Optical sensor chip and detection device

Abstract

The utility model provides a kind of optical sensor chip and detection device, sensor chip includes dielectric layer and transparent substrate, substrate is nonmetal material, and the outer surface of substrate includes connecting surface;Dielectric layer includes at least one dielectric unit, and dielectric unit is nonmetal material, and dielectric unit is connected in connecting surface, and the central axis of dielectric unit is inclined relative to connecting surface.The optical sensor chip is simple in structure, and has high sensitivity and fast response characteristics, suitable for label-free detection of DNA, polypeptide, protein, sugar, lipid and other biomolecules.

Description

Technical Field

[0001] This utility model relates to the field of biochemical detection technology, and in particular to an optical sensor chip and detection device. Background Technology

[0002] Optical sensors based on changes in the refractive index of the environment have shown broad application prospects in the field of optical biosensing due to their compact structure and extreme sensitivity to changes in the refractive index of the surrounding medium. Compared with traditional fluorescent labeling and electrochemical detection methods, refractive index sensors have the advantages of real-time, label-free, and non-destructive detection, as well as being easy to operate, having a fast response speed, and being suitable for the analysis of trace samples.

[0003] In existing technologies, one type of refractive index sensor detects refractive index by inducing BIC resonance (Bound State in the Continuum) in the optical sensor chip. This type of sensor can achieve extremely high quality factors (also known as Q-factors) and sharp resonance lines, thus possessing high detection sensitivity. However, the structure of existing optical sensor chips is relatively complex in order to induce BIC resonance. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an optical sensor chip with a simple structure.

[0005] This invention also proposes a detection device including the aforementioned optical sensor chip.

[0006] An optical sensor chip according to a first aspect of the present invention includes: a transparent substrate, the substrate being made of a non-metallic material, the outer surface of the substrate including a connection surface; a dielectric layer including at least one dielectric unit, the dielectric unit being made of a non-metallic material, the dielectric unit being connected to the connection surface, and the central axis of the dielectric unit being inclined relative to the connection surface.

[0007] The optical sensor chip according to the first aspect of this utility model has at least the following beneficial effects: light can be decomposed into a superposition of left-handed and right-handed circularly polarized light. When there is asymmetry in the optical structure, the interference destructive condition between the left-handed and right-handed circularly polarized light is destroyed, causing the originally bound mode to transform into a leakage mode, which manifests as a high-Q resonance characteristic in the spectrum. This embodiment constructs an asymmetric optical structure by setting tilted dielectric units on the substrate, thereby inducing BIC resonance during the detection process. The dielectric unit structure of the optical sensor chip in this embodiment is simple, and the manufacturing difficulty and cost are both low.

[0008] According to some embodiments of the present invention, the dielectric layer includes a plurality of dielectric units, any two dielectric units are spaced apart, and all dielectric units are arranged in a rectangular array.

[0009] According to some embodiments of the present invention, all the media units have the same tilt direction and all the media units have the same tilt angle.

[0010] According to some embodiments of the present invention, the dielectric unit is in the shape of a quadrangular prism, and both the top and bottom surfaces of the dielectric unit are rectangular.

[0011] According to some embodiments of the present invention, the angle between the central axis of the medium unit and the normal of the connecting surface is α, where 5°≤α≤20°.

[0012] According to some embodiments of this utility model, the dielectric unit is made of monocrystalline silicon.

[0013] According to some embodiments of the present invention, the length of the dielectric unit is L, 300nm≤L≤500nm; the width of the dielectric unit is W, 100nm≤W≤200nm; and the height of the dielectric unit is H, 100nm≤H≤300nm.

[0014] According to some embodiments of the present invention, the dielectric layer includes a plurality of dielectric units, any two dielectric units are spaced apart, and all dielectric units are arranged in a rectangular array; in a first direction, the arrangement period of the dielectric units is Z1, 500nm≤Z1≤700nm; in a second direction, the distance between the arrangement periods of the dielectric units is Z2, 500nm≤Z2≤700nm; any two of the first direction, the second direction, and the thickness direction of the substrate are perpendicular to each other.

