Semiconductor temperature control device

Abstract

The utility model discloses a kind of semiconductor temperature control devices, the semiconductor temperature control device includes bottom plate, semiconductor refrigeration module, substrate and radiating fin;Bottom plate upper surface is divided into first, second area, semiconductor refrigeration module is located in first area and contains refrigeration surface and heat conduction part, substrate is fixed on refrigeration surface, radiating fin is located in second area and is connected with heat conduction part by multiple heat pipes. Bottom plate is convex structure and built-in first radiating air duct, its narrow part, wide part are connected first, second gas connector respectively, both are communicated with first radiating air duct, one of first gas connector is connected with temperature sensor;Semiconductor refrigeration module contains semiconductor refrigerator, heat conduction part, two first heat insulation plates, support plate and two second heat insulation plates. The utility model combines semiconductor refrigeration and heat pipe heat conduction technology, through temperature sensor dynamic regulation refrigeration efficiency, cooperate double air duct radiating and double-layer heat insulation structure, and microLED screen module AA area temperature is stably controlled within 100 DEG C.

Description

Technical Field

[0001] This utility model relates to a temperature control device, specifically a semiconductor temperature control device. Background Technology

[0002] In the manufacturing of microLED displays, with the upgrading of process technology, higher requirements have been placed on the curing conditions of ACF (Anisotropic Conductive Coating): not only does the curing time need to be extended to 15-150 seconds, but the curing temperature has also increased from the traditional 130℃ to 165℃. Prolonged exposure to high temperatures will have a significant thermal impact on the AA (Anisotropic Adhesive) area of ​​the microLED display module, leading to an abnormal increase in the AA area temperature.

[0003] Currently, the conventional air-blowing cooling method and simple cooling platform used in the industry cannot meet the precise temperature control requirements of this process. Actual testing has shown that, under existing technological conditions, the temperature in the AA area of ​​a microLED screen module can reach up to 115℃, far exceeding the safety threshold. Excessive temperature can damage the performance of the display elements in the AA area, causing display abnormalities and other quality problems, severely impacting the yield of microLED bonding products.

[0004] In view of this, it is necessary to improve traditional refrigeration equipment. Utility Model Content

[0005] The core objective of this invention is to provide a semiconductor precision temperature control cooling platform system that stably controls the temperature of the AA area of ​​the microLED screen module below 100℃, avoiding display problems in the AA area caused by high temperature, and effectively improving the yield of microLED bonding products.

[0006] To solve the above-mentioned technical problems, this utility model provides the following solution: A semiconductor temperature control device of this utility model, comprising:

[0007] The base plate, the upper surface of which is divided into a first area and a second area;

[0008] A semiconductor cooling module is disposed in the first region, and the semiconductor cooling module is provided with a cooling surface and a heat-conducting part;

[0009] The substrate is fixed to the cooling surface;

[0010] Heat dissipation fins are disposed in the second region, and the heat dissipation fins and the heat-conducting part are connected by multiple heat-conducting pipes.

[0011] Furthermore, the base plate has a convex structure and a first heat dissipation duct is provided inside it;

[0012] The narrow section of the base plate is designated as a first region, and multiple first air connectors are connected to this narrow section.

[0013] The upper surface of the wide portion of the base plate is designated as a second region, and multiple second air connectors are connected to this wide portion. The first air connector, the heat dissipation duct, and the second air connectors are connected.

[0014] Furthermore, one of the first gas connectors is connected to a temperature sensor.

[0015] Furthermore, the semiconductor cooling module includes:

[0016] A semiconductor cooler, wherein one side of the semiconductor cooler is a cooling surface and the other side is a heating surface;

[0017] The heat-conducting part is installed in close contact with the heating surface;

[0018] The first heat insulation plate is provided in two pieces. The two first heat insulation plates are vertically connected to both sides of the lower plate surface of the substrate and clamp the semiconductor cooler and the heat-conducting part.

