A device for vacuum testing of semiconductor vacuum valves

Abstract

The utility model belongs to semiconductor equipment test technical field especially for a kind of device for semiconductor vacuum valve vacuum test, including base, box, multiple baffle, vacuum pump, support frame, adjusting assembly, multiple compression limiting components, mounting plate, support shaft, multiple sealing plug, multiple self-resetting components, multiple plug-in monitoring components, pressure sensor and control panel;The vacuum pump and box are fixedly installed on base, multiple detection sockets are formed on the box, multiple sealing plugs are arranged in the box and are respectively matched with corresponding detection socket, multiple self-resetting components are arranged in the box and are connected with multiple sealing plugs, the box is divided into chamber corresponding to different detection sockets by multiple baffle.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment testing technology, and in particular to a device for vacuum testing of semiconductor vacuum valves. Background Technology

[0002] In the semiconductor manufacturing industry, vacuum valves, as key control components of vacuum systems, directly affect the stability of the entire process and product quality. Therefore, rigorous vacuum testing is required before shipment. Existing testing equipment is mostly a single-station design, capable of testing only one valve at a time, which is inefficient and cannot meet the needs of mass production. At the same time, traditional equipment has poor compatibility with different models and batches of valves. When changing test objects, frequent tooling adjustments are required, which is cumbersome and prone to leakage due to misalignment, affecting test accuracy. In addition, problems such as unstable valve fixation during testing, insufficient chamber sealing in non-testing states, and inability to monitor interface insertion force often lead to distorted test data or valve damage, increasing production costs.

[0003] Therefore, this invention proposes a device for vacuum testing of semiconductor vacuum valves to solve the above problems.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings mentioned in the background section by providing a device for vacuum testing of semiconductor vacuum valves.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a device for vacuum testing of semiconductor vacuum valves, comprising a base, a housing, multiple partitions, a vacuum pump, a support frame, an adjustment assembly, multiple clamping and limiting assemblies, a mounting plate, a support shaft, multiple sealing plugs, multiple self-resetting assemblies, multiple plug-in monitoring assemblies, a pressure sensor, and a control panel.

[0007] The vacuum pump and the housing are both fixedly mounted on the base. The housing has multiple detection ports, and multiple sealing plugs are set inside the housing and adapted to the corresponding detection ports. Multiple self-resetting components are set inside the housing and connected to the multiple sealing plugs. The housing is divided into chambers corresponding to different detection ports by multiple partitions. The vacuum pump has a multi-headed extraction tube fixedly installed at its inlet end, and the multiple inlet ends of the extraction tube are connected to different chambers.

[0008] The support frame is slidably mounted on the base. The adjustment component is located on the bottom side of the base and connected to the support frame. The support shaft is rotatably mounted on the support frame, and a servo motor for driving the support shaft is fixedly mounted on the support frame. Multiple mounting plates are fixedly mounted on the support shaft and arranged radially with the support shaft as the center. Multiple mounting plates are provided with multiple placement slots. Multiple clamping and limiting components are respectively located on the corresponding mounting plates and adapted to the corresponding multiple placement slots. The pressure sensor is fixedly mounted on the side of the housing near the support frame. Multiple plug-in monitoring components are respectively located on the corresponding mounting plates and adapted to the pressure sensor.

[0009] The control panel is fixedly installed on the front side of the enclosure and electrically connected to the pressure sensor, servo motor II, vacuum pump, and adjustment components.

[0010] Preferably, the adjustment assembly includes a lead screw, a servo motor, and two guide rods. A guide groove and a mounting groove are provided on the bottom side of the base. The lead screw, which is threadedly connected to the support frame, is rotatably installed in the guide groove. The servo motor, which is electrically connected to the control panel, is fixedly installed in the mounting groove. The output shaft of the servo motor is axially fixedly connected to the lead screw. Two guide rods, which are slidably connected to the support frame and parallel to the lead screw, are fixedly installed in the guide groove.

[0011] Preferably, the self-resetting assembly includes multiple T-shaped rods and multiple springs. Multiple T-shaped rods arranged in parallel to each other are fixedly installed on the inner wall of the box body near the support frame. The multiple T-shaped rods are slidably connected to the corresponding sealing plugs. Each of the multiple T-shaped rods is fixedly installed with a spring, and each of the multiple springs is fixedly connected to the inner wall of the box body near the support frame.

