A copper rod surface cooling device

Abstract

The utility model relates to a copper pole surface cooling device belongs to copper pole production technical field, this copper pole surface cooling device, include: cooling mechanism, cooling mechanism includes mounting panel, cooling box and water spraying subassembly, and cooling box fixed setting is in the mounting panel upper surface, filter mechanism, filter mechanism includes the mounting frame, filter screen and be used for to the mounting frame quick assembly disassembly installation subassembly, and mounting frame and filter screen all are provided with two groups, cooling mechanism is used for to the cooling water inside cooling box cooling, through setting two groups of mounting frame and filter screen, when the upper filter screen inside impurity is too much, through installation subassembly and take off the upper mounting frame quickly and clean down, the lower filter screen continues to the copper pole surface impurity and filters at this moment, when the upper filter screen finishes cleaning again and installs in the cooling box inside, to the filter screen surface impurity convenient cleaning, solved the problem that the filter screen could not be cleaned during the operation of the cooling device.

Description

Technical Field

[0001] This utility model relates to the field of copper rod production technology, and in particular to a copper rod surface cooling device. Background Technology

[0002] In the copper rod production process, surface cooling plays a crucial role in product quality and production efficiency. Traditional cooling methods mostly employ open or semi-open systems, which consume large amounts of water and pose potential environmental pollution risks. With increasing environmental awareness and rising water costs, the development of efficient and water-saving cooling technologies is urgently needed. Closed-loop water circulation systems, due to their unique advantages, are gradually becoming a research hotspot in the field of copper rod cooling.

[0003] While closed-loop water circulation systems are used in existing copper rod surface cooling devices, they still have many shortcomings. In the filtration stage, existing filter screens are not easy to disassemble and clean. Excessive impurities on the filter screen surface can affect water circulation. Furthermore, disassembly and cleaning during operation can cause copper shavings and colloidal impurities to fall into the circulating water, gradually accumulating in the cooling pipes and nozzles, leading to poor water flow, reduced cooling efficiency, and even equipment malfunction. Utility Model Content

[0004] Therefore, it is necessary to provide a copper rod surface cooling device to address the problem that the filter screen is inconvenient to disassemble for cleaning, or that disassembly and cleaning are required during the operation of the cooling device, which leads to copper shavings and colloidal impurities falling into the circulating water.

[0005] A copper rod surface cooling device includes: a cooling mechanism, the cooling mechanism including a mounting plate, a cooling box and a water spray assembly, the cooling box being fixedly disposed on the upper surface of the mounting plate;

[0006] The filtering mechanism includes a mounting frame, a filter screen, and a mounting assembly for quick assembly and disassembly of the mounting frame. Both the mounting frame and the filter screen are provided in two sets, with the two sets of filter screens disposed inside the corresponding mounting frame.

[0007] The cooling mechanism is used to cool the cooling water inside the cooling tank.

[0008] In one embodiment, the mounting assembly includes an extension plate, a spring plunger, and a snap-fit ​​block. Two sets of snap-fit ​​blocks are provided on both sides of the two sets of mounting frames, and the two sets of snap-fit ​​blocks are set as inclined blocks. The side of the snap-fit ​​block that contacts the mounting frame is the lower side, and the inner side of the cooling box is provided with a snap-fit ​​groove corresponding to the mounting frame and the snap-fit ​​block.

[0009] In one embodiment, two sets of extension plates are provided on the side of the two sets of mounting frames away from the cooling box, and the spring plunger is fixedly disposed on the upper surface of the extension plate. Pull rings are provided on the side of the two sets of mounting frames away from the cooling box.

[0010] In one embodiment, four sets of positioning plates are fixedly installed on one side of the cooling box, and the four sets of positioning plates are located above the corresponding mounting frames. The lower surface of the positioning plates is provided with positioning holes corresponding to the spring plungers.

[0011] In one embodiment, the water spray assembly includes a water pump, a water supply pipe, and spray heads. The water pump is bolted to the upper surface of the mounting plate, and several sets of spray heads are provided. The several sets of spray heads are sealed to the water pump through the water supply pipe.

