Pressure sensor with micro heat sink

Abstract

The utility model relates to the pressure sensor with miniature heat abstractor belongs to pressure sensor technical field, include: upper end cover, lower end cover, circuit component and signal line, the upper end cover is used for the heat emission in its inside, the lower end cover is connected with the upper end cover through the screw thread, and the lower end cover is used for pressure transmission, the circuit component is bonded in the lower end cover, and one end of circuit component is fixedly connected with signal line, and signal line is from the upper end cover and is worn, after the inside of lower end cover is subjected to pressure, the other end of circuit component is given pressure transmission, and circuit component converts pressure into electric signal, and electric signal is transmitted through signal line, the utility model has the beneficial effect: the hot air of circuit component produces from the inside of lower end cover and flows into the upper end cover, and the upper end cover transmits the heat in hot air to the outside of upper end cover, and the cold air after the cooling in the upper end cover flows into the inside of lower end cover again, realizes the heat dissipation of circuit component.

Description

Technical Field

[0001] This invention belongs to the field of pressure sensor technology, and specifically relates to a pressure sensor with a miniature heat dissipation device. Background Technology

[0002] Pressure sensors, as detection devices that convert pressure signals into electrical signals, are widely used in various fields such as industrial control, automotive electronics, and aerospace and medical equipment. In practical applications, pressure sensors in some scenarios operate in high-temperature environments for extended periods. For example, in the engine compartment of a car, pressure sensors must withstand the high temperatures generated by engine operation (typically reaching 120-200℃); in pressure monitoring of industrial furnaces and kilns, the ambient temperature can even exceed 300℃.

[0003] like Figure 1 As shown in the prior art CN120352071A, a miniaturized ultra-high temperature water-cooled high-temperature pressure sensor is proposed. This sensor adds a pressure-guiding through-hole 101 to the bottom cover 10 at the rear of the pressure sensor, allowing liquid cooling media such as silicone oil to circulate into the reference pressure chamber. When the pressure sensor operates in a high-temperature environment, the liquid medium in the reference pressure chamber helps lower the internal temperature of the pressure sensor, enabling the pressure-sensitive unit to operate in a relatively low-temperature constant-temperature environment. By using a water-cooling circuit to cool the pressure sensor, the sensor's temperature tolerance is improved. However, the use of a water-cooling circuit results in a relatively large device size, and the water-cooling circuit requires complex external equipment for support, placing high demands on the device's packaging. Therefore, there is an urgent need for a compact pressure sensor with high heat dissipation efficiency to meet the precise measurement requirements in high-temperature environments. Utility Model Content

[0004] This invention provides a pressure sensor with a miniature heat dissipation device to solve the technical problem of poor heat dissipation in existing pressure sensors. By deploying a miniature air pump on the circuit assembly and combining it with the heat dissipation channel between the upper and lower end caps, high-temperature air convection heat dissipation of the pressure sensor is achieved in a compact volume.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] Pressure sensors equipped with miniature heat dissipation devices include:

[0007] The upper cover is used for heat dissipation from its interior.

[0008] The lower end cover is connected to the upper end cover by threads, and the lower end cover is used for pressure transmission.

[0009] The circuit assembly is bonded inside the lower end cover. One end of the circuit assembly is fixedly connected to a signal line, which passes through the upper end cover. When pressure is applied inside the lower end cover, the pressure is transmitted to the other end of the circuit assembly. The circuit assembly converts the pressure into an electrical signal, which is then transmitted through the signal line.

[0010] The hot air generated by the circuit components flows from the lower end cover into the upper end cover. The upper end cover transfers the heat from the hot air to the outside of the upper end cover. The cooled air inside the upper end cover then flows back into the lower end cover, thus achieving heat dissipation for the circuit components.

[0011] Optionally, the upper end cover has a flow guide block, an upper end cover heat-conducting wall, and a flow guide chamber;

[0012] The flow guide block is located inside the upper end cover and is used to guide hot air; the heat-conducting wall of the upper end cover is used to transfer the heat in the hot air to the outside of the upper end cover; the flow guide chamber is located inside the upper end cover and is used to contain the cooled air.

[0013] Optionally, the lower end cap has a pressure connector and a baffle plate on each side;

[0014] The pressure connector has a pressure sensing element inside, which can deform on its own.

[0015] Multiple guide holes arranged in a circumferential array are formed on the guide plate along its axis. These guide holes are used to guide the cold air in the guide chamber into the guide plate.

