Heat dissipating light emitting diode module

Abstract

This utility model relates to the field of LED technology, and in particular to a heat-dissipating light-emitting diode module, including a heat-dissipating base plate with multiple sets of mounting slots spaced apart. LED light-emitting modules are installed in the mounting slots, and thermally conductive adhesive is applied between the LED light-emitting modules and the mounting slots. A heat-dissipating outer plate is attached to the lower surface of the heat-dissipating base plate and arranged along the length of the heat-dissipating base plate. A heat-dissipating frame plate is attached to the upper surface of the heat-dissipating base plate and arranged along the length of the heat-dissipating base plate. Multiple sets of openings are spaced apart on the heat-dissipating frame plate, and the LED light-emitting modules are located within these openings. This structure allows heat conducted by the heat-dissipating base plate to pass through its lower surface. Simultaneously, the contact area between the heat-dissipating frame plate and the air is increased compared to traditional modules. Combined with the air convection effect, this accelerates the dissipation of heat to the external environment, effectively solving the problem of excessively high temperatures in hot spots in existing modules and ensuring that the junction temperature of the LED chip is stably controlled within a safe threshold.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diode module technology, and in particular to a heat-dissipating light-emitting diode module. Background Technology

[0002] Light-emitting diodes (LEDs) have been widely used in many fields such as general lighting, displays, automotive lighting, and backlighting due to their advantages such as low energy consumption, long lifespan, fast response speed, and mercury-free environmental friendliness. With the continuous expansion of LED application scenarios, the market is placing higher demands on the power density, brightness output, and long-term stability of LED light-emitting modules.

[0003] The core flaw in existing LED light-emitting modules lies in the inadequate design of the heat dissipation system. LEDs exhibit significant electro-optical conversion losses during operation; approximately 70%-80% of the input electrical energy is converted into heat rather than light. If this heat cannot be dissipated in time, the junction temperature of the LED chip will rise sharply. Excessive junction temperature directly triggers a series of performance problems: First, accelerated light decay. According to LED characteristics, for every 10°C increase in junction temperature, the luminous flux decay rate increases by approximately 50%. A module originally rated for 50,000 hours may have its actual lifespan shortened to 10,000-20,000 hours under high-temperature conditions, significantly increasing replacement costs. Second, color temperature drift. High temperatures reduce the excitation efficiency of LED phosphors, causing the color temperature of the module's output light to shift towards a cooler or warmer direction, severely affecting the color consistency of lighting or displays. For example, in display applications, localized color differences may appear. Third, decreased current stability. High temperatures alter the electrical characteristics of the LED chip, leading to fluctuations in the forward voltage drop. If the drive circuit lacks precise temperature control compensation, current overshoot is likely to occur, further increasing the risk of chip damage. Utility Model Content

[0004] The purpose of this invention is to provide a heat-dissipating LED module, which aims to solve the problem of insufficient heat dissipation in the above-mentioned LED light-emitting modules, so as to improve the service life and luminous stability of the LED light-emitting modules.

[0005] The technical solution adopted in this utility model is as follows: A heat-dissipating light-emitting diode module, comprising: The heat dissipation base plate has multiple sets of mounting slots spaced apart. An LED light-emitting module is installed in the mounting slot, and thermally conductive adhesive is applied between the LED light-emitting module and the mounting slot. The heat dissipation outer plate is combined with the lower surface of the heat dissipation base plate and is arranged along the length of the heat dissipation base plate; A heat dissipation frame plate is attached to the upper part of the heat dissipation base plate and arranged along the length of the heat dissipation base plate. The heat dissipation frame plate is provided with multiple sets of openings at intervals, and the LED light-emitting module is located in the opening.

[0006] This utility model also has the following technical features: In one embodiment of the present invention, a light reflection groove is provided on the outer side of the heat dissipation frame plate, the opening is located at the bottom of the light reflection groove, and the LED light-emitting module protrudes from the opening of the light reflection groove.

[0007] In one embodiment of the present invention, the cross-section of the light reflecting groove is an inverted trapezoidal structure with a large opening and a small bottom, and diffuse reflection protrusions are provided on both sides of the groove wall.

[0008] In one embodiment of the present invention, a first heat dissipation fin is provided on one side of the heat dissipation base plate. The first heat dissipation fin is arranged along the length direction of the heat dissipation base plate. Multiple sets of the first heat dissipation fin are arranged at intervals along the width direction of the heat dissipation base plate. The first heat dissipation fin is located on both sides of the joint surface between the heat dissipation base plate and the heat dissipation frame plate. The multiple sets of first heat dissipation fins and the heat dissipation frame plate form a heat dissipation channel.

