A kind of chemical nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering

Abstract

This utility model discloses a pretreatment activation tank structure for electroless nickel-palladium-gold plating to prevent silver blistering. It includes an electric actuator for Y-axis agitation of the wafer, and a lateral agitation component above the actuator for X-axis agitation of the wafer. Above the lateral agitation component is a multi-axis agitation assembly for Z-axis agitation and tilting of the wafer. This solution, through a three-dimensional irregular agitation structure combining X, Y, and Z-axis agitation with tilting and oscillation, breaks the continuous contact between the wafer and the wafer cassette, completely solving the problem of plating adhesion. Simultaneously, it drives the plating solution to form full-area turbulence, eliminating dead zones in the flow field such as contact gaps and wafer edges, ensuring uniform activation of the silver surface, effectively preventing silver blistering, providing a high-quality substrate for subsequent nickel-palladium-gold plating, and improving plating quality and production yield.

Description

Technical Field

[0001] This utility model belongs to the field of chemical nickel-palladium-gold plating technology, and particularly relates to a pretreatment activation tank structure for preventing blistering on the silver surface during chemical nickel-palladium-gold plating. Background Technology

[0002] In electroless nickel-palladium-gold plating processes, wafer pretreatment activation is a crucial step in ensuring the quality of subsequent plating layers. It requires cleaning and activating the silver surface of the wafer in an activation tank to provide a uniform catalytic substrate for nickel, palladium, and gold plating. However, most existing activation tanks employ a two-dimensional ballistic structure, only capable of reciprocating motion in a single plane in the X or Y direction. This presents two major problems in practical applications, directly leading to plating quality defects and silver surface blistering, severely impacting production efficiency and product yield.

[0003] On the one hand, the problem of coating adhesion is prominent. The wafer is supported by a hollow frame wafer box, and the two-dimensional slinging cannot achieve dynamic separation between the wafer and the sides of the wafer box or adjacent wafers. The continuous contact between the two obstructs the flow of the plating solution in the gaps, leading to the enrichment of palladium ions and the easy formation of potential differences. This causes palladium ion deposition and the formation of metallic bond bridging, resulting in coating adhesion. On the other hand, there are dead zones in the plating solution flow field. The two-dimensional slinging cannot create full-area turbulence. Impurities and insufficient activators easily accumulate in contact gaps, wafer gaps, and upper and lower edges. Furthermore, the constant variable speed mode exacerbates the flow field closure, and uneven activation leads to blistering on the silver surface during subsequent nickel plating. Utility Model Content

[0004] The purpose of this invention is to provide a pretreatment activation tank structure for electroless nickel-palladium-gold plating that prevents silver blistering. This addresses the technical problems mentioned in the background art, where existing electroless nickel-palladium-gold plating pretreatment activation tanks employ a two-dimensional turbulent structure, which cannot achieve dynamic separation between wafers and wafer box sides or adjacent wafers. This easily leads to plating adhesion and makes it difficult to drive the plating solution to form full-area turbulence. This results in flow field dead zones in contact gaps, wafer gaps, and upper and lower edges, leading to uneven silver activation. Consequently, it easily causes silver blistering and damage to plating integrity in subsequent nickel plating processes, ultimately affecting production efficiency and product yield.

[0005] To achieve the above objectives, the specific technical solution of this utility model is as follows: a pretreatment activation tank structure for preventing silver blistering in electroless nickel-palladium-gold plating includes an electric push rod for driving and shoveling a wafer along the Y-axis, and a lateral shoveling component above the electric push rod for shoveling the wafer along the X-axis. A multi-axis shoveling assembly is mounted above the lateral shoveling component, which is used for shoveling the wafer along the Z-axis and tilting it. The electric push rod, the lateral shoveling component, and the multi-axis shoveling assembly are used to perform three-dimensional shoveling of the wafer, providing anti-overplating protection. The multi-axis projectile assembly includes a flap, with a shaft extending through one end of the flap.

