A heat dissipation system and an air conditioning system

Abstract

The utility model discloses a heat dissipation system and air conditioning system, the heat dissipation system includes the heat dissipation assembly for the heat dissipation device carries out heat dissipation, still includes vapor liquid separator and with heat dissipation assembly constitutes the microchannel assembly of circulating flow path in vapor liquid separator periphery, be equipped with the heat exchange medium that can with vapor liquid separator carries out heat exchange in microchannel assembly. Compared with prior art, the utility model discloses a microchannel assembly is set up on the outer surface of vapor liquid separator, converts the cold energy of vapor liquid separator into the cold energy that can be transported, realizes the efficient recovery and reuse of cold energy.

Description

Technical Field

[0001] This utility model relates to the field of air conditioning, and in particular to a heat dissipation system and an air conditioning system. Background Technology

[0002] In air conditioning systems, the vapor-liquid separator is a crucial component for separating the gas and liquid components of the refrigerant. During operation, it generates a significant amount of low-temperature cooling energy due to heat exchange. However, in current technologies, this cooling energy is often not effectively utilized, frequently being directly discharged or dissipated through natural heat dissipation, resulting in energy waste.

[0003] Meanwhile, the electrical box inside the air conditioning system often contains power components (such as IGBT modules, capacitors, relays, etc.). These power components generate a lot of heat during operation. If they cannot be dissipated in time, it will lead to a decrease in the performance of the air conditioning system or even damage.

[0004] Common heat dissipation methods include natural convection, air cooling, or water cooling, but these methods suffer from high energy consumption and low heat dissipation efficiency. If the low-temperature cooling energy generated by the vapor-liquid separator during operation can be utilized to dissipate heat from power components, heat dissipation efficiency can be well guaranteed while avoiding energy waste.

[0005] Therefore, how to design a heat dissipation system and air conditioning system that can utilize the cooling capacity generated during the operation of the vapor-liquid separator for heat dissipation is a technical problem that the industry urgently needs to solve. Utility Model Content

[0006] In view of the problem that the cooling capacity generated by the vapor-liquid separator is not effectively utilized in the prior art, this utility model proposes a heat dissipation system and an air conditioning system.

[0007] The technical solution of this utility model is to propose a heat dissipation system, including a heat dissipation component for dissipating heat for the device to be cooled, a vapor-liquid separator 3, and a microchannel component 4 disposed around the vapor-liquid separator 3 and forming a circulation path with the heat dissipation component. The microchannel component 4 is provided with a heat exchange medium that can exchange heat with the vapor-liquid separator 3.

[0008] Furthermore, the microchannel assembly 4 includes at least an inlet pipe 41 connected to the pump body 7 and an outlet pipe 44 connected to the electronic expansion valve 12. The pump body 7 is used to pump the heat exchange medium into the microchannel assembly 4, and the electronic expansion valve 12 is used to regulate the flow rate of the heat exchange medium flowing into the heat dissipation assembly.

[0009] Furthermore, the microchannel assembly 4 also includes a first liquid collection tube 42, a second liquid collection tube 45, and a plurality of branch tubes connected between the first liquid collection tube 42 and the second liquid collection tube 45, through which the heat exchange medium can flow between the first liquid collection tube 42 and the second liquid collection tube 45.

[0010] The branch pipe is arranged around the shell of the vapor-liquid separator 3, and the first liquid collecting pipe 42 is connected to the liquid inlet pipe 41 and the liquid outlet pipe 44 respectively.

[0011] Furthermore, the heat dissipation system includes at least a first connecting pipe 8 connecting the heat dissipation component to the pump body 7, a second connecting pipe 11 connecting the heat dissipation component to the electronic expansion valve 12, a third connecting pipe 14 connecting the liquid outlet pipe 44 to the electronic expansion valve 12, and a fourth connecting pipe 15 connecting the liquid inlet pipe 41 to the pump body 7.

[0012] The microchannel component 4 and the heat dissipation component form a circulation path through the first connecting pipe 8, the second connecting pipe 11, the third connecting pipe 14, and the fourth connecting pipe 15.