[0009] In one embodiment of this utility model, a mating groove is provided on the mating surface of the heat dissipation base plate and the heat dissipation outer plate. Two sets of mating grooves are provided at intervals along the length direction of the heat dissipation base plate. A mating protrusion is provided on the mating surface of the heat dissipation outer plate and the heat dissipation base plate. Two sets of mating protrusions are arranged at intervals along the length direction of the heat dissipation outer plate and are mated with the mating groove.

[0010] In one embodiment of the present invention, a second heat dissipation fin is provided on the outer side of the heat dissipation outer plate. The second heat dissipation fin is arranged along the length direction of the heat dissipation outer plate, and multiple sets of the second heat dissipation fin are arranged at intervals along the width direction of the heat dissipation outer plate.

[0011] In one embodiment of this utility model, the bottom of the mounting groove is provided with pin through holes, and two sets of through slots are opened on the back of the heat dissipation base plate. The through slots are arranged through the length of the heat dissipation base plate, and an electrode is provided in the through slot. The wiring pins of the LED light-emitting module pass through the pin through holes and contact the electrode.

[0012] In one embodiment of this utility model, the two ends of the electrode extending out of the heat dissipation base plate are respectively provided with a plug and a plug spring, and the ends of adjacent heat dissipation type light-emitting diode modules form a plug-in fit, and the plug and the plug spring are combined.

[0013] In one embodiment of this utility model, an upper retaining plate is provided at one end of the heat dissipation frame plate, a lower retaining plate is provided at one end of the heat dissipation outer plate, and the insert spring is disposed between the upper retaining plate and the lower retaining plate.

[0014] In one embodiment of this utility model, a first plug-in heat dissipation fin is provided at the other end of the heat dissipation base plate, and a second plug-in heat dissipation fin is provided at the other end of the heat dissipation outer plate. The first plug-in heat dissipation fin extends into the space between the first heat dissipation fins, and the second plug-in heat dissipation fin extends into the space between the second heat dissipation fins.

[0015] Compared with existing technologies, the beneficial effects of this utility model are as follows: The LED light-emitting module is installed in the mounting groove of the heat dissipation base plate, and the gap between the two is coated with thermally conductive adhesive. The structural design of the mounting groove allows for three-sided wrapping contact between the groove wall and the thermally conductive adhesive, increasing the thermally conductive contact area between the LED light-emitting module and the heat dissipation base plate. Simultaneously, the thermally conductive adhesive fills the tiny gap between the mounting groove and the LED light-emitting module, eliminating air thermal resistance. This allows the heat generated by the LED chip during operation to be quickly conducted through the chip, the LED light-emitting module housing, the thermally conductive adhesive, and the heat dissipation base plate, preventing heat accumulation around the chip and subsequent junction temperature rise. The heat dissipation outer plate is bonded to the lower surface of the heat dissipation base plate, and the heat dissipation frame plate is bonded to the upper edge of the heat dissipation base plate. Both are arranged along the length of the base, forming a bidirectional heat dissipation structure with a heat dissipation outer plate at the bottom and a heat dissipation frame plate at the top. Compared to existing modules that rely on a single heat sink, this structure can transfer heat from the heat sink base plate to the lower surface. At the same time, the contact area between the heat sink frame plate and the air can be increased compared to traditional modules. Combined with the air convection effect, it accelerates the dissipation of heat to the external environment, effectively solving the problem of excessively high temperature in the hot spot area of ​​existing modules, and keeping the junction temperature of the LED chip stably controlled within a safe threshold. Attached Figure Description

[0016] Figure 1 and Figure 2 These are schematic diagrams of two different viewpoints of a heat-dissipating LED module in one embodiment of the present invention. Figure 3 This is a front view of a heat-dissipating LED module according to one embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the heat-dissipating light-emitting diode module after the heat dissipation outer plate and heat dissipation frame plate are removed in one embodiment of the present invention; Figure 5 and Figure 6 These are schematic diagrams of the heat dissipation base plate in a heat dissipation type light-emitting diode module according to two different perspectives in one embodiment of this utility model; Figure 7 This is a schematic diagram of the heat dissipation frame plate in a heat dissipation type light-emitting diode module according to one embodiment of the present invention; Figure 8 This is a schematic diagram of the heat dissipation outer plate in a heat dissipation type light-emitting diode module according to one embodiment of the present invention; Explanation of icon numbers: 10. Heat sink base plate; 11. Mounting slot; 12. First heat sink fin; 111. Pin through hole; 112. Through slot; 13. Connecting groove; 14. Electrode; 141. Connector; 142. Connecting spring; 15. First connecting heat sink fin; 20. LED lighting module; 30. Heat dissipation outer plate; 31. Connecting protrusion; 32. Second heat dissipation fin; 33. Lower retaining plate; 34. Second plug-in heat dissipation fin; 40. Heat dissipation frame plate; 41. Opening; 42. Light reflection groove; 421. Diffuse reflection protrusion; 43. Upper plate. Detailed Implementation