[0006] Preferably, a base is mounted above the electric actuator, wherein a push plate is connected to the output end of the electric actuator. Meanwhile, two slide rails are symmetrically arranged along the axis on the upper part of the base, and a slider is slidably arranged at the end of the slide rail.

[0007] Preferably, the lateral projectile component includes a drive motor as the X-axis projectile power source, and the output shaft of the drive motor is connected to a screw, wherein the surface of the screw is threaded with a screw plate.

[0008] Preferably, the lateral throwing component further includes an upper plate and a lower plate disposed at the upper and lower ends of the drive motor, and an assembly base plate is disposed above the upper plate.

[0009] Preferably, a second drive motor is provided at the shaft end of the shaft rod, and the output shaft of the second drive motor is connected to the shaft end of the shaft rod. Both shaft ends of the shaft rod are fitted with L-shaped plates through bearings.

[0010] Preferably, an electric actuator two is provided at the upper center of the flip plate, and the bottom of the electric actuator two is fixedly connected to the top of the flip plate through a mounting base plate.

[0011] Preferably, a mounting plate is vertically connected to one side of the top of the flip plate, and an auxiliary moving component is connected to one end of the mounting plate near the electric push rod 2, wherein a reinforcing seat is connected to one side of the auxiliary moving component.

[0012] Preferably, a sleeve is connected to one side wall of the reinforcing seat, and a sleeve rod is provided through the inner cavity of the sleeve. Meanwhile, a connecting plate is connected to the other end of the sleeve rod.

[0013] Preferably, one end of the sleeve is connected to a mounting housing, and an electromagnetic component is installed in the inner cavity of the mounting housing; at the same time, a magnet ring is fitted on the surface of the sleeve rod.

[0014] Preferably, an assembly housing is connected to one side of the two connecting plates, and a wafer cassette is fitted inside the cavity of the assembly housing, wherein multiple wafers are arranged in an array inside the wafer cassette.

[0015] The pretreatment activation tank structure for preventing silver-plated nickel-palladium-gold blistering in this invention has the following advantages: This anti-blistering electroless nickel-palladium-gold plating pretreatment activation tank structure uses an electric actuator to provide power. The output of the actuator pushes a push plate, causing the download plate to slide along a slide rail on the base. This, in turn, causes the lateral throwing component and the entire upper structure to throw in the Y-axis direction. Simultaneously, a drive motor in the lateral throwing component drives a screw to rotate, causing the screw plate to move linearly along the screw, which in turn causes the assembly base plate to slide along a slide rail on the upper plate, achieving throwing in the X-axis direction. In the multi-axis throwing assembly, a drive motor drives a shaft to tilt and flip a flip plate, while an electric actuator pushes a reinforcing seat to move up and down along the slide rail and slide plate of the auxiliary moving component, achieving throwing in the Z-axis direction. During the tilting and throwing process... First, the electromagnetic component inside the mounting housing is energized, attracting it to the magnet ring on the sleeve rod. This fixes the sleeve and sleeve rod as a whole, causing them to tilt with the flip plate. Once the tilt reaches a certain point, the power supply to the electromagnetic component is disconnected, restoring the sliding connection between the sleeve and sleeve rod. Under the influence of gravity, the assembly housing and wafer box float back and forth around the sleeve and sleeve rod, further enhancing the tilting and throwing effect. Ultimately, this achieves three-dimensional irregular throwing of the wafer, ensuring that the plating solution flow field has no dead angles and only acts on the wafer area. This prevents the plating layer from sticking at the contact point between the wafer and the wafer box, improves the surface cleaning and activation efficiency of the silver surface, prevents blistering of the silver surface from the pretreatment stage, and ensures the uniformity and stability of the subsequent electroless nickel-palladium-gold plating layer. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is one of the overall structural schematic diagrams of this utility model; Figure 2 This is the second schematic diagram of the overall structure of this utility model; Figure 3 This is one of the structural assembly diagrams of the base, upper plate, multi-axis projectile assembly, and sleeve of this utility model; Figure 4 The second schematic diagram shows the assembly of the base, upper plate, multi-axis projectile assembly, and sleeve of this utility model. Figure 5 A bottom view of the assembly of the base, upper plate, multi-axis projectile assembly and sleeve of this utility model; Figure 6 The explosion diagram illustrates the structure of this utility model, including the base, upper plate, multi-axis projectile assembly, and sleeve. Figure 7 This is a schematic diagram of the multi-axis projectile component structure assembly of this utility model; Figure 8 This is an exploded view of the base, download plate, and upper plate of this utility model. Figure 9 This is an exploded cross-sectional view of the sleeve and rod structure of this utility model.