[0019] The support plate is fixed to the lower ends of the heat-conducting part and the two first heat-insulating plates;

[0020] The second heat insulation plate consists of two pieces, which are vertically connected to the lower ends of the support plate on both sides. The lower ends of the two second heat insulation plates are fixed to the base plate.

[0021] Furthermore, the support plate is equipped with a third air connector on each of its two opposite sides, and a second heat dissipation duct is provided inside the third air connector on both sides, which is connected to the second heat dissipation duct.

[0022] Furthermore, the substrate has a fourth gas connector connected to each of its two back sides, and a negative pressure chamber is provided inside the fourth gas connector. The fourth gas connector is connected to the negative pressure chamber, and the upper surface of the substrate is also provided with a negative pressure hole connected to the negative pressure chamber.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] 1. Based on the traditional refrigeration platform, this utility model combines semiconductor refrigeration technology and heat pipe heat conduction technology to develop a new type of semiconductor precision temperature control refrigeration device, which can effectively control the temperature of the AA area of ​​the microLED screen module within 100℃, greatly improve the product yield, and fill the gap in precision temperature control technology in this process in the industry.

[0025] 2. Precise temperature control of this utility model: By powering on a semiconductor cooler for cooling, and with the real-time feedback of temperature data from a temperature sensor, the cooling efficiency can be dynamically adjusted to ensure that the temperature of the AA area of ​​the microLED screen module is stably controlled within 100℃, with high temperature control accuracy.

[0026] 3. High-efficiency heat dissipation of this utility model: It adopts a heat-conducting structure of "heat-conducting part + heat-conducting pipe + heat dissipation fins", combined with the airflow heat dissipation design of the first heat dissipation air duct of the base plate and the second heat dissipation air duct of the support plate, so as to realize the rapid export and dissipation of heat from the heating surface of the semiconductor cooler and avoid heat accumulation affecting the cooling effect.

[0027] 4. This utility model features double heat insulation: the first heat insulation plate and the second heat insulation plate form a double-layer heat insulation structure, which effectively isolates the heat from the outside of the semiconductor refrigeration module and prevents the cold energy of the semiconductor refrigeration unit from being lost to components such as the base plate, thereby improving energy utilization efficiency. Attached Figure Description

[0028] Figure 1 This is a structural diagram of the semiconductor temperature control device of this utility model.

[0029] The following components are labeled as follows: substrate 1, semiconductor cooler 2, support plate 3, fourth gas connector 4, heat dissipation fins 5, base plate 6, first heat insulation plate 7A, second heat insulation plate 7B, and temperature sensor 8. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Obviously, the embodiments described in this utility model are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0032] Example 1: The specific structure of this utility model is as follows:

[0033] Please refer to the appendix. Figure 1 The present invention provides a semiconductor temperature control device, comprising:

[0034] The base plate 6 has an upper surface divided into a first region and a second region.

[0035] A semiconductor cooling module is disposed in the first region, and the semiconductor cooling module is provided with a cooling surface and a heat-conducting part;

[0036] Substrate 1 is fixed to the cooling surface;

[0037] Heat dissipation fins 5 are disposed in the second region, and the heat dissipation fins 5 and the heat-conducting part are connected by multiple heat-conducting pipes.

[0038] The base plate 6 has a convex structure and a first heat dissipation duct is provided inside it;

[0039] The narrow upper plate surface of the base plate 6 is designated as a first region, and multiple first air connectors are connected to the narrow side.

[0040] The upper surface of the wide portion of the base plate 6 is designated as a second region, and multiple second air connectors are connected to this wide portion. The first air connector, the heat dissipation duct, and the second air connectors are connected.

[0041] One of the first gas connectors is connected to a temperature sensor 8.

