Heat dissipation device and heat pump unit

Abstract

The utility model discloses a heat abstractor and heat pump unit, heat abstractor includes: heat abstractor spare, it is used to tightly have the drive board of heating component element, respectively with the both sides connection of heat abstractor heat conduction spare, heat conduction spare is used to connect evaporimeter, circuit breaking assembly, it sets up in the one side or both sides of heat abstractor with corresponding heat conduction spare's junction, circuit breaking assembly is used to make heat conduction spare with corresponding heat abstractor disconnect or contact. The heat abstractor of the utility model does not need to borrow system refrigerant, but makes drive board to form heat circulation loop with evaporimeter through heat abstractor and heat conduction spare, thereby the heat of drive board is transmitted to the fin of evaporimeter, thereby realizes the cooling heat dissipation of drive board, and still does not need to increase the complexity or redundancy of system like this, and through the on-off state of circuit breaking assembly to avoid the problem that heat abstractor produces condensation because of supercooling.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, and in particular to a heat dissipation device and a heat pump unit. Background Technology

[0002] In the existing technology, the heat dissipation device for heat pump units uses refrigerant bypass technology to achieve temperature regulation (equivalent to refrigerant heat dissipation). This can regulate the temperature of the driving electrical components and prevent condensation by controlling the refrigerant temperature. Although this method can achieve the purpose, using refrigerant bypass technology will increase the number of valves, sensors and other components, thereby increasing the complexity or redundancy of the system. Utility Model Content

[0003] This utility model provides a heat dissipation device and a heat pump unit to solve the problem that the heat dissipation device in the prior art uses refrigerant bypass technology, which increases the complexity or redundancy of the system.

[0004] The technical solution of this utility model is a heat dissipation device, comprising:

[0005] Heat sink, which is used to fit closely to the drive board containing heat-generating components;

[0006] A heat-conducting component is connected to both sides of the heat sink, and the heat-conducting component is used to connect to the evaporator;

[0007] A circuit breaker assembly is disposed at the connection point between the heat sink and the corresponding heat conduction component on one or both sides of the heat sink; the circuit breaker assembly is used to disconnect or contact the heat conduction component with the corresponding heat sink.

[0008] Furthermore, multiple heat dissipation components are provided, and each heat dissipation component has heat-conducting components on both sides for connecting to the fins of the evaporator; a circuit breaker component is provided at the connection between each heat-conducting component and the corresponding heat dissipation component.

[0009] Furthermore, the circuit breaker assembly includes a base, on both sides of which a heat-conducting component and a heat-dissipating component are respectively inserted;

[0010] Magnets are provided at the ends of the heat sinks inserted into the base, and electromagnets are provided on the base to match the magnets;

[0011] Specifically, when the electromagnet is energized and generates a magnetic field that attracts the magnet, the end of the heat sink with the magnet protrudes and breaks contact with the corresponding heat-conducting component; when the electromagnet is energized and generates a magnetic field that repels the magnet, the end of the heat sink with the magnet comes into contact with the corresponding heat-conducting component.

[0012] Furthermore, the base is provided with an installation space for installing the electromagnet, and the opening of the installation space is fitted with a cover plate;

[0013] When the cover plate closes with the opening of the installation space, it restricts the movement of the electromagnet within the installation space.

[0014] Furthermore, a signal rod is provided on the outer wall of the base, and the signal rod is electrically connected to the coil winding of the electromagnet through a wire hole.

[0015] Furthermore, an insertion space is provided within the base, and a heat-conducting component and a heat-dissipating component are respectively inserted into the two sides of the insertion space; the internal diameter of the insertion space gradually decreases from the heat-conducting component to the heat-dissipating component.

[0016] Furthermore, a guide groove is provided extending outward from one side of the insertion space corresponding to the heat-conducting component; the heat-conducting component can be matched and extended into the guide groove.

[0017] Furthermore, the base is provided with at least one first through hole at the bottom corresponding to the insertion space;

[0018] The first fastener can be fitted through the first through hole and connected to the heat-conducting element.

[0019] Furthermore, the base extends outward from the side into which the heat sink is inserted in the insertion space to form an extension plate, and the extension plate is provided with at least one second through hole;

[0020] The second fastener can be fitted through the second through hole and connected to the heat sink.

[0021] This utility model also proposes a heat pump unit, which includes the heat dissipation device described above.