[0018] Explanation of markings in the diagram: 100, Assembly shell; 110, Wafer box; 200, Base; 210, Electric push rod one; 211, Push plate; 220, Slide rail one; 221, Slider one; 300, Download plate; 310, Loading plate; 320, Drive motor one; 321, Screw; 322, Screw plate; 330, Slide rail two; 331, Slider two; 340, Assembly base plate; 400, Multi-axis projectile assembly; 410, Flip plate; 420, Shaft; 421, Drive motor two; 430, Electric push rod two; 431, Mounting base plate; 440, Mounting plate; 441, Auxiliary moving component; 450, Reinforcing seat; 600, Sleeve; 601, Mounting shell; 602, Slip ring; 610, Electromagnetic component; 620, Sleeve rod; 621, Ring groove; 630, Connecting plate; 640, Magnet ring. Detailed Implementation

[0019] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0020] In the description of the embodiments of this utility model, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0023] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0024] To better understand the purpose, structure, and function of this utility model, the following description, in conjunction with the accompanying drawings, provides a more detailed account of the structure of an activation tank for the pretreatment of electroless nickel-palladium-gold plating to prevent blistering on silver surfaces.

[0025] This utility model discloses a pretreatment activation tank structure for preventing silver blistering in electroless nickel-palladium-gold plating. Its core purpose is to solve problems such as "continuous contact between the wafer and the carrier causing coating adhesion" and "dead zones in the plating solution flow field leading to uneven silver activation and easy blistering" caused by two-dimensional agitation in the traditional electroless nickel-palladium-gold plating pretreatment stage. The specific structure and assembly relationship are as follows: like Figures 1-9 As shown, the anti-blistering electroless nickel-palladium-gold pretreatment activation tank structure includes an assembly housing 100 and a wafer box 110. The wafer box 110 contains wafers and employs a hollow frame design to vertically and equidistantly separate the wafers. However, its traditional fixed support method easily leads to continuous contact between the wafer edges and the sides of the box, which is a major cause of plating adhesion. Therefore, this solution breaks this fixed contact state through a multi-dimensional agitation structure, such as... Figures 3 to 6 ,as well as Figure 8As shown, the electroless nickel-palladium-gold pretreatment activation tank junction for preventing silver blistering in this solution also includes an electric push rod 210 for driving and slinging the wafer along the Y-axis. A base 200 is mounted above the electric push rod 210, allowing the electric push rod 210 to be mounted on the bottom of the base 200 via a support plate and to act as a power source to push the download plate 300 to move. The base 200 is used to support both the electric push rod 210 and the download plate 300. The output end of the electric push rod 210 is connected to a push plate 211, which extends to the top of the base 200 and connects to the bottom of the download plate 300. Meanwhile, a slot is formed through the middle of the surface of the base 200 for the push plate 211 to pass through, and the surface of the push plate 211 slides in contact with the inner wall of the slot in the base 200. Meanwhile, two slide rails 220 are symmetrically arranged along the axis above the base 200, and sliders 221 are slidably arranged at the ends of the slide rails 220. The top of the sliders 221 is connected to the bottom of the download board 300. Therefore, when the electric push rod 210 is working, it can directly push the download board 300 to move through the push plate 211. The sliders 221 can slide along the slide rails 220 with the download board 300 to help support the download board 300, provide stability to the download board 300, and ultimately achieve the Y-direction throwing of the wafer.