[0015] According to some embodiments of the present invention, the optical sensor chip further includes a modification layer, which is connected to the side surface of the dielectric unit facing away from the substrate, and the modification layer is used to bind with ligands.

[0016] The detection device according to a second aspect embodiment of the present invention includes: an optical sensor chip as described in the first aspect embodiment; a sample container including a sample chamber for containing a sample, wherein the optical sensor chip is located in the sample chamber; a light source for emitting light toward the sample chamber; and a spectrometer for collecting the spectrum of the light emitted from the sample chamber.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a front view of an optical sensor chip according to some embodiments of the present invention; Figure 2 This is a top view of an optical sensor chip according to some embodiments of the present invention; Figure 3 This is a schematic diagram illustrating the detection principle of an optical sensor chip. Figure 4 To measure the resonant wavelength drift diagram when using the optical sensor chip of the first embodiment for different liquid refractive indices; Figure 5 To measure the resonant wavelength drift diagram when using the optical sensor chip of the second embodiment for different liquid refractive indices; Figure 6 This is a schematic diagram illustrating the manufacturing process of the optical sensor chip in some embodiments; Figure 7 This is a schematic diagram of a detection device according to some embodiments of the present invention.

[0019] Reference numerals: 101-Optical sensor chip, 102-Substrate, 103-Dielectric layer, 104-Dielectric unit, 105-Connecting surface, 106-Modification layer, 107-Modification molecule, 108-Initial layer, 109-Dielectric strip, 110-Central axis, 111-Normal, 201-Ligand, 202-Target analyte, 301-Detection device, 302-Microfluidic chip, 303-Sample chamber, 304-Light source, 305-Spectrometer, 306-First ray, 307-Second ray, 308-First channel, 309-Second channel. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0021] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0024] Figure 1 and Figure 2 An optical sensor chip 101 according to an embodiment of the present invention is shown. For example... Figure 1 As shown, the optical sensor chip 101 includes a substrate 102 and a dielectric layer 103, both of which are non-metallic. The substrate 102 is transparent; for example, it is made of glass. The outer surface of the substrate 102 includes a bonding surface 105. Figure 1 In this embodiment, the connection surface 105 is the top surface of the substrate 102. The dielectric layer 103 includes a plurality of dielectric units 104, which are connected to the connection surface 105. The central axis 110 of the dielectric unit 104 is inclined relative to the connection surface 105, that is, the central axis 110 of the dielectric unit 104 intersects the connection surface 105 but is not perpendicular to it. The center of the top surface and the center of the bottom surface of the dielectric unit 104 are both located on the central axis 110 of the dielectric unit 104. In some other embodiments not shown, the optical sensor chip 101 may also include only one dielectric unit 104.

[0025] Light, regardless of its state, can be decomposed into left-handed and right-handed circularly polarized light. When an optical structure is asymmetrical, the destructive interference condition between left-handed and right-handed circularly polarized light is disrupted, and the originally bound modes transform into leakage modes, manifesting as a high-Q resonance characteristic in the spectrum. In this embodiment, an asymmetrical optical structure is constructed by setting tilted dielectric units 104 on the substrate 102, thereby inducing BIC resonance during detection. The dielectric unit 104 of the optical sensor chip 101 in this embodiment has a simple structure, resulting in low manufacturing difficulty and cost.

[0026] The following is a combination Figure 7 and Figure 3 This section introduces the working principle of the optical sensor chip 101.

[0027] Figure 7A detection device 301 is shown, comprising an optical sensor chip 101, a microfluidic chip 302, a light source 304, and a spectrometer 305. The microfluidic chip 302 includes a sample chamber 303, within which the optical sensor chip 101 is exposed. The sample chamber 303 is used to contain a sample, which, upon entering the sample chamber 303, comes into contact with the optical sensor chip 101. Figure 7 In this embodiment, the optical sensor chip 101 is entirely located within the sample chamber 303. However, in some other embodiments not shown, only a portion of the optical sensor chip 101 may be exposed within the sample chamber 303, as long as the dielectric layer 103 of the optical sensor chip 101 can contact the biological solution within the sample chamber 303.

