Damping mechanism and damping platform

Abstract

The application relates to the technical field of damping platforms, in particular to a damping mechanism and a damping platform. The damping mechanism is configured to connect a first mechanism and a second mechanism, and comprises a buffer and a connecting piece. The buffer is arranged to pass through the first mechanism, the two ends of the buffer are arranged to protrude from the two sides of the first mechanism and clamp the first mechanism, the buffer is provided with a first through hole, and the connecting piece is arranged to pass through the first through hole and connect the second mechanism. The damping mechanism uses the buffer to isolate the contact between the connecting piece and the first mechanism, forms multidirectional damping among the first mechanism, the second mechanism and the connecting piece, and is beneficial to isolating the vibration conduction between the first mechanism and the second mechanism. The damping platform comprises the damping mechanism, the first mechanism and the second mechanism, and is beneficial to isolating the vibration conduction between the first mechanism and the second mechanism.

Description

Technical Field

[0001] This application relates to the field of vibration reduction platform technology, and in particular to vibration reduction mechanisms and vibration reduction platforms. Background Technology

[0002] With the continuous development of technology, vibration damping platforms, as an advanced vibration reduction device, are playing an increasingly important role in scientific research and industrial production. Vibration damping platforms are widely used in scientific research and industrial production, such as in scientific laboratories for scanning electron microscopes and atomic force microscopes; in optical systems for precision optical equipment such as laser systems and optical interferometers; in semiconductor manufacturing for lithography machines and electron beam lithography machines; and in medical imaging for MRI instruments and ultrasound imaging equipment. Vibration damping platforms can reduce the impact of external vibrations, such as those from the ground, on equipment, thus ensuring the reliability and accuracy of instruments and equipment.

[0003] In related technologies, vibration damping platforms include vibration damping mechanisms and base plates and platforms connected by the vibration damping mechanisms; however, the vibration damping mechanisms cannot effectively isolate vibrations between the base plates and platforms, resulting in poor stability of the vibration damping platforms. Utility Model Content

[0004] Therefore, it is necessary to provide a vibration damping mechanism and a vibration damping platform to address the problem that the vibration damping mechanism cannot effectively isolate the vibration between the base plate and the platform, resulting in poor stability of the vibration damping platform.

[0005] A vibration damping mechanism is configured to connect a first mechanism and a second mechanism, the vibration damping mechanism comprising:

[0006] A buffer member is provided for passing through the first mechanism; both ends of the buffer member protrude from the sides of the first mechanism and are used to clamp the first mechanism; the buffer member is provided with a first through hole; and

[0007] A connector is provided for passing through the first through hole, and the connector is used to connect the second mechanism.

[0008] The connecting member of the vibration damping mechanism is used to pass through the first through hole of the buffer member. The buffer member isolates the contact between the connecting member and the first mechanism, so that the first mechanism and the connecting member, as well as the first mechanism and the second mechanism, are isolated by the buffer member. There is no hard connection between the connecting member and the first mechanism, or between the first mechanism and the second mechanism. At the same time, multi-directional damping is formed between the first mechanism, the second mechanism and the connecting member, which is beneficial to isolate the vibration transmission between the first mechanism and the second mechanism.

[0009] In one embodiment, the buffer has the following at both ends:

[0010] A first buffer portion, the first buffer portion being used to abut against one side of the first mechanism; and

[0011] The second buffer portion is used to abut against the other side of the first mechanism to clamp the first mechanism;

[0012] The first through hole extends through the first buffer portion and the second buffer portion along the extension direction of the center line of the buffer member.

[0013] The first and second buffer sections facilitate the fixation of the first mechanism. At the same time, the first or second buffer section is located between the first and second mechanisms, which helps to isolate the vibration transmission between the first and second mechanisms.

[0014] In one embodiment, the buffer (100) includes:

[0015] An embedding portion, the embedding portion being used to pass through the first mechanism;

[0016] The first through hole extends through the embedded portion along the extension direction of the center line of the buffer member;

[0017] One end of the embedded part is connected to one of the first buffer part and the second buffer part; the other end of the embedded part abuts or gap fits with the other of the first buffer part and the second buffer part.

[0018] The embedded part is used to isolate the rigid contact between the connector and the first mechanism, thereby reducing the vibration transmission between the first mechanism and the second mechanism through the connector.

[0019] In one embodiment, the other of the first buffer portion and the second buffer portion has a recessed groove on the side facing the embedded portion, the embedded portion protruding from the first mechanism and inserted into the recessed groove.

