Wafer profilometer
Patent Information
- Application Number
- CN202522526114.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-11-28
AI Technical Summary
[0003]本申请在现有技术下进行改进，现有技术中，现有的晶圆轮廓测量装置在实际使用中，大多为接触式或者采用显微镜进行图像检测，以上两种方式对晶圆的检测还存在一定局限性，难以实现对大批量的晶圆进行测量，测量效率较低
通过显示屏、控制面板、吸盘、吸嘴、L型限位块、转板、伺服电机、第一传动块、第一相机、真空泵、升降板、正反电机、传动螺杆、横杆、螺纹块和第二相机的结构设计，可以实现对大批量的晶圆进行轮廓测量，操作简单，测量效率高，解决了现有的晶圆轮廓测量装置在实际使用中，大多为接触式或者采用显微镜进行图像检测，以上两种方式对晶圆的检测还存在一定局限性，难以实现对大批量的晶圆进行测量，测量效率较低的问题；
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Figure CN224757777U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of measurement device technology, specifically a wafer profile measurement device. Background Technology
[0002] Wafer manufacturing process: Broadly speaking, wafer manufacturing includes two main steps: ingot manufacturing and wafer manufacturing. It can be further subdivided into the following main processes (ingot manufacturing only includes the first process below, and the rest are all wafer manufacturing, so they are sometimes collectively referred to as post-silicon slicing processing processes): ingot growth - ingot cutting and inspection - outer diameter grinding - slicing - edge rounding - surface grinding - etching - defect removal - polishing - cleaning - inspection - packaging. Among the above processes, the inspection of the polished wafer is particularly important. After the polishing process, the wafer needs to be inspected for its appearance (thickness, angle, depth, etc.), especially for wafers with notches or gaps.
[0003] This application improves upon the existing technology. In practical use, most existing wafer contour measurement devices are contact-type or use microscopes for image inspection. Both of these methods have certain limitations in wafer inspection, making it difficult to measure large quantities of wafers and resulting in low measurement efficiency.
[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0005] The purpose of this invention is to provide a wafer profile measurement device to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer contour measuring device, comprising a worktable, with legs fixedly connected to the four corners of the bottom of the worktable, a servo motor mounted on the right side of the bottom of the worktable, a rotating plate fixedly connected to the output end of the servo motor, a vacuum pump mounted on the bottom of the rotating plate, a suction cup fixedly connected to the input end of the vacuum pump, multiple suction nozzles fixedly disposed on the top of the suction cup, multiple L-shaped limiting blocks fixedly disposed on the top of the rotating plate, second cameras disposed at both ends of the rotating plate, and a vertical plate fixedly connected to the top of the worktable. A control panel is fixedly installed on the upper surface of the workbench at the front of the vertical plate, and a storage box is fixedly connected to the upper surface of the workbench at the rear of the vertical plate. A display screen is installed on the front face of the vertical plate. A lifting plate is movably arranged on the right side of the vertical plate, and a forward and reverse motor is installed on the right side of the lifting plate. A transmission screw is fixedly connected to the output end of the forward and reverse motor. A threaded block is threaded on the outer wall of the transmission screw. A crossbar is movably arranged through the surface of the threaded block. A first transmission block is fixedly connected to the bottom of the threaded block, and a first camera is fixedly installed at the bottom of the first transmission block.
[0007] As a further embodiment of this utility model: the upper surface of the vertical plate is provided with a plurality of positioning screw holes in a ring array, a rotating plate is rotatably arranged above the positioning screw holes, a positioning screw is movably arranged through the surface of the rotating plate, and one end of the positioning screw is threaded into the interior of one of the positioning screw holes.
[0008] As a further embodiment of this utility model: a lifting screw is fixedly connected to the bottom of the rotating plate via a transmission rod, and a moving block is threaded onto the outer wall of the lifting screw.
[0009] As a further embodiment of this utility model: a vertical rod is movably provided through the surface of the movable block, a second transmission block is fixedly connected to the right side of the movable block, and one end of the second transmission block is fixedly connected to the outer wall of the lifting plate.
[0010] As a further embodiment of this utility model: a sleeve is provided below the second camera, and a movable block is movably provided inside the sleeve. Multiple adjustment holes are linearly arrayed on the outer wall of the movable block, and an adjustment screw is threaded onto the inner wall of one of the adjustment holes.
