Wafer thickness detection device

Abstract

The utility model relates to wafer thickness detection device relates to wafer thickness detection technical field, including frame, detection platform, object assembly, removal module, detection mechanism, vision mechanism, control system, detection platform is horizontally arranged on the frame, and object assembly is used for bearing the wafer of measuring, removal module is used for moving detection mechanism, detection mechanism includes fixed frame and lifting assembly, and fixed frame is connected with removal module, and lifting assembly installs in fixed frame, and vision mechanism installs in the frame top end, the utility model has wide detection range and is nimble, can according to wafer size automatic detection wafer thickness, the artificial cooperation of feeding and discharging link is close, and the operator controls the lift door through the pedal button etc. operation control, and the lift door opening and closing is controlled conveniently, and the equipment is automatically completed wafer identification, positioning and thickness measurement, and the operation efficiency is improved significantly.

Description

Technical Field

[0001] This utility model relates to the field of wafer thickness detection technology, and in particular to a wafer thickness detection device. Background Technology

[0002] In the field of semiconductor wafer thickness inspection, traditional inspection methods have many shortcomings. On the one hand, manual inspection relies on the experience and skill of the inspectors, which is not only inefficient but also prone to large errors due to human factors, making it difficult to guarantee the consistency and accuracy of the inspection results. On the other hand, some existing automated inspection equipment is either complex in structure, expensive, and difficult to maintain; or it cannot meet the high-precision production requirements in terms of inspection accuracy. For example, for the inspection of wafers with extremely high thickness accuracy requirements, the performance indicators of existing equipment, such as displacement sensor resolution and repeatability, do not meet the requirements, or the inspection range is limited and cannot flexibly adapt to the inspection of wafers of different sizes (such as 4-inch, 6-inch, etc.). At the same time, the lack of efficient and safe control methods in the loading and unloading process makes it easy for operational errors to occur, affecting the smoothness of the production process and posing certain safety hazards. In addition, the equipment is not strong enough to resist external environmental vibrations during operation, and factors such as floor vibration can easily interfere with the inspection accuracy. Furthermore, it is lacking in safety protection against dust and oil contamination, which may contaminate the inspected products and affect product quality. Utility Model Content

[0003] To overcome the technical defects of the existing technology, this utility model provides a wafer thickness detection device to solve the problems of complex structure or small inspection range of the existing automated detection equipment.

[0004] The technical solution adopted in this utility model is: a wafer thickness detection device, including a frame, a detection platform, a loading component, a moving module, a detection mechanism, a vision mechanism, and a control system; the control system is electrically connected to the moving module, the detection mechanism, and the vision mechanism, and is used to control the moving module, the detection mechanism, and the vision mechanism; The testing platform is horizontally mounted on the frame, and the loading component is installed on the testing platform. The loading component includes a base, and fixing blocks are symmetrically arranged on both sides of the upper end of the base for fixing a ceramic disc. The ceramic disc is loaded with a wafer. The mobile module is installed on the detection platform and is used to move the detection mechanism; The detection mechanism includes a fixed frame and a lifting assembly. The fixed frame is connected to the movable module, and the lifting assembly is installed inside the fixed frame. The vision mechanism is mounted on the top of the frame.

[0005] Preferably, the moving module includes an X-axis module, a Y-axis module, and a Z-axis module, wherein the Y-axis module is fixedly connected to the detection platform via a bracket, and the X-axis module is connected to the Y-axis module and the Z-axis module; The X-axis module is used to drive the detection mechanism to reciprocate in the X-axis direction, the Y-axis module is used to drive the detection mechanism to reciprocate in the Y-axis direction, and the Z-axis module is used to drive the detection mechanism to reciprocate in the Z-axis direction.

[0006] Preferably, the X-axis module includes a first mounting base, a first guide rail connected to the first mounting base, a first slider slidably connected to the first guide rail, and the X-axis module is also connected to a first driving member, which is used to drive the first slider to reciprocate along the X-axis direction. The Y-axis module includes a second mounting base, one side of which is connected to a bracket, and the other side is connected to a second guide rail. A second slider is slidably connected to the second guide rail. The Y-axis module is also connected to a second driving component, which is used to drive the second slider to reciprocate along the Y-axis direction. The Z-axis module includes a third mounting base, one side of which is connected to the first slider, and the other side is connected to a third guide rail. The third guide rail is slidably connected to the third slider. The Z-axis module is also connected to a third driving component, which is used to drive the third slider to reciprocate along the Z-axis direction.

