Air-cooled and water-cooled integrated device

Abstract

The utility model discloses a kind of air-cooled water-cooled integrated device, including semiconductor refrigeration sheet, heat dissipation device in semiconductor refrigeration sheet hot face, and refrigeration device in semiconductor refrigeration sheet cold face;The heat dissipation device includes water-cooled plate, hot face heat dissipation plate and heat dissipation fan connected in turn, and the refrigeration device includes cold face heat dissipation plate and refrigeration fan connected, and the two sides of the semiconductor refrigeration sheet are connected in water-cooled plate and cold face heat dissipation plate respectively.The air-cooled water-cooled integrated device of the utility model, by setting water-cooled plate, hot face heat dissipation plate and heat dissipation fan in the hot face of semiconductor refrigeration sheet, water-cooled plate is first grade heat dissipation, hot face heat dissipation plate is second grade heat dissipation, and heat dissipation fan is third grade heat dissipation.Under the three-stage heat dissipation of air-cooled and water-cooled combination, the heat of semiconductor refrigeration sheet hot face is discharged in time and fully, with the technical effect of improving cooling efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor refrigeration technology, and in particular to an integrated air-cooled and water-cooled device. Background Technology

[0002] Semiconductor refrigeration, also known as thermoelectric refrigeration, electronic refrigeration, or thermoelectric cooling, is a technology that utilizes the thermoelectric effect of semiconductor materials to achieve cooling. Semiconductor refrigeration technology is widely used in cooling electronic equipment, medical devices, food preservation, and air purification.

[0003] The medium for semiconductor refrigeration technology is a semiconductor refrigeration chip, which is formed by connecting two semiconductor materials with different conductivity to form a thermocouple. When a direct current passes through the thermocouple, one surface of the semiconductor refrigeration chip absorbs heat and the other surface releases heat. In this way, one side of the semiconductor refrigeration chip becomes cold and the other side becomes hot, thereby achieving the cooling of an object.

[0004] While the cold side of a thermoelectric cooler absorbs heat, the hot side releases a large amount of heat. When the temperature of the hot side exceeds the tolerance limit of the semiconductor material, if the heat cannot be dissipated in time, it will not only reduce the cooling efficiency of the thermoelectric cooler, but may even burn out the device at high temperature in severe cases. Therefore, it is necessary to cool the hot side of the thermoelectric cooler efficiently. Utility Model Content

[0005] This invention addresses the technical problem of improving the cooling efficiency of the hot surface of a semiconductor refrigeration chip by providing an integrated air-cooled and water-cooled device.

[0006] This utility model provides an integrated air-cooled and water-cooled device, including a semiconductor refrigeration chip, a heat dissipation device disposed on the hot side of the semiconductor refrigeration chip, and a cooling device disposed on the cold side of the semiconductor refrigeration chip; the heat dissipation device includes a water-cooled plate, a hot-side heat dissipation plate, and a cooling fan connected in sequence, and the cooling device includes a cold-side heat dissipation plate and a cooling fan connected in sequence, and the two sides of the semiconductor refrigeration chip are respectively connected to the water-cooled plate and the cold-side heat dissipation plate.

[0007] Furthermore, a heat-conducting connector is provided between the hot side of the semiconductor cooling chip and the water-cooling plate, and a heat-conducting connector is provided between the water-cooling plate and the hot side heat dissipation plate.

[0008] Furthermore, the hot side edge of the semiconductor cooling chip is provided with fasteners.

[0009] Furthermore, the heat dissipation device also includes a hot end housing, in which the water-cooled plate, the hot surface heat dissipation plate, and the cooling fan are disposed; the cooling device also includes a cold end housing, in which the cold surface heat dissipation plate and the cooling fan are disposed; the hot end housing and the cold end housing are detachably connected.

[0010] Furthermore, the hot end housing is provided with a first magnetic element, and the cold end housing is provided with a second magnetic element. The first magnetic element and the second magnetic element are magnetically attracted to each other, so that the hot end housing and the cold end housing can be detachably connected.

[0011] Furthermore, the hot end housing is provided with a first clearance groove for the wires of the semiconductor cooling chip to pass through, and a second clearance groove for the water inlet and outlet of the water cooling plate to pass through.

[0012] Furthermore, the heat dissipation device is provided with a support device, which includes a connecting rod, a ball and a base. One end of the connecting rod is connected to the heat dissipation device and the other end is connected to the ball. The base has a ball groove, and the ball is placed in the ball groove and is rotatably connected to the base through the ball groove.

[0013] Furthermore, the base is equipped with a counterweight.

[0014] Furthermore, the bottom surface of the base is provided with anti-slip components.