[0022] Compared with the prior art, the present invention has at least the following beneficial effects:

[0023] The heat dissipation device proposed in this utility model does not require the use of system refrigerant. Instead, the drive plate forms a thermal circulation loop with the evaporator through heat dissipation components and heat conduction components, thereby transferring the heat generated by the drive plate to the fins of the evaporator, thus achieving cooling and heat dissipation of the drive plate. This does not increase the complexity or redundancy of the system. Furthermore, the on / off state of the circuit breaker component avoids the problem of condensation caused by overcooling of the heat dissipation components. Attached Figure Description

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects and not to describe a particular order.

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a partial structural schematic diagram of the heat pump unit proposed in this utility model;

[0027] Figure 2 This is an internal schematic diagram of the heat dissipation device proposed in this utility model in the on-state.

[0028] Figure 3 This is an internal schematic diagram of the heat dissipation device proposed in this utility model in the cut-off state;

[0029] Figure 4 This is an exploded view of the circuit breaker component proposed in this utility model;

[0030] Figure 5 This is a schematic diagram of the structure of the base proposed in this utility model;

[0031] Figure 6 This is a partial structural diagram of the base proposed in this utility model;

[0032] Figure 7 This is a schematic diagram of the heat pump unit proposed in this utility model.

[0033] Figure label:

[0034] 10. Heat sink; 101. Magnet;

[0035] 20. Driver board;

[0036] 30. Heat-conducting component; 301. Positioning groove;

[0037] 40. Evaporator;

[0038] 50. Circuit breaker components;

[0039] 501. Base; 502. Electromagnet; 503. Mounting space; 504. Cover plate; 505. Signal rod; 506. Cable hole; 507. Insertion space; 508. Guide groove; 509. First through hole; 510. First fastener; 511. Extension plate; 512. Second through hole; 513. Second fastener;

[0040] 60. Compressor;

[0041] 70. Water-side heat exchanger;

[0042] 80. Four-way valve;

[0043] 90. Expansion valve;

[0044] 100. Gas-liquid separator;

[0045] 110. Filter. Detailed Implementation

[0046] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present utility model, and does not imply that every embodiment of the present utility model must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0047] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0048] In the existing technology, the heat dissipation device for heat pump units uses refrigerant bypass technology to achieve temperature regulation (equivalent to refrigerant heat dissipation). This can regulate the temperature of the driving electrical components and prevent condensation by controlling the refrigerant temperature. Although this method can achieve the purpose, using refrigerant bypass technology will increase the number of valves, sensors and other components, thereby increasing the complexity or redundancy of the system.

[0049] Therefore, in some embodiments, such as Figure 1 As shown, this utility model proposes a heat dissipation device that does not require the use of system refrigerant, comprising:

[0050] Heat sink 10 is used to closely attach to drive board 20 which has heat-generating components;

[0051] Heat-conducting components 30 are respectively connected to both sides of the heat sink 10, and the heat-conducting components 30 are used to connect the evaporator 40;

[0052] A circuit breaker assembly 50 is disposed at the connection point between the heat sink 10 and the corresponding heat conduction component 30 on one or both sides; the circuit breaker assembly 50 is used to disconnect or contact the heat conduction component 30 with the corresponding heat sink 10.

[0053] It should be noted that the heat sink 10 and the heat conductor 30 proposed in this embodiment are made of copper or aluminum. This embodiment illustrates this by assuming that both sides of the heat sink 10 are connected to the corresponding heat conductor 30 through the circuit breaker assembly 50. Furthermore, the drive plate 20 proposed in this embodiment is not located on the side where the evaporator 40 is located (equivalent to the drive plate 20 being far away from the evaporator 40) to avoid electrical hazards caused by the generation of a large amount of condensate at low temperatures.

[0054] In this way, when the heat-generating components on the driver board 20 are used and generate heat, their heat will be transferred to the heat sink 10 that is in close contact with the driver board 20. At the same time, the circuit breaker assembly 50 will cause the heat-conducting component 30 to come into contact with the corresponding heat sink 10 (e.g., Figure 2 As shown), the heat on the heat sink 10 is transferred to the fins of the evaporator 40 through the heat conductor 30, that is, the fins of the evaporator 40 are connected in series to the heat sink 10, and the cold energy of the fins of the evaporator 40 is transferred back to the heat sink 10 to form a thermal circulation loop, so as to achieve the cooling and heat dissipation of the drive plate 20.