[0007] Preferably, the fixed frame includes, from top to bottom, a fixed base, a first fixed plate, a first support column, a second fixed plate, a second support column, and a third fixed plate connected together; The fixed base is connected to the Z-axis module of the moving module, and the fixed base and the first fixed plate are connected by equal-height positioning columns, with springs sleeved on the equal-height positioning columns. The third fixing plate is connected to the first positioning pin and the first sensor; The lifting assembly includes a telescopic component and a lifting platform. The fixed end of the telescopic component is connected to the fixed base, and its extended end is connected to the lifting platform. A guide column is connected to the lifting platform, and the guide column is connected to the second fixed plate through a bearing. The lifting platform is also connected to a second positioning pin and a second sensor.

[0008] Preferably, the extension length of the first positioning pin is greater than the extension length of the second positioning pin; the tip of the first positioning pin is lower than the free end face of the first sensor probe; and the tip of the second positioning pin is lower than the free end face of the second sensor probe.

[0009] Preferably, the vision mechanism includes a CCD camera and a mounting bracket. The CCD camera is fixed to the top of the frame by the mounting bracket, and the camera head of the CCD camera faces the detection platform.

[0010] Preferably, a dust cover is fitted on the second guide rail, one side of which is connected to the second mounting base via a first connector, and the other side is connected to the second slider via a second connector.

[0011] Preferably, the detection mechanism further includes a protective housing, and the protective housing and the second mounting base are provided with an oil receiving tray.

[0012] Preferably, the wafer thickness detection device further includes a lifting door, a safety light curtain, indicator lights, and a foot pedal.

[0013] Preferably, the lifting door includes a door body, a lifting cylinder, and a third connecting member. The lifting cylinder is fixedly connected to the frame, and the lifting cylinder is connected to the door body through the third connecting member.

[0014] Compared with the prior art, the beneficial effects of this utility model are: This invention offers a wide and flexible detection range. By setting up a first and second positioning pin with corresponding sensors and combining them with a liftable detection mechanism, it can automatically detect the wafer thickness based on the wafer size. During the loading and unloading process, close cooperation between personnel and equipment is achieved. Operators control the lifting door via foot pedals, allowing for convenient opening and closing, while the equipment automatically completes wafer identification, positioning, and thickness measurement, significantly improving operational efficiency. Simultaneously, multiple safety protection measures, including safety light curtains, dust covers, oil trays, and rubber shock-absorbing pads, effectively prevent equipment misoperation, contamination, and external vibration interference, ensuring stable equipment operation and product quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the vision mechanism structure; Figure 3 This is a schematic diagram of the cargo carrier component structure; Figure 4 This is a schematic diagram of the mobile module structure; Figure 5 This is a schematic diagram of the testing mechanism. Figure 6 This is a schematic diagram of a lifting door structure; Explanation of reference numerals in the attached figures: 1. Rack; 2. Testing platform; 3. Loading assembly; 31. Base; 32. Fixing block; 33. Ceramic disc; 4. Moving module; 41. X-axis module; 42. Y-axis module; 43. Z-axis module; 44. Bracket; 411. First mounting base; 412. First guide rail; 413. First slider; 421. Second mounting base; 422. Second guide rail; 423. Second slider; 424. Dust cover; 425. First connector; 426. Second connector; 431. Third mounting base; 432. Third guide rail; 433. Third slider; 5. Detection mechanism; 51. Fixed frame; 52. Lifting assembly; 501. Fixed base; 502. First fixed plate; 503. First support column; 504. Second fixed plate; 505. Second support column; 506. Third fixed plate; 507. Equal height positioning column; 508. Spring; 509. First positioning pin; 510. First sensor; 511. Telescopic component; 512. Lifting platform; 513. Guide column; 514. Bearing; 515. Second positioning pin; 516. Second sensor; 6. Vision mechanism; 61. CCD camera; 62. Mounting bracket; 7. Control system; 8. Lifting door; 81. Door body; 82. Lifting cylinder; 83. Third connecting component; 9. Safety light curtain; 10. Indicator lights; 11. Foot pedal button. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0018] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The following is combined with Figures 1 to 6 As shown, this embodiment provides a wafer thickness detection device, including a frame 1, a detection platform 2, a loading assembly 3, a moving module 4, a detection mechanism 5, a vision mechanism 6, and a control system 7; the control system 7 is electrically connected to the moving module 4, the detection mechanism 5, and the vision mechanism 6, and is used to control the moving module 4, the detection mechanism 5, and the vision mechanism 6; The testing platform 2 is horizontally mounted on the frame 1, and the carrier component 3 is mounted on the testing platform 2 to carry the wafer to be tested. The carrier component 3 includes a base 31, and fixing blocks 32 are symmetrically arranged on both sides of the upper end of the base 31 to clamp and fix the ceramic disk 33, on which the wafer is loaded. The mobile module 4 is installed on the detection platform 2 and is used to move the detection mechanism 5. The detection mechanism 5 includes a fixed frame 51 and a lifting component 52. The fixed frame 51 is connected to the movable module 4, and the lifting component 52 is installed inside the fixed frame 51. like Figure 2 As shown, the vision mechanism 6 is installed on the top of the frame 1. The vision mechanism 6 includes a CCD camera 61 and a mounting bracket 62. The CCD camera 61 is fixed to the top of the frame 1 by the mounting bracket 62. The camera head of the CCD camera 61 faces the detection platform 2. The CCD camera 61 can read the QR code on the ceramic disk 33, determine the position of the first wafer, and transmit the information to the control system 7.