[0013] Furthermore, the heat dissipation system also includes a pressure sensor disposed on the microchannel component 4 and a temperature sensor disposed at the heat dissipation device. The opening degree of the electronic expansion valve 12 and the working state of the pump body 7 are set according to the detection results of the pressure sensor and the temperature sensor.

[0014] Furthermore, when the surface temperature of the heat dissipation device detected by the temperature sensor is within the first temperature range, the pump body 7 operates normally, and the opening of the electronic expansion valve 12 increases as the surface temperature of the heat dissipation device increases.

[0015] When the surface temperature of the heat dissipation device is in the second temperature range, the pump body 7 stops working;

[0016] When the surface temperature of the heat dissipation device is in the third temperature range, the pump body 7 operates normally and the opening of the electronic expansion valve 12 is adjusted to the maximum opening.

[0017] The temperature in the second temperature range is lower than the temperature in the first temperature range, and the temperature in the first temperature range is lower than the temperature in the third temperature range.

[0018] Furthermore, when the pipeline pressure detected by the pressure sensor is within the first pressure range, the pump body 7 operates normally;

[0019] When the pipeline pressure detected by the pressure sensor is in the second pressure range, the pump body 7 stops working;

[0020] When the pipeline pressure detected by the pressure sensor is in the third pressure range, the pump body 7 stops working and issues an alarm signal;

[0021] The pressure in the third pressure range is less than the pressure in the first pressure range, and the pressure in the second pressure range is greater than the pressure in the first pressure range.

[0022] Furthermore, the heat dissipation system also includes at least one heat insulation cotton covering the outside of the housing of the vapor-liquid separator 3, and the branch pipe is disposed between the heat insulation cotton and the housing of the vapor-liquid separator 3.

[0023] Furthermore, the heat exchange medium is a cryogenic liquid.

[0024] This utility model also proposes an air conditioning system, which has an electrical box and is equipped with the above-mentioned heat dissipation system.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects:

[0026] 1. This utility model has a microchannel component on the outer surface of the gas-liquid separator, which converts the cold energy generated by the gas-liquid separator into transportable cold energy, realizing the efficient recovery and reuse of cold energy;

[0027] 2. This utility model uses a low-temperature resistant liquid as the heat exchange medium and forms a closed circulation path through a pump body, which can ensure the safe operation of the heat dissipation system and eliminate the risk of leakage.

[0028] 3. This utility model connects the microchannel component to the heat sink of the electrical box in the air conditioning system, and sets an electronic expansion valve in the circulation path to regulate the flow rate of the heat sink entering the electrical box. This can make reasonable use of the cooling capacity for cooling the power components in the electrical box, avoiding the problem of excessive cooling causing the power components to be too cold, below the dew point temperature, resulting in condensation and damage to the air conditioning system. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the heat dissipation system in this utility model;

[0031] Figure 2 This is a schematic diagram showing the arrangement of the insulation cotton in the heat dissipation system of this utility model.

[0032] Figure 3 This is a schematic diagram of the microchannel component of the heat dissipation system in this utility model;

[0033] Figure 4 This is a flowchart illustrating the adjustment of the pump body and electronic expansion valve according to the surface temperature of the device to be cooled in this utility model.

[0034] Figure 5 This is a flowchart illustrating the process of adjusting the pump body according to pipeline pressure in this utility model.

[0035] Among them, 1 is the base, 2 is the electrical box, 3 is the vapor-liquid separator, 4 is the microchannel assembly, 5 is the heat exchanger fixing plate, 6 is the pump body fixing base, 7 is the pump body, 8 is the first connecting pipe, 9 is the radiator, 10 is the liquid injection nozzle, 11 is the second connecting pipe, 12 is the electronic expansion valve, 13 is the electronic expansion valve coil, 14 is the third connecting pipe, 15 is the fourth connecting pipe, 16 is the pressure sensor, 17 is the first insulation cotton, and 18 is the second insulation cotton.