[0016] Optionally, the pressure connector has a fluid chamber located at one end of the pressure sensing element, and the other end of the pressure sensing element leads to a through hole on the pressure connector.

[0017] Optionally, a pressure sensor is used to separate the through-hole and the fluid chamber, and the pressure sensor is fixedly installed inside the pressure connector.

[0018] Optionally, the outer peripheral wall of the circuit assembly is tightly bonded to the inner peripheral wall of the lower end cap, and the circuit assembly is used to separate the interior of the guide plate from the fluid chamber.

[0019] Optionally, the other end face of the circuit assembly has a pressure-sensitive element and a circuit element;

[0020] The pressure-sensitive element and the circuit element are located in the fluid chamber. The pressure-sensitive element is used to sense the fluid pressure in the fluid chamber, and the circuit element is used to convert the pressure sensed by the pressure-sensitive element into an electrical signal.

[0021] Optionally, a miniature air pump is provided on one end face of the circuit assembly, which is used to perform heat exchange on the air inside the baffle.

[0022] Optionally, the circuit assembly includes a miniature air pump with an SOI substrate and a metal heat exchange plate. The SOI substrate is connected to the metal heat exchange plate and can transfer heat from the metal heat exchange plate.

[0023] Optionally, the SOI substrate has vents for heat dissipation on the end face away from the metal heat exchange plate.

[0024] The beneficial effects of this utility model are:

[0025] 1. In this invention, after the circuit board is in operation, the metal heat exchange plate transfers the heat from the circuit board to the SOI substrate. The air holes on the SOI substrate dissipate the heat from the metal heat exchange plate. The high-temperature air flows along the inside of the guide plate into the guide chamber inside the upper end cover. The high-temperature air in the guide chamber is convectively cooled by the heat-conducting wall of the upper end cover, causing the high-temperature air to cool down. The cooled low-temperature air continues to remain in the guide chamber. The cooled low-temperature air in the guide chamber continues to flow along the guide holes to the air holes of the micro air pump inside the guide plate. The low-temperature air transfers the low temperature to the circuit board through the metal heat exchange plate, causing the airflow inside the entire pressure sensor to circulate, thus achieving heat dissipation of the entire pressure sensor.

[0026] 2. In this invention, the pressure sensing element deforms, causing a change in the volume of the fluid chamber and a change in the fluid pressure within the chamber. This causes the pressure sensing element to detect the change in fluid pressure within the chamber. The circuit element converts the pressure sensed by the pressure sensing element into an electrical signal. The electrical signal on the circuit element is transmitted through a signal line to the device outside the upper cover in the form of an electrical signal. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic cross-sectional view of a miniaturized ultra-high temperature water-cooled high-temperature pressure sensor based on existing technology.

[0029] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0030] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0031] Figure 4This is a cross-sectional structural diagram of the present invention;

[0032] Figure 5 For the present utility model Figure 4 A schematic diagram of a partial cross-sectional structure;

[0033] Figure 6 This is a three-dimensional structural diagram of the lower end cap of this utility model;

[0034] Figure 7 This is a schematic diagram of the cross-sectional structure of the lower end cap of this utility model;

[0035] Figure 8 This is a three-dimensional structural diagram of the back of the circuit component of this utility model;

[0036] Figure 9 This is a three-dimensional front view of the circuit component of this utility model;

[0037] Figure 10 This is a three-dimensional structural diagram of the miniature air pump of this utility model.

[0038] Icons: 1-Upper end cover, 11-Flow guide block, 12-Upper end cover heat-conducting wall, 13-Flow guide chamber, 2-Lower end cover, 21-Pressure connector, 22-Through hole, 23-Pressure sensing element, 24-Fluid chamber, 25-Flow guide plate, 26-Flow guide hole, 3-Circuit assembly, 31-Pressure sensitive element, 32-Circuit element, 33-Miniature air pump, 34-Circuit board, 331-SOI substrate, 332-Metal heat exchange plate, 333-Air hole, 4-Signal line. Detailed Implementation

[0039] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0040] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to welding, bolting, or riveting; they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] Example 1

[0044] like Figures 2-3 As shown, this embodiment provides a pressure sensor with a miniature heat dissipation device, including: an upper cover 1, a lower cover 2, a circuit assembly 3, and a signal line 4; the upper cover 1 is used for heat dissipation; the lower cover 2 is threadedly connected to the upper cover 1 and is used for pressure conduction; the circuit assembly 3 is bonded inside the lower cover 2, and one end of the circuit assembly 3 is fixedly connected to the signal line 4, which extends out from inside the upper cover 1; as shown... Figure 3 As shown, after the lower end cover 2 is subjected to pressure, the pressure is transmitted to the other end of the circuit component 3. The circuit component 3 converts the pressure into an electrical signal, which is transmitted through the signal line 4. That is, the electrical signal on the circuit component 3 is transmitted to the device (not shown in the figure) outside the upper end cover 1 through the signal line 4.

