A chip stress measurement device

Abstract

The application belongs to the technical field of chip testing, and particularly relates to a chip stress measuring device, which comprises a mounting frame, step motors are symmetrically and fixedly installed on the left and right sides of the front end of the mounting frame, a shaft coupling is fixedly installed at the output end of the step motor, mounting grooves are symmetrically formed in the inner side of the mounting frame, rotating wheels are uniformly and rotatably installed in the mounting grooves, and transmission belts are movably installed on the outer side of the rotating wheels. In the process of measuring the stress of the chip, the chip is placed between the supporting blocks for extrusion and fixation, then the step motor is started to move with the transmission belts, then the transmission belts move the chip between the supporting blocks to the lower side of the electric telescopic rod, the electric telescopic rod fixedly installed in the connecting block is moved by the linear motor, then the electric telescopic rod moves with the pressing block and the pressure sensor, so that the chip at different positions is pressed and measured more stably.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip stress measurement device. Background Technology

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing integrated circuits, often a component of computers or other electronic devices. Chips are a general term for semiconductor components and the carriers of integrated circuits, formed by dicing wafers. During chip manufacturing, various performance tests are required, with stress testing being a crucial aspect. Chip stress reflects properties such as chip strength and flexibility.

[0003] However, in the existing technology, when performing stress measurement on a chip, a stress detection device is used to squeeze the chip. However, during the detection process, the chip is prone to movement, which affects the measurement results. Therefore, further improvement is needed. To this end, we propose a chip stress measurement device. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip stress measurement device.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a chip stress measuring device, comprising a mounting frame, wherein stepper motors are symmetrically fixedly mounted on the left and right sides of the front end of the mounting frame, and couplings are fixedly mounted on the output ends of the stepper motors. The inner side of the mounting frame is symmetrically provided with mounting grooves, in which rotating wheels are uniformly rotatably mounted. A transmission belt is movably mounted on the outer side of the rotating wheels. The stepper motors are fixedly connected to the frontmost rotating wheel via couplings. Electromagnetic blocks are uniformly fixedly mounted on the side of the transmission belt away from the mounting frame, and a mounting post is fixedly mounted on the end of the electromagnetic blocks away from the transmission belt. A through groove is provided inside the mounting post, and a spring is movably mounted in the through groove. A connecting rod is movably inserted into the open end of the through groove. A pressing block is fixedly installed at one end of the connecting rod inside the through groove. The side of the pressing block away from the connecting rod abuts against a spring. A fixing plate is fixedly installed at the end of the connecting rod away from the mounting post. Support blocks are fixedly installed at the upper and lower ends of the side of the fixing plate away from the connecting rod. A chip is placed between the support blocks. A mounting plate is fixedly installed at the upper and lower ends of the middle of the mounting frame. A linear motor is fixedly installed on the front side of the mounting plate. A connecting block is movably installed on the linear motor. An electric telescopic rod is fixedly installed in the middle of the connecting block. A pressing block is fixedly installed at the bottom end of the electric telescopic rod. A pressure sensor is fixedly installed at the bottom end of the pressing block.

[0006] Furthermore, support legs are evenly fixedly installed at the bottom of the mounting bracket, and shock-absorbing pads are fixedly installed at the bottom of the support legs; this allows the support legs to support the mounting bracket in a more convenient operating position, improving work efficiency, while reducing the reaction force experienced by the mounting bracket during operation, ensuring the measurement results of the chip.

[0007] Furthermore, a waste recycling bin is movably mounted at the lower middle part of the mounting frame, located directly below the pressure sensor. A storage box is placed below the rear end of the mounting frame. This allows the waste recycling bin to collect broken chips, while the storage box below the rear end of the mounting frame collects qualified chips, thus preventing chips from falling everywhere, increasing labor costs, and affecting work efficiency.