[0011] As a further embodiment of this utility model: a fixing plate is fixedly connected to the top of the movable block, and the top of the fixing plate is fixedly connected to the bottom of the second camera.
[0012] This utility model has the following beneficial effects: Through the structural design of the display screen, control panel, suction cup, suction nozzle, L-shaped limit block, rotating plate, servo motor, first transmission block, first camera, vacuum pump, lifting plate, forward and reverse motor, transmission screw, crossbar, threaded block and second camera, it is possible to perform contour measurement on a large number of wafers. The operation is simple and the measurement efficiency is high. It solves the problem that most existing wafer contour measurement devices are contact type or use microscopes for image detection in actual use. The above two methods still have certain limitations in wafer detection, making it difficult to measure a large number of wafers and resulting in low measurement efficiency. The structural design of the rotating plate, positioning screw, positioning screw hole, vertical plate, adjusting screw, sleeve, movable block, fixed plate, vertical rod, moving block, lifting screw and adjusting hole makes it easy to adjust the height position of the first camera, thereby facilitating the acquisition of chamfer, appearance contour and angle information of the wafer slot, and also makes it easy to adjust the height position of the second camera, thereby facilitating the acquisition of wafer thickness and depth. Attached Figure Description
[0013] Figure 1 This is a partial three-dimensional schematic diagram of the overall structure of this utility model; Figure 2 This is a partial side view of the structure of this utility model; Figure 3 This is a top view of a partial structure of the present invention; Figure 4 This is a partial structural diagram of the transmission screw, which is the main feature of this utility model. Figure 5 This is a partial structural diagram of the lifting screw, which is the main feature of this utility model.
[0014] In the diagram: 1. Rotating plate; 2. Positioning screw; 3. Positioning screw hole; 4. Vertical plate; 5. Storage box; 6. Display screen; 7. Workbench; 8. Control panel; 9. Suction cup; 10. Suction nozzle; 11. L-shaped limit block; 12. Rotating plate; 13. Servo motor; 14. Support leg; 15. First transmission block; 16. First camera; 17. Vacuum pump; 18. Lifting plate; 19. Forward and reverse motor; 20. Second transmission block; 21. Adjusting screw; 22. Sleeve; 23. Movable block; 24. Fixed plate; 25. Transmission screw; 26. Horizontal bar; 27. Threaded block; 28. Second camera; 29. Vertical bar; 30. Moving block; 31. Lifting screw; 32. Adjusting hole. Detailed Implementation
[0015] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of this utility model in any way.
[0016] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0017] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0018] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0019] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0020] Please see Figure 1-5This utility model provides an embodiment of a wafer contour measuring device, including a worktable 7. Support legs 14 are fixedly connected to the four corners of the bottom of the worktable 7. A servo motor 13 is installed on the right side of the bottom of the worktable 7. A rotating plate 12 is fixedly connected to the output end of the servo motor 13. A vacuum pump 17 is installed at the bottom of the rotating plate 12. A suction cup 9 is fixedly connected to the input end of the vacuum pump 17. Multiple suction nozzles 10 are fixedly arranged on the top of the suction cup 9. Multiple L-shaped limiting blocks 11 are fixedly arranged on the top of the rotating plate 12. Second cameras 28 are arranged at both ends of the rotating plate 12. A vertical plate 4 is fixedly connected to the top of the worktable 7. A control panel 8 is fixedly installed on the upper surface of the workbench 7 at the front. A storage box 5 is fixedly connected to the upper surface of the workbench 7 behind the vertical plate 4. A display screen 6 is installed on the front face of the vertical plate 4. A lifting plate 18 is movably arranged on the right side of the vertical plate 4. A forward and reverse motor 19 is installed on the right side of the lifting plate 18. A transmission screw 25 is fixedly connected to the output end of the forward and reverse motor 19. A threaded block 27 is threaded on the outer wall of the transmission screw 25. A crossbar 26 is movably arranged through the surface of the threaded block 27. A first transmission block 15 is fixedly connected to the bottom of the threaded block 27. A first camera 16 is fixedly installed at the bottom of the first transmission block 15. Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in use, when it is necessary to measure the contour of the wafer, the wafer is placed on the suction nozzle 10, and then the vacuum pump 17 is started by operating the control panel 8. The vacuum pump 17 generates suction to hold the wafer. Then, the servo motor 13 is started by operating the control panel 8. The output of the servo motor 13 drives the rotating plate 12 to rotate slowly. The first camera 16 can collect images of the chamfer, appearance contour, and angle information of the wafer's notch. During this process, the output of the forward and reverse motor 19 drives the transmission screw 25 to rotate. The rotation of the transmission screw 25 drives the threaded block 27 to move. The movement of the threaded block 27 drives the first camera 16 to rotate through the first transmission block 15. By controlling the output of the forward and reverse motor 19 to follow a certain pattern... By performing forward and reverse rotation, the first camera 16 can reciprocate horizontally, thereby improving measurement accuracy. The second camera 28 can also acquire images of wafer thickness, depth, and other information, comparing the acquired information with the original data. After comparison, the information is transmitted to the display screen 6 for easy viewing by staff, thus completing the wafer contour measurement. The operation is simple, enabling the measurement of large batches of wafers with high efficiency. This solves the problem that existing wafer contour measurement devices mostly rely on contact or microscope image inspection, which have limitations in wafer inspection, making it difficult to measure large batches of wafers and resulting in low measurement efficiency.