[0022] like Figure 4 As shown, the moving module 4 includes an X-axis module 41, a Y-axis module 42, and a Z-axis module 43. The Y-axis module 42 is fixedly connected to the detection platform 2 via a bracket 44, and the X-axis module 41 is connected to the Y-axis module 42 and the Z-axis module 43. Specifically, the X-axis module 41 is used to drive the detection mechanism 5 to reciprocate in the X-axis direction, the Y-axis module 42 is used to drive the detection mechanism 5 to reciprocate in the Y-axis direction, and the Z-axis module 43 is used to drive the detection mechanism 5 to reciprocate in the Z-axis direction.

[0023] Specifically, the X-axis module 41 includes a first mounting base 411, a first guide rail 412 connected to the first mounting base 411, a first slider 413 slidably connected to the first guide rail 412, and the X-axis module 41 is also connected to a first driving member, which is used to drive the first slider 413 to reciprocate along the X-axis direction. The Y-axis module 42 includes a second mounting base 421. One side of the second mounting base 421 is connected to the bracket 44, and the other side is connected to a second guide rail 422. The second guide rail 422 is slidably connected to a second slider 423. The Y-axis module 42 is also connected to a second driving member, which is used to drive the second slider 423 to reciprocate along the Y-axis direction. The Z-axis module 43 includes a third mounting base 431. One side of the third mounting base 431 is connected to the first slider 413, and the other side is connected to a third guide rail 432. The third guide rail 432 is slidably connected to the third slider 433. The Z-axis module 43 is also connected to a third driving member, which is used to drive the third slider 433 to reciprocate along the Z-axis direction.

[0024] The first driving component, the second driving component, and the third driving component can be servo motors, stepper motors, or linear motors.

[0025] like Figure 5 As shown, the fixed frame 51 includes, from top to bottom, a fixed base 501, a first fixed plate 502, a first support column 503, a second fixed plate 504, a second support column 505, and a third fixed plate 506 connected to each other. The fixed base 501 is connected to the Z-axis module 43 of the moving module 4, so that the detection mechanism 5 can move with the moving module 4. The fixed base 501 and the first fixed plate 502 are connected by a height-equal positioning column 507. The height-equal positioning column 507 is fitted with a spring 508, which is used to apply elastic buffer to the lifting component 52 during the detection process. The third fixed plate 506 is connected to the first positioning pin 509 and the first sensor 510. The lifting assembly 52 includes a telescopic member 511 and a lifting platform 512. The fixed end of the telescopic member 511 is connected to the fixed base 501, and its extended end is connected to the lifting platform 512. A guide column 513 is connected to the lifting platform 512. The guide column 513 is connected to the second fixed plate 504 through a bearing 514 to ensure that the lifting process is stable and without swaying. The lifting platform 512 is also connected to a second positioning pin 515 and a second sensor 516. Preferably, the telescopic member 511 is a cylinder.

[0026] The detection mechanism 5 in this embodiment can detect the thickness of wafers of different sizes, such as the thickness of 4-inch wafers and 6-inch wafers. The number of sensors can also be adjusted according to implementation requirements. Preferably, the first sensor 510 and the second sensor 516 are both contact-type LVDT displacement sensors; wherein, there are 3 first sensors 510 for measuring 6-inch wafers; and there are 13 second sensors 516, mainly for measuring 4-inch wafers, but also for measuring 6-inch wafers.