[0055] Of course, when there is no need to cool down the heat-generating components on the driver board 20, the heat-conducting component 30 can be disconnected from the corresponding heat sink 10 via the circuit breaker component 50 (e.g., Figure 3 As shown in the figure, this disconnects the entire thermal cycle loop.

[0056] Therefore, the heat dissipation device proposed in this utility model does not require the use of system refrigerant. Instead, the drive plate 20 forms a thermal circulation loop with the evaporator 40 through the heat dissipation component 10 and the heat conduction component 30, thereby transferring the heat generated by the drive plate 20 to the fins of the evaporator 40, thus achieving cooling and heat dissipation of the drive plate 20. This also does not increase the complexity or redundancy of the system. Furthermore, the on / off state of the circuit breaker component 50 avoids the problem of condensation on the heat dissipation component 10 due to overcooling.

[0057] In some embodiments, multiple heat sinks 10 are provided, and each heat sink 10 has heat conductors 30 on both sides for connecting to the fins of the evaporator 40; a circuit breaker assembly 50 is provided at the connection between each heat conductor 30 and the corresponding heat sink 10.

[0058] In this way, more heat sinks 10 and heat conductors 30 can be installed according to the actual heat dissipation situation, thereby forming more heat circulation loops and further enhancing the cooling and heat dissipation function and anti-condensation function of the drive board 20.

[0059] In some embodiments, such as Figure 4 As shown, this embodiment proposes a structure for a circuit breaker component 50, including:

[0060] The base 501 has heat-conducting components 30 and heat-dissipating components 10 inserted on its two sides respectively;

[0061] Magnets 101 are provided at the ends of the heat sink 10 inserted into the base 501, and electromagnets 502 are provided in the base 501 in correspondence with the magnets 101.

[0062] When the electromagnet 502 is energized and generates a magnetic field that attracts the magnet 101, the end of the heat sink 10 with the magnet 101 is raised and disconnected from the corresponding heat-conducting component 30; when the electromagnet 502 is energized and generates a magnetic field that repels the magnet 101, the end of the heat sink 10 with the magnet 101 is attached to and in contact with the corresponding heat-conducting component 30.

[0063] It is understood that the heat dissipation device proposed in this embodiment also includes a control unit (not shown, the same throughout), which is electrically connected to the electromagnet 502. Furthermore, the magnet 101 proposed in this embodiment is preferably a neodymium iron boron permanent magnet, with a nickel-copper-nickel composite protective layer plated on its surface; of course, the magnet 101 can also be an aluminum nickel cobalt permanent magnet, which is not limited here.

[0064] In this way, the control unit causes the electromagnet 502 to generate different magnetic fields by inputting current and controlling the input direction, thereby generating attractive and repulsive forces on the magnet 101. Therefore, when the electromagnet 502 is energized and generates a magnetic field that attracts the magnet 101, the end of the heat sink 10 with the magnet 101 is raised and disconnected from the corresponding heat-conducting component 30, heat conduction is terminated, and the circuit breaker 50 is in the cut-off state (e.g., Figure 3 (As shown); when the electromagnet 502 is energized and generates a magnetic field that repels the magnet 101, the end of the heat sink 10 with the magnet 101 comes into contact with the corresponding heat-conducting component 30, completing heat conduction, and the circuit breaker 50 is in the connected state (as shown). Figure 2 As shown in the figure, this is to achieve cooling and heat dissipation of the driver board 20.

[0065] Of course, in other embodiments, the contact surfaces of the heat-conducting component 30 and the corresponding heat-dissipating component 10 with the end of the magnet 101 are provided with elastic heat-conducting pads, thereby filling the air gaps formed by the microscopic unevenness of the contact surfaces and reducing the contact thermal resistance.

[0066] In some embodiments, to ensure that the electromagnet 502 does not move during heat dissipation, thereby affecting the heat dissipation effect, such as... Figure 4 and Figure 6 As shown, the base 501 is provided with an installation space 503 for installing the electromagnet 502, and the opening of the installation space 503 is matched with a cover plate 504.

[0067] When the cover plate 504 closes the opening of the mounting space 503, it restricts the movement of the electromagnet 502 within the mounting space 503.