[0021] The upper surface of the vertical plate 4 has multiple positioning screw holes 3 arranged in a ring array. A rotating plate 1 is rotatably arranged above the positioning screw holes 3. A positioning screw 2 is movably arranged through the surface of the rotating plate 1, and one end of the positioning screw 2 is threaded into the interior of one of the positioning screw holes 3. The bottom of the rotating plate 1 is fixedly connected to a lifting screw 31 through a transmission rod. A moving block 30 is threadedly installed on the outer wall of the lifting screw 31. A vertical rod 29 is movably arranged through the surface of the moving block 30. A second transmission block 20 is fixedly connected to the right side of the moving block 30, and one end of the second transmission block 20 is fixedly connected to the outer wall of the lifting plate 18 close to it. A sleeve 22 is arranged below the second camera 28. A movable block 23 is movably arranged inside the sleeve 22. Multiple adjustment holes 32 are arranged in a linear array on the outer wall of the movable block 23. An adjustment screw 21 is threadedly installed on the inner wall of one of the adjustment holes 32. A fixed plate 24 is fixedly connected to the top of the movable block 23, and the top of the fixed plate 24 is fixedly connected to the bottom of the second camera 28. Specifically, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in use, rotating the rotating plate 1 causes the lifting screw 31 to rotate via the transmission rod. The rotation of the lifting screw 31 causes the moving block 30 to move. The movement of the moving block 30 causes the lifting plate 18 to move via the second transmission block 20. The movement of the lifting plate 18 causes the first camera 16 to move. After the height position of the first camera 16 is adjusted, one end of the positioning screw 2 is passed through the rotating plate 1 and screwed into the matching positioning screw hole 3 to fix the rotating plate 1, thereby preventing the first camera 16 from moving. By facilitating the adjustment of the height position of the first camera 16, it is convenient to collect information on the chamfer, appearance contour, and angle of the wafer slot. Furthermore, by adjusting the screw 21 to fit the adjustment hole 32 at different positions, the length of the movable block 23 inside the sleeve 22 can be adjusted, thereby adjusting the height of the second camera 28. By facilitating the adjustment of the height position of the second camera 28, it is convenient to collect information on the thickness and depth of the wafer.
[0022] Working Principle: In this application, when it is necessary to measure the contour of a wafer, the wafer is placed on the suction nozzle 10. Then, the control panel 8 is operated to start the vacuum pump 17, which generates suction to hold the wafer. The control panel 8 is then operated to start the servo motor 13, which drives the rotating plate 12 to rotate slowly. The first camera 16 can collect images of the chamfer, outline, and angle information of the wafer's notch. During this process, the output of the forward and reverse motor 19 drives the transmission screw 25 to rotate. The rotation of the transmission screw 25 moves the threaded block 27, which in turn drives the first camera 16 to rotate via the first transmission block 15. By controlling the output of the forward and reverse motor 19 to rotate in a certain pattern, the first camera 16 can reciprocate horizontally, thereby improving the measurement accuracy. Furthermore, the second camera 28 can collect images of the wafer's thickness, depth, and other information. The collected information is compared with the original data, and the comparison information is transmitted to the display screen 6 after comparison, facilitating further processing by the operator. The wafer profile can be measured by observing the wafers. The operation is simple and can measure a large number of wafers with high efficiency. Secondly, by rotating the rotating plate 1, the rotation of the rotating plate 1 drives the lifting screw 31 to rotate via the transmission rod. The rotation of the lifting screw 31 drives the moving block 30 to move. The movement of the moving block 30 drives the lifting plate 18 to move via the second transmission block 20. The movement of the lifting plate 18 drives the first camera 16 to move. After the height position of the first camera 16 is adjusted, one end of the positioning screw 2 is passed through the rotating plate 1 and screwed into the matching positioning screw. The screw hole 3 is used to fix the rotating plate 1, thereby preventing the first camera 16 from moving. By adjusting the height of the first camera 16, it is convenient to collect information on the chamfer, appearance contour and angle of the wafer slot. Furthermore, by adjusting the screw 21 to fit the adjustment hole 32 at different positions, the length of the movable block 23 inside the sleeve 22 can be adjusted, thereby adjusting the height of the second camera 28. By adjusting the height of the second camera 28, it is convenient to collect information on the thickness and depth of the wafer.