[0012] Preferably, the clamping and limiting assembly includes a pressure plate, multiple T-shaped rods and multiple springs. Multiple parallel T-shaped rods are slidably mounted on the mounting plate, and springs are fixedly mounted on each of the multiple T-shaped rods. The multiple springs are fixedly connected to the mounting plate, and the same pressure plate is fixedly mounted on each of the multiple T-shaped rods, which movably abuts against the top side of the mounting plate. The pressure plate is located on the opening side of the multiple placement slots.

[0013] Preferably, multiple handles are fixedly installed on the side of the pressure plate away from the mounting plate.

[0014] Preferably, the plug-in monitoring assembly includes a support plate, an H-shaped rod, and a spring. The support plate is fixedly installed on the side of the mounting plate away from the placement slot. An H-shaped rod parallel to the mounting plate is slidably installed on the support plate. The same spring is fixedly installed on the H-shaped rod and the support plate. When the H-shaped rod is in a horizontal state, it is located on the same axis as the pressure sensor.

[0015] Preferably, the inner wall of the detection port is stepped and a silicone sealing ring is fixedly installed thereon, and the silicone sealing ring is adapted to the inner wall of the detection port.

[0016] Preferably, the housing is fixedly equipped with a plurality of wide-range composite vacuum gauges, each connected to a corresponding chamber, and the plurality of wide-range composite vacuum gauges are electrically connected to the control panel.

[0017] Preferably, a plurality of exhaust pipes, each connected to a corresponding chamber, are fixedly installed on the side of the housing near the vacuum pump, and a pressure relief valve electrically connected to the control panel is fixedly installed on each of the exhaust pipes.

[0018] Preferably, a plurality of control valves electrically connected to the control panel are fixedly installed at one end of the extraction tube near the housing.

[0019] The beneficial effects of this utility model are:

[0020] This invention, by setting up multiple independent chambers and cooperating with multi-head extraction tubes, can simultaneously perform vacuum performance tests on multiple semiconductor vacuum valves of different models or batches, significantly improving testing efficiency. The adjustment component, in conjunction with the support shaft driven by the servo motor, can precisely align the valves to be tested on different mounting plates with different testing ports, meeting diverse testing needs. Simultaneously, the clamping and limiting component, through the elastic clamping force of the spring and the positioning effect of the placement groove, ensures the valve remains stable and without displacement during testing. The self-resetting component, sealing plug, and silicone sealing ring work together to effectively guarantee the chamber's sealing performance in non-testing states, preventing external air interference with the initial vacuum environment. Furthermore, the insertion monitoring component, in conjunction with the pressure sensor, can monitor the insertion force of the valve interface in real time, preventing over-insertion damage or under-insertion leakage. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of a device for vacuum testing of semiconductor vacuum valves proposed in this utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure from another perspective;

[0024] Figure 3 for Figure 1 A partial sectional view of the structure;

[0025] Figure 4 This is a partial three-dimensional structural schematic diagram of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the sealing plug and self-resetting assembly proposed in this utility model;

[0027] Figure 6 This is a schematic diagram of the support frame and adjustment components proposed in this utility model;

[0028] Figure 7 This is a schematic diagram of the structure of the plug-in monitoring component proposed in this utility model;

[0029] Figure 8 This is a schematic diagram of the pressing and limiting component proposed in this utility model.

[0030] In the diagram: 1. Base; 2. Housing; 201. Partition; 21. Vacuum pump; 211. Extraction pipe; 212. Control valve; 22. Detection port; 221. Sealing plug; 222. T-shaped rod one; 223. Spring one; 23. Exhaust pipe; 231. Pressure relief valve; 24. Wide-range composite vacuum gauge; 3. Support frame; 301. Lead screw; 302. Servo motor one; 303. Guide rod; 31. Support shaft; 311. Servo motor two; 32. Mounting plate; 321. Placement slot; 33. Pressure plate; 331. T-shaped rod two; 332. Spring two; 34. Support plate; 341. H-shaped rod; 342. Spring three; 35. Pressure sensor; 4. Control panel. Detailed Implementation

[0031] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0032] Reference Figure 1-8 An apparatus for vacuum testing of semiconductor vacuum valves includes a base 1, a housing 2, multiple partitions 201, a vacuum pump 21, a support frame 3, a mounting plate 32, a support shaft 31, multiple sealing plugs 221, a pressure sensor 35, and a control panel 4.