[0026] During operation, the electric actuator 210 pushes the push plate 211, which drives the download plate 300 to reciprocate along the slider 221 on the slide rail 220. During this process, the wafer moves synchronously in the Y direction with the download plate 300, which can break the continuous contact between the wafer and the wafer box 110 in the Y direction, avoid the coating adhesion caused by the enrichment of palladium ions in the contact gap, and at the same time provide power for the flow of the plating solution in the Y direction, initially reducing the dead angle of the Y direction flow field.

[0027] like Figures 3 to 6 ,as well as Figure 8 As shown, a lateral throwing component is provided above the electric push rod 210 for X-axis throwing of the wafer, further enhancing the "dynamic contact separation" effect and the coverage of the plating solution flow field; the lateral throwing component includes a drive motor 320 as the X-axis throwing power source, and the output shaft of the drive motor 320 is connected to a screw 321, wherein the surface of the screw 321 is threadedly connected to a screw plate 322, and the top of the screw plate 322 penetrates through the upper carrier plate 310 and is connected to the mounting substrate 340.

[0028] Specifically, such as Figure 8As shown, a rectangular groove is formed on the surface of the upper plate 310. The top of the screw plate 322 passes through the rectangular groove on the upper plate 310 and can be connected to the bottom of the upper plate 310. Therefore, the drive motor 320 drives the screw 321, which can drive the screw plate 322 to move linearly on the surface of the screw 321, thereby pushing the assembly substrate 340 to move, and finally driving the wafer in the wafer box 110 to be thrown along the X-axis.

[0029] Specifically, the two shaft ends of the screw 321 are smooth surfaces, and a shaft support plate is sleeved on the smooth surface of the shaft end through a bearing. The bottom of the shaft support plate is connected to the bottom of the download plate 300 to ensure stable rotation of the screw 321.

[0030] The lateral throwing component also includes an upper plate 310 and a lower plate 300 disposed at the upper and lower ends of the drive motor 320. The lower plate 300 is used to install the drive motor 320. The four corners of the lower plate 300 are connected to the upper plate 310 through support blocks, connecting the lower plate 300 and the upper plate 310 into a whole for assembling the drive motor 320, screw 321, screw plate 322, slide rail 330, and slider 331, forming a closed lateral throwing component frame.

[0031] Meanwhile, an assembly base plate 340 is provided above the upper plate 310, and the bottom of the assembly base plate 340 is connected to the top of the slider 331. The top of the screw plate 322 is fastened to the bottom of the assembly base plate 340 by bolts, so that the screw plate 322 can push the assembly base plate 340 to move along the X-axis when it is subjected to force.

[0032] As a further optimization of this solution, the assembly substrate 340 is composed of multiple stacked flat plates, which together form the assembly substrate 340. The multiple flat plates are connected by bolts, and the relative positions between the multiple flat plates are adjustable. The assembly substrate 340 can be used to assist in supporting the multi-axis projectile assembly 400.

[0033] Among them, the top of the upper plate 310 is symmetrically connected to the left and right along the axis of the slide rail 330, and the surface of the slide rail 330 is slidably provided with the slider 331. The slider 331 can assist in supporting the assembly plate 340 when it moves, thereby increasing the stability of the assembly plate 340 when it moves.

[0034] During operation, the drive motor 320 drives the screw 321 to rotate, causing the screw plate 322 to move linearly along the screw 321, which in turn pushes the assembly substrate 340 to move along the slide rail 330 on the top of the upper plate 310 in the X-axis direction. At this time, the wafers are thrown together in the X and Y directions to achieve "no fixed contact points in the plane". The wafers alternately contact and separate from the side of the wafer box 110 and adjacent wafers, which reduces the adhesion of the coating caused by metal adsorption from the root. At the same time, the plating solution forms preliminary turbulence under the action of the X and Y direction movement, which washes away the static plating solution between the wafers and reduces the dead angle of the horizontal flow field.