[0028] The microfluidic chip 302 also includes flow channels, including a first channel 308 and a second channel 309, both of which are connected to the sample chamber 303. Samples can enter the sample chamber 303 through the first channel 308, and the detected samples can exit the sample chamber 303 through the second channel 309. The light source 304 faces the sample chamber 303 and emits light (first light ray 306) into it. The microfluidic chip 302 is transparent, and the substrate 102 layer of the optical sensor chip 101 is also transparent; therefore, at least a portion of the light will pass through the sample chamber 303 and exit. The light emitted from the sample chamber 303 (second light ray 307) will be collected by the spectrometer 305.

[0029] exist Figure 7 In this configuration, the light source 304 is located above the optical sensor chip 101, and the spectrometer 305 is located below the optical sensor chip 101. In other embodiments not shown, the positions of the light source 304 and the spectrometer 305 can also be interchanged, i.e., the spectrometer 305, the optical sensor chip 101, and the light source 304 are arranged sequentially from top to bottom, as long as the light source 304 can emit light into the sample chamber 303 and the light emitted from the sample chamber 303 can be collected by the spectrometer 305.

[0030] Figure 3 Images (a) through (c) illustrate the process of combining the optical sensor chip 101 with the target detection object 202 in the sample. Figure 3 Figures (d) to (f) show the spectral response curves generated by spectrometer 305. Figure 3 In (d) to (f), the vertical axis T represents the light transmittance, and the horizontal axis represents the wavelength of the light. The light transmittance refers to the ratio of light passing through the optical sensor chip 101, which can also be understood as the ratio of the luminous flux of the second ray 307 to the luminous flux of the first ray 306.

[0031] like Figure 3As shown in (a), in order to enable the optical sensor chip 101 to have a better bonding effect with the target detection object 202, the optical sensor chip 101 may further include a modification layer 106. The modification layer 106 is connected to the side surface of the dielectric unit 104 facing away from the substrate 102, and the modification layer 106 includes a plurality of modification molecules 107. The modification molecules 107 may be molecules with functional groups such as amino (-NH2), carboxyl (-COOH), streptavidin (SA).

[0032] When the optical sensor chip 101 is in Figure 3 In the state shown in (a), the spectral response curve generated by spectrometer 305 is as follows: Figure 3 As shown in (d), the light emitted by light source 304 comprises a continuous set of light rays in wavelength, with different wavelengths having different transmittances. Figure 3 In (d), the curve shows a resonance peak at λ0. Light with wavelength λ0 has a low transmittance through the optical sensor chip 101, meaning it is essentially "bound" within the chip, causing BIC resonance. At this point, the refractive index of the biological solution corresponding to this curve is the first refractive index.

[0033] like Figure 3 As shown in (b), when a sample needs to be detected, ligand 201 can be added to sample chamber 303 to allow ligand 201 to bind to modified molecule 107. Ligand 201 can be DNA, RNA, polypeptide, antibody fragment, etc. Ligand 201 can specifically bind to modified molecule 107. After ligand 201 binds to modified molecule 107, the refractive index of optical sensor chip 101 changes, and the spectral response curve generated by spectrometer 305 at this time is shown in Figure 107. Figure 3 As shown in (e), the resonance peak of the curve at this time is redshifted to λ1, and the refractive index of the biological solution corresponding to the curve is the second refractive index, which is different from the first refractive index and the second refractive index.

[0034] Subsequently, the sample solution can be added to sample chamber 303. Assuming the sample solution contains the target analyte 202, the target analyte 202 will bind to the ligand 201 and undergo a specific reaction (e.g., Figure 3 As shown in (c), this causes a change in the refractive index of the biological solution, resulting in a redshift of the resonance peak of the curve to λ2. The refractive index corresponding to this curve is the third refractive index, which differs from the second refractive index. The target analyte 202 can be a protein, antibody / antigen, tumor marker, etc.

[0035] Therefore, in the three-step reaction process of chip modification, ligand 201 binding, and receptor detection, the specific recognition and binding of biomolecules at each step leads to a change in the refractive index of the liquid. This change in refractive index is directly reflected in the spectral characteristics of the optical sensor chip 101. Through real-time monitoring and analysis of the spectrum, highly sensitive, label-free, real-time dynamic monitoring of the biomolecule binding reaction can be achieved. The presence of the target analyte 202 in the sample solution can be determined by the spectral curve. This embodiment is based on the principle of resonance peak wavelength shift to achieve BIC resonance of the high-quality factor, and uses the change in spectrum to determine the minute change in the refractive index of the biological solution, thereby achieving highly sensitive detection of the sample.

