Chip cold insert oblique heating defoaming clamp with bubble breaking blade

Abstract

A chip cold insert oblique heating defoaming clamp with bubble breaking blade. It relates to semiconductor processing equipment. The utility model discloses a gas -proof glue box, blade insertion, heating sheet and posture holder, the heat of heating sheet is passed through gas -proof glue box and enters chip sample, the viscosity of glue in sample drops, and the moving resistance of bubble in glue drops, the air density of bubble is less than the density of surrounding glue, and the bubble in glue expands after being heated, and the buoyancy of bubble becomes big, and the bubble floats up, at this moment, the bubble has three paths to rise to the open top of gas -proof glue box, and is broken by the sawtooth blade, namely, the device passes through the mode of buoyancy, physical breaking and heat influence, and eliminates the bubble in the chip sample fixed by epoxy resin glue.

Description

Technical Field

[0001] This utility model relates to semiconductor processing equipment, and more particularly to a chip cold mounting tilting heating defoaming fixture with a defoaming cutting edge. Background Technology

[0002] Chip failure analysis is a core method for locating and eradicating defects in semiconductor products, improving yield and reliability. Its process typically includes several key steps such as unpacking, sample preparation, microscopic observation, and component analysis. Among these, the cold-mount sample preparation process, as a prerequisite for physical failure analysis, relies on embedding and fixing the chip sample with epoxy resin. This provides a stress-free and damage-free support for subsequent precision grinding, polishing, and even nanoscale observation using scanning electron microscopy or transmission electron microscopy. The quality of this molding process, especially the integrity of the resin-sample interface, directly determines the accuracy and reliability of the final observation results.

[0003] As semiconductor technology moves towards more advanced process nodes and more complex packaging architectures, cold mounting prototyping faces unprecedented challenges: 1. Interface Integrity Challenge: Microbubbles remaining at the interface between the chip and the resin can create weak areas in mechanical strength. Under subsequent polishing stress, these can easily lead to the peeling off of brittle chip edges or the fracture of the intermetallic compound (IMC) layer, resulting in the loss of key failure evidence (such as whiskers formed by metal electromigration and gate oxide layer breakdown points), leading to misjudgments in analysis.

[0004] 2. Structural Integrity Challenges: For porous low-k dielectric materials, microcracked chips, or high aspect ratio structures, internal air bubbles can significantly reduce the overall mechanical strength of the embedded module, causing sample displacement or fragmentation during cutting or sampling, making analysis impossible.

[0005] 3. Analytical Interference Challenges: Any residual foreign matter can interfere with the analysis. Traditional chemical methods using defoamers may introduce interference signals from elements such as sulfur, silicon, and phosphorus contained in the defoamer, which can easily be misinterpreted as "halogen contamination" or "sulfur corrosion" in subsequent energy dispersive spectroscopy (EDS) or X-ray photoelectron spectroscopy (XPS) analyses, leading to completely erroneous conclusions and misleading the direction of process improvement.

[0006] To address the aforementioned challenges, current mainstream defoaming methods in the industry all have significant limitations: Physical oscillation method: This method relies on the operator's experience to perform manual vibration. The force and frequency are difficult to quantify and control, which poses a risk of introducing new air bubbles or damaging tiny structures. In addition, it has low processing efficiency and a high rework rate.

[0007] Vacuum impregnation method: Although it can remove some air bubbles, the equipment is expensive, the operation is complicated and lengthy, and the effect on removing air bubbles in closed pores is limited. It is usually limited to large laboratory configurations and is difficult to popularize.

[0008] Chemical defoaming method: This involves adding defoaming agents. As mentioned above, its chemical pollution risk is in fundamental conflict with the requirements of high-precision elemental analysis, and it has been gradually abandoned in high-end chip analysis.

[0009] Therefore, designing an efficient, simple, and economical fixture is a technical problem that urgently needs to be solved in this case. Utility Model Content

[0010] To address the above problems, this utility model provides a chip cold embedding tilting heating defoaming fixture with a defoaming blade that is ingeniously structured, highly efficient, and easy to use.