[0008] Furthermore, a guide plate is movably mounted on the rear side of the mounting bracket, with the end of the guide plate away from the mounting bracket placed inside the storage box; this allows qualified chips to be stably transported into the storage box through the guide plate, reducing damage during chip collection and improving work efficiency.

[0009] Furthermore, a protective pad is fixedly installed on the side of the fixing plate away from the connecting rod; this can reduce the damage caused by the fixing plate squeezing the chip and improve the chip's safety.

[0010] Furthermore, the top of the mounting plate is lower than the bottom of the lower fixing plate; this prevents collisions between the mounting plate and the fixing plate when the transmission belt moves the fixing plate, thus avoiding damage to the fixing plate and affecting its use.

[0011] The beneficial effects of this utility model are:

[0012] 1. In use, this utility model, during the stress measurement of the chip, involves placing the chip between support blocks and pressing it in place. Then, a stepper motor is started, moving the chip with a transmission belt. The transmission belt, via an electromagnetic block, moves the chip between the support blocks to below the electric telescopic rod. Simultaneously, a linear motor moves the electric telescopic rod, which is fixedly installed in the connecting block. The electric telescopic rod then moves the pressing block and pressure sensor, thereby more stably pressing and measuring different positions of the chip, improving the chip detection effect. After pressing, unqualified chips fall off, while qualified chips continue to move under the drive of the transmission belt. Finally, the staff collects the chips that have been tested.

[0013] 2. In use, this utility model has a protective pad fixedly installed on the side of the fixed plate away from the connecting rod, which can reduce the damage caused by the fixed plate squeezing the chip and improve the safety of the chip. Then, qualified chips continue to move under the drive of the transmission belt and are stably transported into the inside of the storage box by the guide plate, which reduces the damage caused during chip collection, reduces labor costs and improves work efficiency. Attached Figure Description

[0014] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a rear view of the present invention;

[0017] Figure 3 This is an overall cross-sectional view of the present invention;

[0018] Figure 4 This is an enlarged view of part A of this utility model.

[0019] The attached figures are labeled as follows:

[0020] 1. Mounting bracket; 2. Support leg; 3. Stepper motor; 4. Rotating wheel; 5. Mounting slot; 6. Drive belt; 7. Electromagnetic block; 8. Mounting column; 9. Through slot; 10. Spring; 11. Connecting rod; 12. Pressing block; 13. Fixing plate; 14. Support block; 15. Chip; 16. Mounting plate; 17. Linear motor; 18. Connecting block; 19. Electric telescopic rod; 20. Pressing block; 21. Pressure sensor; 22. Waste recycling bin; 23. Storage bin; 24. Guide plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-4As shown, a chip stress measuring device is disclosed, comprising a mounting frame 1. Stepper motors 3 are symmetrically fixedly mounted on the left and right sides of the front end of the mounting frame 1. Couplings are fixedly mounted on the output ends of the stepper motors 3. Mounting grooves 5 are symmetrically opened on the inner side of the mounting frame 1. Rotating wheels 4 are uniformly rotatably mounted in the mounting grooves 5. A transmission belt 6 is movably mounted on the outer side of the rotating wheels 4. The stepper motors 3 are fixedly connected to the frontmost rotating wheel 4 through the couplings. Electromagnetic blocks 7 are uniformly fixedly mounted on the side of the transmission belt 6 away from the mounting frame 1. A mounting post 8 is fixedly mounted on the end of the electromagnetic block 7 away from the transmission belt 6. A through groove 9 is opened inside the mounting post 8. A spring 10 is movably mounted in the through groove 9. A connecting rod 11 is movably inserted into the open end of the through groove 9. A pressing block 12 is fixedly installed at one end inside the through groove 9. The side of the pressing block 12 away from the connecting rod 11 abuts against the spring 10. A fixing plate 13 is fixedly installed at the end of the connecting rod 11 away from the mounting column 8. Support blocks 14 are fixedly installed at the upper and lower ends of the side of the fixing plate 13 away from the connecting rod 11. A chip 15 is placed between the support blocks 14. A mounting plate 16 is fixedly installed at the upper and lower ends of the middle part of the mounting frame 1. A linear motor 17 is fixedly installed on the front side of the mounting plate 16. A connecting block 18 is movably installed on the linear motor 17. An electric telescopic rod 19 is fixedly installed in the middle of the connecting block 18. A pressing block 20 is fixedly installed at the bottom end of the electric telescopic rod 19. A pressure sensor 21 is fixedly installed at the bottom end of the pressing block 20.

