Electroplating apparatus

Abstract

The application relates to an electroplating device, characterized in that the device comprises a first track, a hanger arranged on the first track, the hanger being used for fixing a workpiece to be electroplated, a control device for controlling the hanger to move along the first track, a conductive detection device for detecting the resistance of the workpiece to be electroplated, and an electroplating tank for electroplating the workpiece to be electroplated; and the control device controls the first track to move the workpiece to be electroplated to the electroplating tank when the resistance of the workpiece to be electroplated meets the electroplating condition. The electroplating device can improve the electroplating quality.

Description

Technical Field

[0001] This application relates to the field of electroplating technology, and in particular to an electroplating device. Background Technology

[0002] With the development of electroplating technology, the method of electroplating workpieces by replacing manual labor with electroplating equipment has gradually been accepted by the public. Electroplating equipment can automate the electroplating of workpieces, thereby improving the electroplating efficiency.

[0003] However, when there are a large number of workpieces to be electroplated, traditional electroplating equipment cannot guarantee that the resistance of each workpiece meets the electroplating conditions. Therefore, the finished electroplated workpieces obtained by using traditional electroplating equipment have poor quality. Utility Model Content

[0004] Therefore, it is necessary to provide an electroplating device that can improve the quality of electroplating in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides an electroplating apparatus, comprising:

[0006] First track;

[0007] A hanger is installed on the first track; the hanger is used to fix the workpiece to be electroplated.

[0008] A control device for controlling the hanging device to follow the movement of the first track;

[0009] A conductivity detection device for detecting the resistance of a workpiece to be electroplated.

[0010] An electroplating tank for electroplating the workpiece to be electroplated;

[0011] When the workpiece resistance meets the electroplating conditions, the control device controls the first track to move the workpiece to be electroplated to the electroplating tank.

[0012] In one embodiment, the electroplating equipment further includes a removal device connected to the control device;

[0013] When the workpiece resistance does not meet the electroplating conditions, the control device controls the removal device to move the hanger out of the first track.

[0014] In one embodiment, the electroplating equipment further includes a second track and a pre-impregnation tank and an air-cutting groove arranged sequentially on the second track; the control device controls the hanger to slide from the second track into the first track.

[0015] In one embodiment, the first track moves at a speed greater than the second track.

[0016] In one embodiment, a track gap is provided between the first track and the second track; the track gap is less than the contact length between the hanger and the second track.

[0017] In one embodiment, the electroplating equipment further includes a detection sensor disposed on the first track; the detection sensor and the conductive detection device are arranged sequentially along the movement direction of the first track.

[0018] In one embodiment, the electroplating equipment further includes a first rectifier; the first rectifier is connected to the detection sensor and the conductivity detection device; the first rectifier supplies power to the conductivity detection device when the detection sensor detects the hanger.

[0019] In one embodiment, the electroplating equipment further includes a position adjustment device; the position adjustment device is correspondingly arranged with the conductivity detection device; the position adjustment device adjusts the position of the probe of the conductivity detection device so that the probe of the conductivity detection device contacts the workpiece to be electroplated.

[0020] In one embodiment, the position adjustment device includes a gravity sensor and a position adjuster.

[0021] In one embodiment, the electroplating equipment further includes a second rectifier; the second rectifier is connected to the control device and the electroplating tank.

[0022] The aforementioned electroplating equipment includes: a first track; a hanger disposed on the first track; the hanger for fixing the workpiece to be electroplated; a control device for controlling the hanger to follow the movement of the first track; a conductivity detection device for detecting the workpiece resistance value; and an electroplating tank for electroplating the workpiece. When the workpiece resistance value meets the electroplating conditions, the control device controls the first track to move the workpiece to be electroplated into the electroplating tank. Using this electroplating equipment, the workpiece resistance value can be detected before electroplating each workpiece, and electroplating can be performed on workpieces with resistance values ​​meeting the electroplating conditions, thereby ensuring electroplating quality. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a structural block diagram of an electroplating device in one embodiment;

[0025] Figure 2 This is a structural block diagram of the electroplating equipment in another embodiment;

[0026] Figure 3 This is a structural block diagram of the position adjustment device in one embodiment;

[0027] Figure 4 This is a structural block diagram of the electroplating equipment in another embodiment.