[0027] To ensure the stability and repeatability of the measurement reference, each thickness measurement involves three positioning pins of equal height contacting the reference surface of the ceramic disk 33 to construct a precise Z-axis reference plane, i.e., a zero height point. Therefore, the extension length of the first positioning pin 509 is greater than that of the second positioning pin 515, meaning the tips of the first and second positioning pins 509 are at different heights in the Z-axis direction: when the lifting platform 512 is at a high position, the tip of the first positioning pin 509 is below the tip of the second positioning pin 515; when the lifting platform 512 descends to a low position, the tip of the second positioning pin 515 can be lowered below the tip of the first positioning pin 509, thus adapting to the reference switching requirements for different wafer sizes.

[0028] Furthermore, the tips of all positioning pins are located below the free end face of their corresponding sensor probes in the free state before contacting the workpiece, thereby ensuring that during the overall downward movement of the detection mechanism 5, the positioning pins first contact the surface of the ceramic disk 33 to establish a reference, and then the sensor probes continue to move downward and contact the upper surface of the wafer.

[0029] Specifically, there are three of each of the first positioning pins 509 and the second positioning pins 515. The tip of the first positioning pin 509 is lower than the free end face of the probe of the first sensor 510; the tip of the second positioning pin 515 is also lower than the free end face of the probe of the second sensor 516. When the lifting platform 512 is in a high position, the free end faces of the probes of the first sensor 510 and the second sensor 516 are at the same height.

[0030] During thickness measurement, three positioning pins of equal height first lightly touch the reference surface of the ceramic disk 33, jointly establishing a precise and stable Z-axis measurement reference plane, i.e., the zero height point. Subsequently, the sensor's probe continues to extend downwards, contacting the upper surface of the wafer and generating slight compression. The control system 7 uses the reference surface determined by the positioning pins as the starting point, and measures the height of the wafer surface relative to this reference surface through the sensor, thereby calculating the wafer thickness. This design ensures consistent starting conditions for each measurement and prevents overpressure of the sensor through mechanical limits, effectively guaranteeing the repeatability and safety of the measurement.

[0031] Specifically, when measuring a 6-inch wafer, the telescopic component 511 is not extended, and the lifting platform 512 remains in a high position. Because the tip of the first positioning pin 509 is lower, it contacts the surface of the ceramic disk 33 first, and the three first positioning pins 509 together establish a zero point in the Z-direction height. The tip of the second positioning pin 515 is higher and does not touch the ceramic disk 33, remaining suspended and not participating in the reference establishment. After the reference is established, the probes of the first sensor 510 and the second sensor 516 contact the upper surface of the 6-inch wafer downwards. At this time, although the second positioning pin 515 is not in contact, all sensors use the previously established reference surface constructed by the first positioning pins 509 as the starting point for measurement to complete the thickness measurement.

[0032] When measuring a 4-inch wafer, the telescopic component 511 extends, causing the lifting platform 512 to descend. At this time, the second positioning pin 515 descends synchronously with the lifting platform 512, and its tip contacts the surface of the ceramic disk 33. The three second positioning pins 515 together establish a new Z-axis height zero point. The first positioning pin 509, because it is fixed to the upper structure, has its tip above the surface of the ceramic disk 33 and is in a suspended state, not participating in the establishment of this reference. Subsequently, the second sensor 516 contacts the upper surface of the 4-inch wafer to complete the thickness detection.

[0033] To further ensure the safety of the equipment operating environment and personnel, a dust cover 424 is fitted on the second guide rail 422. One side of the dust cover 424 is connected to the second mounting base 421 through the first connector 425, and the other side is connected to the second slider 423 through the second connector 426. The dust cover 424 is a telescopic structure. When the second slider 423 moves along the second guide rail 422, the dust cover 424 extends or folds synchronously, thereby preventing dust and debris from entering and effectively ensuring the operating accuracy and service life of the Y-axis module 42.

[0034] The testing mechanism 5 also includes a protective housing. The protective housing and the second mounting base 421 are provided with an oil receiving tray to prevent oil and other impurities from seeping into the product area and causing wafer contamination.

