Far infrared superconducting graphene floor heating

Abstract

The utility model relates to the technical field of building heating, specifically a far infrared superconducting graphene floor heating, it includes a plurality of array distribution's floor heating module unit, each floor heating module unit is by the upper heat conduction plate, three solidification formation a hard integral type structure of three dimensional heat dissipation core material and lower insulating base, three dimensional heat dissipation core material is honeycomb three dimensional heat dissipation fin of metal material quality, it has a plurality of vertical extension's heat dissipation fin, the facade of heat dissipation fin is attached with modified graphene superconducting heating coating, the lower insulating base is inlayed with electrode flow bar, its side is equipped with the plug -in electrical interface for electrical connection between modules. The utility model uses, three dimensional heat dissipation fin structure greatly increased the heat dissipation area, and promoted the micro - convection between the fin of air, and the heat exchange efficiency and speed are far higher than the plane membrane type structure.

Description

Technical Field

[0001] This utility model relates to the field of building heating technology, specifically to a far-infrared superconducting graphene floor heating system. Background Technology

[0002] As people's living standards improve, their demands for the comfort of their living environment are also increasing. Underfloor heating systems are widely used in modern buildings due to their advantages such as comfort, energy saving, and space saving. Currently, the mainstream underfloor heating systems on the market mainly include two types: water-based underfloor heating and electric underfloor heating.

[0003] Traditional water-based underfloor heating systems suffer from drawbacks such as complex installation, high thermal inertia, high energy consumption, and troublesome maintenance. Electric underfloor heating systems are further divided into resistance wire, carbon fiber, and graphene types. Resistance wire underfloor heating systems suffer from problems such as high electromagnetic radiation, uneven heating, localized overheating, and short lifespan; while carbon fiber underfloor heating systems have shown some improvement, they still have issues such as power attenuation and easy oxidation of joints.

[0004] In recent years, graphene underfloor heating has attracted widespread attention due to its excellent thermal conductivity and electrothermal conversion efficiency. Existing graphene underfloor heating systems mostly employ a two-dimensional planar film structure, where graphene conductive ink is printed onto a PET or PI film, and then a protective layer is applied. This structure has the following inherent drawbacks: First, planar membrane structures primarily rely on surface heat radiation for heat dissipation, resulting in poor heat convection and a slow heating rate, typically requiring 1-2 hours to reach the set temperature, leading to a poor user experience. Second, to maintain flexibility, the material's mechanical strength is insufficient, exhibiting poor impact and compressive strength, necessitating an additional 3-5 cm concrete protective layer. This not only increases costs but also significantly increases the floor load, limiting its application in certain situations. Third, the cavity between the heating element and the floor covering material creates thermal resistance, affecting heat conduction efficiency and resulting in energy waste. Utility Model Content

[0005] The purpose of this invention is to provide a far-infrared superconducting graphene floor heating system, which at least solves the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A far-infrared superconducting graphene floor heating system includes a heating element and an electrical connection system. It comprises several floor heating module units arranged in an array. Each floor heating module unit consists of an upper heat-conducting plate, a three-dimensional heat dissipation core material, and a lower insulating base, which are fixed together to form a rigid integral structure. The three-dimensional heat dissipation core material is a honeycomb-shaped three-dimensional heat dissipation fin made of metal, which has multiple vertically extending heat dissipation fins. A modified graphene superconducting heating coating is attached to the vertical surface of the heat dissipation fins. The lower insulating base has an embedded electrode guide strip and a plug-in electrical interface for electrical connection between modules on its side.

[0007] As a further embodiment of this utility model, the three-dimensional heat dissipation core material is a honeycomb-shaped three-dimensional heat dissipation fin made of high-strength aluminum alloy through precision die casting. The fin has multiple vertically upward-extending heat dissipation fins with a height of 8-15mm and a fin spacing of 5-8mm, thereby increasing its contact area with the upper heat conduction plate by 3-5 times.

[0008] As a further embodiment of this utility model, on multiple vertical surfaces of the heat dissipation fins of the three-dimensional heat dissipation core material, a dense alumina insulating layer with a thickness of 10-20μm is first generated by a micro-arc oxidation process, and then a modified graphene superconducting heating coating is deposited by a high-temperature sintering process at a temperature of 650-850℃.