[0023] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. At the same time, the electrical components mentioned in this application are all connected to an external power supply and control switch when in use. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art, which is common knowledge in the field. Therefore, this utility model will not explain the control method and circuit connection in detail. Moreover, the external controller mentioned in the specification can play a control role for the electrical components mentioned in this article, and the external controller is a conventional known device.
[0024] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0025] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above are only preferred embodiments of this utility model. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this utility model, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the protection scope of this utility model.
Claims
1. A wafer profile measuring device, comprising a worktable (7), characterized in that: Support legs (14) are fixedly connected to the four corners of the bottom of the workbench (7). A servo motor (13) is installed on the right side of the bottom of the workbench (7). A rotating plate (12) is fixedly connected to the output end of the servo motor (13). A vacuum pump (17) is installed at the bottom of the rotating plate (12). A suction cup (9) is fixedly connected to the input end of the vacuum pump (17). Multiple suction nozzles (10) are fixedly installed on the top of the suction cup (9). Multiple L-shaped limit blocks (11) are fixedly installed on the top of the rotating plate (12). Second cameras (28) are installed at both ends of the rotating plate (12). A vertical plate (4) is fixedly connected to the top of the workbench (7). The front of the vertical plate (4) is fixedly installed on the upper surface of the workbench (7). There is a control panel (8). A storage box (5) is fixedly connected to the upper surface of the workbench (7) behind the vertical plate (4). A display screen (6) is installed on the front end of the vertical plate (4). A lifting plate (18) is movably arranged on the right side of the vertical plate (4). A forward and reverse motor (19) is installed on the right side of the lifting plate (18). A transmission screw (25) is fixedly connected to the output end of the forward and reverse motor (19). A threaded block (27) is threaded on the outer wall of the transmission screw (25). A crossbar (26) is movably arranged through the surface of the threaded block (27). A first transmission block (15) is fixedly connected to the bottom of the threaded block (27). A first camera (16) is fixedly installed at the bottom of the first transmission block (15).
2. The wafer profile measuring device according to claim 1, characterized in that: The upper surface of the vertical plate (4) is provided with a plurality of positioning screw holes (3) arranged in a ring array. A rotating plate (1) is rotatably arranged above the positioning screw holes (3). A positioning screw (2) is movably arranged through the surface of the rotating plate (1), and one end of the positioning screw (2) is threadedly installed inside one of the positioning screw holes (3).
3. The wafer profile measuring device according to claim 2, characterized in that: The bottom of the rotating plate (1) is fixedly connected to a lifting screw (31) via a transmission rod, and a moving block (30) is threaded onto the outer wall of the lifting screw (31).
4. The wafer profile measuring device according to claim 3, characterized in that: A vertical rod (29) is movably provided through the surface of the movable block (30). A second transmission block (20) is fixedly connected to the right side of the movable block (30), and one end of the second transmission block (20) is fixedly connected to the outer wall of the lifting plate (18).
5. The wafer profile measuring device according to claim 1, characterized in that: A sleeve (22) is provided below the second camera (28). A movable block (23) is movably provided inside the sleeve (22). Multiple adjustment holes (32) are linearly arrayed on the outer wall of the movable block (23). An adjustment screw (21) is threaded onto the inner wall of one of the adjustment holes (32).
6. The wafer profile measuring device according to claim 5, characterized in that: The top of the movable block (23) is fixedly connected to a fixing plate (24), and the top of the fixing plate (24) is fixedly connected to the bottom of the second camera (28).