[0035] like Figures 3 to 7 As shown, a multi-axis projectile assembly 400 is mounted above the lateral projectile component. The multi-axis projectile assembly 400 is used to project the wafer along the Z-axis and tilt and flip it, solving the problems of "vertical flow field dead angle" and "fixed angle contact adhesion" that cannot be covered by traditional two-dimensional projectiles. In this way, the wafer is projected in three dimensions using the electric push rod 210, the lateral projectile component and the multi-axis projectile assembly 400, changing the traditional two-dimensional projectile method and providing anti-overplating protection for the wafer. This solution uses an electric actuator 210 to drive the lateral throwing component to perform Y-axis displacement, which in turn drives the multi-axis throwing assembly 400 to perform X-axis displacement. The multi-axis throwing assembly 400 can indirectly drive the assembly housing 100 and the wafers in its internal wafer box 110 to perform Z-axis displacement and tilting, thereby realizing three-dimensional throwing of the wafers and tilting throwing of the wafers based on three-dimensional throwing.

[0036] The multi-axis projectile assembly 400 includes a flap 410, with a shaft 420 extending through one end of the flap 410. In actual use, the flap 410 has a through hole, and the shaft 420 is installed by passing through the through hole of the flap 410. The shaft 420 is connected by a fixed connection through the through hole of the flap 410. The shaft 420 is driven by a drive structure. When the drive structure is working, it can drive the flip plate 410 to tilt and flip, and tilt and throw the wafers stored in the wafer box 110 to avoid the wafers from sticking together at the position where they contact the wafer box 110.

[0037] The driving structure in the multi-axis projectile assembly 400 is a second drive motor 421. The second drive motor 421 is mounted on the shaft end of the shaft 420, and its output shaft is connected to the shaft end of the shaft 420. Driven by the second drive motor 421, the shaft 420 can drive the flap 410 to rotate. Figure 7As shown, both ends of the shaft 420 are fitted with L-shaped plates through bearings. One end of the L-shaped plate is bolted to the side wall of the mounting base plate 340. The L-shaped plate can be used to assist in supporting the shaft 420 and the flap 410.

[0038] During operation, the drive motor 421 drives the shaft 420 to rotate, which in turn causes the flip plate 410 to tilt and flip around the shaft 420, causing the wafer to tilt and throw. This action allows the plating solution at the bottom and top of the wafer to form vertical convection, eliminating the flow field dead angle at the upper and lower edges of the wafer. Traditional two-dimensional throwing cannot reach this area, which can easily lead to insufficient edge activation and cause silver blistering. At the same time, it further breaks the fixed contact between the wafer and the upper and lower frames of the wafer box 110, avoiding vertical plating adhesion.

[0039] like Figure 7 As shown, an electric actuator 430 is provided in the upper middle part of the flip plate 410, and the bottom of the electric actuator 430 is fixedly connected to the top of the flip plate 410 through the mounting base plate 431; wherein the mounting base plate 431 and the fixed end of the electric actuator 430 are fixedly connected by bolts on opposite sides.

[0040] A mounting plate 440 is vertically connected to one side of the top of the flip plate 410. An auxiliary moving member 441 is connected to one end of the mounting plate 440 near the electric actuator 430. A reinforcing seat 450 is connected to one side of the auxiliary moving member 441. The bottom side of the reinforcing seat 450 is connected to the output end of the electric actuator 430. Thus, when the electric actuator 430 is working, it can push the reinforcing seat 450 to move up and down. The auxiliary moving member 441 can help support the reinforcing seat 450 and improve its stability during movement.

[0041] During operation, the electric actuator 430 pushes the reinforcing seat 450 to move up and down along the slide of the auxiliary moving component 441, causing the subsequently connected assembly housing 100 and wafer box 110 to perform Z-axis jerking. This action allows the plating solution to penetrate deep into the contact gap between the wafer and the wafer box 110, which is only 0.1 to 0.3 mm wide, flushing out the palladium ions and impurities accumulated in the gap, completely solving the problem of "dead angle of the flow field in the contact gap", and avoiding plating adhesion and silver surface blistering caused by uneven activation in the gap.

