A multi-size wafer frame flatness detection jig

Abstract

The utility model discloses a kind of multi-size wafer frame flatness detection fixture, including base, and detection platform is arranged on the top of base;The middle part of detection platform is provided with through-hole, and the width of through-hole is less than the width of wafer frame body to be detected;Detection platform includes first detection mechanism, second detection mechanism, third detection mechanism, fourth detection mechanism, which are stacked together and the outside is cuboid type.The first detection mechanism, second detection mechanism, third detection mechanism, fourth detection mechanism structure is same, length decreases gradually;First detection mechanism is provided with detection groove;The width of detection groove is 1mm greater than the width of wafer frame to be detected, and the height of detection groove is the sum of the height of wafer frame to be detected and acceptable deformation height.The utility model has the advantages of low investment cost, high detection efficiency and high detection accuracy, and can detect multiple specifications of wafer frame, avoid unqualified frame into next process, and improve production yield.

Description

Technical Field

[0001] This utility model relates to the field of wafer packaging technology, and more specifically to a multi-size wafer frame flatness testing fixture. Background Technology

[0002] A wafer frame is a box specifically designed to hold and protect wafers, typically made of high-strength, corrosion-resistant materials. The wafer frame has symmetrical grooves with strictly uniform dimensions designed to support the wafers on both sides, keeping them stable within the box and preventing them from sliding. This ensures stability and safety during processing, transportation, and storage.

[0003] The wafer cassette comes into direct contact with high-value wafers, making its cleanliness and flatness crucial. Introducing contaminants or causing cassette deformation can fatally damage the wafer. Therefore, wafer cassettes must undergo rigorous visual inspections before and after each use, including flatness, surface, and edge checks. Uneven cassettes lead to uneven stress on the wafer; when robotic arms pick up and place wafers or when equipment clamps them, stress concentrates on the raised areas of the cassette, easily causing cracks or even complete shattering of the fragile wafer.

[0004] Current inspection methods include: 1) Non-contact optical inspection using lasers, which has the disadvantages of high equipment cost and large investment. 2) Placing the wafer frame on a flat surface and measuring the warpage using calipers, which requires skilled operators to ensure the stability and accuracy of the measurement, and has the disadvantages of slow speed and unsuitability for large-scale full inspection. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a multi-size wafer frame flatness testing fixture to solve the problems in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows.

[0007] A multi-size wafer frame flatness testing fixture includes a base, with a testing platform for testing the flatness of the wafer frame disposed on the base. A rectangular through-hole, longitudinally penetrating the testing platform, is provided in the center of the testing platform for observing the wafer frame, and the width of the through-hole is smaller than the width of the wafer frame to be tested. The testing platform includes four stacked, rectangular testing mechanisms: a first testing mechanism, a second testing mechanism, a third testing mechanism, and a fourth testing mechanism. These four mechanisms have identical structures, with their lengths decreasing sequentially. A rectangular testing groove, penetrating the front and rear ends, is provided on the first testing mechanism. The width of the testing groove is 1 mm larger than the width of the wafer frame to be tested, and the height of the testing groove is the sum of the height of the wafer frame to be tested and the acceptable deformation height.

[0008] To further optimize the technical solution, the base includes a horizontally arranged rectangular panel, with vertically arranged brackets connected to the corners of the bottom surface of the horizontal panel, and horizontally arranged crossbeams connecting adjacent brackets.

[0009] The technical solution has been further optimized, and the base is made of stainless steel.

[0010] The technical solution is further optimized by reducing the length of the first, second, third, and fourth testing mechanisms by 2 cm in sequence, with the length of the first testing mechanism being 2 cm shorter than the length of the horizontal panel; the rear ends of the horizontal panel, the first, second, third, and fourth testing mechanisms are aligned, and the front ends are in a stepped structure.

[0011] To further optimize the technical solution, a 45° chamfer is provided at the entrance of the front end of the bottom end of the detection groove.

[0012] To further optimize the technical solution, the front end of the upper surface of the first, second, third, and fourth testing mechanisms is marked with the corresponding dimensions of the wafer frame to be tested.

[0013] Due to the adoption of the above technical solutions, the technological progress achieved by this utility model is as follows.

[0014] This invention provides a multi-size wafer frame flatness inspection fixture. By setting up multiple stacked inspection mechanisms, it enables the inspection of wafer frames of various sizes. The stepped arrangement of the stacked inspection mechanisms facilitates the placement of the wafer frames to be inspected and provides a clear location for marking the dimensions to be measured, reducing the probability of incorrect placement. Furthermore, a chamfer is added at the entrance of the inspection mechanism to reduce the probability of scratching the wafer frames during inspection. This invention has the advantages of low investment cost, high inspection efficiency, and accurate inspection. It can also inspect wafer frames of multiple specifications, preventing defective frames from entering the next process and improving production yield. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of this utility model from another direction; Figure 3 This is a side view of the present invention; Figure 4 This is a top view of the present invention.

[0016] The components are: 1. base, 11. horizontal panel, 12. crossbeam, 13. bracket, 2. testing platform, 21. first testing mechanism, 22. second testing mechanism, 23. third testing mechanism, 24. fourth testing mechanism, 211. testing groove, 212. through hole. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0018] A multi-size wafer frame flatness testing fixture, combined with Figures 1 to 4 As shown, it includes a base 1 and a testing platform 2. The base 1 includes a horizontal panel 11, a crossbeam 12, and a bracket 13; the testing platform 2 includes a first testing mechanism 21, a second testing mechanism 22, a third testing mechanism 23, and a fourth testing mechanism 24, and the testing mechanisms are provided with testing grooves 211 and through holes 212.