[0045] like Figure 4 As shown, the hot air generated by the circuit component 3 flows from the lower end cover 2 into the upper end cover 1. The upper end cover 1 transfers the heat from the hot air to the outside of the upper end cover 1. The cooled air inside the upper end cover 1 then flows back into the lower end cover 2, thus achieving heat dissipation of the circuit component 3.

[0046] Specifically, such as Figure 5 As shown, the upper end cover 1 has a flow guide block 11, an upper end cover heat-conducting wall 12, and a flow guide chamber 13;

[0047] The flow guide block 11 is located inside the upper cover 1 and is used to guide hot air; the heat-conducting wall 12 of the upper cover is used to transfer the heat in the hot air to the outside of the upper cover 1; the flow guide chamber 13 is located inside the upper cover 1 and is used to contain the cooled air.

[0048] like Figures 6-7 As shown, the lower end cover 2 has a pressure connector 21 and a guide plate 25 on both sides respectively;

[0049] The pressure connector 21 has a pressure sensing plate 23 inside, which can deform on its own.

[0050] Multiple guide holes 26 arranged in a circular array are provided on the guide plate 25 along the axis of the guide plate 25. The guide holes 26 are used to guide the cold air in the guide chamber 13 into the guide plate 25.

[0051] The pressure connector 21 has a fluid chamber 24, which is located at one end of the pressure sensing plate 23. The other end of the pressure sensing plate 23 leads to a through hole 22 on the pressure connector 21. The pressure sensing plate 23 is used to separate the through hole 22 and the fluid chamber 24. The pressure sensing plate 23 is fixedly installed in the pressure connector 21 (i.e., the pressure sensing plate 23 can be laser welded into the pressure connector 21).

[0052] The outer peripheral wall of the circuit assembly 3 is tightly bonded to the inner peripheral wall of the lower end cover 2. The circuit assembly 3 is used to separate the interior of the guide plate 25 and the fluid chamber 24. The other end face of the circuit assembly 3 has a pressure-sensitive element 31 and a circuit element 32.

[0053] Among them, such as Figure 8 As shown, the pressure-sensitive element 31 and the circuit element 32 are located inside the fluid chamber 24. The pressure-sensitive element 31 is used to sense the fluid pressure inside the fluid chamber 24, and the circuit element 32 is used to convert the pressure sensed by the pressure-sensitive element 31 into an electrical signal. That is, the pressure-sensitive element 31 senses the pressure, and the circuit element 32 is electrically connected to the pressure-sensitive element 31. The circuit element 32 converts the pressure sensed by the pressure-sensitive element 31 into an electrical signal, and the circuit element 32 is electrically connected to the signal line 4. The electrical signal on the circuit element 32 is transmitted to the device outside the upper cover 1 through the signal line 4.

[0054] like Figure 9 As shown, a miniature air pump 33 is provided on one end face of the circuit component 3. The miniature air pump 33 is used for heat exchange of the air inside the guide plate 25. Specifically, as shown... Figure 10 As shown, the micro air pump 33 has an SOI substrate 331 and a metal heat exchange plate 332. The SOI substrate 331 is connected to the metal heat exchange plate 332. The SOI substrate 331 can transfer heat from the metal heat exchange plate 332. The end face of the SOI substrate 331 away from the metal heat exchange plate 332 has air holes 333 for heat dissipation.

[0055] Example 2

[0056] Based on Example 1, such as Figure 4 As shown, under normal conditions, the pressure sensing element 23 does not deform, the volume of the fluid chamber 24 does not change, the fluid pressure inside the fluid chamber 24 does not change, and the pressure sensing element 31 cannot sense any change in the fluid pressure inside the fluid chamber 24.