[0028] Reference numerals: 1-First track; 2-Hanger; 3-Control device; 4-Conductivity detection device; 5-Electroplating tank; 6-Removal device; 7-Second track; 8-Pre-impregnation tank; 9-Air cutting groove; 10-Track gap; 11-Detection sensor; 12-First rectifier; 13-Position adjustment device; 131-Gravity sensor; 132-Position adjuster; 14-Second rectifier. Detailed Implementation

[0029] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0031] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0032] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is transmission of electrical signals or data between the connected objects.

[0033] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0034] As described in the background section, existing electroplating equipment, when electroplating the grid lines of solar cells, first places the solar cells into a rack, and then automatically feeds them into the main unit for the electroplating process. After the electroplating process is completed, the cells are dried in a drying device. However, this process cannot monitor the resistance value of the solar cells before they enter the electroplating process, which may result in resistance uniformity not being within the process standard or poor contact between the solar cells. Furthermore, the grid line height and width of the solar cells plated by the aforementioned electroplating equipment may be abnormal, leading to defects such as grid line drop or breakage, and affecting the peeling of the adhesive film around the grid lines, causing copper and tin seepage problems.

[0035] To address the aforementioned issues and improve electroplating quality, an electroplating equipment is provided that solves the problem of poor electroplating quality caused by the inability to monitor and detect the resistance value of the workpiece to be electroplated, thereby improving the electroplating quality of the finished workpiece.

[0036] Based on the above reasons, this application provides an electroplating device, which is configured with a first track and a fixture set on the first track. The fixture is used to fix the workpiece to be electroplated. A control device is configured to control the fixture to move along the first track, and a conductivity detection device is configured to measure the workpiece resistance value. When the workpiece resistance value meets the electroplating conditions, the control device controls the first track to move the workpiece to be electroplated to the electroplating tank. The electroplating tank is configured to perform electroplating treatment on the workpiece. This device can realize the workpiece resistance value detection function and perform electroplating on workpieces that meet the electroplating conditions, thus ensuring the electroplating quality.

[0037] In one embodiment, such as Figure 1As shown, an electroplating device is provided, including: a first track 1; a hanger 2 disposed on the first track; the hanger 2 is used to fix the workpiece to be electroplated; a control device 3 for controlling the hanger 2 to follow the movement of the first track 1; a conductivity detection device 4 for detecting the workpiece resistance value of the workpiece to be electroplated; an electroplating tank 5 for electroplating the workpiece to be electroplated; and the control device 3 controls the first track 1 to move the workpiece to be electroplated to the electroplating tank 5 when the workpiece resistance value meets the electroplating conditions.

[0038] The first track 1 is a transport tool used to move the hangers 2. For example, buckles or hooks for hanging hangers 2 can be evenly arranged in the first track 1. Each hanger 2 can be placed into a buckle sequentially or hooked into a hook at once, thus achieving the transport of the hangers 2. The hangers 2 are frames used to suspend the workpieces to be electroplated in electroplating and related operations. There are many forms of hangers, including general-purpose hangers applicable to several common parts and hangers specifically designed for large-volume production. For workpieces with complex geometries, auxiliary anodes, auxiliary cathodes, or shielding plates are sometimes required. The non-contact parts of the hangers used for aluminum anodizing and plastic electroplating must have a good insulation layer. The hangers used on automated lines differ from those used in manual electroplating. The basic design principles for hangers are: sufficient mechanical strength and good conductivity, lightweight, easy loading and unloading, and firm contact between the parts and the hanger.

[0039] The workpiece to be electroplated refers to the workpiece awaiting electroplating, such as a solar cell. The control device 3 can be a hardware module containing various processing chips and their peripheral circuits, possessing logic operation functions. This processing chip can be a microcontroller, a DSP (Digital Signal Processing) chip, or an FPGA (Field Programmable Gate Array) chip. The workpiece resistance refers to the resistance value of the workpiece to be electroplated. The conductivity detection device 4 is a device for detecting the resistance of the workpiece to be electroplated. The electroplating tank 5 is the tank in which the workpiece is electroplated. Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It utilizes electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics. Many coins also have an electroplated outer layer. Electroplating conditions refer to the resistance range within which electroplating can be performed. In this embodiment, the electroplating condition refers to the first gradient resistance value in the standard gradient of the electroplating process.