[0036] 41 is the inlet pipe, 42 is the first collection pipe, 43 is the fixed plate assembly, 44 is the outlet pipe, 45 is the second collection pipe, and 46 is the partition plate. Detailed Implementation

[0037] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0038] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0039] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0040] During operation, vapor-liquid separators generate a significant amount of low-temperature cooling energy due to heat exchange. However, in existing technologies, this cooling energy is typically not effectively utilized, resulting in energy waste. The design concept of this invention is to incorporate a microchannel assembly on the outer surface of the vapor-liquid separator. This microchannel assembly contains a heat exchange medium that exchanges heat with the vapor-liquid separator, thereby converting the cooling energy generated by the separator into transportable cooling energy, achieving efficient recovery and reuse of this cooling energy.

[0041] Based on the above design concept, the present invention proposes a heat dissipation system, including a heat dissipation component for dissipating heat for the device to be cooled.

[0042] It also includes a vapor-liquid separator 3 and a microchannel assembly 4 disposed around the vapor-liquid separator 3 and forming a circulation path with the heat dissipation components. The microchannel assembly 4 contains a heat exchange medium that can exchange heat with the vapor-liquid separator 3.

[0043] As can be seen from the above settings, in this utility model, the microchannel component 4 is set on the periphery of the vapor-liquid separator 3, and a heat exchange medium is set inside the microchannel component 4. Under this setting, the heat exchange medium can exchange heat with the vapor-liquid separator 3. The vapor-liquid separator 3 will generate a large amount of low-temperature cold energy during operation. When the heat exchange medium exchanges heat with the vapor-liquid separator 3, this part of the low-temperature cold energy can be obtained.

[0044] Meanwhile, since the microchannel component 4 and the heat dissipation component form a circulation path, and the heat exchange medium can flow in the microchannel component 4, after the heat exchange medium obtains the low-temperature cooling energy generated by the vapor-liquid separator 3, it can flow from the microchannel component 4 to the heat dissipation component, and then use the low-temperature cooling energy to dissipate heat for the device to be cooled.

[0045] Here, the aforementioned heat dissipation device can be the electrical box of the air conditioning system, which contains power components that generate a lot of heat during operation. The heat dissipation component can be a radiator configured for the electrical box. By delivering a heat exchange medium with low-temperature cooling capacity to the radiator, the heat exchange medium, due to its low temperature, will exchange heat with the power components inside the electrical box, thereby absorbing heat and achieving the effect of heat dissipation and cooling.

[0046] In other words, based on the above settings, this utility model can convert the low-temperature cold energy generated by the gas-liquid separator 3 into transportable cold energy through the heat exchange medium, and use it to dissipate heat for the power components in the electrical box, thus realizing the efficient recovery and reuse of cold energy.

[0047] Please see Figure 1 and Figure 3 To achieve the above-mentioned circulation path configuration, the microchannel component 4 proposed in this utility model needs to include at least an inlet pipe 41 connected to the pump body 7 and an outlet pipe 44 connected to the electronic expansion valve 12. The pump body 7 is used to pump the heat exchange medium into the microchannel component 4, and the electronic expansion valve 12 is used to regulate the flow rate of the heat exchange medium flowing into the heat dissipation component.

[0048] Here, the pump body 7 serves as a driving device, mainly used to pump the heat exchange medium into the microchannel component 4 and provide power so that the heat exchange medium can flow in the circulation path formed by the microchannel component 4 and the heat dissipation component. The closed circulation path formed by the pump body 7 can ensure the safe operation of the heat dissipation system without leakage risk.

[0049] The purpose of setting the above-mentioned electronic expansion valve 12 is to regulate the flow rate of the heat exchange medium entering the heat dissipation component. In practical applications, although the heat exchange medium can dissipate heat from the heat dissipation device, for some heat exchange mediums with excessively low temperatures or heat exchange mediums with sufficient cooling capacity, after achieving the heat dissipation effect of the heat dissipation device, they will still exchange heat with the heat dissipation device and provide cooling capacity. When the temperature of the heat dissipation device gradually decreases to below the dew point temperature, condensation will occur, which will damage the entire system.