[0057] When fluid from outside the lower end cover 2 enters the lower end cover 2 through the through hole 22, the fluid causes the pressure sensing element 23 to deform. After the pressure sensing element 23 deforms (i.e., the pressure sensing element 23 bends and deforms into the fluid chamber 24), the volume of the fluid chamber 24 decreases due to the deformation of the pressure sensing element 23, and the fluid pressure in the fluid chamber 24 increases. As a result, the pressure sensing element 31 senses the fluid pressure in the fluid chamber 24. Since the pressure sensing element 31 senses the increase in fluid pressure in the fluid chamber 24, the circuit element 32 converts the pressure sensed by the pressure sensing element 31 into an electrical signal. The electrical signal on the circuit element 32 transmits the magnitude of the pressure sensed by the pressure sensing element 31 to the device outside the upper end cover 1 in the form of an electrical signal through the signal line 4.

[0058] Similarly, when the fluid inside the lower end cover 2 flows out through the through hole 22, the outflow of the fluid in the lower end cover 2 causes the pressure sensing element 23 to deform. After the pressure sensing element 23 deforms (i.e., the pressure sensing element 23 bends and deforms outward from the fluid chamber 24), the volume of the fluid chamber 24 increases due to the deformation of the pressure sensing element 23, and the fluid pressure in the fluid chamber 24 decreases. As a result, the fluid pressure in the fluid chamber 24 also decreases. The pressure sensing element 31 senses the fluid pressure in the fluid chamber 24. Since the pressure sensing element 31 senses the decrease in fluid pressure in the fluid chamber 24, the circuit element 32 converts the pressure sensed by the pressure sensing element 31 into an electrical signal. The electrical signal on the circuit element 32 transmits the magnitude of the pressure sensed by the pressure sensing element 31 to the device outside the upper end cover 1 in the form of an electrical signal through the signal line 4.

[0059] Example 3

[0060] Based on Examples 1-2, such as Figure 5 and Figure 10 As shown, the end face of the metal heat exchange plate 332 away from the SOI substrate 331 is connected to the circuit board 34 in the circuit assembly 3. The circuit board 34 plays a control role in the circuit. The circuit board 34 is connected to the pressure-sensitive element 31, the circuit element 32, and the signal line 4. The circuit board 34 controls the pressure-sensitive element 31 to sense the pressure in the fluid chamber 24. The circuit board 34 controls the circuit element 32 to convert the pressure in the fluid chamber 24 sensed by the pressure-sensitive element 31 into an electrical signal. The electrical signal on the circuit element 32 controlled by the circuit board 34 transmits the magnitude of the pressure sensed by the pressure-sensitive element 31 to the device outside the upper cover 1 in the form of an electrical signal through the signal line 4.

[0061] like Figure 5As shown, the micro air pump 33 mainly uses the air vents 333 to perform the functions of air intake and exhaust. After the circuit board 34 is working, the metal heat exchange plate 332 transfers the heat from the circuit board 34 to the SOI substrate 331. The air vents 333 on the SOI substrate 331 dissipate the heat from the metal heat exchange plate 332. The high-temperature air flows along the inside of the guide plate 25 into the guide chamber 13 inside the upper end cover 1. The high-temperature air in the guide chamber 13 dissipates heat through the heat-conducting wall 12 of the upper end cover, that is, the high-temperature air inside the guide plate 25... When the high-temperature air flows through the heat-conducting wall 12 of the upper end cover, it undergoes convection heat dissipation. The heat-conducting wall 12 of the upper end cover dissipates the heat of the high-temperature air in the guide chamber 13 to the outside of the upper end cover 1, causing the high-temperature air to cool down. The cooled low-temperature air continues to remain in the guide chamber 13. The cooled low-temperature air in the guide chamber 13 continues to flow along the guide hole 26 to the air hole 333 of the miniature air pump 33 inside the guide plate 25. The low-temperature air transfers its low temperature to the circuit board 34 through the metal heat exchange plate 332, so that the airflow inside the entire pressure sensor passes through the metal heat exchange plate 332. Figure 5 The airflow path shown circulates to dissipate heat from the entire pressure sensor.

[0062] This invention is based on the traditional pressure sensor structure. By deploying a miniature air pump 33 on the circuit assembly 3 and combining it with the heat dissipation channel between the upper end cover 1 and the lower end cover 2, the pressure sensor achieves high-temperature air convection heat dissipation in a compact volume.