[0042] The semiconductor cooling module includes:

[0043] A semiconductor cooler 2, wherein one side of the semiconductor cooler 2 is a cooling surface and the other side is a heating surface;

[0044] The heat-conducting part is installed in close contact with the heating surface;

[0045] Two first heat insulation plates 7A are provided. The two first heat insulation plates 7A are vertically connected to both sides of the lower plate surface of the substrate 1 and clamp the semiconductor cooler 2 and the heat-conducting part.

[0046] The support plate 3 is fixed to the lower end of the heat-conducting part and the two first heat insulation plates 7A;

[0047] Two second heat insulation plates 7B are provided. The two second heat insulation plates 7B are vertically connected to the lower ends of the support plate 3 on both sides, and the lower ends of the two second heat insulation plates 7B are fixed to the base plate 6.

[0048] The support plate 3 has a third air connector installed on each of its two opposite sides, and a second heat dissipation air duct is provided inside it. The third air connectors on both sides are connected to the second heat dissipation air duct.

[0049] The substrate 1 has a fourth gas connector 4 connected to each of its two back sides, and a negative pressure chamber is provided inside the fourth gas connector 4. The fourth gas connector 4 is connected to the negative pressure chamber. The upper surface of the substrate 1 is also provided with a negative pressure hole that is connected to the negative pressure chamber.

[0050] Example 2:

[0051] System debugging: Negative pressure is introduced into the fourth gas connector 4 to test the adsorption force of the negative pressure holes on the upper surface of the substrate 1, ensuring that standard-sized microLED screen modules can be stably adsorbed; the semiconductor cooler 2 is powered on, and the target temperature is set to ≤100℃ through the temperature control system. The temperature sensor 8 collects the temperature data near the substrate 1 in real time and feeds it back to the temperature control system, dynamically adjusting the input current of the semiconductor cooler 2 until the temperature stabilizes within the target range; high-pressure cooling airflow is introduced into the first gas connector and the third gas connector. The airflow passes through the first heat dissipation channel of the base plate 6 and the second heat dissipation channel of the support plate 3, respectively, carrying away the heat transferred by the heat dissipation fins 5 and the heat-conducting part. The heat dissipation efficiency of the heat dissipation system is tested to ensure that the temperature of the heating surface of the semiconductor cooler 2 does not exceed the safety threshold.

[0052] Example 3:

[0053] The steps for applying this semiconductor precision temperature control cooling platform system in the microLED screen module bonding production process are as follows:

[0054] The microLED screen module to be bonded is placed on the upper surface of the substrate 1. Negative pressure is introduced through the fourth gas connector 4, and the screen module is firmly adsorbed and fixed by the negative pressure hole to ensure that the AA area of ​​the screen module corresponds to the cooling area of ​​the substrate 1.

[0055] The semiconductor cooler 2 is started. According to the ACF curing process requirements of 165℃ for 15-150 seconds, the target control temperature of the AA zone is set to 95℃ through the temperature control system. The temperature sensor 8 monitors the temperature near the AA zone in real time and transmits the data to the temperature control system. When the temperature control system detects that the temperature is higher than the target value, it automatically increases the input current of the semiconductor cooler 2 to improve the cooling efficiency. When the temperature is lower than the target value, it decreases the input current to avoid over-cooling. At the same time, the first gas connector and the third gas connector continuously supply high-pressure cooling airflow, and the first heat dissipation channel and the second heat dissipation channel assist in heat dissipation to ensure the stable operation of the semiconductor cooler 2.

[0056] The equipment is started to heat and cure the ACF. Throughout the curing process, the system continuously controls the temperature of the AA area within the target range to avoid damage to the display elements in the AA area due to high temperature.

[0057] After curing is complete, turn off the semiconductor cooler 2, stop the negative pressure, remove the processed screen module, and proceed to the next process.

[0058] The semiconductor precision temperature control cooling platform system of this invention can control the temperature fluctuation range of the AA area of ​​the microLED screen module within ±2℃, improve the product yield by more than 30% compared with the traditional cooling platform, and the system operates stably with a low failure rate, meeting the needs of large-scale industrial production.