[0050] Therefore, when cooling and dissipating heat through a heat exchange medium, it is also necessary to control the flow rate of the heat exchange medium to avoid problems caused by excessive cooling of the heat exchange medium. With the electronic expansion valve 12 described above, the flow rate of the heat exchange medium flowing from the microchannel component 4 into the heat dissipation component can be adjusted by regulating the opening of the electronic expansion valve 12, thereby preventing excessive cooling of the heat exchange medium.

[0051] In summary, this utility model, through the arrangement of the inlet pipe 41, outlet pipe 44, pump body 7, and electronic expansion valve 12, can form a circulating flow path for the heat exchange medium to transfer the cooling energy generated by the vapor-liquid separator 3 to the heat dissipation component. It can also provide power for the circulating flow of the heat exchange medium through the pump body 7, ensuring the safe operation of the heat dissipation system. At the same time, the opening degree of the electronic expansion valve 12 can be adjusted to avoid excessive cooling.

[0052] Please see Figure 1 and Figure 3 The microchannel assembly 4 proposed in this utility model also includes a first liquid collecting pipe 42, a second liquid collecting pipe 45, and a plurality of branch pipes connected between the first liquid collecting pipe 42 and the second liquid collecting pipe 45. The heat exchange medium can flow between the first liquid collecting pipe 42 and the second liquid collecting pipe 45 through the branch pipes.

[0053] The branch pipe is arranged around the shell of the vapor-liquid separator 3, and the first liquid collection pipe 42 is connected to the inlet pipe 41 and the outlet pipe 44 respectively.

[0054] Here, the branch pipe is attached. Figure 3 Multiple pipes are connected between the first liquid collection pipe 42 and the second liquid collection pipe 45, in conjunction with the attached... Figure 1 This branch pipe, also known as the multi-turn pipe surrounding the outer surface of the vapor-liquid separator 4, originates from the attached... Figure 1It can be clearly seen that setting the branch pipe to be wrapped in circles on the outer surface of the vapor-liquid separator 4 can significantly increase the contact area between the branch pipe and the outer surface of the vapor-liquid separator 4.

[0055] Meanwhile, the branch pipe in this utility model connects the first liquid collecting pipe 42 and the second liquid collecting pipe 45. As an important channel for the flow of heat exchange medium, setting it to increase the contact area with the outer surface of the vapor-liquid separator 4 can fully ensure the heat exchange between the heat exchange medium and the vapor-liquid separator 4, thereby fully obtaining the cold energy and ensuring the cold energy recovery efficiency.

[0056] In addition, as mentioned above, when this utility model is applied to an air conditioning system, the heat dissipation device can be an electrical box, and the heat dissipation component is a radiator used to dissipate heat for the power components inside the electrical box. The radiator is generally provided with multiple heat dissipation fins or heat dissipation pipes for heat exchange with the power components inside the electrical box.

[0057] The microchannel component 4 in this invention injects heat exchange medium into the radiator, which is actually used to transfer the cooling capacity to the heat sink or heat pipe. Then, the cooling capacity is transferred to the power components in the electrical box through the heat sink or heat pipe. Based on the above-mentioned branch pipe design concept, this invention can set the pipes in the radiator to be multiple winding arrangements to increase the contact area with the heat sink or heat pipe, thereby improving the heat exchange efficiency.

[0058] In summary, this utility model improves the structure of the microchannel component 4 by dividing it into a first liquid collection pipe 42, a second liquid collection pipe 45, and multiple branch pipes. The branch pipes are then wound into multiple loops and installed on the shell of the vapor-liquid separator 3. This greatly increases the contact area between the heat exchange medium and the vapor-liquid separator 3, thereby ensuring the heat exchange efficiency between the heat exchange medium and the vapor-liquid separator 3, and thus ensuring the efficient recovery and reuse of cold energy.

[0059] Please see Figure 1 The heat dissipation system proposed in this utility model includes at least a first connecting pipe 8 connecting the heat dissipation component and the pump body 7, a second connecting pipe 11 connecting the heat dissipation component and the electronic expansion valve 12, a third connecting pipe 14 connecting the liquid outlet pipe 44 and the electronic expansion valve 12, and a fourth connecting pipe 15 connecting the liquid inlet pipe 41 and the pump body 7.