[0036] In existing technologies, optical sensor chips 101 typically employ metal nanostructures. This can lead to non-specific adsorption of biomolecules such as proteins on the metal surface, affecting the accuracy and repeatability of detection. When a sample comes into contact with a metal surface, it may degrade or undergo structural changes. Therefore, optical sensor chips 101 using metal surfaces are unsuitable for detecting live components. In contrast, the optical sensor chip 101 of this embodiment is made of non-metallic materials. This allows for effective specific adsorption, improving detection accuracy. Furthermore, the optical sensor chip 101 of this embodiment is less likely to cause sample degradation or structural changes, making it suitable for detecting live components.

[0037] As described above, the materials used in each part of the optical sensor chip 101 in this embodiment are non-metallic dielectric materials, which are compatible with instruments such as gene sequencers and microfluidic chips, enabling complementary detection needs across upstream and downstream applications. For example, biological solutions detected by the detection device can subsequently undergo sequencing analysis.

[0038] The structure of the optical sensor chip 101 will be described below.

[0039] like Figure 1 As shown, the angle between the central axis 110 of the dielectric unit 104 and the normal 111 of the connecting surface 105 is α, where 5° ≤ α ≤ 20°. More specifically, α can be 5°, 8°, 10°, 13°, 15°, 17°, 20°, etc. Within this angle range, the optical sensor chip 101 can effectively induce a BIC.

[0040] like Figure 2As shown, the dielectric layer 103 includes multiple dielectric units 104, with any two dielectric units 104 spaced apart, and all dielectric units 104 arranged in a periodic array. In this embodiment, the periodic array is a rectangular array, and the dielectric layer 103 includes multiple rows and columns of dielectric units 104. In other embodiments not shown, the periodic array may also be a circular array or an array of other shapes. Because the dielectric layer 103 includes multiple dielectric units 104, the number of dielectric units 104 that can be combined with the target detection object 202 in the optical sensor chip 101 is relatively large, which allows the optical sensor chip 101 to be fully combined with the target detection object 202, improving the reliability of the optical sensor chip 101. The periodic array distribution of all dielectric units 104 helps to reduce the structural complexity and fabrication difficulty of the optical sensor chip 101.

[0041] To reduce the structural complexity and fabrication difficulty of the optical sensor chip 101, such as Figure 1 As shown, all dielectric units 104 can have the same tilt direction and the same tilt angle. To reduce the structural complexity and fabrication difficulty of the optical sensor chip 101, as... Figure 1 and Figure 2 As shown, the dielectric unit 104 can be in the shape of a quadrangular prism, and both the top and bottom surfaces of the dielectric unit 104 are rectangular.

[0042] The manufacturing process of optical sensor chip 101 is as follows: Figure 6 As shown. First, please refer to... Figure 6 In (a) and (b), an initial layer 108 is formed on substrate 102 by physical deposition or chemical deposition. The material of the initial layer 108 is the same as the material of the dielectric unit 104. For example, if both the initial layer 108 and the dielectric unit 104 are made of single-crystal silicon, a silicon thin film can be deposited on substrate 102 by plasma-enhanced chemical vapor deposition (PECVD). Then, please refer to... Figure 6 From (b) to (e), the initial layer 108 can be etched twice, and the remaining part of the initial layer 108 is the dielectric layer 103.

[0043] Please refer to Figure 6 In (c), during the first etching, both the substrate 102 and the initial layer 108 are horizontal, and the etching direction of the initial layer 108 is vertically downward. After the first etching, the remaining portion of the initial layer 108 includes multiple spaced dielectric strips 109.