[0042] like Figure 7 As shown, the auxiliary moving component 441 consists of a slide rail, a sliding plate, and a connecting plate. The slide rail is installed on the side wall of the mounting plate 440, and the sliding plate is slidably disposed on the surface of the slide rail. The other side of the sliding plate is connected to the connecting plate. The connecting plate is connected to the side opposite to the reinforcing seat 450 by bolts. Therefore, when the reinforcing seat 450 moves under the push of the electric push rod 430, it can drive the connecting plate to move, thereby causing the connecting plate to move linearly on the slide rail via the sliding plate, thus improving the stability of the support for the reinforcing seat 450.

[0043] like Figure 6 and Figure 7 as well as Figure 9 As shown, a sleeve 600 is connected to one side wall of the reinforcing seat 450, and a sleeve rod 620 is provided through the inner cavity of the sleeve 600. The inner walls of the sleeve 600 and the sleeve rod 620 slide in contact. At the same time, a connecting plate 630 is connected to the other end of the sleeve rod 620, and the connecting plate 630 is fastened to the side wall of the assembly housing 100 by bolts.

[0044] One end of the sleeve 600 is connected to the mounting housing 601, which is used to mount the electromagnetic component 610, and the electromagnetic component 610 is mounted in the inner cavity of the mounting housing 601. Meanwhile, a magnet ring 640 is fitted on the surface of the sleeve rod 620, and the magnet ring 640 is located in the inner cavity of the electromagnetic component 610. When the electromagnetic component 610 is not energized, the two are in a state of sliding contact with each other.

[0045] When the sleeve rod 620 is inserted into the sleeve 600 and the electromagnetic component 610 is energized, it can attract the electromagnetic component 610 and the magnet ring 640, so that the sleeve 600 and the sleeve rod 620 change from sliding contact to fixed connection. After the electromagnetic component 610 is de-energized, the sleeve rod 620 and the sleeve 600 return to sliding connection.

[0046] In this design, during actual use, when tilting and tossing the wafers inside the wafer cassette 110, the control electromagnetic component 610 is energized and attracts the magnetic ring 640, making the sleeve 600 and the sleeve rod 620 a single unit. Then, by adjusting the tilt angle of the flip plate 410, the sleeve 600 and the sleeve rod 620 can tilt and flip with the flip plate 410, thereby tilting and tossing the assembly housing 100 and the wafers inside the wafer cassette 110. After tilting and tossing the wafers inside the wafer cassette 110 to a certain degree... When the electromagnetic component 610 is disconnected, the fixed connection state of the sleeve 600 and the sleeve rod 620 is adjusted to the sliding connection state. Under the influence of the gravity of the assembly shell 100 and the wafer box 110, the sleeve rod 620 drives the assembly shell 100 and the wafer box 110 to move in the direction of the assembly shell 100 and the wafer box 110. This allows the assembly shell 100 and the wafer box 110 to float back and forth with the sleeve 600 and the sleeve rod 620 as the center, thereby effectively tilting and throwing the wafers in the wafer box 110.

[0047] As a further optimization of this solution, such as Figure 9As shown, a slip ring 602 is integrally formed on one side of the inner wall of the sleeve 600, while an annular groove 621 that cooperates with the slip ring 602 is opened on one end of the surface of the sleeve rod 620. After the sleeve rod 620 is inserted into the inner cavity of the sleeve 600, the slip ring 602 is inserted into the inner cavity of the annular groove 621 to ensure the stability of the sleeve 600 and the sleeve rod 620 when they slide in contact.

[0048] In practical use, the core function of this structural design is to achieve "controllable tilting and swaying": when tilting and tossing the wafer, the electromagnetic component 610 is first energized to attract the magnetic ring 640, fixing the sleeve 600 and the sleeve rod 620 as a whole, and tilting synchronously with the flip plate 410 to ensure the wafer tilt angle is accurate; after tilting to the preset angle, the power supply of the electromagnetic component 610 is disconnected, the sleeve 600 and the sleeve rod 620 return to sliding connection, and the assembly shell 100 and the wafer box 110 float back and forth with the sleeve 600 and the sleeve rod 620 as the center under the action of gravity. This irregular swaying motion can simulate "three-dimensional curved surface trajectory", allowing the plating solution to form turbulent flow without a fixed path on the wafer surface, completely eliminating the "inertial flow field dead angle" of traditional two-dimensional tossing, while making the activation efficiency of each point on the wafer surface uniform, avoiding silver blistering caused by local over-activation or under-activation.