[0009] As a further embodiment of this invention, the modified graphene superconducting heating coating is composed of the following raw materials in weight percentages: 60-80% graphene, 10-20% carbon nanotubes, 5-10% ceramic binder, 3-5% far-infrared radiating material, and 2-5% dispersant; wherein the far-infrared radiating material is one or more of zirconium oxide, tourmaline, or silicon carbide.

[0010] As a further embodiment of this invention, an insulating layer is generated on the surface of the heat dissipation fins through a micro-arc oxidation process, and the modified graphene superconducting heating coating is solidified and attached to the insulating layer through a high-temperature sintering process.

[0011] As a further embodiment of this utility model, the upper heat-conducting plate is a metal heat-conducting plate or a ceramic plate, and its bottom surface is tightly attached to the top of the heat dissipation fins of the three-dimensional heat dissipation core material through thermal grease. Its top surface is used to directly support decorative materials such as flooring or tiles. The upper heat-conducting plate is an anodized aluminum plate or a microcrystalline ceramic plate with a thickness of 2-4mm, and its surface is treated with sandblasting or anodizing to increase the heat radiation efficiency.

[0012] As a further embodiment of this utility model, the lower insulating base is manufactured using high-temperature resistant engineering plastic through injection molding. It has a silver-copper composite electrode guide strip embedded inside, which is electrically connected to the modified graphene superconducting heating coating. The base is designed with a male-female plug-in electrical interface on the side to realize rapid series and parallel connection between module units. The male-female plug-in electrical interface adopts a waterproof and dustproof design, and the protection level reaches the IP67 standard.

[0013] As a further embodiment of this utility model, it also includes a temperature sensor and an intelligent thermostat. The temperature sensor is embedded in each floor heating module unit and is connected to the intelligent thermostat via signal. The intelligent thermostat monitors the working status of each module unit in real time through the temperature sensor, uses a PID algorithm to accurately control the temperature, and has multiple safety protection functions such as over-temperature protection, leakage protection, and dry-burning protection.

[0014] As a further improvement of this utility model, a far-infrared reflective layer is laid on top of all the floor heating module units.

[0015] As a further embodiment of this utility model, the floor heating module units are connected and fixed together by positioning pins and buckle structures. The floor heating module units are plugged into each other through male and female plug-in electrical interfaces on their sides, and are laid flat and fixed to the ground by positioning pins and buckle structures. Finally, a far-infrared reflective layer and floor decoration material are laid on top of all the module units.

[0016] Compared with the prior art, the beneficial effects of this utility model are: 1. When in use, the three-dimensional heat dissipation fin structure of this invention greatly increases the heat dissipation area and promotes micro-convection of air between the fins, resulting in heat exchange efficiency and speed far exceeding those of planar membrane structures. Actual tests show that this invention can raise the floor temperature to the set value within 10-15 minutes, while traditional underfloor heating requires more than 60 minutes, achieving rapid heating, reducing preheating time, and improving the user experience.

[0017] 2. In use, the heating coating is directly located on the heat dissipation fins. Heat is directly conducted through the fins to the upper heat conduction plate, and then directly transferred to the floor material, eliminating the cavity thermal resistance of traditional underfloor heating and minimizing heat loss. Actual measured thermal efficiency reaches over 98%, which is 20-30% higher than traditional underfloor heating.

[0018] 3. This utility model features a modular design, allowing for quick connection via side-mounted plug-in interfaces, eliminating the need for on-site welding or additional wiring. The standard module dimensions facilitate transportation and installation. Damaged individual modules can be directly replaced, resulting in extremely low maintenance costs and avoiding the need for extensive floor repairs required with traditional underfloor heating systems. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a far-infrared superconducting graphene floor heating system. Figure 2 This is a schematic diagram of the structure of a far-infrared superconducting graphene floor heating module unit; Figure 3 A schematic diagram of the structure of a three-dimensional heat dissipation core material for far-infrared superconducting graphene floor heating; Figure 4 This is a schematic diagram of the structure of an insulating base for a far-infrared superconducting graphene floor heating system.