[0033] The vacuum pump 21 and the housing 2 are both fixedly mounted on the base 1. The housing 2 has multiple detection ports 22. Multiple sealing plugs 221 are set inside the housing 2 and are adapted to the corresponding detection ports 22. The housing 2 is divided into chambers corresponding to different detection ports by multiple partitions 201. The inlet end of the vacuum pump 21 is fixedly mounted with a multi-headed extraction pipe 211, and the multiple inlet ends of the extraction pipe 211 are connected to different chambers respectively.

[0034] Multiple parallel T-shaped rods 222 are fixedly installed on the inner wall of the chamber 2 near the support frame 3. Each T-shaped rod 222 is slidably connected to a corresponding sealing plug 221. Each T-shaped rod 222 is fixedly installed with a spring 223. Each spring 223 is fixedly connected to the inner wall of the chamber 2 near the support frame 3. This ensures that the sealing plug 221 maintains a sealed state for the test port 22 when it is not subjected to external force. When the interface of the semiconductor vacuum valve to be tested is inserted into the test port 22 and pushes the sealing plug 221, the spring 223 is compressed, causing the sealing plug 221 to move into the chamber 2 and release the seal on the test port 22. At the same time, after the test is completed, when the interface of the semiconductor vacuum valve to be tested is pulled out, the spring 223 releases its elastic potential energy, causing the sealing plug 221 to automatically reset and reseal the test port 22. This effectively prevents outside air from entering the chamber 2 when not in a test state and ensures the stability of the initial vacuum environment of the chamber before testing.

[0035] The support frame 3 is slidably mounted on the base 1, the support shaft 31 is rotatably mounted on the support frame 3, and a servo motor 311 for driving the support shaft 31 is fixedly mounted on the support frame 3. Multiple mounting plates 32 are fixedly mounted on the support shaft 31 and arranged radially with the support shaft 31 as the center. Multiple mounting plates 32 are provided with multiple placement slots 321. The control panel 4 is fixedly mounted on the front side of the housing 2 and electrically connected to the servo motor 311 and the vacuum pump 21.

[0036] Multiple parallel T-shaped rods 331 are slidably mounted on the mounting plate 32. Each T-shaped rod 331 is fixedly mounted with a spring 332. Each spring 332 is fixedly connected to the mounting plate 32. A pressure plate 33 is fixedly mounted on each T-shaped rod 331 and moves against the top side of the mounting plate 32. The pressure plate 33 is located on the opening side of the multiple placement slots 321. It can press and fix the semiconductor vacuum valve under test in the placement slot 321 through the elastic force of the spring 332, so as to prevent the semiconductor vacuum valve under test from being displaced or falling off due to equipment operation or external interference during the test, and ensure the stability and accuracy of the test process.

[0037] The bottom side of the base 1 is provided with a guide groove and a mounting groove. A lead screw 301, which is threadedly connected to the support frame 3, is rotatably installed in the guide groove. A servo motor 302, which is electrically connected to the control panel 4, is fixedly installed in the mounting groove. The output shaft of the servo motor 302 is axially fixedly connected to the lead screw 301. Two guide rods 303, which are slidably connected to the support frame 3 and parallel to the lead screw 301, are fixedly installed in the guide groove. The distance between the support frame 3 and the housing 2 can be adjusted as needed, so as to facilitate the control of the relative state between the semiconductor vacuum valve under test and the corresponding detection port 22.

[0038] The pressure sensor 35 is fixedly installed on the side of the housing 2 near the support frame 3 and electrically connected to the control panel 4. A support plate 34 is fixedly installed on the side of the mounting plate 32 away from the placement slot 321. An H-shaped rod 341 parallel to the mounting plate 32 is slidably installed on the support plate 34. The same spring 342 is fixedly installed on the H-shaped rod 341 and the support plate 34. When the H-shaped rod 341 is in a horizontal state, it is located on the same axis as the pressure sensor 35. This allows for real-time monitoring of the insertion force of the semiconductor vacuum valve under test into the detection socket 22, avoiding damage due to over-insertion or leakage due to incomplete insertion. This ensures the tightness of the connection between the semiconductor vacuum valve under test and the detection socket 22, preventing the accuracy of the test results from being affected by incomplete connection.

[0039] In this embodiment, in order to facilitate the operator to manually pull the pressure plate 33 to overcome the elastic force of the spring 332 and lift the pressure plate 33 away from the mounting plate 32, thereby providing operating space for the semiconductor vacuum valve to be tested to be placed into or removed from the placement slot 321, the operation is convenient and labor-saving, and the efficiency of the semiconductor vacuum valve loading and unloading process is effectively improved. Multiple handles are fixedly installed on the side of the pressure plate 33 away from the mounting plate 32.