[0040] Specifically, a first track 1 can be set up to transport and fix a fixture 2 for electroplating the workpiece. A control device 3 controls the fixture 2 to move along the first track 1. During the movement of the fixture 2, it passes a conductivity detection device 4 that detects the workpiece resistance. After detecting the workpiece resistance, the conductivity detection device 4 sends the workpiece resistance value to the control device 3. The control device 3 determines whether the workpiece resistance value meets the electroplating conditions. If it does, the workpiece is considered ready for electroplating, and the control device can then control the first track 1 to move the workpiece to the electroplating tank 5. In a specific embodiment, the electroplating conditions refer to the first gradient resistance value in the electroplating standard gradient, which is a resistance range. If the workpiece resistance value is within the range, it is considered to meet the electroplating conditions. If the workpiece resistance value is less than the minimum value or greater than the maximum value of the range, it is considered not to meet the electroplating conditions.

[0041] The aforementioned electroplating equipment is equipped with a first track and a fixture mounted on the first track. The fixture is used to fix the workpiece to be electroplated. A control device controls the fixture to move along the first track, and a conductivity detection device measures the resistance value of the workpiece. When the workpiece resistance value meets the electroplating conditions, the control device controls the first track to move the workpiece to the electroplating tank. The electroplating tank is configured to perform electroplating treatment on the workpiece. This equipment can realize the function of detecting the workpiece resistance value and electroplating workpieces that meet the electroplating conditions. Before electroplating each workpiece, the workpiece resistance value can be detected, and electroplating can be performed on workpieces whose resistance value meets the electroplating conditions, thereby ensuring the electroplating quality.

[0042] In one embodiment, such as Figure 2 or Figure 4 As shown, the electroplating equipment also includes a removal device 6 connected to the control device 3; when the workpiece resistance does not meet the electroplating conditions, the control device 3 controls the removal device 6 to move the hanger 2 out of the first track 1.

[0043] The removal device 6 is a device that can remove the hanger. For example, the removal device can be a transplanting platform or a device carrying a robotic arm.

[0044] Specifically, if the resistance value of the workpiece to be electroplated does not meet the electroplating conditions, it is considered that the resistance value of the workpiece does not meet the requirements for electroplating. Therefore, even if electroplating is performed on the workpiece, the quality of the finished product will not meet the requirements. Thus, if the control device 3 determines that the workpiece resistance value does not meet the electroplating conditions, it needs to control the removal device 6 to move the fixture 2 out of the first track 1. In one specific embodiment, the removal device 6 is a transfer platform. When the control device 3 determines that the workpiece resistance value does not meet the electroplating conditions, it will give an NG (Not Good) signal to the transfer platform, and the transfer platform will quickly move to the receiving position of the first track to remove the fixture 2. In another specific embodiment, the removal device 6 is a device carrying a robotic arm. When the control device 3 determines that the workpiece resistance value does not meet the electroplating conditions, it will control the robotic arm of the removal device 6 to remove the fixture from the first track.

[0045] In this embodiment, by setting the removal device 6, the workpiece to be electroplated that does not meet the electroplating conditions can be removed, thus ensuring the electroplating quality.

[0046] In one embodiment, such as Figure 2 or Figure 4 As shown, the electroplating equipment also includes a second track 7, and a pre-immersion tank 8 and an air-cutting groove 9 arranged sequentially on the second track 7; the control device 3 controls the hanger 2 to slide from the second track 7 into the first track 1.

[0047] The second track 7 is also a transport tool for moving the hanger 2, but its purpose differs from that of the first track 1. The second track 7 is used to clean and dry the workpiece to be electroplated in the hanger 2 during transport, while the first track 1 is used to perform resistance testing on the workpiece until electroplating is performed. The pre-immersion tank 9 contains a weak acid solution, which removes residual copper ions and other residues from the grid lines of the workpiece by cleaning it with the weak acid. The air-cutting tank 9 is equipped with a blowing device to remove residual liquid from the cleaned workpiece.

[0048] Specifically, there may be residual copper ions and residues in the workpiece to be electroplated. If these are not cleaned, the quality of the finished electroplated workpiece will be affected. Therefore, in order to improve the electroplating quality of the electroplating equipment, a pre-immersion tank 8 and an air-cutting tank 9 can be set sequentially on the second track 7. The pre-immersion tank 9 performs weak acid cleaning on the workpiece to be electroplated to remove residual copper ions and residues on the grid lines of the workpiece. Then, the air-cutting tank 9 blows air to remove the residual liquid on the cleaned workpiece, so that a workpiece to be electroplated without residues can be obtained.