[0023] In this embodiment, during the stress measurement of chip 15, the electromagnetic block 7 is energized to attract and move the fixing plate 13. During the movement, the fixing plate 13 compresses the spring 10 via the connecting rod 11 and the pressing block 12. Then, chip 15 is placed between support blocks 14. Then, the power is turned off, and the pressing block 12 moves the connecting rod 11 via the reaction force of the spring 10. Then, the connecting rod 11 compresses and fixes chip 15 with the fixing plate 13. Then, the stepper motor 3 is started, and the stepper motor 3 moves the transmission belt 6 via the rotating wheel 4. Then, the transmission belt 6 moves chip 15 between support blocks 14 to below the electric telescopic rod 19 via the electromagnetic block 7. At the same time, the linear motor 17 moves the electric telescopic rod 19 fixedly installed in the connecting block 18. Then, the electric telescopic rod 19 moves the pressing block 20 and the pressure sensor 21, thereby measuring the pressure at different positions of chip 15.

[0024] Specifically, support legs 2 are evenly fixedly installed at the bottom of the mounting frame 1, and shock-absorbing pads are fixedly installed at the bottom of the support legs 2.

[0025] By evenly fixing support legs 2 at the bottom of the mounting frame 1, the support legs 2 can support the mounting frame 1 in a more convenient position for operation, thereby improving work efficiency. At the same time, shock-absorbing pads are fixedly installed at the bottom of the support legs 2, which can reduce the reaction force experienced by the mounting frame 1 during operation.

[0026] Specifically, a waste recycling bin 22 is movably installed at the lower middle part of the mounting frame 1. The waste recycling bin 22 is located directly below the pressure sensor 21. A storage box 23 is placed at the lower rear end of the mounting frame 1.

[0027] By movably installing a waste recycling bin 22 at the lower middle part of the mounting frame 1, the waste recycling bin 22 can collect broken chips 15, while a storage bin 23 placed at the lower rear end of the mounting frame 1 can collect qualified chips 15.

[0028] Specifically, a guide plate 24 is movably installed on the rear side of the mounting bracket 1, and the end of the guide plate 24 away from the mounting bracket 1 is placed inside the storage box 23;

[0029] By movably installing a guide plate 24 on the rear side of the mounting bracket 1, qualified chips 15 can be stably transported into the storage box 23 through the guide plate 24, reducing the damage caused during the collection of chips 15.

[0030] Specifically, a protective pad is fixedly installed on the side of the fixing plate 13 away from the connecting rod 11;

[0031] By fixing a protective pad on the side of the fixing plate 13 away from the connecting rod 11, the damage caused by the fixing plate 13 squeezing the chip 15 can be reduced.

[0032] Specifically, the top of the lower mounting plate 16 is lower than the bottom of the lower fixing plate 13;

[0033] By ensuring that the top of the lower mounting plate 16 is lower than the bottom of the lower fixing plate 13, collisions between the mounting plate 16 and the fixing plate 13 can be avoided when the transmission belt 6 moves the fixing plate 13.