[0068] It should be noted that after the electromagnet 502 is installed in the installation space 503, the opening of the installation space 503 is covered with a cover plate 504, and then the cover plate 504 is fixed with screws or pins to prevent the electromagnet 502 from moving within the installation space 503. The cover plate 504 also provides physical protection for the electromagnet 502, preventing damage caused by external impacts or dust intrusion. The cover plate 504 is usually made of metal materials (such as copper, aluminum or galvanized steel plate), which can effectively isolate external electromagnetic interference and prevent the magnetic field generated by the electromagnet 502 from leaking and interfering with surrounding equipment.

[0069] In some embodiments, to enable the control unit to better generate different magnetic properties in the electromagnet 502 by inputting current and controlling the input direction, such as... Figure 5 As shown, a signal rod 505 is provided on the outer wall of the base 501, and the signal rod 505 is electrically connected to the coil winding of the electromagnet 502 through the wire hole 506.

[0070] It is understandable that the signal rod 505 is electrically connected to the control unit, thereby enabling the control unit to control the current and direction of the input electromagnet 502 through the signal rod 505.

[0071] The wire hole 506 is provided on the base 501. The inner wall of the wire hole 506 is provided with an insulating bushing for fixing and protecting the wire of the signal rod 505. The inner diameter of the wire hole 506 matches the outer diameter of the signal rod 505, and the interference fit tolerance is 0.05-0.1mm.

[0072] In some embodiments, to better allow the end of the heat sink 10 with the magnet 101 to be raised and disconnected from the corresponding heat-conducting element 30, such as... Figure 3 As shown, an insertion space 507 is provided in the base 501, and a heat-conducting component 30 and a heat-dissipating component 10 are respectively inserted on both sides of the insertion space 507; the internal diameter of the insertion space 507 gradually decreases from the heat-conducting component 30 to the heat-dissipating component 10.

[0073] In some embodiments, to improve the connection stability of the heat-conducting element 30 within the insertion space 507, such as Figure 6 As shown, a guide groove 508 is provided in the insertion space 507 extending outward from one side corresponding to the heat-conducting component 30; the heat-conducting component 30 can be matched and extended into the guide groove 508.

[0074] In this way, the heat-conducting component 30 can be inserted into the insertion space 507 along the guide groove 508, ensuring that the heat-conducting component 30 runs along the preset path, reducing deviation, and also improving assembly efficiency.

[0075] In some embodiments, to ensure that the heat-conducting element 30 can be more stably fixed within the insertion space 507, such as... Figures 3-4 As shown, the base 501 is provided with at least one first through hole 509 at the bottom of the insertion space 507;

[0076] The first fastener 510 can be fitted through the first through hole 509 and connected to the heat-conducting element 30.

[0077] It should be noted that the first fastener 510 proposed in this embodiment is preferably a positioning pin, and the heat-conducting component 30 inserted into the insertion space 507 is provided with a positioning groove 301 along its width direction.

[0078] When the heat-conducting component 30 is inserted into the insertion space 507, the first fastener 510 is then passed through the first through hole 509 and connected to the positioning groove 301 to fix the heat-conducting component 30 in the insertion space 507, thereby limiting the displacement of the heat-conducting component 30 and avoiding affecting the heat dissipation effect. Of course, the first fastener 510 proposed in this embodiment can also be a bolt or a screw, which is not limited here.

[0079] In some embodiments, to ensure that the heat sink 10 can be more stably fixed to the base 501, such as... Figure 2 and Figure 4 As shown, the base 501 extends outward from the side of the insertion space 507 into which the heat sink 10 is inserted to form an extension plate 511, and the extension plate 511 is provided with at least one second through hole 512.

[0080] The second fastener 513 can be fitted through the second through hole 512 and connected to the heat sink 10.

[0081] It should be noted that the second fastener 513 proposed in this embodiment is preferably a bolt. In this way, after the heat sink 10 is inserted into the insertion space 507, the second fastener 513 is then passed through the second through hole 512 and fixedly connected to the heat sink 10, thereby restricting the displacement of the heat sink 10 and avoiding affecting the heat dissipation effect. Of course, the second fastener 513 proposed in this embodiment can also be a shaft pin or a screw, which is not limited here.

[0082] In some embodiments, such as Figure 7As shown, this utility model also proposes a heat pump unit, which includes the heat dissipation device described above.

[0083] The heat pump unit also includes a refrigeration system, which includes an evaporator 40, a compressor 60, a water-side heat exchanger 70, a four-way valve 80, an expansion valve 90, a gas-liquid separator 100, and a filter 110.