[0049] In this embodiment, by setting a second track 7 and a pre-immersion tank 8 and an air-cutting groove 9 arranged sequentially on the second track 7, the residues on the workpiece to be electroplated can be cleaned and the residual liquid on the cleaned workpiece to be electroplated can be removed, thereby improving the electroplating quality.

[0050] In one embodiment, the moving speed of the first track 1 is greater than the moving speed of the second track 7.

[0051] The moving speed refers to the running speed of the track. In this embodiment, the running speed of the track can represent the moving speed of the hanger.

[0052] Specifically, it can be understood that the faster the track moves, the faster the rack 2 carrying the workpiece to be electroplated runs. Since the rack spacing needs to be uniform and within the process range, the moving speed of the first track 1 can be set to be greater than that of the second track 7. Increasing the moving speed in the first track 1 can increase the speed at which the workpiece to be electroplated is processed in the first track 1, and can avoid the presence of more than one rack on the first track 1 at the same time, which could lead to electroplating errors. In a specific embodiment,

[0053] The first track 1 is accelerated to transport the hanger 2 at 1.5 times the speed of the second track 7. The 1.5 times speed setting is to prevent the next hanger from arriving at the first track 1 before the first hanger has been inspected, which would cause unstable interference to the workpiece resistance data.

[0054] In this embodiment, setting the moving speed of the first track 1 to be greater than the moving speed of the second track 7 can prevent the workpiece resistance data of the current workpiece to be electroplated from being interfered with.

[0055] In one embodiment, such as Figure 2 As shown, a track gap 10 is provided between the first track 1 and the second track 7; the track gap 10 is less than the contact length between the hanger 2 and the second track 7.

[0056] Here, track gap 10 refers to the absence of a connection between the first track 1 and the second track 7, with a certain distance between them. Contact length refers to the length of the contact surface of the hanger 2 placed on the second track 7 along the second track 7.

[0057] Specifically, since the first track 1 and the second track 7 have different transport functions and different setting parameters, but the hanger 2 needs to run from the second track 7 to the first track 1, a track gap 10 smaller than the contact length between the hanger 2 and the second track 7 is set between the first track 1 and the second track 7 to ensure that the hanger 2 can run from the second track 7 to the first track 1, thereby ensuring the normal operation of the electroplating process.

[0058] In one embodiment, such as Figure 2 or Figure 4 As shown, the electroplating equipment also includes a detection sensor 11 disposed on the first track 1; the detection sensor 11 and the conductivity detection device 4 are arranged sequentially along the movement direction of the first track 1.

[0059] The detection sensor 11 is a device used to detect the workpiece to be electroplated. The detection sensor 11 can be, for example, an infrared detector. In an infrared detector, a thermoelectric element detects the presence or movement of the workpiece and converts the output signal of the thermoelectric element into a voltage signal. Then, waveform analysis is performed on the voltage signal. Therefore, a detection signal is output only when a waveform generated by the workpiece is detected through waveform analysis. For example, the voltage signal can be amplified in two different frequency ranges, and the amplified signal can be used to identify the signal caused by the workpiece.

[0060] This infrared detector includes an infrared transmitter, a receiver, and a signal processor. The signal output of the signal processor is connected to the infrared transmitter via an infrared transmitting circuit; the signal input is connected to the infrared receiver via an infrared receiving circuit; and its feedback signal output is connected to a peripheral control circuit. This technology uses a microcontroller as the signal processor to generate coded signals, driving the infrared transmitter to emit infrared signals containing coded signals. It also detects the reflected signals after amplification in real time. The coded signals ensure that multiple sensors of the same model can operate simultaneously in the same location without interference. Furthermore, it features consistent operating frequency, high reliability, and low power consumption.

[0061] Specifically, to save costs, the conductivity detection device 4 can be activated only when the workpiece to be electroplated is about to be transported to it. Therefore, the detection sensor 11 and the conductivity detection device 4 need to be sequentially arranged along the movement direction of the first track. The detection sensor 11 detects the presence of the workpiece to be electroplated. Furthermore, the detection sensor 11 can be connected to the control device 3 or the first rectifier 12. When the detection sensor 11 is connected to the control device 3, it detects the presence of the workpiece and sends a signal to the control device 3, which then controls the conductivity detection device 4 to activate. When the detection sensor 11 is connected to the first rectifier 12, it detects the presence of the workpiece and sends a signal to the first rectifier 12, which then supplies current to the conductivity detection device 4, activating it.