[0017] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0018] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0019] It should be noted that the core defect of existing LED light-emitting modules lies in the inadequate design of the heat dissipation system. During operation, LEDs exhibit significant electro-optical conversion losses, with approximately 70%-80% of the input electrical energy being converted into heat energy rather than light energy. If this heat cannot be dissipated in time, the junction temperature of the LED chip will rise sharply. To address this, a heat-dissipating LED module is proposed, comprising: a heat dissipation base plate 10 with multiple sets of mounting slots 11 spaced apart; an LED light-emitting module 20 mounted within the mounting slots 11, with thermally conductive adhesive applied between the LED light-emitting module 20 and the mounting slots 11; a heat dissipation outer plate 30, coupled to the lower surface of the heat dissipation base plate 10 and arranged along the length of the heat dissipation base plate 10; and a heat dissipation frame plate 40, coupled to the upper edge of the heat dissipation base plate 10 and arranged along the length of the heat dissipation base plate 10, with multiple sets of openings 41 spaced apart on the heat dissipation frame plate 40, and the LED light-emitting module 20 located within the openings 41.

[0020] In one embodiment, the heat dissipation base plate 10 can be a magnesium-aluminum alloy, which can effectively enhance heat dissipation efficiency and improve corrosion resistance. Similarly, the heat dissipation frame plate 40 can also be a magnesium-aluminum alloy, with the purpose of enhancing heat dissipation efficiency and improving corrosion resistance.

[0021] In the above embodiments, the mounting groove 11 physically limits the LED light-emitting module 20, preventing displacement of the module during transportation, installation, or in vibrating environments (such as automotive industrial equipment). Simultaneously, the thermally conductive adhesive not only conducts heat but also enhances the adhesion between the LED light-emitting module and the mounting groove through its own adhesiveness. Compared to existing modules that are "fixed solely by screws," this reduces contact loosening caused by vibration (loosening creates new air gaps, leading to a sharp increase in thermal resistance), ensuring the long-term integrity of the heat conduction path. The heat dissipation outer plate 30 and the heat dissipation frame plate 40 are respectively integrated with the heat dissipation base plate 10 from the bottom and top directions, forming a frame-like protective structure surrounding the LED light-emitting module 20. This structure not only prevents external dust and moisture from directly contacting the LED light-emitting module 20 but also buffers external impacts, reducing the risk of damage to the LED light-emitting module 20 due to collisions, making it particularly suitable for complex environments such as outdoor lighting.

[0022] In one embodiment, the outer side of the heat dissipation frame plate 40 is provided with a light reflection groove 42, the opening 41 is opened at the bottom of the light reflection groove 42, and the LED light-emitting module 20 protrudes from the opening of the light reflection groove 42.

[0023] In the above embodiment, the light reflection groove 42 is formed on the outer side of the heat dissipation frame plate 40, while the joint between the heat dissipation frame plate 40 and the heat dissipation base plate 10 and the internal heat conduction path remain unchanged. The heat conducted by the heat dissipation base plate can still be efficiently dissipated through the upper edge of the base, the heat dissipation frame plate 40 and the outside air. The groove wall structure of the light reflection groove 42 increases the contact area between the heat dissipation frame plate 40 and the air, further improving the heat dissipation efficiency and avoiding the problem of optical structure hindering heat dissipation.

[0024] In one embodiment, the cross-section of the light reflecting groove 42 is an inverted trapezoidal structure with a large opening and a small bottom, and diffuse reflection protrusions 421 are provided on both sides of the groove wall of the light reflecting groove 42.