[0084] The discharge side of the compressor 60 is connected to the first port of the four-way valve 80, the second port of the four-way valve 80 is connected to the inlet of the gas-liquid separator 100, and the outlet of the gas-liquid separator 100 is connected to the suction side of the compressor 60; the third port of the four-way valve 80 is connected to the outlet of the evaporator 40; the fourth port of the four-way valve 80 is connected in sequence to the water-side heat exchanger 70 and the expansion valve 90 and then connected to the inlet of the evaporator 40, and a filter 110 is provided at both the outlet and the inlet of the expansion valve 90.

[0085] Furthermore, the driver board 20 is equipped with a first temperature sensor, a second temperature sensor, a third temperature sensor, and a humidity sensor. The first temperature sensor is used to detect the temperature of the heating element, the second temperature sensor is used to detect the air temperature around the heating element, the third temperature sensor is used to detect the temperature of the driver board 20, and the humidity sensor is used to detect the relative humidity of the air around the heating element. The air temperature and relative humidity around the heating element are used to calculate its dew point temperature.

[0086] The control unit has pre-set temperatures I, II, III, T, and T2 for the heating element. Temperature I is the first temperature limit for the heating element, temperature II is the second temperature limit (maximum temperature limit) for the heating element, and temperature III is the allowable temperature for normal operation of the heating element. Temperature II > Temperature I > Temperature III. Temperature T is the first warning value for preventing condensation, and temperature T2 is the second warning value for preventing condensation. Temperature T < Temperature T2.

[0087] In this way, after the refrigerant is compressed by the compressor 60, it exchanges heat with water in the water-side heat exchanger 70 to release heat. Then, after being throttled by the expansion valve 90, it enters the evaporator 40 and increases the heat exchange area with the air through the fins. The refrigerant in the evaporator 40 absorbs heat energy from the surrounding air, so the fins of the evaporator 40 and the surrounding air are on the low-temperature side. This invention utilizes this to dissipate heat from the heat-generating components. It is not connected to the refrigerant flow path of the system, but directly connected to the evaporator 40 of the heat pump unit to form a heat circulation loop, dissipating heat from the heat-generating components through heat conduction. The heat dissipated is transferred to the evaporator 40 and the cold energy of the evaporator 40 is also brought back, realizing the cooling and heat dissipation of the drive plate 20; and the on / off state of the circuit breaker component 50 avoids the problem of condensation on the heat sink 10 due to overcooling; at the same time, since the heat pump unit transfers the air heat on the side where the evaporator 40 is located to the water-side heat exchanger 70 through refrigerant to produce hot water, the heat dissipation device proposed in this embodiment transfers the heat of the drive plate 20 to the side where the evaporator 40 is located, improving the heat exchange capacity of the evaporator 40, thereby improving the energy efficiency of the heat pump unit.

[0088] The circuit breaker component 50 controls the on / off state of the thermal circulation loop, and the specific logic is as follows:

[0089] S1: When the temperature of the heating element is greater than temperature I, the control unit controls one of the circuit breaker components 50 to be in the on state;

[0090] S2: Then the control unit determines whether the temperature of the heating element is greater than temperature II;

[0091] If the temperature of the heating element is greater than temperature II, the control unit will control another circuit breaker component 50 to also be in the connected state.

[0092] S3: If the temperature of the heating element is not greater than temperature II, the control unit then determines whether the temperature of the drive board 20 is less than the dew point temperature + T of the air surrounding the heating element.

[0093] If so, the control unit switches one of the circuit breaker components 50 in step S1 from the connected state to the disconnected state;

[0094] If not, proceed to step S2 again;

[0095] S4: After the other circuit breaker component 50 is also in the connected state, the control unit then determines whether the temperature of the drive board 20 is less than the dew point temperature of the air around the heat-generating component + T2.

[0096] If the temperature of the drive board 20 is less than the dew point temperature of the air around the heating element + T2, the control unit will switch one of the circuit breaking components 50 in step S1 from the connected state to the disconnected state.

[0097] Then the control unit determines whether the temperature of the drive board 20 is less than the dew point temperature of the air around the heating element +T;

[0098] If the temperature of the drive board 20 is less than the dew point temperature of the air around the heating element +T, then the control unit will switch the other circuit breaker component 50 in step S2 from the connected state to the disconnected state.

[0099] If the temperature of the drive board 20 is not less than the dew point temperature of the air around the heating element + T, and the control unit detects that the temperature of the heating element is less than temperature II, then the control unit will switch the other circuit breaker component 50 in step S2 from the connected state to the disconnected state.