[0015] Furthermore, the counterweight is an iron block, and / or the anti-slip component is a silicone pad or a suction cup.

[0016] The beneficial effects of this utility model are:

[0017] 1. This utility model discloses an integrated air-cooled and water-cooled device. It utilizes a water-cooled plate, a heat dissipation plate, and a cooling fan on the hot side of a thermoelectric cooler. The water-cooled plate is the first stage of heat dissipation, directly contacting the hot side of the thermoelectric cooler and rapidly absorbing and conducting heat through water circulation. The heat dissipation plate is the second stage, further dispersing the heat from the water-cooled plate over a larger surface area and accelerating heat conduction through its metallic thermal conductivity. The cooling fan is the third stage, forcing air convection to quickly expel the heat from the heat dissipation plate into the environment, maintaining the temperature difference between the hot and cold sides. This three-stage cooling system combining air and water cooling ensures timely and sufficient heat dissipation from the hot side of the thermoelectric cooler, resulting in improved cooling efficiency.

[0018] 2. The air-cooled and water-cooled integrated device of this utility model improves the heat dissipation performance of the cold side of the semiconductor refrigeration chip and reduces the temperature by setting a cold side heat dissipation plate and a cooling fan on the cold side of the semiconductor refrigeration chip. The cold side heat dissipation plate and the cooling fan serve as the first stage of heat dissipation and the second stage of heat dissipation, respectively, which is conducive to further improving the cooling efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the integrated air-cooled and water-cooled device of this utility model;

[0020] Figure 2 This is an exploded structural diagram of the air-cooled and water-cooled integrated device of this utility model. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. Moreover, the features in the embodiments of the present invention can be combined with each other without conflict.

[0022] like Figures 1-2 As shown, this utility model provides an integrated air-cooled and water-cooled device, including a semiconductor refrigeration chip 1, a heat dissipation device 2 disposed on the hot side of the semiconductor refrigeration chip 1, and a cooling device 3 disposed on the cold side of the semiconductor refrigeration chip 1; the heat dissipation device 2 includes a water-cooled plate 21, a hot-side heat dissipation plate 22 and a cooling fan 23 connected in sequence, and the cooling device 3 includes a cold-side heat dissipation plate 31 and a cooling fan 32 connected in sequence. The two sides of the semiconductor refrigeration chip 1 are respectively connected to the water-cooled plate 21 and the cold-side heat dissipation plate 31.

[0023] In one specific embodiment, the hot side of the semiconductor cooling chip 1 is connected to the heat dissipation device 2, and the cold side is connected to the cooling device 3. The heat dissipation device 2 and the cooling device 3 are used to dissipate heat and cool the two sides of the semiconductor cooling chip 1, respectively.

[0024] The heat dissipation device 2 includes a hot-end housing 24 and a water-cooled plate 21, a hot-side heat dissipation plate 22, and a cooling fan 23 fixedly connected within the hot-end housing 24. The hot-end housing 24 is a rectangular frame with openings on both sides. Since the wires of the thermoelectric cooler 1 are located at the bottom of the thermoelectric cooler 1, and the inlet and outlet of the water-cooled plate 21 are located at the bottom of the water-cooled plate 21, a first clearance groove 242 for the wires of the thermoelectric cooler 1 to pass through, and a second clearance groove 241 for the inlet and outlet of the water-cooled plate 21 to pass through are provided on one side of the bottom of the hot-end housing 24. This ensures that the thermoelectric cooler 1 and the water-cooled plate 21 are fixed within the hot-end housing 24 without affecting the connection between the wires and the power supply, or the connection between the inlet and outlet and the water source.

[0025] The hot side of the thermoelectric cooler 1 is provided with a thermally conductive connector, which is thermally conductive silicone grease. The hot side of the thermoelectric cooler 1 is bonded to one side of the water-cooling plate 21 by the thermally conductive silicone grease. The thermally conductive silicone grease not only ensures close contact between the hot side of the thermoelectric cooler 1 and the water-cooling plate 21, but also utilizes its good thermal conductivity to quickly conduct the heat generated by the hot side of the thermoelectric cooler 1.

[0026] The side of the water-cooled plate 21 furthest from the hot side of the thermoelectric cooler 1 is also bonded to one side of the hot-side heat sink 22 using thermally conductive silicone grease. The hot-side heat sink 22 is made of aluminum with high thermal conductivity. The side of the hot-side heat sink 22 furthest from the water-cooled plate 21 is fixedly connected to the side of the cooling fan 23 with screws. In addition to screws, double-sided tape, clip structures, etc., can also be used for fixing. The heat from the hot side of the thermoelectric cooler 1 can be dissipated sequentially through the water-cooled plate 21, the hot-side heat sink 22, and the cooling fan 23.