[0011] The technical solution of this utility model is: A chip cold mounting tilting heating defoaming fixture with a defoaming blade includes: A breathable adhesive barrier box with an open-top receiving cavity that is adapted to fit the chip sample; A cutting edge insert is movably disposed within the top opening, and has multiple cutting edges at its end; A heating element is disposed on the outside of the gas-permeable barrier box, near the adhesive layer side of the chip sample; The posture holding frame has a V-shaped groove on the top that is adapted to the air-permeable adhesive-blocking box, so that the air-permeable adhesive-blocking box is tilted and placed on the horizontal worktable.

[0012] Specifically, the V-shaped groove includes an inclined bottom surface and a side surface perpendicular to the bottom surface.

[0013] Specifically, multiple cutting edges are serrated.

[0014] Specifically, a gap is provided between the serrated cutting edge and the inner sidewall of the receiving cavity.

[0015] Specifically, the chip sample includes a cover glass, an adhesive layer, a chip, and a substrate connected in sequence.

[0016] This invention includes a breathable adhesive barrier box, a cutting edge insert, a heating element, and a posture holder. The heat emitted by the heating element passes through the breathable adhesive barrier box and enters the chip sample, reducing the viscosity of the adhesive in the sample and decreasing the resistance to the movement of air bubbles in the adhesive. The air density in the air bubbles is less than the density of the surrounding adhesive, and the air bubbles in the adhesive expand after being heated, increasing the buoyancy of the air bubbles and causing them to rise. At this point, the air bubbles rise to the opening at the top of the breathable adhesive barrier box via three paths, where they are punctured by the serrated cutting edge. In other words, this patented device eliminates air bubbles in the chip sample embedded and fixed with epoxy resin adhesive through buoyancy, physical puncture, and thermal effects. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 yes Figure 1 Schematic diagram of the B-direction structure; Figure 3 yes Figure 1 Schematic diagram of the A-direction structure; Figure 4 yes Figure 3 A schematic diagram of the structure of a bubble in the C-direction; Figure 5 yes Figure 3 Schematic diagram of the second state structure of the bubble in the C-direction; Figure 6 yes Figure 3 A schematic diagram of the three-dimensional structure of the bubble in the C-direction; Figure 7 yes Figure 3 Schematic diagram of the four-stage structure of the bubble in the C-direction; Figure 8 yes Figure 3 Schematic diagram of the five-stage structure of the bubble in the C-direction; Figure 9 yes Figure 3 A schematic diagram of the six-dimensional structure of the bubble in the C-direction; In the diagram, 1-cover glass, 2-chip, 3-substrate, 4-adhesive layer, 5-breathable barrier box, 6-heating plate, 7-posture holder, 8-blade insert, 81-blade. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The following is for reference. Figure 1-9 Description according to this utility model; A chip cold mounting tilting heating defoaming fixture with a defoaming blade includes: The breathable adhesive barrier box 5 has a top-opening receiving cavity that is adapted to fit the chip sample. A cutting edge insert 8 is movably disposed within the top opening, and has multiple cutting edges 81 at its end; The blade insert 8 is a sheet plate with a serrated blade 81 on one side and a straight edge on the opposite side. The other two sides (the two sides perpendicular to the blade edge) can be inserted into the gas-permeable adhesive-blocking box 5. The gas-permeable adhesive-blocking box 5 can be equipped with sliding grooves and other structures on both sides to facilitate the installation of the blade insert 8. After the blade insert 8 is inserted into the gas-permeable adhesive-blocking box 5, it fits and covers the side of the chip sample. Heating element 6 is disposed on the outside of the gas-permeable adhesive barrier box 5, near the adhesive layer 4 of the chip sample; The posture holding frame 7 has a V-shaped groove on the top that is adapted to the air-permeable adhesive-blocking box 5, so that the air-permeable adhesive-blocking box 5 is tilted and placed on the horizontal worktable.

[0022] The V-groove includes an inclined bottom surface and a side surface perpendicular to the bottom surface.

[0023] Multiple cutting edges 81 are serrated.

[0024] A gap is provided between the serrated cutting edge 81 and the inner sidewall of the receiving cavity.