[0049] like Figure 1 and Figure 2 As shown, the two connecting plates 630 are connected to the assembly housing 100 on opposite sides, and the inner cavity of the assembly housing 100 holds the wafer box 110. The wafer box 110 contains an array of multiple wafers. The above structure is used to realize the triaxial slewing and tilting flipping slewing of the wafers in the wafer box 110.

[0050] This solution symmetrically sets two sets of three-axis projectile + tilting projectile structures on both sides of the assembly housing 100, which can improve the stability of the projectile motion of the wafers in the wafer box 110. It can ensure that all wafers in the wafer box 110 are subjected to uniform force, avoid uneven activation of edge wafers due to insufficient projectile amplitude, achieve efficient projectile motion of wafers, replace the two-dimensional projectile motion method of transmission, can eliminate dead corners in the flow field of the plating solution, and act only on the wafer area, which may improve the overall surface cleaning and activation efficiency of the silver surface.

[0051] This solution can also control the movement speed of electric actuator 210, drive motor 320, drive motor 421 and electric actuator 430 by setting "pi-type irregular speed" through software; such as the speed is dynamically adjusted with the infinite non-cyclic characteristic of π, to avoid the formation of "boundary layer thickening" of the plating solution due to a fixed speed, further enhance the scouring effect of the plating solution on the wafer surface, and ensure that the plating solution flow field has no dead corners and only acts on the wafer area.

[0052] This solution abandons the single plane, such as only X or Y direction throwing, and instead uses a curved surface motion trajectory that combines three-dimensional space in X, Y and Z directions, so that the wafer can achieve multi-directional and three-dimensional movement in the activation tank of the wafer box 110, breaking the continuous contact state between the wafer and the assembly shell 100. In summary, this structure, through the synergistic action of the electric actuator 210, the lateral projectile component, and the multi-axis projectile assembly 400, achieves three-dimensional projectile motion and tilting of the wafer in X, Y, and Z directions, completely breaking the limitations of traditional two-dimensional projectile motion. It solves the two core problems of "plating adhesion" and "dead corners in the plating solution flow field," improves the overall cleaning and activation efficiency of the silver surface from the pretreatment stage, prevents blistering of the silver surface, and provides a guarantee for the uniformity and stability of the subsequent electroless nickel-palladium-gold plating.

[0053] The working principle of a pretreatment activation tank structure for preventing silver blistering in electroless nickel-palladium-gold plating is as follows: After the wafer cleaning process is completed, the wafer cassette 110 containing the wafers is inserted into the inner cavity of the assembly housing 100. The assembly housing 100 is connected to the sleeve rod 620 via the connecting plate 630. The sleeve rod 620 is inserted into the sleeve 600, which is connected to the reinforcing seat 450, thus establishing the wafer support and transmission system. During operation, power is first provided by the electric push rod 210, whose output end pushes the push plate. 211 drives the download plate 300 to slide along the slide rail 220 on the base 200, thereby driving the lateral throwing component and the entire upper structure to throw in the Y-axis direction. At the same time, the drive motor 320 in the lateral throwing component drives the screw 321 to rotate, causing the screw plate 322 to move linearly along the screw 321, driving the assembly base plate 340 to slide along the slide rail 330 on the upper plate 310, thereby achieving throwing in the X-axis direction. In the multi-axis throwing assembly 400, the drive motor 421 drives the shaft 420 to... The movable flap 410 tilts and flips, while the electric actuator 430 pushes the reinforcing seat 450 to move up and down along the slide rail and slide plate of the auxiliary moving component 441, realizing the throwing motion in the Z-axis direction. During the tilting and throwing process, the electromagnetic component 610 inside the mounting housing 601 is first energized, so that it attracts the magnet ring 640 on the sleeve rod 620, fixing the sleeve 600 and the sleeve rod 620 into a whole and tilting with the flap 410. After tilting to a certain extent, the power supply to the electromagnetic component 610 is disconnected, so that the sleeve 600 and the sleeve rod 620 return to their original positions. The sliding connection allows the housing 100 and the wafer box 110 to oscillate back and forth around the sleeve 600 and the rod 620 under the influence of gravity, further enhancing the tilting and throwing effect. This ultimately achieves three-dimensional irregular throwing of the wafer, ensuring that the plating solution flow field has no dead angles and only acts on the wafer area. This prevents the plating layer from sticking at the contact point between the wafer and the wafer box 110, improves the surface cleaning and activation efficiency of the silver surface, prevents blistering of the silver surface from the pretreatment stage, and ensures the uniformity and stability of the subsequent electroless nickel-palladium-gold plating layer.