[0062] In this embodiment, a detection sensor 11 and a conductivity detection device 4 are sequentially arranged along the movement direction of the first track. The conductivity detection device 4 can be activated only when the workpiece to be electroplated is detected to be about to be transported to the conductivity detection device 4, thereby saving costs.

[0063] In one embodiment, such as Figure 2or Figure 4 As shown, the electroplating equipment also includes a first rectifier 12; the first rectifier 12 is connected to the detection sensor 11 and the conductivity detection device 4; the first rectifier 12 supplies power to the conductivity detection device 4 when the detection sensor 11 detects the hanger 2.

[0064] The first rectifier 12 is used to provide current to the conductivity detection device 4 and to perform current matching.

[0065] Specifically, a first rectifier 12 can be set up to connect the detection sensor 11 and the conductivity detection device 4. When the detection sensor 11 detects the hanger 2, the detection sensor 11 sends a signal to the first rectifier 12. After receiving the signal, the first rectifier 12 supplies power to the conductivity detection device 4, thereby ensuring the normal operation of the electroplating equipment.

[0066] In one embodiment, such as Figure 2 As shown, the electroplating equipment also includes a position adjustment device 13; the position adjustment device 13 is correspondingly arranged with the conductivity detection device 4; the position adjustment device 13 adjusts the position of the probe of the conductivity detection device 4 so that the probe of the conductivity detection device 4 contacts the workpiece to be electroplated.

[0067] Among them, the position adjustment device 13 refers to a device that can adjust the position of the probe of the conductivity detection device 4.

[0068] Specifically, the hanger 2 is equipped with a conductive block. If the probe of the conductive detection device 4 is not in complete contact with the conductive block, the workpiece resistance may be inaccurately determined. Therefore, a position adjustment device 13 is provided corresponding to the conductive detection device 4. The position adjustment device 13 adjusts the position of the probe of the conductive detection device 4 so that the probe of the conductive detection device 4 contacts the workpiece to be electroplated, thereby improving the accuracy of the workpiece resistance determination.

[0069] In one embodiment, such as Figure 3 As shown, the position adjustment device 13 includes a gravity sensor 131 and a position adjuster 132.

[0070] Among them, gravity sensor 131 is a device that can sense the gravity of the conductivity detection device 4. Position adjuster 132 is a device that can adjust the position of the probe of conductivity detection device 4.

[0071] Specifically, a gravity sensor 131 can be set to sense the gravity of the conductivity detection device 4. If the gravity of the conductivity detection device 4 does not match the weight of the workpiece to be electroplated, it is considered that the probe of the conductivity detection device 4 is not in full contact with the workpiece. Therefore, the position of the probe of the conductivity detection device 4 can be adjusted by the position adjuster 132 until the gravity of the conductivity detection device 4 matches the weight of the workpiece to be electroplated, and the probe of the conductivity detection device 4 is in full contact with the workpiece, thereby improving the accuracy of workpiece resistance determination.

[0072] In one embodiment, such as Figure 2 As shown, the electroplating equipment also includes a second rectifier 14; the second rectifier 14 is connected to the control device 3 and the electroplating tank 5.

[0073] The second rectifier 14 is used for current matching of the electroplating tank 5.

[0074] Specifically, since the electroplating conditions for the workpiece resistance value to be electroplated are still within a resistance range, the workpiece resistance value may be too large or too small. Therefore, a second rectifier 14 can be set to perform current matching and current compensation for the electroplating tank 5, thereby ensuring the accuracy of the electroplating process.

