A thin film microelectrode based on printed circuit board manufacturing process
Patent Information
- Application Number
- CN202522158864.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-13
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-10-13
AI Technical Summary
[0003]传统电镀槽通常为单一的大型空间结构,其设计容量往往是按照最大生产批次的需求来确定的,然而,在实际生产过程中,由于订单需求的多样性和波动性,生产批次的规模差异较大,经常会出现小批次生产的情况,当进行小批次生产时,传统大型电镀槽的大部分空间处于闲置状态,但为了保证电镀工艺的正常进行,仍需对整个电镀槽内的镀液进行加热、搅拌以及循环处理,这就导致了大量的能源浪费,增加了生产的能耗成本,因此,我们提出一种基于印制线路板制程工艺的薄膜化微电极
本实用新型通过多个隔板分割为多个独立空间,能高效适配不同批次规模的生产需求,面对订单需求的多样性和波动性,无需更换电镀槽设备,只需通过增减隔板数量调整使用空间大小,改进后的电镀槽能有效减少资源浪费,降低综合成本,降低无效能耗,实现节能增效。
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Figure CN224754565U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of printed circuit board manufacturing technology, specifically a thin-film microelectrode based on printed circuit board manufacturing process. Background Technology
[0002] With the increasing demand for high-performance, miniaturized sensors in fields such as biomedical detection, environmental monitoring, and safety monitoring, thin-film microelectrodes based on printed circuit board manufacturing processes have become an important direction for sensor miniaturization due to their advantages of high precision and mass production capability. In the fabrication process of these microelectrodes, the electroplating process is the key step that determines their performance, and the design rationality of the electroplating tank, as the core equipment of the electroplating process, directly affects the production quality, efficiency, and energy consumption of the microelectrodes.
[0003] Traditional electroplating tanks are typically large, single-space structures, with their design capacity determined by the needs of the largest production batch. However, in actual production, due to the diversity and volatility of order demands, the scale of production batches varies greatly, often resulting in small-batch production. When small-batch production is carried out, most of the space in a traditional large electroplating tank is idle. However, in order to ensure the normal operation of the electroplating process, the plating solution in the entire electroplating tank still needs to be heated, stirred, and circulated. This leads to a large amount of energy waste and increases the energy consumption cost of production. Therefore, we propose a thin-film microelectrode based on printed circuit board manufacturing process. Utility Model Content
[0004] This utility model provides the following technical solution: a thin-film microelectrode based on printed circuit board manufacturing process, including an electroplating tank, the electroplating tank having multiple sets of snap-fit grooves inside, each snap-fit groove having a partition plate slidably connected inside, the partition plate having a sealing structure on both sides, the electroplating tank being connected to a fume hood via a lifting structure, the fume hood having multiple mounting plates fixedly installed on its inner sidewall, and each mounting plate having multiple clamping structures on its side.
[0005] Preferably, the sealing structure includes multiple sealing plates, which are fixedly installed on the side of the partition plate. A sealing airbag is provided in the middle of the multiple sealing plates. The sealing airbag is fixedly installed on the side of the partition plate. An air inlet pipe is fixedly installed on the side of the sealing airbag. A sealing plug is provided at one end of the air inlet pipe. A sealing gasket is fixedly installed at the bottom of the partition plate.
[0006] Preferably, both the sealing airbag and the sealing gasket are made of chemically resistant fluororubber, the inner layer of the sealing airbag is provided with a tear-resistant reinforcing layer, and the outer surface of the sealing airbag is smoothed.
[0007] Preferably, the lifting structure includes two lifting cylinders, which are located at the side ends of the electroplating tank. Fixing plates are fixedly installed at both ends of the two lifting cylinders, and the two fixing plates are fixedly installed on the outer walls of the electroplating tank and the fume hood.
[0008] Preferably, each of the clamping structures includes a clamping plate one, which is fixedly installed on the side end of the mounting plate. A clamping plate two is provided on one side of the clamping plate one. Two T-shaped rods are slidably connected to the side end of the clamping plate two. The two T-shaped rods pass through the side wall of the clamping plate two and are fixedly installed on the side end of the mounting plate. A compression spring is sleeved on the outer surface of the T-shaped rod. The two ends of the compression spring are respectively fixedly installed on the opposite side ends of the T-shaped rod and the clamping plate two.
[0009] Preferably, a handle is fixedly installed on the side end of the second clamping plate, the handle is located in the middle of the two T-shaped rods, and the handle is cylindrical.
[0010] Preferably, the side end of the fume hood is provided with a plurality of through slots, and the longitudinal section of the plurality of through slots is U-shaped.
[0011] Preferably, an exhaust pipe is fixedly installed at the upper end of the flue hood, and one end of the exhaust pipe is connected to the spray tower.