[0025] The chip sample consists of a cover glass 1, an adhesive layer 4, a chip 2, and a substrate 3 connected in sequence.

[0026] This patent eliminates air bubbles in chip samples (“substrate-chip-adhesive-cover glass” structure) embedded and fixed with epoxy resin adhesive through buoyancy, physical puncture, and heat-affected processes. The specific implementation steps and principles are as follows: 1. Place the chip sample that has been coated with epoxy resin adhesive into the gas-permeable adhesive box 5, and then insert the cutting edge 8 from the open end of the gas-permeable adhesive box 5 until it can no longer be pushed. At this time, the cutting edge 81 does not completely seal the gas-permeable adhesive box 5, but has a certain opening. 2. Place the bottom of the gas-permeable barrier box 5 containing the chip sample on the attitude holder 7; 3. Activate the heating plate 6 on the side wall of the gas-permeable adhesive barrier box 5. The heat emitted by the heating plate 6 passes through the gas-permeable adhesive barrier box 5 and enters the chip sample. The viscosity of the adhesive 4 in the sample decreases, and the resistance to the movement of air bubbles in the adhesive decreases (the air bubbles in the adhesive mainly come from large air bubbles visible to the naked eye during the chip cold mounting sample preparation process and tiny air bubbles dissolved in the adhesive). 4. The air density inside the bubble is less than the density of the surrounding glue, and the bubble in the glue expands after being heated, increasing its buoyancy and causing it to rise. At this point, the bubble has three paths to rise to the opening at the top of the air-permeable glue-blocking box 5: 4.1) The bubbles reach the opening directly under the action of buoyancy; 4.2) The bubble rises to the cutting edge insertion point 8 under the action of buoyancy, and then rises along the cutting edge insertion point to the open part; 4.3) Under the action of buoyancy, the bubbles rise to the inner side wall of the breathable adhesive barrier box 5, and then rise along the inner wall to the opening (when the bubbles come into contact with the inner wall of the breathable adhesive barrier box 5, only a small part of them can be discharged directly from the inner wall, and most of them cannot be discharged directly due to surface tension, but continue to move towards the top). 5. As the bubbles rise, they merge or eventually merge completely or partially at the opening. Meanwhile, the bubbles continue to rise until they touch the cutting edge 81. The surface tension of the adhesive breaks the constraint on the bubbles, causing them to burst and the gas to escape. The bubbles are then eliminated. After the adhesive has cured, the sample is removed, and the cold mounting of the chip sample is complete.

[0027] The breathable barrier box 4 in this patent can be made of metal or non-metal, preferably a porous hydrophobic polymer material.

[0028] Regarding the information disclosed in this case, the following points need to be clarified: (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design. (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments; The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A die cold sintering slant heating defoaming clamp with bubble breaking blade, characterized in that, include: The gas-permeable barrier box (5) has a top-opening receiving cavity that is adapted to the chip sample; A cutting edge insert (8) is movably disposed within the top opening and has multiple cutting edges (81) at its end. A heating element (6) is disposed on the outside of the gas-permeable barrier box (5), close to the adhesive layer (4) of the chip sample; The posture holding frame (7) has a V-shaped groove on the top that is adapted to the breathable adhesive barrier box (5), so that the breathable adhesive barrier box (5) is tilted and placed on the horizontal workbench.

2. The chip cold mounting tilting heating defoaming fixture with defoaming blade as described in claim 1, characterized in that, The V-groove includes an inclined bottom surface and a side surface perpendicular to the bottom surface.

3. The chip cold mounting tilting heating defoaming fixture with defoaming blade as described in claim 1, characterized in that, Multiple cutting edges (81) are serrated.

4. A chip cold mounting tilting heating defoaming fixture with a defoaming cutting edge according to claim 3, characterized in that, A gap is provided between the serrated cutting edge (81) and the inner sidewall of the receiving cavity.

5. A chip cold mounting tilting heating defoaming fixture with a defoaming cutting edge according to claim 1, characterized in that, The chip sample comprises a cover glass (1), an adhesive layer (4), a chip (2), and a substrate (3) connected in sequence.

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