat the sputtering surface. However, the roughness produced by sandblasting was insufficient, resulting in significantly weaker anti-sputtering material adsorption capacity. Prolonged sputtering also caused anti-sputtering material peeling off.
[0095] In summary, the annular target provided by this utility model, through the specific structural design of the sputtering surface and the specific position design of the molten layer, enhances the adsorption effect of the anti-sputtered material, prevents the anti-sputtered material from peeling off, improves the sputtering life of the annular target, and improves product yield and quality.
[0096] The above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model fall within the protection and disclosure scope of the present utility model.
Claims
1. A ring-shaped target for preventing the peeling of reflected sputtering material, characterized in that, The annular target includes a sputtering surface and a connecting surface; From the inner circumference to the outer circumference of the annular target, the inner circumference of the sputtering surface is provided with a first inclined surface and a second inclined surface in sequence, and the outer circumference of the sputtering surface is provided with a first step and a second step in sequence, wherein the first step is higher than the second step; A first molten layer, a second molten layer, a third molten layer, and a fourth molten layer are respectively provided on the surface of the first inclined surface, the surface of the second inclined surface, the side surface of the first step, and the surface of the second step, and the edges of the first molten layer and the second molten layer are connected.
2. The annular target for preventing spalling as described in claim 1, characterized in that, The surface roughness of the first, second, third, and fourth molten layers is independently 25-35 μm.
3. The annular target for preventing spalling as described in claim 1, characterized in that, The thicknesses of the first, second, third, and fourth sprayed layers are each 0.13-0.25 mm.
4. The annular target for preventing spalling as described in claim 1, characterized in that, The ratio of the radial width of the first sputtering layer to the radial width of the first inclined surface is (0.7-0.85):1, where the radial direction is the direction of the plane containing the first inclined surface.
5. The annular target for preventing spalling as described in claim 1, characterized in that, The ratio of the radial width of the second sputtering layer to the radial width of the second inclined surface is (0.1-0.2):1, where the radial direction is the direction of the plane containing the second inclined surface.
6. The annular target for preventing spalling according to claim 1, characterized in that, The angle between the first inclined plane and the horizontal direction is greater than the angle between the second inclined plane and the horizontal direction.
7. The annular target for preventing spalling according to claim 6, characterized in that, The first inclined plane makes an angle of 40-50° with the horizontal direction, and the second inclined plane makes an angle of 20-30° with the horizontal direction.
8. The annular target for preventing spalling according to claim 1, characterized in that, The ratio of the height of the first inclined plane to the total height of the annular target is (0.1-0.2):
1.
9. The annular target for preventing spalling according to claim 1, characterized in that, The ratio of the height of the second inclined plane to the total height of the annular target is (0.5-0.6):
1.
10. The annular target for preventing spalling according to claim 1, characterized in that, The second inclined plane is connected to the first step via a third inclined plane.