[0060] The microchannel component 4 and the heat dissipation component form a circulation path through the first connecting pipe 8, the second connecting pipe 11, the third connecting pipe 14, and the fourth connecting pipe 15.

[0061] Here, the first connecting pipe 8 and the second connecting pipe 11 are pipes connected to the heat dissipation assembly, attached... Figure 1In the scenario where this utility model is applied to the radiator of the electrical box in an air conditioning system, the first connecting pipe 8 and the second connecting pipe 11 are connected to the heat sink or heat pipe inside the radiator, which can guide the heat exchange medium to exchange heat with the heat sink or heat pipe, so that the heat sink or heat pipe can obtain cold energy for cooling.

[0062] The third connecting pipe 14 and the fourth connecting pipe 15 are connected to the microchannel assembly 4. The third connecting pipe 14 is connected to the outlet pipe 44 through the electronic expansion valve 12, and the fourth connecting pipe 15 is connected to the inlet pipe 41 through the pump body 7. They are used to guide the heat exchange medium into and out of the microchannel assembly 4, respectively. Here, the pump body 7 serves as a power component and can guide the heat exchange medium into the inlet pipe 41. The electronic expansion valve 12 serves as a flow regulating device and can regulate the flow rate of the heat exchange medium flowing out of the outlet pipe 44.

[0063] By using the first connecting pipe 8, the second connecting pipe 11, the third connecting pipe 14, and the fourth connecting pipe 15, this utility model can connect the flow channels of the microchannel component 4 with the flow channels in the radiator to form a complete circulating flow path for the circulation of the heat exchange medium, converting the cold energy generated by the vapor-liquid separator 3 into transportable cold energy, thereby achieving efficient recovery and reuse of cold energy.

[0064] In actual operation, the flow rate of the heat exchange medium needs to be adjusted according to the actual situation. For example, when the temperature of the heat dissipation device is low, the demand for cooling is not high, so the flow rate of the heat exchange medium does not need to be too high to avoid excessive cooling. In this case, it needs to be adjusted by the electronic expansion valve 12. In addition, the pump body 7 is used to provide power to the pipeline, but when the pipeline pressure is high, the pump body 7 does not need to provide power to avoid pipeline damage.

[0065] As can be seen from this section, the adjustment of the pump body 7 and the electronic expansion valve 12 needs to be adjusted according to the pipeline pressure and the temperature of the device to be cooled. Based on this, the heat dissipation system provided by this utility model also includes a pressure sensor set on the microchannel component 4 and a temperature sensor set on the device to be cooled. The opening degree of the electronic expansion valve 12 and the working state of the pump body 7 are set according to the detection results of the pressure sensor and the temperature sensor.

[0066] Here, the pressure sensor is used to detect the pipeline pressure. If the pipeline pressure is too high, the pump body 7 needs to be shut off. The temperature sensor is used to detect the temperature of the device to be cooled, thereby adjusting the opening of the electronic expansion valve 12. With the above-mentioned pressure and temperature sensors, this invention can adjust the amount of cooling medium supplied to the device to be cooled in real time, achieving a good heat dissipation effect while avoiding overcooling. It can also monitor the pipeline status in real time to avoid pipeline damage and improve the safety of the heat dissipation system.

[0067] Furthermore, the specific process of adjusting the temperature sensor according to the heat dissipation device in this utility model is as follows:

[0068] When the surface temperature of the heat dissipation device detected by the temperature sensor is within the first temperature range, the pump body 7 operates normally, and the opening of the electronic expansion valve 12 increases as the surface temperature of the heat dissipation device rises.

[0069] When the surface temperature of the heat dissipation device is in the second temperature range, the pump body 7 stops working;

[0070] When the surface temperature of the heat dissipation device is in the third temperature range, the pump body 7 operates normally and the opening of the electronic expansion valve 12 is adjusted to the maximum opening.