[0012] In one embodiment, several sets of the spray nozzles are located inside the cooling tank, several sets of the spray nozzles are located above two sets of water pumps, and a copper rod is slidably arranged between the spray nozzles and the mounting frame.

[0013] In one embodiment, the cooling mechanism includes an immersion evaporator and a refrigeration structure. The immersion evaporator is disposed at the bottom of the cooling chamber, and the refrigeration structure is disposed on the upper surface of the mounting plate, and the refrigeration structure is sealed to the immersion evaporator.

[0014] In one embodiment, the side of the two sets of mounting frames away from the extension plate is set as an inclined surface, and the two sets of mounting frames do not contact the immersion evaporator.

[0015] Beneficial effects

[0016] 1. The above-mentioned copper rod surface cooling device, by setting two sets of mounting frames and filter screens, allows the upper mounting frame to be quickly removed for cleaning when there are too many impurities inside the upper filter screen through the mounting assembly. At this time, the lower filter screen continues to filter the impurities on the surface of the copper rod. After the upper filter screen is cleaned, it is put back into the cooling box. This facilitates the cleaning of impurities on the surface of the filter screen and solves the problem that the filter screen cannot be cleaned during the operation of the cooling device.

[0017] 2. The above-mentioned copper rod surface cooling device improves the cooling effect of the spray nozzles spraying water onto the copper rod by installing an immersion evaporator inside the cooling box, and the immersion evaporator, in conjunction with the refrigeration structure, cools the cooling water inside the cooling box. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is an exploded view of the overall structure of this utility model;

[0021] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 For the present utility model Figure 2 Front view;

[0023] Figure 5 This is a cross-sectional view of the cooling box of this utility model.

[0024] Reference numerals: 100, cooling mechanism; 200, filtration mechanism; 300, cooling system; 101, mounting plate; 102, water pump; 103, cooling tank; 104, water pipe; 105, spray nozzle; 201, mounting frame; 202, filter screen; 203, extension plate; 204, spring plunger; 205, snap-fit ​​block; 206, snap-fit ​​groove; 207, positioning plate; 208, positioning hole; 301, immersion evaporator; 302, refrigeration structure. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] The following is combined with Figures 1-5 This invention describes a copper rod surface cooling device.

[0027] In one embodiment, a copper rod surface cooling device includes: a cooling mechanism 100, which includes a mounting plate 101, a cooling box 103, and a water spray assembly. The cooling box 103 is fixedly disposed on the upper surface of the mounting plate 101. The water spray assembly includes a water pump 102, a water supply pipe 104, and a water spray head 105. The water pump 102 is bolted to the upper surface of the mounting plate 101. Several sets of water spray heads 105 are provided. The several sets of water spray heads 105 are sealed to the water pump 102 through the water supply pipe 104. The several sets of water spray heads 105 are located inside the cooling box 103 and above two sets of water pumps 102. A copper rod is slidably disposed between the water spray head 105 and the mounting frame 201.

[0028] In this embodiment, the water pump 102 is disposed on the upper surface of the mounting plate 101, and the water inlet is provided with a water suction pipe that seals and penetrates the cooling box 103. The water pump 102 draws out the cooling water from the bottom of the cooling box 103 and delivers it to the water spray head 105 through the water supply pipe 104. The water spray head 105 then sprays water to cool the copper rod below. The cooling box 103 is provided with a conveying mechanism on both sides to transport the copper rod, which does not affect the disassembly of the mounting frame 201.

[0029] like Figure 1 , Figure 2 and Figure 3 As shown, the filter mechanism 200 includes a mounting frame 201, a filter screen 202, and a mounting assembly for quick assembly and disassembly of the mounting frame 201. Both the mounting frame 201 and the filter screen 202 are provided in two sets, with the two sets of filter screens 202 located inside the corresponding mounting frame 201. The mounting assembly includes an extension plate 203, a spring plunger 204, and a snap-fit ​​block 205. Two sets of snap-fit ​​blocks 205 are provided on both sides of the two sets of mounting frames 201, and the two sets of snap-fit ​​blocks 205 are set as inclined blocks. The side of the snap-fit ​​block 205 that contacts the mounting frame 201 is the lower side, and the inner side of the cooling box 103 is provided with a snap-fit ​​groove 206 corresponding to the mounting frame 201 and the snap-fit ​​block 205.