[0035] The wafer thickness detection device also includes a lifting door 8, a safety light curtain 9, an indicator light 10, and a foot pedal button 11; The lifting door 8 includes a door body 81, a lifting cylinder 82, and a third connecting member 83. The lifting cylinder 82 is fixedly connected to the frame 1, and the lifting cylinder 82 is connected to the door body 81 through the third connecting member 83, so that the lifting cylinder 82 can drive the door body 81 to rise or fall when it extends or retracts.

[0036] The safety light curtain 9 can be installed inside or outside the frame 1; when the lifting door 8 is accidentally opened, the safety light curtain 9 immediately triggers an emergency stop signal, cuts off the power source of the equipment, and ensures the personal safety of the operators.

[0037] The foot pedal 11 is electrically connected to the control system 7 and is used to send commands to the control system 7. Specifically, the lifting cylinder 82 of the lifting door 8 is connected to the control system 7 through a solenoid valve. The control system 7 controls the extension and retraction of the lifting cylinder 82 according to the trigger state of the foot pedal 11, thereby realizing the automatic opening and closing of the lifting door 8. When the detection is completed, the yellow light of the thickness gauge illuminates and a buzzer alarm sounds; the manual pedal is pressed twice to raise the lifting door 8 and the wafer thickness detection device stops working; the manual removes the ceramic disc 33 and puts the undetected ceramic disc 33 into the wafer thickness detection device; the manual pedal is pressed twice to lower the lifting door 8 and the wafer thickness detection device can start working again.

[0038] To prevent ground vibration from affecting the detection accuracy of the thickness gauge, steel plates can be laid on the ground in the area where the wafer thickness detection device is located, and rubber vibration damping pads can be added at the feet of the frame 1. The working process of this utility model is as follows: after the operator places the ceramic disk 33 loaded with wafers on the ceramic disk 33 carrier, he steps on the foot pedal button 11 twice in succession, the lifting door 8 closes automatically, and the equipment starts; The vision module then images the ceramic disk 33, reads the QR code or identification information, identifies the chip type (4-inch or 6-inch), batch and first chip location, and transmits the data to the control system 7. The control system 7 drives the moving module 4 to move the detection mechanism 5 precisely above the first wafer; and performs the corresponding thickness measurement process according to the wafer size. If it is a 6-inch wafer, the lifting component 52 is kept in a high position, and the first positioning pin 509 lightly touches the ceramic disk 33 to establish a Z-axis reference plane. The three first sensors 510 and the thirteen second sensors 516 jointly contact the wafer surface to complete the measurement. If it is a 4-inch wafer, the telescopic component 511 drives the lifting platform 512 to descend, and the second positioning pin 515 establishes a new Z-axis reference plane. The thirteen second sensors 516 contact the wafer surface to complete the measurement. All sensors use the reference plane established by the positioning pin as the zero point to collect displacement data in real time. The control system 7 calculates the thickness at each point based on this data and automatically determines whether it is NG and the defect category. The system completes the inspection of the entire wafer in a preset order, archives the data in real time and uploads it to the server. After the test is completed, indicator light 10 will light up and a buzzer will sound. The operator will then press the foot pedal button 11 twice again, raising the lifting door 8. The tested ceramic disc 33 will be removed and replaced with a new disc. The operation can be repeated to enter the next test cycle. Throughout the process, multiple safety protection measures, such as the safety light curtain 9, dust cover 424, oil receiving tray, and rubber anti-vibration pads, effectively prevent equipment misoperation, contamination, and external vibration interference, ensuring stable equipment operation and product quality. At the same time, the system can automatically trigger the calibration module according to the number of tests or time cycle to periodically calibrate the test accuracy and ensure measurement reliability.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer thickness detection device, characterized in that, It includes a frame (1), a detection platform (2), a loading component (3), a moving module (4), a detection mechanism (5), a vision mechanism (6), and a control system (7); the control system (7) is electrically connected to the moving module (4), the detection mechanism (5), and the vision mechanism (6) and is used to control the moving module (4), the detection mechanism (5), and the vision mechanism (6). The detection platform (2) is horizontally mounted on the frame (1), and the loading component (3) is mounted on the detection platform (2). The loading component (3) includes a base (31), and fixing blocks (32) are symmetrically arranged on both sides of the upper end of the base for fixing ceramic discs (33). The ceramic discs (33) are loaded with wafers. The mobile module (4) is installed on the detection platform (2) and is used to move the detection mechanism (5). The detection mechanism (5) includes a fixed frame (51) and a lifting component (52). The fixed frame (51) is connected to the moving module (4), and the lifting component (52) is installed inside the fixed frame (51). The vision mechanism (6) is mounted on the top of the frame (1).