[0020] In the diagram: 1. Upper heat-conducting plate; 2. Three-dimensional heat dissipation core material; 21. Heat dissipation fins; 3. Modified graphene superconducting heating coating; 4. Lower insulating base; 41. Electrode guide strip; 42. Male and female plug-in electrical interface; 5. Far-infrared reflective layer; 6. Temperature sensor; 7. Intelligent temperature controller. Detailed Implementation

[0021] To address the problem of this situation, this utility model provides a far-infrared superconducting graphene floor heating system.

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a far-infrared superconducting graphene floor heating system, including a heating element and an electrical connection system. Its feature is that it includes several floor heating module units distributed in an array. Each floor heating module unit is formed by the upper heat-conducting plate 1, the three-dimensional heat dissipation core material 2 and the lower insulating base 4 consolidating into a rigid integral structure.

[0024] The upper heat-conducting plate 1 is made of 3mm thick aluminum alloy plate, which is anodized to form a black surface to enhance heat radiation efficiency. Its bottom surface is tightly bonded to the top of the heat dissipation fins 21 of the three-dimensional heat dissipation core material 2 through high thermal conductivity thermal grease, forming an efficient heat conduction path. The entire assembly is subjected to 5 tons of pressure in a special fixture and cured at 180°C for 2 hours to ensure tight bonding between the layers.

[0025] The three-dimensional heat dissipation core material 2 is a honeycomb-shaped three-dimensional heat dissipation fin made of metal, which has multiple vertically extending heat dissipation fins 21.

[0026] The core of the modular unit is a three-dimensional heat dissipation core material 2 made of aluminum alloy through precision die casting. Its dimensions are 300mm × 300mm × 20mm (length × width × height). Internally, it features a dense honeycomb-shaped vertical heat dissipation fin structure 21, with a fin height of 12mm, a thickness of 1.5mm, and a fin spacing of 6mm. This design increases the heat dissipation area by 4.2 times compared to a planar structure. The surface of the heat dissipation fins 21 is coated with a modified graphene superconducting heating coating 3; the lower insulating base 4 is embedded with an electrode guide strip 41, and its side is provided with a plug-in electrical interface 42 for electrical connection between modules.

[0027] On the vertical surface of each heat sink fin 21, a dense alumina insulating layer with a thickness of approximately 15 μm is first generated using a micro-arc oxidation process. This insulating layer has a breakdown voltage of over 5 kV, ensuring electrical safety. Subsequently, a modified graphene superconducting heating slurry is uniformly sprayed using an automated spraying device, and then sintered at 780°C in a nitrogen protective atmosphere for 30 minutes to form a modified graphene superconducting heating coating 3 with a thickness of approximately 50 μm.

[0028] The modified graphene superconducting heating paste has the following formulation: 75% graphene, 15% carbon nanotubes, 6% ceramic binder, 3% silicon carbide powder, and 1% dispersant. This optimized formulation ensures both good electrical conductivity and heating performance, and also has a high far-infrared emissivity of over 0.92.

[0029] In some embodiments, an insulating layer is formed on the surface of the heat dissipation fins 21 by a micro-arc oxidation process, and the modified graphene superconducting heating coating 3 is cured and attached to the insulating layer by a high-temperature sintering process.

[0030] In some embodiments, the upper heat-conducting plate 1 is a metal heat-conducting plate or a ceramic plate, and its bottom surface is tightly attached to the top of the heat dissipation fins 21 of the three-dimensional heat dissipation core material 2 through thermally conductive silicone grease.

[0031] In some embodiments, the system further includes a temperature sensor 6 and a smart thermostat 7, wherein the temperature sensor 6 is embedded in each floor heating module unit and is signal-connected to the smart thermostat 7.

[0032] A high-precision digital temperature sensor, such as the DS18B20, is embedded inside the underfloor heating module unit to monitor the module's operating temperature in real time. All modules are connected to the intelligent thermostat via a bus.

[0033] The Smart Thermostat 7 uses a 32-bit ARM processor as its main control chip, features a 4.3-inch touchscreen display, supports Wi-Fi and Bluetooth connectivity, and includes built-in intelligent algorithms: The adaptive PID control algorithm dynamically adjusts the control parameters based on room thermal inertia, outdoor temperature, and user habits. Learn algorithms, record user usage patterns, and automatically preheat in advance; A temperature balancing algorithm ensures that all modules have a consistent temperature, preventing localized overheating. Energy-saving algorithms minimize energy consumption while ensuring comfort.

[0034] In some embodiments, a far-infrared reflective layer 5 is laid entirely above all the underfloor heating module units.