[0054] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.

Claims

1. A pretreatment activation tank structure for preventing silver surface blistering in electroless nickel-palladium-gold plating, characterized in that: The device includes an electric push rod (210) for driving and shoving a wafer along the Y-axis, and a lateral shoving component is provided above the electric push rod (210) for shoving the wafer along the X-axis. A multi-axis shoving assembly (400) is mounted above the lateral shoving component for shoving the wafer along the Z-axis and tilting and flipping it. The wafer is shoved in three dimensions using the electric push rod (210), the lateral shoving component and the multi-axis shoving assembly (400) to protect the wafer from over-plating. The multi-axis projectile assembly (400) includes a flap (410), and a shaft (420) is provided through one end of the flap (410).

2. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 1, characterized in that: A base (200) is mounted above the electric actuator (210), wherein the output end of the electric actuator (210) is connected to a push plate (211). At the same time, two slide rails (220) are symmetrically arranged on the upper part of the base (200) along the axis, and a slider (221) is slidably arranged at the end of the slide rail (220).

3. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 2, characterized in that: The lateral throwing component includes a drive motor (320) that serves as the X-axis throwing power source, and the output shaft of the drive motor (320) is connected to a screw (321), wherein the surface of the screw (321) is threadedly connected to a screw plate (322).

4. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver blistering according to claim 3, characterized in that: The lateral throwing component also includes an upper plate (310) and a lower plate (300) disposed at the upper and lower ends of the drive motor (320). Meanwhile, an assembly base plate (340) is disposed above the upper plate (310).

5. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 4, characterized in that: The shaft end of the shaft (420) is provided with a second drive motor (421), and the output shaft of the second drive motor (421) is connected to the shaft end of the shaft (420). Both shaft ends of the shaft (420) are fitted with L-shaped plates through bearings.

6. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 5, characterized in that: An electric push rod 2 (430) is provided at the upper center of the flip plate (410), and the bottom of the electric push rod 2 (430) is fixedly connected to the top of the flip plate (410) through the mounting base plate (431).

7. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 6, characterized in that: A mounting plate (440) is vertically connected to one side of the top of the flap (410), and an auxiliary moving member (441) is connected to one end of the mounting plate (440) near the electric push rod (430). A reinforcing seat (450) is connected to one side of the auxiliary moving member (441).

8. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 7, characterized in that: A sleeve (600) is connected to one side wall of the reinforcing seat (450), and a sleeve rod (620) is provided through the inner cavity of the sleeve (600). Meanwhile, a connecting plate (630) is connected to the other end of the sleeve rod (620).

9. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver surface blistering according to claim 8, characterized in that: One end of the sleeve (600) is connected to the mounting housing (601), and an electromagnetic component (610) is installed in the inner cavity of the mounting housing (601); at the same time, a magnet ring (640) is fitted on the surface of the sleeve rod (620).

10. The electroless nickel-palladium-gold pretreatment activation tank structure for preventing silver blistering according to claim 9, characterized in that: Two connecting plates (630) are connected to an assembly housing (100) on opposite sides, and a wafer cassette (110) is fitted inside the assembly housing (100), wherein multiple wafers are arranged in an array inside the wafer cassette (110).

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