[0025] In the above embodiment, the diffuse reflection protrusions 421 on both sides of the slot wall not only have optical functions, but their concave and convex structure can also increase the surface area of ​​the outer side of the heat dissipation frame plate 40. Compared with the smoother slot wall, the diffuse reflection protrusions 421 can increase the heat dissipation area of ​​the slot wall, further improving the convective heat transfer efficiency between the heat dissipation frame plate 40 and the air. At the same time, the gap between the protrusions can form a micro airflow channel, which accelerates the flow of air on the surface of the slot wall, helps to remove more heat, further delays light decay and extends the module life.

[0026] In one embodiment, a first heat dissipation fin 12 is provided on one side of the heat dissipation base plate 10. The first heat dissipation fin 12 is arranged along the length direction of the heat dissipation base plate 10. Multiple sets of the first heat dissipation fin 12 are arranged at intervals along the width direction of the heat dissipation base plate 10. The first heat dissipation fin 12 is located on both sides of the joint surface between the heat dissipation base plate 10 and the heat dissipation frame plate 40. The multiple sets of first heat dissipation fins 12 and the heat dissipation frame plate 40 form a heat dissipation channel.

[0027] In the above embodiments, the heat dissipation channel formed by the first heat dissipation fins 12 and the heat dissipation frame plate 40 enables them to work together to dissipate heat. The heat from the heat dissipation base plate 10 is transferred to the air in the heat dissipation channel through the fins. When the air flows, it transfers the heat to the heat dissipation frame plate 40, and the frame plate further diffuses the heat to the external environment, forming a three-dimensional heat dissipation network of base, fins, air, frame plate, and the outside world. Compared with the original unidirectional heat dissipation path, this three-dimensional network makes the heat transfer path richer and improves the heat dissipation efficiency compared with the original structure.

[0028] In one embodiment, to further increase the contact area between the heat dissipation base plate 10 and the heat dissipation outer plate 30, thereby increasing the heat dissipation of the heat dissipation base plate 10, a contact groove 13 is provided on the contact surface between the heat dissipation base plate 10 and the heat dissipation outer plate 30. Two sets of contact grooves 13 are arranged at intervals along the length direction of the heat dissipation base plate 10. Two sets of contact protrusions 31 are arranged at intervals along the length direction of the heat dissipation outer plate 30 and are connected with the contact grooves 13.

[0029] In one embodiment, to further enhance the heat dissipation performance of the heat dissipation outer plate 30, a second heat dissipation fin 32 is provided on the outer side of the heat dissipation outer plate 30. The second heat dissipation fin 32 is arranged along the length direction of the heat dissipation outer plate 30, and multiple sets of the second heat dissipation fin 32 are arranged at intervals along the width direction of the heat dissipation outer plate 30.

[0030] In one embodiment, to implement the electrical connection to the LED light-emitting module 20, the bottom of the mounting groove 11 is provided with a pin through hole 111, and the back of the heat dissipation base plate 10 is provided with two sets of through grooves 112. The through grooves 112 are arranged through the length of the heat dissipation base plate 10, and an electrode 14 is provided in the through groove 112. The wiring pins of the LED light-emitting module 20 pass through the pin through hole 111 and contact the electrode 14.

[0031] In one embodiment, the two ends of the electrode 14 extending out of the heat dissipation base plate 10 are respectively provided with a connector 141 and a spring 142, and the ends of adjacent heat dissipation type light-emitting diode modules form a plug-in fit, wherein the connector 141 and the spring 142 are combined.

[0032] In one embodiment, to enable the insertion between adjacent heat-dissipating LED modules, an upper retaining plate 43 is provided at one end of the heat dissipation frame plate 40, a lower retaining plate 33 is provided at one end of the heat dissipation outer plate 30, and the insertion spring 142 is disposed between the upper retaining plate 43 and the lower retaining plate 33.

[0033] When the above-mentioned heat-dissipating LED module is plugged in, the plug 141 is engaged with the plug spring 142, and the plug 141 is located between the upper plate 43 and the lower plate 33 to implement the plugging of the two sets of heat-dissipating LED modules.

[0034] In one embodiment, the other end of the heat dissipation base plate 10 is provided with a first plug-in heat dissipation fin 15, and the other end of the heat dissipation outer plate 30 is provided with a second plug-in heat dissipation fin 34. The first plug-in heat dissipation fin 15 extends between the first heat dissipation fins 12, and the second plug-in heat dissipation fin 34 extends between the second heat dissipation fins 32.