[0020] The recess can limit the insertion part in the radial direction, thereby improving the assembly efficiency of the buffer.

[0021] In one embodiment, the first buffer portion or the second buffer portion connecting the embedded portion is disposed between the first mechanism and the second mechanism to facilitate assembly and improve assembly efficiency.

[0022] In one embodiment, the buffer material includes a flexible material, thereby meeting the different requirements of the buffer material deformation in different application scenarios and helping to expand the applicability of the buffer mechanism.

[0023] In one embodiment, the vibration damping mechanism further includes:

[0024] A support tube is sleeved on the connector and passes through the first through hole. The two ends of the support tube maintain a preset distance from the two ends of the buffer.

[0025] The support tube can constrain the maximum distance at which the connector is tightened, that is, the connector can constrain the maximum extent to which the buffer is compressed, thereby preventing the buffer from being crushed and improving the stability and safety of the vibration damping mechanism.

[0026] In one embodiment, the vibration damping mechanism further includes:

[0027] A gasket, which is fitted onto the connector and is located between the buffer and the end face of the connector facing the buffer.

[0028] The gasket helps to balance the pressure of the connector pressing the buffer, making the surface of the buffer evenly stressed and avoiding damage to the buffer due to excessive local pressure.

[0029] A vibration damping platform includes, as described above, a vibration damping mechanism, a first mechanism, and a second mechanism.

[0030] The first mechanism and the second mechanism are arranged in parallel and spaced apart.

[0031] The vibration damping mechanism includes a buffer and a connector. The buffer passes through the first mechanism. Both ends of the buffer protrude from the sides of the first mechanism and are used to clamp the first mechanism. The buffer has a first through hole. The connector passes through the first through hole and is connected to the second mechanism.

[0032] This vibration reduction platform helps to isolate vibration transmission between the first and second mechanisms, ensuring the accuracy and stability of the instruments and equipment.

[0033] In one embodiment, the first mechanism is provided with a second through hole for the buffer to pass through;

[0034] The second mechanism is provided with a third through hole that mates with the connector.

[0035] This is to facilitate the connection between the vibration damping mechanism and the first and second mechanisms. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of a vibration reduction platform provided in one embodiment of this application.

[0037] Figure 2 This is a schematic diagram of a vibration damping mechanism provided in one embodiment of this application.

[0038] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1000 - Vibration damping mechanism;

[0041] 100 - Buffer element; 110 - First through hole; 120 - First buffer section; 130 - Second buffer section; 131 - Countersunk groove; 140 - Embedded part;

[0042] 200-Connector;

[0043] 300-Support tube;

[0044] 400-gasket;

[0045] 2000 - First mechanism; 2001 - Second through hole;

[0046] 3000 - Second mechanism; 3001 - Third through hole. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] Figure 1 A schematic diagram of a vibration reduction platform provided in one embodiment of this application is shown; Figure 2 A schematic diagram of a vibration damping mechanism provided in one embodiment of this application is shown. Figure 3 It shows Figure 2 A magnified view of part A of the vibration damping mechanism shown.

[0054] See Figure 1 and Figure 2 This embodiment provides a vibration damping mechanism 1000, which is configured to connect a first mechanism 2000 and a second mechanism 3000. The first mechanism 2000 and the second mechanism 3000 can be plate structures, frame structures or box structures, and this application does not limit them.

[0055] like Figure 2 and Figure 3The vibration damping mechanism 1000 includes a buffer member 100 and a connecting member 200. The buffer member 100 is inserted into the first mechanism 2000, with both ends protruding from the sides of the first mechanism 2000 and used to clamp the first mechanism 2000. The buffer member 100 has a first through hole 110. The connecting member 200 is inserted into the first through hole 110 and is used to connect to the second mechanism 3000.

[0056] The vibration damping mechanism 1000 provided in this application embodiment has a connector 200 that passes through the first through hole 110 of the buffer 100. The buffer 100 isolates the connector 200 from the first mechanism 2000, thus isolating the first mechanism 2000 and the connector 200, as well as the first mechanism 2000 and the second mechanism 3000, through the buffer 100. There is no hard connection between the connector 200 and the first mechanism 2000, or between the first mechanism 2000 and the second mechanism 3000. At the same time, multi-directional damping is formed between the first mechanism 2000, the second mechanism 3000, and the connector 200, which is beneficial for isolating the vibration transmission between the first mechanism 2000 and the second mechanism 3000.