[0012] Compared with the prior art, the beneficial effects of this utility model are: This utility model divides the electroplating tank into multiple independent spaces by multiple partitions, which can efficiently adapt to the production needs of different batch sizes. Faced with the diversity and fluctuation of order demand, there is no need to replace the electroplating tank equipment. The size of the usable space can be adjusted by simply increasing or decreasing the number of partitions. The improved electroplating tank can effectively reduce resource waste, reduce overall costs, reduce ineffective energy consumption, and achieve energy saving and efficiency improvement. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the electroplating tank structure of this utility model; Figure 3 This is a schematic diagram of the sealing structure of this utility model; Figure 4 This is a schematic diagram of the structure of the smoke hood of this utility model; Figure 5 For the present utility model Figure 4 Enlarged view of point A in the middle.
[0014] In the diagram: 1. Electroplating tank; 2. Fume hood; 3. Clip groove; 4. Divider plate; 5. Sealing plate; 6. Sealing airbag; 7. Air inlet pipe; 8. Sealing gasket; 9. Mounting plate; 10. Through groove; 11. Clamping plate one; 12. Clamping plate two; 13. T-shaped rod; 14. Compression spring; 15. Handle rod; 16. Fixing plate; 17. Lifting cylinder; 18. Exhaust pipe.
[0015] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0017] like Figures 1-5 As shown, this utility model provides a technical solution: a thin-film microelectrode based on printed circuit board manufacturing process, including an electroplating tank 1, with multiple sets of snap-fit grooves 3 inside the electroplating tank 1, and a partition plate 4 slidably connected inside each snap-fit groove 3. Both sides of the partition plate 4 are provided with sealing structures. The electroplating tank 1 is connected to a fume hood 2 through a lifting structure. Multiple mounting plates 9 are fixedly installed on the inner side wall of the fume hood 2, and multiple clamping structures are provided on the side of each mounting plate 9.
[0018] In an optional embodiment: the sealing structure includes a plurality of sealing plates 5, which are fixedly installed on the side of the partition plate 4. A sealing airbag 6 is provided in the middle of the plurality of sealing plates 5. The sealing airbag 6 is fixedly installed on the side of the partition plate 4. An air inlet pipe 7 is fixedly installed on the side of the sealing airbag 6. A sealing plug is provided at one end of the air inlet pipe 7. A sealing gasket 8 is fixedly installed at the bottom of the partition plate 4.
[0019] It should be noted that the sealing plate 5 can provide the first layer of sealing. When the sealing airbag 6 inflates, it contacts the inner wall of the snap-fit groove 3 and fills the uneven areas inside the snap-fit groove 3 with the flexibility of the sealing airbag 6, thus achieving the effect of a second layer of sealing.
[0020] In an optional embodiment: both the sealing airbag 6 and the sealing gasket 8 are made of chemically resistant fluororubber, the inner layer of the sealing airbag 6 is provided with a tear-resistant reinforcing layer, and the outer surface of the sealing airbag 6 is smoothed.
[0021] It should be noted that, especially in strong acid and high temperature environments, fluororubber can withstand most chemical media. The reinforcing layer, such as polytetrafluoroethylene fiber, improves tear resistance, and the surface is smoothed to reduce electroplating solution residue and crystal adhesion.
[0022] In an optional embodiment: the lifting structure includes two lifting cylinders 17, which are located at the side ends of the electroplating tank 1 respectively. Fixing plates 16 are fixedly installed at both ends of the two lifting cylinders 17 respectively, and the two fixing plates 16 are fixedly installed on the outer side walls of the electroplating tank 1 and the fume hood 2 respectively.
[0023] It should be noted that by activating the lifting cylinder 17, the telescopic end of the lifting cylinder 17 moves up or down, which can move the fume hood 2 up and down, thereby moving the clamped circuit board up or down, and thus completing the electroplating of the circuit board.
[0024] In an optional embodiment: each clamping structure includes a clamping plate 11, which is fixedly installed on the side of the mounting plate 9. A clamping plate 2 12 is provided on one side of the clamping plate 11. Two T-shaped rods 13 are slidably connected to the side of the clamping plate 2 12. The two T-shaped rods 13 pass through the side wall of the clamping plate 2 12 and are fixedly installed on the side of the mounting plate 9. A compression spring 14 is sleeved on the outer surface of the T-shaped rod 13. The two ends of the compression spring 14 are respectively fixedly installed on the opposite side of the T-shaped rod 13 and the clamping plate 2 12.
[0025] It should be noted that after the clamping plate 12 is pulled outward, the compression spring 14 is compressed, and a distance will be generated between the clamping plate 11 and the clamping plate 12. The printed circuit board is placed between the two, and then the clamping plate 12 is pressed against the side wall of the circuit board by the elastic action of the compression spring 14, thereby clamping the circuit board.
[0026] In an optional embodiment: a handle 15 is fixedly installed on the side end of the clamping plate 2 12. The handle 15 is located in the middle of the two T-shaped bars 13 and is cylindrical.
[0027] It should be noted that the clamping plate 12 can be pulled outward by the lever 15, so that the distance between the clamping plate 11 and the clamping plate 12 is separated, which makes it easier to place the printed circuit board between the two, thereby completing the clamping.