[0075] In a specific embodiment, the electroplating equipment's workflow is as follows: After the electroplating equipment is powered on, the process parameters are set, the equipment starts operating, the rack 2 reaches the waiting position, and the automated robotic arm places the solar cells into the rack 2 frame. After placement, the rack 2 is conveyed along the second track 7 to the pre-immersion tank 8 for weak acid cleaning to remove residual copper ions and residues from the grid lines on the solar cells. After cleaning, the rack 2 reaches the air-cutting trough 9 to blow away the water, which can make the detection resistance more stable. At the first track 1, when the detection sensor 11 senses the rack 2, the first rectifier 12 starts to output current to the conductivity detection device 4. Because the rack spacing needs to be uniform and within the process range, the first track 1 transmission speed is increased to 1.5 times the speed of the second track 7 to bring the rack 2 into contact with the conductivity detection device 4 (the set 1.5 times speed avoids the next...). When the fixture reaches the first track 1 (the first fixture is not fully inspected, causing unstable interference with the resulting workpiece resistance data), when the fixture 2 passes the conductive detection device 4, the gravity sensor 132 installed below the conductive detection device 4 automatically adjusts the height of the conductive detection device 4 according to the weight value set by the process, so that the conductive detection device 4 and the fixture 2 are kept at the same weight and in full contact for resistance detection, which can make the detected resistance value more stable. The control device 3 analyzes the workpiece resistance value according to the process electroplating standard gradient. If the resistance value is uniform in the first gradient, it directly enters the main machine and enters the electroplating tank 5 for electroplating grid lines, and sends the workpiece resistance value to the second rectifier 14 for current matching. If the resistance value does not reach the first gradient or is greater than the first gradient resistance value, the control device 3 will give an NG signal to the removal device 6, and the removal device 6 will quickly run to the receiving position to remove the fixture 2.

[0076] The aforementioned electroplating equipment automatically feeds back the workpiece resistance value to the second rectifier 14 for current compensation based on the resistance value detection and analysis according to different process standards. When the workpiece resistance value exceeds the first gradient resistance value, the equipment automatically analyzes and quickly moves to the receiving position via the removal device 6 to remove the hanger 2, thus avoiding large deviations in the workpiece resistance value that could affect electroplating. The automatic resistance testing device is installed after the pre-immersion tank 8 and the air-cutting tank 9, and before the electroplating tank 5. This avoids the influence of residual copper ions and other foreign matter on the grid lines of the wafer, which could affect the stability of the detected resistance. Installing it before the electroplating tank 5 also allows the hanger 2 to quickly enter the electroplating tank 5 for electroplating, reducing the travel distance and making the line resistance value fed back to the rectifier smaller, resulting in more accurate data. A gravity sensor 131 is installed under the conductivity detection device 4. Based on the weight value set by the process, the position of the conductivity detection device 4 is automatically adjusted so that the conductivity detection device 4 and the hanger 2 maintain the same weight and are in full contact for resistance detection, making the detected workpiece resistance value more stable.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An electroplating device, characterized in that, include: First track; The hanger is installed on the first track; The hanger is used to fix the workpiece to be electroplated; A control device for controlling the hanging device to follow the movement of the first track; A conductivity detection device for detecting the resistance of a workpiece to be electroplated. An electroplating tank for electroplating the workpiece to be electroplated; When the workpiece resistance meets the electroplating conditions, the control device controls the first track to move the workpiece to be electroplated to the electroplating tank.

2. The electroplating equipment according to claim 1, characterized in that, The electroplating equipment also includes a removal device connected to the control device; When the workpiece resistance does not meet the electroplating conditions, the control device controls the removal device to move the hanger out of the first track.

3. The electroplating equipment according to claim 1, characterized in that, The electroplating equipment further includes a second track, and a pre-immersion tank and an air-cutting groove arranged sequentially on the second track; the control device controls the hanger to slide from the second track into the first track.

4. The electroplating equipment according to claim 3, characterized in that, The first track moves at a faster speed than the second track.

5. The electroplating equipment according to claim 4, characterized in that, A track gap is provided between the first track and the second track; the track gap is less than the contact length between the hanger and the second track.

6. The electroplating equipment according to claim 1, characterized in that, The electroplating equipment also includes a detection sensor disposed on the first track; the detection sensor and the conductive detection device are arranged sequentially along the movement direction of the first track.

7. The electroplating equipment according to claim 6, characterized in that, The electroplating equipment further includes a first rectifier; the first rectifier is connected to the detection sensor and the conductivity detection device; the first rectifier supplies power to the conductivity detection device when the detection sensor detects the hanger.

8. The electroplating equipment according to claim 1, characterized in that, The electroplating equipment also includes a position adjustment device; the position adjustment device is configured correspondingly to the conductivity detection device; the position adjustment device adjusts the position of the probe of the conductivity detection device so that the probe of the conductivity detection device contacts the workpiece to be electroplated.

9. The electroplating equipment according to claim 8, characterized in that, The position adjustment device includes a gravity sensor and a position adjuster.

10. The electroplating equipment according to any one of claims 1 to 9, characterized in that, The electroplating equipment also includes a second rectifier; the second rectifier is connected to the control device and the electroplating tank.

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