[0071] The temperature in the second temperature range is lower than the temperature in the first temperature range, and the temperature in the first temperature range is lower than the temperature in the third temperature range.

[0072] Please see Figure 4 The first temperature range here is set to the temperature range from the dew point temperature +3℃ to the maximum allowable operating temperature of the power components -25℃. The second temperature range is the temperature range less than the dew point temperature +3℃. The third temperature range is the temperature range from the maximum allowable operating temperature of the power components -25℃ to the maximum allowable operating temperature of the power components -10℃. The parameter detected by the above temperature sensor is the surface temperature of the device to be cooled. In the application scenario of the air conditioning system, the parameter detected is the surface temperature of the power components.

[0073] Combined with appendix Figure 4 The control logic of this utility model based on the temperature sensor is as follows:

[0074] The entire circulation loop uses the pump body 7 as the power source, and the electronic expansion valve 12 adjusts the flow rate of the heat exchange medium entering the radiator, so that the heat exchange medium circulates in the entire system to achieve the best heat exchange effect. The pump body 7 and the electronic expansion valve coil 13 terminals are connected to the main board and controlled by the main board.

[0075] The motherboard monitors the system pipeline pressure and the surface temperature of power components in real time. When the dew point temperature +3℃ ≤ the surface temperature of the power components ≤ the maximum allowable operating temperature -25℃, the pump body 7 operates normally, the electronic expansion valve 12 is adjusted to the minimum opening, and the heat exchange medium entering the radiator is minimized. The surface temperature of the power components is monitored in real time. When the temperature is stable, the opening of the electronic expansion valve 12 remains unchanged. When the temperature continues to rise, the opening of the electronic expansion valve 12 is adjusted to increase the flow rate of the heat exchange medium entering the radiator until the surface temperature of the power components is basically maintained within 2℃. Then, the adjustment of the opening of the electronic expansion valve 12 is stopped.

[0076] When the surface temperature of the power components is ≤ dew point temperature +3℃, the pump body 7 stops working and stops heat exchange to avoid excessive cooling that would cause the power components to be too cold and below the dew point temperature, resulting in condensation.

[0077] When the maximum allowable operating temperature -25℃ ≤ the surface temperature of the power components ≤ the maximum allowable operating temperature -10℃, the pump body 7 starts working, and the synchronous electronic expansion valve 12 adjusts the opening to the maximum opening.

[0078] The above describes the control logic based on the temperature sensor in this invention. Based on this control logic, this invention can ensure good heat dissipation while avoiding excessive cooling.

[0079] Furthermore, in this utility model, the working state of the pump body 7 needs to be adjusted according to the pipeline pressure. The control logic is that when the pipeline pressure detected by the pressure sensor is in the first pressure range, the pump body 7 works normally.

[0080] When the pipeline pressure detected by the pressure sensor is in the second pressure range, the pump body 7 stops working;

[0081] When the pipeline pressure detected by the pressure sensor is in the third pressure range, the pump body 7 stops working and issues an alarm signal;

[0082] The pressure in the third pressure zone is lower than that in the first pressure zone, and the pressure in the second pressure zone is higher than that in the first pressure zone.

[0083] Please see Figure 5 The control logic of the pump body 7 based on the pipeline pressure in this utility model is as follows: the first pressure range is the range between the pipeline pressure P and the pipeline minimum set pressure P3 and the pipeline maximum set operating pressure P1; the second pressure range is the range between the pipeline pressure P and the pipeline maximum set operating pressure P1; and the third pressure range is the range between the pipeline pressure P and the pipeline minimum set pressure P3.

[0084] Combined with appendix Figure 5 The control logic of this utility model based on the pressure sensor is as follows:

[0085] Pressure sensors are installed on the pipes of the heat dissipation system to monitor the pressure in the circulating flow path in real time, ensuring the reliable and stable operation of the entire heat dissipation system.

[0086] The main board monitors the pipeline pressure of the circulating flow path in real time. When the minimum set pressure of the pipeline P3 ≤ pipeline pressure P ≤ maximum set operating pressure of the pipeline P1, the pump body 7 works normally.