[0035] The first plug-in heat dissipation fin 15 extends between the first heat dissipation fins 12, and the second plug-in heat dissipation fin 34 extends between the second heat dissipation fins 32, which can realize heat conduction between the two sets of heat dissipation type light-emitting diode modules and ensure the reliability of the connection between the two sets of modules.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat-dissipating light-emitting diode module, characterized in that, include: The heat dissipation base plate (10) is provided with multiple sets of mounting slots (11) at intervals. An LED light-emitting module (20) is installed in the mounting groove (11), and thermally conductive adhesive is applied between the LED light-emitting module (20) and the mounting groove (11); The heat dissipation outer plate (30) is combined with the lower surface of the heat dissipation base plate (10) and arranged along the length direction of the heat dissipation base plate (10); A heat dissipation frame plate (40) is attached to the upper side of the heat dissipation base plate (10) and arranged along the length direction of the heat dissipation base plate (10). The heat dissipation frame plate (40) is provided with multiple sets of openings (41) at intervals, and the LED light-emitting module (20) is located in the opening (41).

2. The heat-dissipating LED module according to claim 1, characterized in that: The outer side of the heat dissipation frame plate (40) is provided with a light reflection groove (42), the opening (41) is located at the bottom of the light reflection groove (42), and the LED light-emitting module (20) protrudes from the opening of the light reflection groove (42).

3. The heat-dissipating LED module according to claim 2, characterized in that: The cross-section of the light reflection groove (42) is an inverted trapezoidal structure with a large opening and a small bottom. Diffuse reflection protrusions (421) are provided on both sides of the groove wall of the light reflection groove (42).

4. The heat-dissipating LED module according to claim 1, characterized in that: The heat dissipation base plate (10) has a first heat dissipation fin (12) on one side. The first heat dissipation fin (12) is arranged along the length direction of the heat dissipation base plate (10). Multiple sets of the first heat dissipation fin (12) are arranged at intervals along the width direction of the heat dissipation base plate (10). The first heat dissipation fin (12) is arranged on both sides of the joint surface between the heat dissipation base plate (10) and the heat dissipation frame plate (40). Multiple sets of first heat dissipation fins (12) and the heat dissipation frame plate (40) form a heat dissipation channel.

5. The heat-dissipating LED module according to claim 4, characterized in that: A connecting groove (13) is provided on the mating surface of the heat dissipation base plate (10) and the heat dissipation outer plate (30). Two sets of the connecting groove (13) are provided at intervals along the length direction of the heat dissipation base plate (10). A connecting protrusion (31) is provided on the mating surface of the heat dissipation outer plate (30) and the heat dissipation base plate (10). Two sets of the connecting protrusion (31) are arranged at intervals along the length direction of the heat dissipation outer plate (30) and are connected with the connecting groove (13).

6. The heat-dissipating light-emitting diode module according to claim 5, characterized in that: The outer side of the heat dissipation outer plate (30) is provided with a second heat dissipation fin (32). The second heat dissipation fin (32) is arranged along the length direction of the heat dissipation outer plate (30), and multiple sets of the second heat dissipation fin (32) are arranged at intervals along the width direction of the heat dissipation outer plate (30).

7. The heat-dissipating light-emitting diode module according to claim 6, characterized in that: The mounting groove (11) has a pin through hole (111) at the bottom. The heat dissipation base plate (10) has two sets of through grooves (112) on the back. The through grooves (112) are arranged along the length of the heat dissipation base plate (10). An electrode plate (14) is provided in the through groove (112). The wiring pins of the LED light-emitting module (20) pass through the pin through hole (111) and contact the electrode plate (14).

8. The heat-dissipating light-emitting diode module according to claim 7, characterized in that: The electrode (14) extends out of the heat dissipation base plate (10) and is provided with a connector (141) and a spring plate (142) at both ends respectively. The ends of adjacent heat dissipation type light-emitting diode modules are connected by a connector, and the connector (141) is combined with the spring plate (142).

9. The heat-dissipating light-emitting diode module according to claim 8, characterized in that: One end of the heat dissipation frame plate (40) is provided with an upper plate (43), and one end of the heat dissipation outer plate (30) is provided with a lower plate (33). The plug-in spring (142) is disposed between the upper plate (43) and the lower plate (33).

10. The heat-dissipating light-emitting diode module according to claim 6, characterized in that: The other end of the heat dissipation base plate (10) is provided with a first plug-in heat dissipation fin (15), and the other end of the heat dissipation outer plate (30) is provided with a second plug-in heat dissipation fin (34). The first plug-in heat dissipation fin (15) extends between the first heat dissipation fins (12), and the second plug-in heat dissipation fin (34) extends between the second heat dissipation fins (32).

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