[0057] For example, the connector 200 can be a metal part with a connecting function, such as a screw. In order to prevent the connector 200 from loosening during the use of the vibration damping mechanism 1000, this embodiment can use a screw with a built-in anti-loosening structure.

[0058] This embodiment also provides a vibration damping platform, which includes a vibration damping mechanism 100, a first mechanism 2000, and a second mechanism 3000. The first mechanism 2000 and the second mechanism 3000 are arranged in parallel and spaced apart. The vibration damping mechanism 1000 is used to connect the first mechanism 2000 to the second mechanism 3000 for fixing the first mechanism 2000, thereby achieving the installation and fixation of the first mechanism 2000. This vibration damping platform helps to isolate vibration transmission between the first mechanism 2000 and the second mechanism 3000, so as to ensure the accuracy and stability of the operation of instruments and equipment.

[0059] Specifically, the buffer member 100 is used to pass through the first mechanism 2000, and both ends of the buffer member 100 are used to protrude from both sides of the first mechanism 2000 and to clamp the first mechanism 2000. The buffer member 100 is provided with a first through hole 110. The connector 200 is used to pass through the first through hole 110 and the connector 100 is used to connect to the second mechanism 3000.

[0060] Specifically, the first mechanism 2000 has a second through hole 2001, and the second mechanism 3000 has a third through hole 3001 that mates with the connector 200. In use, the buffer 100 is inserted into the second through hole 2001, and then the connector 200 passes through the first through hole 110 of the buffer 100 and is locked into the third through hole 3001, connecting the buffer 100 and the second mechanism 3000 to achieve the connection between the first mechanism 2000 and the second mechanism 3000. The third through hole 3001 can be a threaded hole.

[0061] Furthermore, both the first mechanism 2000 and the second mechanism 3000 are plate-like structures. Here, the first mechanism 2000 can be a platform, and the second mechanism 3000 can be a base plate or mounting surface, etc. This vibration damping platform is a planar design, requiring no complex structure, and can be widely used in fields requiring vibration damping, such as optical equipment.

[0062] For example, the base plate and platform are made of aluminum alloy to ensure the structural stability of the vibration damping platform.

[0063] There are typically multiple vibration damping mechanisms 1000, such as four, six, or more. The number of vibration damping mechanisms 1000 can be determined based on the dimensions of the base plate and platform. When there are four vibration damping mechanisms 1000, the base plate and platform are square, and the vibration damping mechanisms 1000 are respectively placed at the four corners of the platform. When there are six vibration damping mechanisms 1000, three can be placed on the longer side of the platform to improve connection stability.

[0064] For example, four M4 threaded fixing holes are provided on the base plate. The second through hole 2001 on the first mechanism 2000 has a diameter of 8mm. The vibration damping component passes through the second through hole 2001. Then, the connector 200 passes through the first through hole 110 of the vibration damping component and connects with the M4 threaded fixing holes on the base plate. Of course, the diameters of the threaded fixing holes and the second through hole 2001 on the base plate can be adjusted according to the size and weight of the base plate and platform. This embodiment does not limit this.

[0065] In one embodiment, a clearance groove 2002 may be provided on the first mechanism 2000, and a second through hole 2001 is provided in the clearance groove 2002. The clearance groove 2002 can reduce the thickness of the first mechanism 2000 at the location where the vibration damping mechanism 1000 is set, which is convenient for assembling the vibration damping mechanism 1000. At the same time, a connector 200 with a shorter length can be used to achieve the connection, which is convenient for user operation and helps to ensure the locking force of the connector 200.

[0066] Optionally, after the clearance groove 2002 is provided on the first mechanism 2000, its thickness is retained to be 1.5mm, so as to set the vibration damping mechanism 1000.

[0067] Now combined with the appendix Figure 2 and Figure 3 Details of buffer 100 are explained.

[0068] like Figure 2 and Figure 3 As shown, in one embodiment, the buffer 100 is made of a flexible material. For example, the flexible material can be rubber. In use, the user can select rubber with appropriate parameters according to the load-bearing capacity requirements, thereby meeting the different requirements for the deformation of the buffer material in different application scenarios, which helps to expand the applicability of the buffer mechanism.