[0035] In some embodiments, the floor heating module units are connected and fixed together by positioning pins and snap-fit ​​structures.

[0036] The insulating base 4 is injection molded from high-temperature resistant PPS engineering plastic. Two 0.3mm thick silver-copper composite electrode guide strips 41 are pre-embedded inside. These electrode guide strips 41 contact a specific area at the bottom of the three-dimensional heat dissipation core material 2 via elastic gold-plated contacts, thereby supplying power to all parallel heating coatings 3. Two adjacent sides of the base 4 are respectively equipped with male and female plug-in electrical interfaces 42. These interfaces feature waterproof sealing rings and anti-misinsertion designs, enabling quick blind-plug connection and circuit continuity between modules. Positioning clips are also provided next to the interfaces to ensure a secure connection.

[0037] The system uses a 24V DC power supply and is equipped with multiple safety protection circuits, including overcurrent protection, overtemperature protection, and leakage protection.

[0038] The power module provides a safe 24V DC power supply and controls the power output through high-frequency PWM. The protection circuit includes multiple safety measures such as overcurrent protection, overtemperature protection, leakage protection, and short circuit protection to ensure safe system operation.

[0039] The system also supports remote control via a mobile app, allowing users to adjust the temperature, set timers, and view energy consumption statistics anytime, anywhere.

[0040] The working principle of this utility model is as follows: During installation, first level and clean the ground, then lay a 2mm thick heat insulation pad (optional). Next, connect the underfloor heating modules to each other using the side-mounted electrical connectors 42 to form the required heating area. Seal the gaps between modules with high-temperature resistant silicone. After installation, lay an aluminum-coated far-infrared reflective layer 5 over all modules, and finally lay the wood flooring or ceramic tiles.

[0041] After the system is powered on, the intelligent thermostat 7 automatically controls the operation according to the set temperature. Heat is generated from the heating coating on the three-dimensional fins and is quickly conducted through the fins to the upper aluminum plate, directly heating the floor decoration layer. The temperature sensor 6 provides real-time temperature data feedback to ensure precise temperature control.

[0042] Actual tests show that this system can raise the floor temperature from 15℃ to 26℃ within 12 minutes after being powered on, while traditional underfloor heating takes 55 minutes. Under the same conditions, this system saves more than 35% more energy than traditional underfloor heating.

[0043] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A far-infrared superconducting graphene floor heating system, characterized in that, Including a heating element and an electrical connection system, characterized in that: it includes several floor heating module units distributed in an array, each of the floor heating module units is formed by the upper heat-conducting plate (1), the three-dimensional heat dissipation core material (2) and the lower insulating base (4) to form a rigid integral structure; The three-dimensional heat dissipation core material (2) is a honeycomb three-dimensional heat dissipation fin made of metal, which has multiple vertically extending heat dissipation fins (21). The heat dissipation fins (21) are coated with a modified graphene superconducting heating coating (3); the lower insulating base (4) is embedded with an electrode guide strip (41), and its side is provided with a plug-in electrical interface (42) for electrical connection between modules.

2. The far-infrared superconducting graphene floor heating system according to claim 1, characterized in that, An insulating layer is formed on the surface of the heat dissipation fins (21) by a micro-arc oxidation process, and the modified graphene superconducting heating coating (3) is solidified and attached to the insulating layer by a high-temperature sintering process.

3. The far-infrared superconducting graphene floor heating system according to claim 1, characterized in that, The upper heat-conducting plate (1) is a metal heat-conducting plate or a ceramic plate, and its bottom surface is tightly attached to the top of the heat dissipation fins (21) of the three-dimensional heat dissipation core material (2) through thermal grease.

4. The far-infrared superconducting graphene floor heating system according to claim 1, characterized in that, It also includes a temperature sensor (6) and a smart thermostat (7), wherein the temperature sensor (6) is embedded in each floor heating module unit and is signal-connected to the smart thermostat (7).

5. The far-infrared superconducting graphene floor heating system according to claim 1, characterized in that, A far-infrared reflective layer is laid on top of all the floor heating module units (5).

6. The far-infrared superconducting graphene floor heating system according to claim 1, characterized in that, The floor heating module units are connected and fixed together by positioning pins and snap-fit ​​structures.

Images