[0030] In this embodiment, a filter screen 202 is installed inside the mounting frame 201 to filter impurities on the surface of the copper rod, preventing impurities from falling into the cooling box 103. By setting two sets of mounting frames 201 and filter screens 202, when there are too many impurities inside the upper filter screen 202, the upper mounting frame 201 can be quickly removed for cleaning using the mounting assembly. At this time, the lower filter screen 202 continues to filter impurities on the surface of the copper rod, thus solving the problem that the filter screen 202 cannot be cleaned during the operation of the cooling device. The mounting frame 201 is snapped into the cooling box 103 by the snap-fit ​​blocks 205 to ensure the stability of the mounting frame 201 inside the cooling box 103. The snap-fit ​​blocks 205 on both sides of the mounting frame 201 are tilted and snapped into the snap-fit ​​grooves 206. When the mounting frame 201 is pulled out, the water that enters the snap-fit ​​grooves 206 will flow into the cooling box 103 under the action of the tilted surface, thus preventing the cooling water from accumulating inside the snap-fit ​​grooves 206 and affecting the disassembly and assembly of the mounting frame 201.

[0031] like Figure 2 and Figure 3 As shown, each of the two sets of mounting frames 201 has two sets of extension plates 203 on the side away from the cooling box 103, and the spring plunger 204 is fixedly mounted on the upper surface of the extension plate 203. Each of the two sets of mounting frames 201 has a pull ring on the side away from the cooling box 103. Four sets of positioning plates 207 are fixedly mounted on one side of the cooling box 103, and the four sets of positioning plates 207 are located above the corresponding mounting frames 201. The lower surface of the positioning plate 207 has a positioning hole 208 corresponding to the spring plunger 204.

[0032] In this embodiment, when the mounting frame 201 is inserted into the cooling box 103, the mounting frame 201 drives the spring plunger 204 above the side extension plate 203 to move synchronously. After the mounting frame 201 is connected to the cooling box 103, the spring plunger 204 will be inserted into the positioning hole 208 on the side of the corresponding positioning plate 207, thereby positioning the mounting frame 201 and the cooling box 103, ensuring the stability of the mounting frame 201 inside the cooling box 103. The two sets of mounting frames 201 are located above the cooling water inside the cooling box 103, thereby preventing the cooling water from leaking when the mounting frame 201 is pulled out.

[0033] like Figure 1 , Figure 4 and Figure 5 As shown, the cooling mechanism 300 is used to cool the cooling water inside the cooling box 103. The cooling mechanism 300 includes an immersion evaporator 301 and a refrigeration structure 302. The immersion evaporator 301 is located at the bottom of the cooling box 103, and the refrigeration structure 302 is located on the upper surface of the mounting plate 101. The refrigeration structure 302 is sealed to the immersion evaporator 301. The side of the two sets of mounting frames 201 away from the extension plate 203 is set as an inclined surface, and the two sets of mounting frames 201 do not contact the immersion evaporator 301.

[0034] In this embodiment, the inner side of the mounting frame 201 is also set as an inclined surface to ensure that when the mounting frame 201 is pulled out, the snap-fit ​​groove 206 corresponding to the inner side of the mounting frame 201 will not accumulate water. The immersion evaporator 301 on the surface of the mounting plate 101 passes through the cooling box 103 through a connecting pipe and is connected to the immersion evaporator 301 inside the cooling box 103, thereby cooling the cooling water inside the cooling box 103 and improving the cooling effect of the spray head 105 spraying water to the copper rod.