[0063] This invention achieves efficient heat dissipation in a compact size through a miniature air pump 33 and a heat dissipation channel. Compared with existing water-cooled or liquid-cooled heat dissipation methods, this invention has a smaller and more compact structure, simpler packaging, no need for external heat exchange equipment, and lower power consumption.

[0064] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope described in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A pressure sensor equipped with a miniature heat dissipation device, characterized in that, include: The upper end cover (1) is used for heat dissipation inside; The lower end cover (2) is connected to the upper end cover (1) by a thread, and the lower end cover (2) is used for pressure transmission; The circuit assembly (3) is bonded inside the lower end cover (2). One end of the circuit assembly (3) is fixedly connected to a signal line (4), which passes through the upper end cover (1). When pressure is applied inside the lower end cover (2), the pressure is transmitted to the other end of the circuit assembly (3). The circuit assembly (3) converts the pressure into an electrical signal, which is transmitted through the signal line (4). The hot air generated by the circuit assembly (3) flows from the lower end cover (2) into the upper end cover (1). The upper end cover (1) transfers the heat in the hot air to the outside of the upper end cover (1). The cooled air inside the upper end cover (1) flows back into the lower end cover (2), thus realizing the heat dissipation of the circuit assembly (3).

2. The pressure sensor with a miniature heat dissipation device according to claim 1, characterized in that, The upper end cover (1) has a flow guide block (11), an upper end cover heat-conducting wall (12), and a flow guide chamber (13); The guide block (11) is located inside the upper cover (1) and is used to guide hot air; the heat-conducting wall (12) of the upper cover is used to transfer the heat in the hot air to the outside of the upper cover (1); the guide chamber (13) is located inside the upper cover (1) and is used to contain the cooled air.

3. The pressure sensor with a miniature heat dissipation device according to claim 1, characterized in that, The lower end cap (2) has a pressure connector (21) and a guide plate (25) on both sides respectively; The pressure connector (21) has a pressure sensing plate (23) inside, and the pressure sensing plate (23) can deform itself; Multiple flow guide holes (26) arranged in a circular array are provided on the flow guide plate (25) along the axis of the flow guide plate (25). The flow guide holes (26) are used to introduce cold air in the flow guide chamber (13) into the flow guide plate (25).

4. The pressure sensor with a miniature heat dissipation device according to claim 3, characterized in that, The pressure connector (21) has a fluid chamber (24) inside, the fluid chamber (24) is located at one end of the pressure sensing plate (23), and the other end of the pressure sensing plate (23) leads to a through hole (22) on the pressure connector (21).

5. The pressure sensor with a miniature heat dissipation device according to claim 4, characterized in that, The pressure sensor (23) is used to separate the through hole (22) and the fluid chamber (24), and the pressure sensor (23) is fixedly installed inside the pressure connector (21).

6. The pressure sensor with a miniature heat dissipation device according to claim 1, characterized in that, The outer peripheral wall of the circuit assembly (3) is tightly bonded to the inner peripheral wall of the lower end cover (2), and the circuit assembly (3) is used to separate the interior of the guide plate (25) and the fluid chamber (24).

7. The pressure sensor with a miniature heat dissipation device according to claim 6, characterized in that, The other end face of the circuit assembly (3) has a pressure-sensitive element (31) and a circuit element (32); The pressure-sensitive element (31) and the circuit element (32) are located in the fluid chamber (24). The pressure-sensitive element (31) is used to sense the fluid pressure in the fluid chamber (24), and the circuit element (32) is used to convert the pressure sensed by the pressure-sensitive element (31) into an electrical signal.

8. The pressure sensor with a miniature heat dissipation device according to claim 6, characterized in that, A miniature air pump (33) is provided on one end face of the circuit assembly (3), and the miniature air pump (33) is used to perform heat exchange on the air inside the guide plate (25).

9. The pressure sensor with a miniature heat dissipation device according to claim 1, characterized in that, The circuit assembly (3) is provided with a micro air pump (33), which has an SOI substrate (331) and a metal heat exchange plate (332). The SOI substrate (331) is connected to the metal heat exchange plate (332) and the SOI substrate (331) can transfer heat from the metal heat exchange plate (332).

10. The pressure sensor with a miniature heat dissipation device according to claim 9, characterized in that, The SOI substrate (331) has vents (333) for heat dissipation on the end face away from the metal heat exchange plate (332).

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