[0087] When the pipeline pressure P is greater than or equal to the maximum operating pressure P1 set in the pipeline, the main board forcibly controls the pump body 7 to stop working. After the pipeline pressure returns to the safe range pressure P2, the pump body 7 enters the normal working state.

[0088] When the pipeline pressure P continuously falls below the minimum set pressure P3 and continues to decrease, it is determined that there is a leak in the heat exchange medium in the pipeline. The pump body 7 is forced to stop working and an alarm signal is issued to remind that an inspection is required.

[0089] In other words, with the pressure sensor set up as described above, this utility model can monitor the pipeline status in real time, avoid pipeline damage, and improve the safety of the heat dissipation system.

[0090] Please see Figure 2 The heat dissipation system proposed in this utility model also includes at least one heat insulation cotton covering the outside of the housing of the vapor-liquid separator 3, and the branch pipe of the microchannel component 4 is disposed between the heat insulation cotton and the housing of the vapor-liquid separator 3.

[0091] like Figure 2 As shown, this utility model is provided with a first insulation cotton 17 and a second insulation cotton 18. By covering the outer side of the main branch pipe and the shell of the vapor-liquid separator 3 with the first insulation cotton 17 and the second insulation cotton 18, the loss of cold energy can be avoided, and the heat exchange medium in the branch pipe and the liquid separator 3 can be fully exchanged.

[0092] Furthermore, in this invention, the heat exchange medium is a cryogenic liquid, which is a working fluid with excellent thermal conductivity, low-temperature stability, and non-flammability, such as fluorinated liquid or synthetic coolant with a specific formulation, which can maintain good fluidity and thermal conductivity in the range of -40℃ to +80℃.

[0093] Based on the above settings, the overall design logic of this utility model is as follows:

[0094] The vapor-liquid separator 3 is a standard component in existing air conditioning systems, especially in large commercial air conditioning units, which generate a large amount of low-temperature cooling energy during operation. To recover this cooling energy, this invention provides a microchannel assembly 4 on the outer surface of the vapor-liquid separator 3. The microchannel assembly 4 is a slender, flat metal structure, and its surface is tightly fitted to the vapor-liquid separator 3. It is fixed by a fixing plate assembly 43 to enhance heat exchange efficiency.

[0095] The inlet pipe 41 of the microchannel component 4 is connected to the pump body 7, and the outlet pipe 44 is connected to the electronic expansion valve 12. After the flow rate is adjusted by the electronic expansion valve 12, the liquid enters the heat sink in the electrical box to form a complete circulation path.

[0096] The electronic expansion valve 12 works in conjunction with the electronic expansion valve coil 13. The electronic expansion valve coil 13 is connected to the motherboard. The motherboard sends a signal to adjust the opening of the electronic expansion valve 12 through the electronic expansion valve coil 13, thereby adjusting the flow rate of the heat exchange medium flowing into the heat sink. At the same time, the heat dissipation element on the motherboard is equipped with a temperature sensor to monitor the surface temperature of the power components on the motherboard in real time.

[0097] This utility model also proposes an air conditioning system, which has an electrical box equipped with the aforementioned heat dissipation system.

[0098] Compared with the prior art, the present invention has at least the following beneficial effects:

[0099] 1. This utility model has a microchannel component on the outer surface of the gas-liquid separator, which converts the cold energy generated by the gas-liquid separator into transportable cold energy, realizing the efficient recovery and reuse of cold energy;

[0100] 2. This utility model uses a low-temperature resistant liquid as the heat exchange medium and forms a closed circulation path through a pump body, which can ensure the safe operation of the heat dissipation system and eliminate the risk of leakage.

[0101] 3. This utility model connects the microchannel component to the heat sink of the electrical box in the air conditioning system, and sets an electronic expansion valve in the circulation path to regulate the flow rate of the heat sink entering the electrical box. This can make reasonable use of the cooling capacity for cooling the power components in the electrical box, avoiding the problem of excessive cooling causing the power components to be too cold, below the dew point temperature, resulting in condensation and damage to the air conditioning system.