[0035] Working principle: Water from inside the cooling tank 103 is pumped by water pump 102 and fed to the spray head 105 through water pipe 104. Water is then sprayed onto the copper rod below through the spray head 105 to cool it down. The immersion evaporator 301 and the refrigeration structure 302 work together to cool the water inside the cooling tank 103, preventing the water temperature inside the cooling tank 103 from rising and affecting the cooling effect. When there are too many impurities inside the upper filter screen 202, the filter screen 202 is pulled out through the mounting frame 201 to clean the impurities on the surface of the filter screen 202. At this time, the lower filter screen 202 continues to filter the impurities on the surface of the copper rod, preventing impurities from falling directly into the cooling water in the lower half of the cooling tank 103. Then, the upper filter screen 202 is quickly installed through the mounting component. Similarly, when the lower filter screen 202 is cleaned, the upper filter screen 202 will filter.

[0036] It should be noted that the water pump 102, the immersion evaporator 301, and the refrigeration structure 302 mentioned above are all devices with relatively mature existing technology. The specific models can be selected according to actual needs. At the same time, the water pump 102, the immersion evaporator 301, and the refrigeration structure 302 can be powered by the built-in power supply or by the mains power. The specific power supply method should be selected according to the situation, and will not be elaborated here.

[0037] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A copper rod surface cooling device, characterized in that, include: Cooling mechanism (100) includes mounting plate (101), cooling box (103) and water spray assembly, wherein the cooling box (103) is fixedly disposed on the upper surface of mounting plate (101); The filter mechanism (200) includes a mounting frame (201), a filter screen (202), and a mounting assembly for quick assembly and disassembly of the mounting frame (201). The mounting frame (201) and the filter screen (202) are provided in two sets, and the two sets of filter screens (202) are disposed inside the corresponding mounting frame (201). The cooling mechanism (300) is used to cool the cooling water inside the cooling tank (103); The mounting assembly includes an extension plate (203), a spring plunger (204), and a snap-fit ​​block (205). Two sets of snap-fit ​​blocks (205) are provided on both sides of the two sets of mounting frames (201), and the two sets of snap-fit ​​blocks (205) are set as inclined blocks. The side of the snap-fit ​​block (205) that contacts the mounting frame (201) is the lower side, and the inner side of the cooling box (103) is provided with a snap-fit ​​groove (206) corresponding to the mounting frame (201) and the snap-fit ​​block (205). Two sets of extension plates (203) are provided on the side of the two sets of mounting frames (201) away from the cooling box (103), and the spring plunger (204) is fixedly installed on the upper surface of the extension plate (203). Pull rings are provided on the side of the two sets of mounting frames (201) away from the cooling box (103).

2. The copper rod surface cooling device according to claim 1, characterized in that, Four sets of positioning plates (207) are fixedly installed on one side of the cooling box (103), and the four sets of positioning plates (207) are located above the corresponding mounting frame (201). The lower surface of the positioning plate (207) is provided with positioning holes (208) corresponding to the spring plunger (204).

3. The copper rod surface cooling device according to claim 1, characterized in that, The water spray assembly includes a water pump (102), a water supply pipe (104), and a water spray head (105). The water pump (102) is bolted to the upper surface of the mounting plate (101). Several sets of water spray heads (105) are provided, and the several sets of water spray heads (105) are sealed to the water pump (102) through the water supply pipe (104).

4. The copper rod surface cooling device according to claim 3, characterized in that, Several sets of the spray nozzles (105) are located inside the cooling box (103), and several sets of the spray nozzles (105) are located above two sets of water pumps (102). A copper rod is slidably arranged between the spray nozzles (105) and the mounting frame (201).

5. The copper rod surface cooling device according to claim 1, characterized in that, The cooling mechanism (300) includes an immersion evaporator (301) and a refrigeration structure (302). The immersion evaporator (301) is located at the bottom of the cooling box (103), and the refrigeration structure (302) is located on the upper surface of the mounting plate (101). The refrigeration structure (302) is sealed to the immersion evaporator (301).

6. The copper rod surface cooling device according to claim 5, characterized in that, The side of each of the two sets of mounting frames (201) away from the extension plate (203) is set as an inclined surface, and the two sets of mounting frames (201) do not contact the immersion evaporator (301).

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