[0034] Working principle: During stress measurement of chip 15, the electromagnetic block 7 is energized, causing it to attract and move the fixing plate 13. As the fixing plate 13 moves, the connecting rod 11, along with the pressing block 12, presses against the spring 10. The chip 15 is then placed between the support blocks 14. Power is then cut off, allowing the pressing block 12 to move along the connecting rod 11 due to the reaction force of the spring 10. The connecting rod 11, along with the fixing plate 13, presses and fixes the chip 15. Then, the stepper motor 3 is started, causing it to move via the rotating wheel 4 and the transmission belt 6. The transmission belt 6 then moves along the core between the support blocks 14 via the electromagnetic block 7. Chip 15 moves below the electric telescopic rod 19, and the electric telescopic rod 19, which is fixedly installed in the connecting block 18, moves via the linear motor 17. The electric telescopic rod 19 then moves along with the pressing block 20 and the pressure sensor 21, thereby pressing and measuring different positions of chip 15. After pressing, defective chips 15 fall off and are collected by the waste recycling bin 22. Qualified chips 15 continue to move under the drive of the transmission belt 6 and are then stably transported into the storage box 23 by the guide plate 24, reducing damage during chip collection and allowing staff to collect the tested chips 15.

[0035] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A chip stress measuring device, comprising a mounting bracket (1), characterized in that: Stepper motors (3) are symmetrically fixedly installed on the left and right sides of the front end of the mounting bracket (1). A coupling is fixedly installed at the output end of the stepper motor (3). Mounting slots (5) are symmetrically opened on the inner side of the mounting bracket (1). A rotating wheel (4) is evenly installed in the mounting slot (5). A transmission belt (6) is movably installed on the outer side of the rotating wheel (4). The stepper motor (3) is fixedly connected to the frontmost rotating wheel (4) through the coupling. An electromagnetic block (7) is evenly fixedly installed on the side of the transmission belt (6) away from the mounting bracket (1). A mounting post (8) is fixedly installed on the end of the electromagnetic block (7) away from the transmission belt (6). A through groove (9) is opened inside the mounting post (8). A spring (10) is movably installed in the through groove (9). A connecting rod (11) is movably inserted into the opening end of the through groove (9). The connecting rod (11) is located inside the through groove (9). One end of the mounting bracket (1) is fixedly installed with a pressing block (12). The side of the pressing block (12) away from the connecting rod (11) abuts against the spring (10). The end of the connecting rod (11) away from the mounting column (8) is fixedly installed with a fixing plate (13). The upper and lower ends of the side of the fixing plate (13) away from the connecting rod (11) are fixedly installed with support blocks (14). A chip (15) is placed between the support blocks (14). The upper and lower ends of the middle part of the mounting bracket (1) are fixedly installed with a mounting plate (16). The front side of the mounting plate (16) is fixedly installed with a linear motor (17). A connecting block (18) is movably installed on the linear motor (17). An electric telescopic rod (19) is fixedly installed in the middle of the connecting block (18). A pressing block (20) is fixedly installed at the bottom end of the electric telescopic rod (19). A pressure sensor (21) is fixedly installed at the bottom end of the pressing block (20).

2. The chip stress measuring device according to claim 1, characterized in that: The bottom end of the mounting bracket (1) is uniformly fixed with support legs (2), and the bottom end of the support legs (2) is fixed with shock-absorbing pads.

3. The chip stress measuring device according to claim 1, characterized in that: A waste recycling bin (22) is movably installed at the lower middle part of the mounting bracket (1). The waste recycling bin (22) is located directly below the pressure sensor (21). A storage box (23) is placed below the rear end of the mounting bracket (1).

4. The chip stress measuring device according to claim 1, characterized in that: A guide plate (24) is movably mounted on the rear side of the mounting bracket (1), and the end of the guide plate (24) away from the mounting bracket (1) is placed inside the storage box (23).

5. The chip stress measuring device according to claim 1, characterized in that: A protective pad is fixedly installed on the side of the fixing plate (13) away from the connecting rod (11).

6. The chip stress measuring device according to claim 1, characterized in that: The top of the mounting plate (16) below is lower than the bottom of the lower fixing plate (13).

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