[0027] The cooling device 3 includes a cold-end housing 33, which is also a rectangular frame with openings on both sides, and a cold-side heat sink 31 and a cooling fan 32 fixedly connected inside the cold-end housing 33. The cold side of the thermoelectric cooler 1 is attached to one side of the cold-side heat sink 31, which is also made of aluminum. The side of the cold-side heat sink 31 away from the cold side of the thermoelectric cooler 1 is fixedly connected to the side of the cooling fan 32 by screws. In addition to screws, double-sided tape, clip structures, etc. can also be used for fixing. The heat from the cold side of the thermoelectric cooler 1 can be dissipated sequentially through the cold-side heat sink 31 and the cooling fan 32.

[0028] This utility model discloses an integrated air-cooled and water-cooled device. It comprises a water-cooled plate 21, a hot-side heat sink 22, and a cooling fan 23 positioned on the hot side of a thermoelectric cooler 1. The water-cooled plate 21 serves as the first stage of heat dissipation, directly contacting the hot side of the thermoelectric cooler 1 and rapidly absorbing and conducting heat through water circulation. The hot-side heat sink 22 serves as the second stage, further dispersing the heat from the water-cooled plate 21 over a larger surface area and accelerating heat conduction through its metallic thermal conductivity. The cooling fan 23 serves as the third stage, forcing air convection to quickly expel the heat from the hot-side heat sink 22 into the environment, maintaining the temperature difference between the hot and cold sides. This three-stage cooling system, combining air and water cooling, ensures timely and sufficient heat dissipation from the hot side of the thermoelectric cooler 1, thus improving cooling efficiency.

[0029] Similarly, the air-cooled and water-cooled integrated device of this utility model improves the heat dissipation performance of the cold side of the semiconductor refrigeration chip 1 and lowers the temperature by setting a cold side heat dissipation plate 31 and a cooling fan 32 on the cold side of the semiconductor refrigeration chip 1. The cold side heat dissipation plate 31 and the cooling fan 32 serve as the first stage of heat dissipation and the second stage of heat dissipation, respectively, which is conducive to further improving the cooling efficiency.

[0030] In one specific embodiment, to more firmly bond the hot side of the thermoelectric cooler 1 to the water-cooled plate 21, a fastener 4 is provided at the edge of the hot side of the thermoelectric cooler 1. The fastener 4 is Solarin SLL-704 high-temperature resistant thermally conductive silicone, but other high-temperature resistant thermally conductive silicone can also be used. The high-temperature resistant thermally conductive silicone is extruded around the edge of the hot side of the thermoelectric cooler 1, effectively strengthening the connection between the hot side of the thermoelectric cooler 1 and the water-cooled plate 21, thereby achieving the purpose of stabilizing the thermoelectric cooler 1.

[0031] This utility model's integrated air-cooled and water-cooled device can efficiently cool food and can be used in fields such as cooling electronic devices and preserving food. For example, the integrated air-cooled and water-cooled device can be fixed to the side wall of an insulated box, with the cooling device 3 facing inward and the heat dissipation device 2 facing outward. The cold air blown out by the cooling device 3 can be used to preserve the food in the insulated box. Another example is that the integrated air-cooled and water-cooled device can be placed on the back of a mobile phone, with the cooling device 3 facing the back of the phone. The cold air blown out by the cooling device 3 can be used to cool the phone. The integrated air-cooled and water-cooled device can also be used as a small fan to blow the cooling device 3 onto a person to make them feel cool.

[0032] In one specific embodiment, when the integrated air-cooled and water-cooled device is used as a mobile phone heat sink, to improve the heat dissipation effect, the thermoelectric cooler 1 and the heat dissipation device 2 are designed to be detachable from the cooling device 3 for independent use. In this case, the thermoelectric cooler 1 is connected to the heat dissipation device 2 but not to the cooling device 3. Specifically, a first magnetic element is embedded at each of the four corners of the hot end housing 24 near the hot side of the thermoelectric cooler 1, and a second magnetic element 5 is embedded at each of the four corners of the cold end housing 33 near the cold side of the thermoelectric cooler 1. Both the first and second magnetic elements 5 are magnets, and they are magnetically attracted to each other. When the first and second magnetic elements 5 are attracted together, the sides of the hot end housing 24 and the cold end housing 33 are in contact. When the first and second magnetic elements 5 are separated, the hot end housing 24 and the cold end housing 33 are separated, thus enabling the detachable connection of the hot end housing 24 and the cold end housing 33, thereby realizing the separation and independent use of the thermoelectric cooler 1 and the heat dissipation device 2. After separating the thermoelectric cooler 1 and the heat dissipation device 2, the cold side of the thermoelectric cooler 1 is exposed. At this time, the cold side of the thermoelectric cooler 1 can be attached to the back of the mobile phone, and the low temperature generated by the cold side of the thermoelectric cooler 1 can cool down the mobile phone.