[0040] In this embodiment, in order to further enhance the sealing performance between the interface of the semiconductor vacuum valve under test and the detection socket 22, prevent gas leakage during the vacuum test, and ensure the accuracy of the test data, the inner wall of the detection socket 22 is stepped and a silicone sealing ring is installed in a sealed manner. The silicone sealing ring is adapted to the inner wall of the detection socket 22.

[0041] In this embodiment, in order to monitor the changes in vacuum level in different chambers in real time and transmit the data to the control panel 4 for processing so that the operator can accurately grasp the vacuum status of each test station, multiple wide-range composite vacuum gauges 24 are fixedly installed on the housing 2 and are respectively connected to the corresponding chambers. All the wide-range composite vacuum gauges 24 are electrically connected to the control panel 4.

[0042] In this embodiment, in order to quickly release the vacuum environment in the chamber after the test is completed or in case of an abnormal situation, a plurality of exhaust pipes 23 connected to the corresponding chambers are fixedly installed on the side of the housing 2 near the vacuum pump 21, and a pressure relief valve 231 electrically connected to the control panel 4 is fixedly installed on each of the plurality of exhaust pipes 23.

[0043] In this embodiment, in order to independently control the on / off state between the extraction tube 211 and each chamber according to the test requirements of different chambers, realize the grouping or individual vacuuming operation of multiple semiconductor vacuum valves, avoid airflow interference between different test stations, and improve the flexibility and accuracy of the test process, multiple control valves 212 electrically connected to the control panel 4 are fixedly installed at one end of the extraction tube 211 near the housing 2.

[0044] It is worth noting that the content protected by this application does not involve improvements to software, circuits, and methods. Therefore, the circuits, electronic components, and module mechanisms involved all adopt existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon.

[0045] Working principle: In use, first turn on the power, pull the pressure plate 33 away from the mounting plate 32 by the handle, and then place the semiconductor vacuum valves to be tested one by one into the corresponding placement slots 321. Then release the handle. With the cooperation of multiple springs 332 and multiple T-shaped rods 222, the pressure plate 33 can be controlled to press and limit the semiconductor vacuum valves to be tested. Then, the servo motor 311 controls the support shaft 31 to rotate, and adjusts the semiconductor vacuum valves to be tested to a horizontal position close to the interface. Then, the servo motor 302, in conjunction with the lead screw 301 and guide rod 303, controls the support frame 3 to move towards the housing 2, thereby enabling the semiconductor vacuum valve interface to be tested to be pressed and limited. Insert the corresponding detection socket 22 and push the sealing plug 221 to keep the semiconductor vacuum valve in communication with the corresponding cavity on the housing 2. At the same time, the silicone sealing ring can ensure the sealing effect after insertion. As the semiconductor vacuum valve is inserted into the detection socket 22, the left end of the H-shaped rod 341 approaches and abuts against the pressure sensor 35 and compresses the spring 342, so that the insertion force can be monitored in real time to avoid over-insertion or under-insertion. Then, the vacuum pump 21 is started and the corresponding control valve 212 is opened to realize the vacuum operation in the corresponding cavity. The wide range composite vacuum gauge 24 can monitor the change of vacuum in the chamber in real time.

[0046] During the first batch of semiconductor vacuum valve tests, another semiconductor vacuum valve to be tested can be installed on the upper mounting plate 32 while waiting. After the test is completed, control the pressure relief valve 231 to release pressure, and then control the support frame 3 to move to the right so that the semiconductor vacuum valve is disengaged from the test port. Then control the support shaft 31 to rotate counterclockwise, so that the other installed semiconductor vacuum valve can be adjusted to the test position by controlling the counterclockwise rotation of the support shaft 31 and then the test operation can be performed.