[0028] In an optional embodiment: the side end of the fume hood 2 is provided with a plurality of through slots 10, and the longitudinal section of the plurality of through slots 10 is U-shaped.
[0029] It should be noted that when the smoke hood 2 is pressed down, it will not compress the air intake pipe 7.
[0030] In an optional embodiment: an exhaust pipe 18 is fixedly installed on the upper end of the flue hood 2, and one end of the exhaust pipe 18 is connected to the spray tower.
[0031] It should be noted that a negative pressure fan is installed at one end of the exhaust pipe 18 or inside the spray tower to draw acid mist and harmful gases generated by electroplating to the spray tower for treatment, ensuring that the exhaust gas meets emission standards.
[0032] In practical use, the working principle of this utility model is as follows: Multiple sets of positive and negative electrode posts are installed in the electroplating tank 1, located between different partition plates 4. Depending on the production needs of different batches, when there is a large demand, all partition plates 4 can be removed. When there is a small demand, the partition plates 4 can be inserted into the snap-fit groove 3 to divide the electroplating tank 1 into multiple independent spaces. Electroplating can be performed in one of these spaces, or electroplating can be performed separately according to different process requirements. When the partition plate 4 is inserted into the snap-fit groove 3, the sealing plate 5 can provide the first layer of sealing. Then, gas is delivered into the sealing airbag 6 through the air inlet pipe 7. When the sealing airbag 6 inflates, it contacts the inner wall of the snap-fit groove 3 and fills the uneven areas inside the snap-fit groove 3 with the flexibility of the sealing airbag 6, achieving a second layer of sealing. During electroplating, the printed circuit board is clamped and fixed by the clamping structure. Then, the fume hood 2 is lowered by the lifting structure to allow the printed circuit board to enter the electroplating tank 1. After electroplating is completed, it is lifted again.
[0033] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.
Claims
1. A thin-film microelectrode based on printed circuit board manufacturing process, comprising an electroplating tank (1), characterized in that: The electroplating tank (1) has multiple sets of snap-fit grooves (3) inside. Each snap-fit groove (3) is slidably connected to a partition plate (4). Both sides of the partition plate (4) are provided with sealing structures. The electroplating tank (1) is connected to a fume hood (2) through a lifting structure. Multiple mounting plates (9) are fixedly installed on the inner side wall of the fume hood (2). The sides of the mounting plates (9) are provided with multiple clamping structures.
2. The thin-film microelectrode based on printed circuit board manufacturing process according to claim 1, characterized in that: The sealing structure includes multiple sealing plates (5), which are fixedly installed on the side of the partition plate (4). A sealing airbag (6) is provided in the middle of the multiple sealing plates (5). The sealing airbag (6) is fixedly installed on the side of the partition plate (4). An air inlet pipe (7) is fixedly installed on the side of the sealing airbag (6). A sealing plug is provided at one end of the air inlet pipe (7). A sealing gasket (8) is fixedly installed at the bottom of the partition plate (4).
3. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 2, characterized in that: Both the sealing airbag (6) and the sealing gasket (8) are made of chemically resistant fluororubber. The inner layer of the sealing airbag (6) is provided with a tear-resistant reinforcing layer, and the outer surface of the sealing airbag (6) is smoothed.
4. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 1, characterized in that: The lifting structure includes two lifting cylinders (17), which are located at the side ends of the electroplating tank (1). Fixing plates (16) are fixedly installed at both ends of the two lifting cylinders (17), and the two fixing plates (16) are fixedly installed on the outer side walls of the electroplating tank (1) and the fume hood (2).
5. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 1, characterized in that: Each of the clamping structures includes a clamping plate one (11), which is fixedly installed on the side end of the mounting plate (9). A clamping plate two (12) is provided on one side of the clamping plate one (11). Two T-shaped rods (13) are slidably connected to the side end of the clamping plate two (12). The two T-shaped rods (13) pass through the side wall of the clamping plate two (12) and are fixedly installed on the side end of the mounting plate (9). A compression spring (14) is sleeved on the outer surface of the T-shaped rod (13). The two ends of the compression spring (14) are respectively fixedly installed on the opposite side ends of the T-shaped rod (13) and the clamping plate two (12).
6. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 5, characterized in that: A handle (15) is fixedly installed on the side end of the clamping plate 2 (12). The handle (15) is located in the middle of the two T-shaped rods (13) and is cylindrical.
7. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 1, characterized in that: The side end of the smoke hood (2) is provided with a plurality of through slots (10) arranged in a through manner, and the longitudinal section of the plurality of through slots (10) is arranged in a U shape.
8. A thin-film microelectrode based on printed circuit board manufacturing process according to claim 1, characterized in that: An exhaust pipe (18) is fixedly installed at the upper end of the flue gas hood (2), and one end of the exhaust pipe (18) is connected to the spray tower.