[0033] In one specific embodiment, to make the mobile phone heat sink more convenient to use, a support device 6 is added to the heat sink 2. The support device 6 includes a connecting rod 61, a ball 62, and a base 63. The upper end of the connecting rod 61 is fixedly connected to the bottom of the hot end housing 24, and the lower end is integrally formed with a ball 62. The base 63 has a ball groove 631 that mates with the ball 62. The ball 62 is disposed in the ball groove 631 and is rotatably connected to the base 63 through the ball groove 631. There can be friction between the ball 62 and the ball groove 631, so that the ball 62 can rotate on the base 63 and maintain its rotated state. By setting up the support device 6, the support device 6 can support the heat sink 2 and the mobile phone connected to the heat sink 2, so that the semiconductor cooling chip 1, the heat sink 2, and the support device 6 are combined. It can not only be used as a mobile phone heat sink, but also as a mobile phone stand, so that the mobile phone can be cooled and supported at the same time, which greatly improves the practicality of the air-cooling and water-cooling integrated device.

[0034] In one specific embodiment, a counterweight is provided inside the base 63. The counterweight is an iron block and is used to improve the stability of the support device 6 by using a certain weight, so that the support device 6 is not easy to tip over.

[0035] In one specific embodiment, an anti-slip element 7 is provided in the center of the bottom surface of the base 63. In this embodiment, the anti-slip element 7 is a silicone pad. In other embodiments, it can also be a suction cup, which is used to increase the anti-slip properties of the bottom surface of the base 63 and further improve the stability of the support device 6.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An air-cooled and water-cooled integrated device, characterized by: The device includes a thermoelectric cooler, a heat dissipation device disposed on the hot side of the thermoelectric cooler, and a cooling device disposed on the cold side of the thermoelectric cooler; the heat dissipation device includes a water-cooled plate, a hot-side heat dissipation plate and a cooling fan connected in sequence, and the cooling device includes a cold-side heat dissipation plate and a cooling fan connected in sequence, with the two sides of the thermoelectric cooler respectively connected to the water-cooled plate and the cold-side heat dissipation plate.

2. The air-cooled and water-cooled integrated device according to claim 1, characterized in that: A thermally conductive connector is provided between the hot side of the semiconductor cooling chip and the water-cooled plate, and a thermally conductive connector is provided between the water-cooled plate and the hot side heat dissipation plate.

3. The air-cooled and water-cooled integrated device according to claim 1, characterized in that: Fasteners are provided on the hot side edge of the semiconductor cooling chip.

4. The air-cooled and water-cooled integrated device according to claim 1, characterized in that: The heat dissipation device further includes a hot end housing, in which the water-cooled plate, the hot surface heat dissipation plate, and the cooling fan are disposed. The cooling device further includes a cold end housing, in which the cold surface heat dissipation plate and the cooling fan are disposed. The hot end housing and the cold end housing are detachably connected.

5. The air-cooled and water-cooled integrated device according to claim 4, characterized in that: The hot end housing is provided with a first magnetic element, and the cold end housing is provided with a second magnetic element. The first magnetic element and the second magnetic element are magnetically attracted to each other, so that the hot end housing and the cold end housing can be detachably connected.

6. The air-cooled and water-cooled integrated device according to claim 4, characterized in that: The hot end housing has a first clearance groove for the wires of the semiconductor cooling chip to pass through, and a second clearance groove for the inlet and outlet of the water cooling plate to pass through.

7. A combined air-cooled and water-cooled device according to any one of claims 1-6, characterized in that: The heat dissipation device is equipped with a support device, which includes a connecting rod, a ball, and a base. One end of the connecting rod is connected to the heat dissipation device, and the other end is connected to the ball. The base has a ball groove, and the ball is placed in the ball groove and is rotatably connected to the base through the ball groove.

8. The air-cooled and water-cooled integrated device according to claim 7, characterized in that: The base is equipped with a counterweight.

9. The air-cooled and water-cooled integrated device according to claim 8, characterized in that: The base has anti-slip components on its bottom surface.

10. The air-cooled and water-cooled integrated device according to claim 9, characterized in that: The counterweight is an iron block, and / or the anti-slip component is a silicone pad or a suction cup.

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