[0019] The base 1 is made of stainless steel. The base 1 includes a horizontally arranged rectangular panel 11. Vertically arranged brackets 13 are connected to the corners of the bottom surface of the horizontal panel 11, and horizontally arranged crossbeams 12 are connected between adjacent brackets 13. The crossbeams are used to increase the stability of the base.

[0020] A testing platform 2 is mounted above the base 1 and is fixedly connected to the horizontal panel 11 for testing the flatness of the wafer frame. A rectangular through-hole 212 is provided in the center of the testing platform 2, extending longitudinally through the entire platform. This through-hole 212 is used to observe whether the wafer frame is stuck within the testing platform 2. If stuck, the operator can remove the wafer frame through the through-hole 212. The width of the through-hole 212 is smaller than the width of the wafer frame to be tested to prevent it from falling and ensure smooth testing.

[0021] The testing platform 2 includes four stacked, rectangular testing mechanisms: a first testing mechanism 21, a second testing mechanism 22, a third testing mechanism 23, and a fourth testing mechanism 24. These mechanisms are identical in structure and width, with their lengths decreasing sequentially from front to back. A through-hole penetrates each of these mechanisms. The lengths of these mechanisms decrease by 2 cm sequentially, with the length of the first testing mechanism 21 being 2 cm shorter than the length of the horizontal panel 11. The rear ends of the horizontal panel 11, the first testing mechanisms 21, 22, 23, and 24 are aligned, while their front ends have a stepped structure to facilitate the placement of the frame into the corresponding testing mechanism. These mechanisms can be configured to test 12-inch, 8-inch, 6-inch, and 4-inch wafer frames, respectively.

[0022] The first inspection mechanism 21 has an inspection groove 211 that runs through the front and rear end faces. The inspection groove 211 is rectangular in shape. The width of the inspection groove 211 is 1 mm larger than the width of the wafer frame to be inspected. The height of the inspection groove 211 is the sum of the height of the wafer frame to be inspected and the acceptable deformation height, ensuring that qualified wafer frames can pass smoothly through the inspection groove 211.

[0023] The bottom end of the test tank 211 has a 45° chamfer at the front entrance and sharp edges are removed to prevent the wafer frame from being scratched when it is placed into the test tank 211.

[0024] The front end of the upper surface of the first testing unit 21, the second testing unit 22, the third testing unit 23, and the fourth testing unit 24 is marked with the corresponding dimensions of the wafer frame to be tested, to prevent the wafer frame from being placed in the wrong testing unit.

[0025] In practical use, this invention selects the appropriate inspection mechanism based on the size of the wafer frame to be inspected. The wafer frame is smoothly pushed into the inspection mechanism through the chamfered inlet. If the deformation of the wafer frame is within a reasonable range, it can pass through the inspection mechanism smoothly. The inspection personnel must observe the through-hole 212 in a timely manner. If the deformation of the wafer frame exceeds the reasonable range, it will become stuck in the inspection mechanism. The inspection personnel determine the position of the wafer frame through the through-hole 212 and then manually remove the wafer frame from the inspection mechanism through the through-hole 212.

Claims

1. A multi-size wafer frame flatness testing fixture, characterized in that: The device includes a base (1), and a testing platform (2) for testing the flatness of a wafer frame is provided on the top of the base (1). The testing platform (2) has a rectangular through hole (212) that runs through the testing platform (2) and is used to observe the wafer frame. The width of the through hole (212) is smaller than the width of the wafer frame to be tested. The testing platform (2) includes a first testing mechanism (21), a second testing mechanism (22), a third testing mechanism (23), and a fourth testing mechanism (24) stacked together and having a cuboid shape. The first testing mechanism (21), the second testing mechanism (22), the third testing mechanism (23), and the fourth testing mechanism (24) have the same structure and their front and rear lengths decrease sequentially. The first testing mechanism (21) has a cuboid-shaped testing groove (211) that runs through the front and rear ends. The width of the testing groove (211) is 1 mm larger than the width of the wafer frame to be tested, and the height of the testing groove (211) is the sum of the height of the wafer frame to be tested and the acceptable deformation height.

2. The multi-size wafer frame flatness testing fixture according to claim 1, characterized in that: The base (1) includes a horizontally arranged rectangular horizontal panel (11), with vertically arranged brackets (13) connected to the corners of the bottom surface of the horizontal panel (11), and a horizontally arranged crossbeam (12) connecting adjacent brackets (13).

3. The multi-size wafer frame flatness testing fixture according to claim 2, characterized in that: The base (1) is made of stainless steel.

4. The multi-size wafer frame flatness testing fixture according to claim 3, characterized in that: The lengths of the first detection mechanism (21), the second detection mechanism (22), the third detection mechanism (23), and the fourth detection mechanism (24) decrease by 2 cm in sequence. The length of the first detection mechanism (21) is 2 cm shorter than the length of the horizontal panel (11). The rear ends of the horizontal panel (11), the first detection mechanism (21), the second detection mechanism (22), the third detection mechanism (23), and the fourth detection mechanism (24) are aligned, and the front ends have a stepped structure.

5. The multi-size wafer frame flatness testing fixture according to claim 4, characterized in that: The bottom end of the detection groove (211) has a 45° chamfer at the entrance.

6. The multi-size wafer frame flatness testing fixture according to claim 1, characterized in that: The front end of the upper surface of the first testing mechanism (21), the second testing mechanism (22), the third testing mechanism (23), and the fourth testing mechanism (24) is marked with the corresponding dimensions of the wafer frame to be tested.

Images