[0100] S5: If the temperature of the drive board 20 is not less than the dew point temperature of the air around the heating element + T2, the control unit will then determine whether the temperature of the heating element is less than temperature III.

[0101] If the temperature of the heating element is lower than temperature III, the control unit will switch both circuit breaker components 50 from the connected state to the disconnected state, restart (loop) the logic judgment, that is, enter step S1.

[0102] If the temperature of the heating element is not lower than temperature III, and the control unit detects that the temperature of the heating element is lower than temperature II, then the control unit will switch the other circuit breaker component 50 in step S2 from the connected state to the disconnected state.

[0103] When both circuit breaker components 50 switch from the ON state to the OFF state, the drive board 20 dissipates heat through natural air convection. Furthermore, when one circuit breaker component 50 is ON and the other is OFF, the heat sink 10 can still transfer heat from the drive board 20 to the evaporator 40, although the heat dissipation effect is lower than when both circuit breaker components 50 are ON.

[0104] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A heat dissipation device, characterized in that, include: Heat sink (10) is used to fit closely to the drive board (20) which has heat-generating components. Heat-conducting components (30) are respectively connected to both sides of the heat sink (10), and the heat-conducting components (30) are used to connect the evaporator (40). A circuit breaker assembly (50) is disposed at the connection between one or both sides of the heat sink (10) and the corresponding heat conductor (30); the circuit breaker assembly (50) is used to disconnect or contact the heat conductor (30) with the corresponding heat sink (10).

2. The heat dissipation device according to claim 1, characterized in that, Multiple heat sinks (10) are provided, and each heat sink (10) has heat conductors (30) on both sides for connecting the fins of the evaporator (40); each heat conductor (30) is provided with a circuit breaker (50) at the connection between the corresponding heat sink (10).

3. The heat dissipation device according to claim 1 or 2, characterized in that, The circuit breaker assembly (50) includes a base (501) with a heat-conducting component (30) and a heat-dissipating component (10) inserted on its two sides respectively. Magnets (101) are provided at the ends of the heat sinks (10) inserted into the base (501), and electromagnets (502) are provided in the base (501) in correspondence with the magnets (101). When the electromagnet (502) is energized and generates a magnetic field that attracts the magnet (101), the end of the heat sink (10) with the magnet (101) is raised and disconnected from the corresponding heat-conducting component (30); when the electromagnet (502) is energized and generates a magnetic field that repels the magnet (101), the end of the heat sink (10) with the magnet (101) is attached to and in contact with the corresponding heat-conducting component (30).

4. The heat dissipation device according to claim 3, characterized in that, The base (501) is provided with an installation space (503) for installing the electromagnet (502), and the opening of the installation space (503) is provided with a cover plate (504). When the cover plate (504) closes the opening of the mounting space (503), it restricts the movement of the electromagnet (502) within the mounting space (503).

5. The heat dissipation device according to claim 3, characterized in that, A signal rod (505) is provided on the outer wall of the base (501), and the signal rod (505) is electrically connected to the coil winding of the electromagnet (502) through a wire hole (506).

6. The heat dissipation device according to claim 3, characterized in that, An insertion space (507) is provided in the base (501), and a heat-conducting component (30) and a heat-dissipating component (10) are respectively inserted on both sides of the insertion space (507); the internal diameter of the insertion space (507) gradually decreases from the heat-conducting component (30) to the heat-dissipating component (10).

7. The heat dissipation device according to claim 6, characterized in that, A guide groove (508) is provided in the insertion space (507) on one side corresponding to the heat-conducting component (30) extending outward; the heat-conducting component (30) can be matched and extended into the guide groove (508).

8. The heat dissipation device according to claim 6, characterized in that, The base (501) is provided with at least one first through hole (509) at the bottom of the insertion space (507). The first fastener (510) can be fitted through the first through hole (509) and connected to the heat-conducting element (30).

9. The heat dissipation device according to claim 6, characterized in that, The base (501) extends outward from the side of the insertion space (507) into which the heat sink (10) is inserted to form an extension plate (511), and the extension plate (511) is provided with at least one second through hole (512). The second fastener (513) can be fitted through the second through hole (512) and connected to the heat sink (10).

10. A heat pump unit, characterized in that, The heat pump unit includes the heat dissipation device as described in any one of claims 1 to 9.

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