2. The wafer thickness detection device according to claim 1, characterized in that, The mobile module (4) includes an X-axis module (41), a Y-axis module (42) and a Z-axis module (43), wherein the Y-axis module (42) is fixedly connected to the detection platform (2) via a bracket (44), and the X-axis module (41) is connected to the Y-axis module (42) and the Z-axis module (43); The X-axis module (41) is used to drive the detection mechanism (5) to reciprocate in the X-axis direction, the Y-axis module (42) is used to drive the detection mechanism (5) to reciprocate in the Y-axis direction, and the Z-axis module (43) is used to drive the detection mechanism (5) to reciprocate in the Z-axis direction.

3. The wafer thickness detection device according to claim 2, characterized in that, The X-axis module (41) includes a first mounting base (411), a first guide rail (412) is connected to the first mounting base (411), a first slider (413) is slidably connected to the first guide rail (412), and the X-axis module (41) is also connected to a first driving member, which is used to drive the first slider (413) to reciprocate along the X-axis direction. The Y-axis module (42) includes a second mounting base (421), one side of which is connected to the bracket (44), and the other side is connected to a second guide rail (422). The second guide rail (422) is slidably connected to a second slider (423). The Y-axis module (42) is also connected to a second driving member, which is used to drive the second slider (423) to reciprocate along the Y-axis direction. The Z-axis module (43) includes a third mounting base (431), one side of which is connected to the first slider (413), and the other side is connected to a third guide rail (432). The third guide rail (432) is slidably connected to the third slider (433). The Z-axis module (43) is also connected to a third driving member, which is used to drive the third slider (433) to reciprocate along the Z-axis direction.

4. The wafer thickness detection device according to claim 1, characterized in that, The fixed frame (51) includes, from top to bottom, a fixed base (501), a first fixed plate (502), a first support column (503), a second fixed plate (504), a second support column (505), and a third fixed plate (506) connected to each other. The fixed base (501) is connected to the Z-axis module (43) of the moving module (4). The fixed base (501) and the first fixed plate (502) are connected by a height positioning column (507). The height positioning column (507) is fitted with a spring (508). The third fixing plate (506) is connected to the first positioning pin (509) and the first sensor (510). The lifting assembly (52) includes a telescopic member (511) and a lifting platform (512). The fixed end of the telescopic member (511) is connected to the fixed seat (501), and its extended end is connected to the lifting platform (512). A guide column (513) is connected to the lifting platform (512), and the guide column (513) is connected to the second fixed plate (504) through a bearing (514). The lifting platform (512) is also connected to a second positioning pin (515) and a second sensor (516).

5. The wafer thickness detection device according to claim 4, characterized in that, The extension length of the first positioning pin (509) is greater than the extension length of the second positioning pin (515); the tip of the first positioning pin (509) is lower than the free end face of the probe of the first sensor (510); the tip of the second positioning pin (515) is lower than the free end face of the probe of the second sensor (516).

6. The wafer thickness detection device according to claim 1, characterized in that, The vision mechanism (6) includes a CCD camera (61) and a mounting bracket (62). The CCD camera (61) is fixed to the top of the frame (1) by the mounting bracket (62), and the camera head of the CCD camera (61) faces the detection platform (2).

7. The wafer thickness detection device according to claim 3, characterized in that, A dust cover (424) is fitted on the second guide rail (422). One side of the dust cover (424) is connected to the second mounting base (421) through the first connector (425), and the other side is connected to the second slider (423) through the second connector (426).

8. The wafer thickness detection device according to claim 3, characterized in that, The detection mechanism (5) also includes a protective housing, and the protective housing and the second mounting base (421) are provided with an oil receiving tray.

9. The wafer thickness detection device according to claim 1, characterized in that, The wafer thickness detection device also includes a lifting door (8), a safety light curtain (9), an indicator light (10), and a foot pedal button (11).

10. The wafer thickness detection device according to claim 9, characterized in that, The lifting door (8) includes a door body (81), a lifting cylinder (82) and a third connecting member (83). The lifting cylinder (82) is fixedly connected to the frame (1), and the lifting cylinder (82) is connected to the door body (81) through the third connecting member (83).

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