[0069] In one embodiment, the buffer member 100 has a first buffer portion 120 and a second buffer portion 130 at its two ends. The first buffer portion 120 abuts against one side of the first mechanism 2000, and the second buffer portion 130 abuts against the other side of the first mechanism 2000 to clamp the first mechanism 2000. A first through hole 110 extends squarely along the center line of the buffer member 100 through the first buffer portion 120 and the second buffer portion 130. This structure facilitates the fixation of the first mechanism 2000, while the location of the first buffer portion 120 or the second buffer portion 130 between the first mechanism 2000 and the second mechanism 3000 helps to isolate vibration transmission between the first mechanism 2000 and the second mechanism 3000.

[0070] Furthermore, the buffer 100 includes an insert 140. The insert 140 is for passing through the first mechanism 2000, and the first through hole 110 extends squarely along the center line of the buffer 100 through the first buffer portion 120 and the second buffer portion 130. One end of the insert 140 is connected to one of the first buffer portion 120 and the second buffer portion 130. The other end of the insert 140 is in abutting or clearance fit with the other of the first buffer portion 120 and the second buffer portion 130. The insert 140 is used to isolate the rigid contact between the connector 200 and the first mechanism 2000 and the second mechanism 3000, thereby reducing vibration transmission between the first mechanism 2000 and the second mechanism 3000 through the connector 200.

[0071] During assembly, firstly, a first buffer portion 120 or a second buffer portion 130 is provided on the side of the first mechanism 2000 facing the second mechanism 3000, and the position of the first buffer portion 120 or the second buffer portion 130 corresponds to the second through hole 2001. Then, another of the first buffer portion 120 and the second buffer portion 130 is provided on the other side of the first mechanism 2000, and the insert portion 140 passes through the second through hole 2001. Finally, the connector 200 is connected to the second mechanism 3000 through the first through hole 110, thereby connecting the first mechanism 2000 and the second mechanism 3000. This buffer component 100 has a simple structure and is easy to assemble and disassemble.

[0072] Optionally, the other of the first buffer portion 120 or the second buffer portion 130 has a recess 131 on the side facing the insert portion 140, the insert portion 140 protruding from the first mechanism 2000 and inserted into the recess 131. The recess 131 can limit the insert portion 140 in the radial direction, thereby improving the assembly efficiency of the buffer member 100.

[0073] Specifically, when the user assembles the buffer 100, the embedded part 140 can be inserted into the recess 131. At this time, the first through hole 110 passes through the first buffer part 120, the buffer 100 and the second buffer part 130. The user can directly insert the connector 200 without moving the first buffer part 120 or the second buffer part 130 to align it, which helps to improve assembly efficiency.

[0074] The first buffer portion 120 or the second buffer portion 130 connecting the embedded portion 140 is disposed between the first mechanism 2000 and the second mechanism 3000 to facilitate assembly and improve assembly efficiency. For example, during assembly, the user first sets up the first buffer portion 120 or the second buffer portion 130 connected to the embedded portion 140 and inserts the embedded portion 140 into the second through hole 2001. At this time, the embedded portion 140 protrudes from the first mechanism 2000. When the user assembles the other of the first buffer portion 120 and the second buffer portion 130 on the other side of the first mechanism 2000, the protruding embedded portion 140 can be directly inserted into the recess 131. This simple and quick operation improves the user's assembly efficiency.

[0075] For example, in this embodiment, the first buffer portion 120 is connected to the embedded portion 140, and the two are an integral structure. The second buffer portion 130 is provided with a recess 131.

[0076] In one embodiment, the vibration damping mechanism 1000 further includes a support tube 300, which is sleeved on the connector 200 and passes through the first through hole 110. The two ends of the support tube 300 maintain a preset distance from the two ends of the buffer member 100. Since the buffer member 100 is made of flexible material, during the tightening process of the connector 200 and the second mechanism 3000, the connector 200 can continuously compress the buffer member 100. If the connector 200 is over-tightened, it may damage the buffer member 100. When the support tube 300 passes through the buffer member 100, the support tube 300 can constrain the maximum tightening distance of the connector 200, that is, the connector 200 can constrain the maximum compression limit of the buffer member 100, thereby preventing the buffer member 100 from being damaged and improving the stability and safety of the vibration damping mechanism 1000.

[0077] It is understood that the two ends of the buffer 100 refer to the end of the first buffer 120 away from the second buffer 130 and the end of the second buffer 130 away from the first buffer 120, respectively.

[0078] Furthermore, the two ends of the support tube 300 and the two ends of the buffer 100 are kept at a preset distance of 0.3mm-0.8mm to ensure that the buffer 100 is compressed to a certain extent, so as to protect the buffer 100 from the first mechanism 2000 with a moderate clamping force, while avoiding the buffer 100 being over-compressed. This is conducive to ensuring that the buffer 100 has appropriate elasticity to buffer the vibration force between the first mechanism 2000 and the second mechanism 3000.