[0047] The present invention provides a detailed description of a device for vacuum testing of semiconductor vacuum valves. Specific embodiments have been used to illustrate the principle and implementation of the present invention. These embodiments are merely illustrative and are intended to aid in understanding the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. An apparatus for vacuum testing of semiconductor vacuum valves, characterized in that, Includes a base (1), a housing (2), multiple partitions (201), a vacuum pump (21), a support frame (3), an adjustment assembly, multiple clamping and limiting assemblies, a mounting plate (32), a support shaft (31), multiple sealing plugs (221), multiple self-resetting assemblies, multiple plug-in monitoring assemblies, a pressure sensor (35), and a control panel (4); The vacuum pump (21) and the housing (2) are both fixedly installed on the base (1). The housing (2) has multiple detection ports (22). Multiple sealing plugs (221) are set inside the housing (2) and are adapted to the corresponding detection ports (22). Multiple self-resetting components are set inside the housing (2) and connected to the multiple sealing plugs (221). The housing (2) is divided into chambers corresponding to different detection ports by multiple partitions (201). The vacuum pump (21) has a multi-head extraction tube (211) fixedly installed at the air inlet end, and the multiple air inlets of the extraction tube (211) are connected to different chambers respectively. The support frame (3) is slidably mounted on the base (1). The adjustment component is set on the bottom side of the base (1) and connected to the support frame (3). The support shaft (31) is rotatably mounted on the support frame (3). A servo motor (311) for driving the support shaft (31) is fixedly mounted on the support frame (3). Multiple mounting plates (32) are fixedly mounted on the support shaft (31) and arranged radially with the support shaft (31) as the center. Multiple mounting plates (32) are provided with multiple placement slots (321). Multiple clamping and limiting components are respectively set on the corresponding mounting plates (32) and adapted to the corresponding multiple placement slots (321). The pressure sensor (35) is fixedly mounted on the side of the housing (2) close to the support frame (3). Multiple plug-in monitoring components are respectively set on the corresponding mounting plates (32) and adapted to the pressure sensor (35). The control panel (4) is fixedly installed on the front side of the housing (2) and electrically connected to the pressure sensor (35), servo motor 2 (311), vacuum pump (21) and adjustment assembly.

2. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The adjustment assembly includes a lead screw (301), a servo motor (302), and two guide rods (303). The bottom side of the base (1) is provided with a guide groove and a mounting groove. The lead screw (301) which is threadedly connected to the support frame (3) is rotatably installed in the guide groove. The servo motor (302) which is electrically connected to the control panel (4) is fixedly installed in the mounting groove. The output shaft of the servo motor (302) is axially fixedly connected to the lead screw (301). Two guide rods (303) which are slidably connected to the support frame (3) and parallel to the lead screw (301) are fixedly installed in the guide groove.

3. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The self-resetting assembly includes multiple T-shaped rods (222) and multiple springs (223). Multiple T-shaped rods (222) arranged in parallel are fixedly installed on the inner wall of the box (2) near the support frame (3). The multiple T-shaped rods (222) are slidably connected to the corresponding sealing plugs (221). Each of the multiple T-shaped rods (222) is fixedly installed with a spring (223). The multiple springs (223) are fixedly connected to the inner wall of the box (2) near the support frame (3).

4. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The clamping and limiting assembly includes a pressure plate (33), multiple T-shaped rods (331) and multiple springs (332). Multiple parallel T-shaped rods (331) are slidably mounted on the mounting plate (32). Each T-shaped rod (331) is fixedly mounted with a spring (332). Each spring (332) is fixedly connected to the mounting plate (32). The same pressure plate (33) is fixedly mounted on the multiple T-shaped rods (331) and moves against the top side of the mounting plate (32). The pressure plate (33) is located on the opening side of multiple placement slots (321).

5. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 4, characterized in that: Multiple handles are fixedly installed on the side of the pressure plate (33) away from the mounting plate (32).

6. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The plug-in monitoring assembly includes a support plate (34), an H-shaped rod (341), and a spring (342). The support plate (34) is fixedly installed on the side of the mounting plate (32) away from the placement slot (321). An H-shaped rod (341) parallel to the mounting plate (32) is slidably installed on the support plate (34). The same spring (342) is fixedly installed on the H-shaped rod (341) and the support plate (34). When the H-shaped rod (341) is in a horizontal state, it is located on the same axis as the pressure sensor (35).

7. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The inner wall of the detection port (22) is stepped and a silicone sealing ring is installed and sealed. The silicone sealing ring is adapted to the inner wall of the detection port (22).

8. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: Multiple wide-range composite vacuum gauges (24) are fixedly installed on the housing (2), each connected to a corresponding chamber, and all wide-range composite vacuum gauges (24) are electrically connected to the control panel (4).

9. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: The housing (2) has multiple exhaust pipes (23) fixedly installed on the side near the vacuum pump (21), each of which is connected to a corresponding chamber. Each of the multiple exhaust pipes (23) is fixedly installed with a pressure relief valve (231) that is electrically connected to the control panel (4).

10. The apparatus for vacuum testing of semiconductor vacuum valves according to claim 1, characterized in that: Multiple control valves (212) electrically connected to the control panel (4) are fixedly installed at one end of the extraction tube (211) near the box (2).

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