[0102] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation system, comprising a heat dissipation component for dissipating heat from a device to be cooled, characterized in that, It also includes a vapor-liquid separator (3) and a microchannel assembly (4) disposed around the vapor-liquid separator (3) and forming a circulation path with the heat dissipation assembly. The microchannel assembly (4) contains a heat exchange medium that can exchange heat with the vapor-liquid separator (3).

2. The heat dissipation system according to claim 1, characterized in that, The microchannel assembly (4) includes at least an inlet pipe (41) connected to the pump body (7) and an outlet pipe (44) connected to the electronic expansion valve (12). The pump body (7) is used to pump the heat exchange medium into the microchannel assembly (4), and the electronic expansion valve (12) is used to regulate the flow rate of the heat exchange medium flowing into the heat dissipation assembly.

3. The heat dissipation system according to claim 2, characterized in that, The microchannel assembly (4) further includes a first liquid collection tube (42), a second liquid collection tube (45), and a plurality of branch tubes connected between the first liquid collection tube (42) and the second liquid collection tube (45), through which the heat exchange medium can flow between the first liquid collection tube (42) and the second liquid collection tube (45); The branch pipe is arranged around the shell of the vapor-liquid separator (3), and the first liquid collection pipe (42) is connected to the liquid inlet pipe (41) and the liquid outlet pipe (44) respectively.

4. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system includes at least a first connecting pipe (8) connecting the heat dissipation component to the pump body (7), a second connecting pipe (11) connecting the heat dissipation component to the electronic expansion valve (12), a third connecting pipe (14) connecting the liquid outlet pipe (44) to the electronic expansion valve (12), and a fourth connecting pipe (15) connecting the liquid inlet pipe (41) to the pump body (7). The microchannel component (4) and the heat dissipation component form a circulation path through the first connecting pipe (8), the second connecting pipe (11), the third connecting pipe (14), and the fourth connecting pipe (15).

5. The heat dissipation system according to claim 2, characterized in that, The heat dissipation system also includes a pressure sensor disposed on the microchannel component (4) and a temperature sensor disposed on the heat dissipation device. The opening degree of the electronic expansion valve (12) and the working state of the pump body (7) are set according to the detection results of the pressure sensor and the temperature sensor.

6. The heat dissipation system according to claim 5, characterized in that, When the surface temperature of the heat dissipation device detected by the temperature sensor is in the first temperature range, the pump body (7) works normally, and the opening of the electronic expansion valve (12) increases as the surface temperature of the heat dissipation device increases. When the surface temperature of the heat dissipation device is in the second temperature range, the pump body (7) stops working; When the surface temperature of the heat dissipation device is in the third temperature range, the pump body (7) works normally and the opening of the electronic expansion valve (12) is adjusted to the maximum opening. The temperature in the second temperature range is lower than the temperature in the first temperature range, and the temperature in the first temperature range is lower than the temperature in the third temperature range.

7. The heat dissipation system according to claim 5, characterized in that, When the pipeline pressure detected by the pressure sensor is in the first pressure range, the pump body (7) operates normally; When the pipeline pressure detected by the pressure sensor is in the second pressure range, the pump body (7) stops working; When the pipeline pressure detected by the pressure sensor is in the third pressure range, the pump body (7) stops working and issues an alarm signal; The pressure in the third pressure range is less than the pressure in the first pressure range, and the pressure in the second pressure range is greater than the pressure in the first pressure range.

8. The heat dissipation system according to claim 3, characterized in that, The heat dissipation system also includes at least one heat insulation cotton covering the outside of the housing of the vapor-liquid separator (3), and the branch pipe is disposed between the heat insulation cotton and the housing of the vapor-liquid separator (3).

9. The heat dissipation system according to claim 1, characterized in that, The heat exchange medium is a low-temperature resistant liquid.

10. An air conditioning system, the air conditioning system having an electrical box, characterized in that, The electrical box is equipped with a heat dissipation system as described in any one of claims 1 to 9.

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