[0079] Preferably, the two ends of the support tube 300 and the two ends of the buffer 100 are kept at a preset distance of 0.5mm, so that the buffer 100 achieves a better compression amount.

[0080] In one embodiment, the vibration damping mechanism 1000 further includes a shim 400, which is sleeved on the connector 200 and located between the buffer member 100 and the end face of the connector 200 facing the buffer member 100. The shim 400 helps to balance the pressure of the connector 200 pressing against the buffer member 100, making the surface of the buffer member 100 uniformly stressed and avoiding damage to the buffer member 100 caused by excessive local pressure.

[0081] Optionally, since the surface area of ​​the buffer 100 increases after being compressed and deformed, the size of the pad 400 is larger than the diameter of the buffer 100, and the diameter of the pad 400 is 1.2 to 2 times the diameter of the buffer 100. This ensures that even after the area of ​​the buffer 100 is compressed and increased, the surface area of ​​the pad 400 is still larger than the diameter of the buffer 100, thus ensuring the uniformity of the force on the surface of the buffer 100.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A damping mechanism characterized by, The vibration damping mechanism is configured to connect a first mechanism (2000) and a second mechanism (3000), and the vibration damping mechanism includes: A buffer member (100) is used to pass through the first mechanism (2000); the two ends of the buffer member (100) are used to protrude from both sides of the first mechanism (2000) and to clamp the first mechanism (2000); the buffer member (100) is provided with a first through hole (110); A connector (200) is provided through the first through hole (110) and is used to connect the second mechanism (3000).

2. The damping mechanism of claim 1, wherein The buffer (100) is provided with the following at both ends: A first buffer section (120) is provided for abutting against one side of the first mechanism (2000); and The second buffer (130) is used to abut against the other side of the first mechanism (2000) to clamp the first mechanism (2000); The first through hole (110) extends through the first buffer portion (120) and the second buffer portion (130) along the extension direction of the center line of the buffer member (100).

3. The damping mechanism of claim 2, wherein The buffer (100) includes: An embedding part (140) is used to pass through the first mechanism (2000); The first through hole (110) extends through the embedded part (140) along the extension direction of the center line of the buffer (100); One end of the embedded part (140) is connected to one of the first buffer part (120) and the second buffer part (130); the other end of the embedded part (140) abuts or gap fits with the other of the first buffer part (120) and the second buffer part (130).

4. The damping mechanism of claim 3, wherein The other of the first buffer part (120) and the second buffer part (130) has a recess (131) on the side facing the embedded part (140), the embedded part (140) protrudes from the first mechanism (2000) and is inserted into the recess (131).

5. The damping mechanism of claim 3, wherein The first buffer portion (120) or the second buffer portion (130) connecting the embedded portion (140) is disposed between the first mechanism (2000) and the second mechanism (3000).

6. The damping mechanism according to any one of claims 1 to 5, characterized in that The buffer (100) is made of flexible material.

7. The damping mechanism according to any one of claims 1 to 5, wherein The vibration damping mechanism also includes: A support tube (300) is sleeved on the connector (200) and passes through the first through hole (110). The two ends of the support tube (300) and the two ends of the buffer (100) are kept at a preset distance.

8. The damping mechanism according to any one of claims 1 to 5, wherein The vibration damping mechanism also includes: A gasket (400) is fitted onto the connector (200) and is located between the buffer (100) and the end face of the connector (200) facing the buffer (100).

9. A vibration reduction platform characterized by, Includes the vibration damping mechanism, the first mechanism (2000), and the second mechanism (3000) as described in any one of claims 1-8. The first mechanism (2000) and the second mechanism (3000) are arranged in parallel at intervals; The vibration damping mechanism includes a buffer (100) and a connector (200). The buffer (100) passes through the first mechanism (2000). Both ends of the buffer (100) protrude from both sides of the first mechanism (2000) and are used to clamp the first mechanism (2000). The buffer (100) is provided with a first through hole (110). The connector (200) passes through the first through hole (110) and is connected to the second mechanism (3000).

10. The vibration isolation platform of claim 9, wherein, The first mechanism (2000) is provided with a second through hole (2001) for the buffer (100) to pass through; The second mechanism (3000) is provided with a third through hole (3001) that mates with the connector (200).

Images