[0059] In summary, this invention, based on a traditional refrigeration platform, combines semiconductor refrigeration technology and heat pipe heat conduction technology to develop a novel semiconductor precision temperature control refrigeration device. This device can effectively and stably control the temperature of the AA area of ​​the microLED screen module below 100℃, significantly improving product yield and filling the gap in precision temperature control technology for this process in the industry.

[0060] This invention features precise temperature control: by powering on a semiconductor cooler for cooling, and in conjunction with a temperature sensor to provide real-time temperature data feedback, the cooling efficiency can be dynamically adjusted to ensure that the temperature of the AA area of ​​the microLED screen module is stably controlled within 100℃, resulting in high temperature control accuracy.

[0061] This utility model features efficient heat dissipation: it adopts a heat-conducting structure of "heat-conducting part + heat-conducting pipe + heat dissipation fins", combined with the airflow heat dissipation design of the first heat dissipation air duct of the base plate and the second heat dissipation air duct of the support plate, to achieve rapid heat dissipation and heat transfer from the heating surface of the semiconductor cooler, avoiding heat accumulation that affects the cooling effect.

[0062] This utility model features double heat insulation: the first heat insulation plate and the second heat insulation plate form a double-layer heat insulation structure, which effectively isolates the heat from the outside of the semiconductor cooling module and prevents the cooling capacity of the semiconductor cooler from being lost to components such as the base plate. The purpose of double-layer heat insulation is to reduce the heat transfer to the working parts below the base plate, ensure the controllability of heat dissipation, improve the temperature controllability of the cooling platform, and enhance energy utilization efficiency.

[0063] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A semiconductor temperature control device, characterized in that, include: The base plate (6) has an upper surface divided into a first region and a second region; A semiconductor cooling module is disposed in the first region, and the semiconductor cooling module is provided with a cooling surface and a heat-conducting part; Substrate (1) is fixed to the cooling surface; Heat dissipation fins (5) are disposed in the second region, and the heat dissipation fins (5) and the heat-conducting part are connected by multiple heat-conducting pipes.

2. The semiconductor temperature control device according to claim 1, characterized in that, The base plate (6) has a convex structure and a first heat dissipation duct is provided inside it; The narrow upper plate surface of the base plate (6) is designated as a first region, and multiple first air connectors are connected to the narrow side. The upper surface of the wide portion of the base plate (6) is designated as a second region, and multiple second air connectors are connected to the wide portion side. The first air connector, the heat dissipation duct, and the second air connectors are connected.

3. The semiconductor temperature control device according to claim 1, characterized in that, One of the first gas connectors is connected to a temperature sensor (8).

4. The semiconductor temperature control device according to claim 1, characterized in that, The semiconductor cooling module includes: A semiconductor cooler (2) has a cooling surface on one side and a heating surface on the other side. The heat-conducting part is installed in close contact with the heating surface; Two first heat insulation plates (7A) are provided. The two first heat insulation plates (7A) are vertically connected to both sides of the lower plate surface of the substrate (1) and clamp the semiconductor cooler (2) and the heat-conducting part. The support plate (3) is fixed to the lower end of the heat-conducting part and the two first heat insulation plates (7A); The second heat insulation plate (7B) is provided in two pieces. The two second heat insulation plates (7B) are vertically connected to the lower ends of the support plate (3) and the lower ends of the two second heat insulation plates (7B) are fixed to the bottom plate (6).

5. A semiconductor temperature control device according to claim 4, characterized in that, The support plate (3) is equipped with a third air connector on both of its opposite sides, and a second heat dissipation duct is provided inside it. The third air connectors on both sides are connected to the second heat dissipation duct.

6. A semiconductor temperature control device according to claim 1, characterized in that, The substrate (1) is connected to a fourth gas connector (4) on both of its back sides. The fourth gas connector (4) is connected to the negative pressure cavity. The upper surface of the substrate (1) is also provided with a negative pressure hole connected to the negative pressure cavity.

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