[0044] Please refer to Figure 6In the second etching step (d), the substrate 102 is tilted relative to the horizontal plane. For example, a wedge-shaped plate can be placed at the bottom of the substrate 102 to tilt it. At this time, the angle between the normal 111 of the substrate 102 and the vertical direction is θ, where θ = α. The etching direction is still vertically downward, but due to the tilt of the substrate 102, multiple tilted dielectric units 104 will be formed after the dielectric strip 109 is etched. The above method can efficiently process a dielectric layer 103 in which the dielectric units 104 are distributed in a rectangular array, and the tilt direction and tilt angle of these dielectric units 104 are the same.

[0045] Whether in the first or second etching, a mask needs to be formed on the dielectric layer 103 before etching. Specifically, photoresist can be uniformly coated on the dielectric layer 103, and then a high-energy electron beam can be used to irradiate the photoresist for scanning exposure at a preset step size to form a mask. After the mask is formed, reactive ion etching (RIE) can be used to etch the dielectric layer 103. After etching is complete, the photoresist remaining on the surface of the dielectric layer 103 can be removed using a chemical solution.

[0046] In some embodiments, the dielectric unit 104 can be made of readily available and easily processed monocrystalline silicon. Furthermore, monocrystalline silicon possesses excellent optical properties, such as high light energy utilization and extremely low transmission loss. Using monocrystalline silicon as the material for the dielectric unit is beneficial for improving the accuracy and efficiency of detection.

[0047] In some embodiments, the operating spectrum of the optical sensor chip 101 is located in the near-infrared band, with a wavelength range of 800nm-1000nm (inclusive). That is, the wavelength of the light emitted by the light source 304 is between 800nm ​​and 1000nm. To make the dielectric layer 103 suitable for inducing bio-induction (BIC), the length L, width W, and height H of the dielectric unit 104 can satisfy the following conditions: 300nm≤L≤500nm, 100nm≤W≤200nm, and 100nm≤H≤300nm. The length, width, and thickness of the dielectric unit 104 are all smaller than the minimum wavelength of the light emitted by the light source 304. The optical sensor chip 101 is a meta-device, and the size of its dielectric unit 104 is at the nanometer level. The optical sensor chip 101 has good on-chip integration capabilities, making it easy to integrate with microfluidic chips, optical components, etc., and suitable for developing miniaturized, biocompatible integrated sensing systems.

[0048] like Figure 2As shown, in the first direction, the arrangement period of the dielectric cells 104 is Z1, and in the second direction, the arrangement period of the dielectric cells 104 is Z2. In some embodiments, in order for the dielectric layer 103 to be suitable for inducing BIC, Z1 and Z2 can satisfy: 500nm≤Z1≤700nm, 500nm≤Z2≤700nm. Z1 and Z2 can be the same or different.

[0049] In this configuration, any two of the first direction, the second direction, and the thickness direction of the substrate 102 are perpendicular to each other. For example, the first direction is left-right, the second direction is front-back, and the thickness direction is vertical. The arrangement period refers to the distance between the same location of two adjacent dielectric cells 104 in a certain direction. For example, as... Figure 2 As shown, for the two medium cells 104 in the first row, in the first direction, the distance between the left edge of one medium cell 104 and the left edge of the other medium cell 104 is Z1.

[0050] The following is a specific embodiment and its test data to demonstrate that the optical sensor chip 101 has high accuracy and sensitivity.

[0051] Specific embodiment: The substrate 102 is transparent glass, the material of which is silicon dioxide, and its refractive index is between 1.44 and 1.46 (inclusive); the substrate 102 is provided with a plurality of dielectric units 104 arranged in a rectangular array; each dielectric unit 104 is prism-shaped, the dielectric unit 104 is made of single crystal silicon, and its length is 400nm, its width is 150nm, and its height is 200nm; the tilt angle of the dielectric unit 104 (i.e., α mentioned above) is 12.7°; Z1 and Z2 are both 600nm.

[0052] like Figure 4 As shown, testing and verification have demonstrated that the metasurface performance of the dielectric layer 103 in this specific embodiment is excellent, and the detection range of the optical sensor chip 101 can cover most biological solutions with refractive indices between 1.30 and 1.40. Figure 5 The index in the upper right corner indicates the refractive index.

[0053] This specific embodiment was used to detect the refractive index change of a biological solution containing DNA molecules, such as... Figure 5As shown. In the initial stage, after the amino group (modified molecule 107) is immobilized on the surface of the medium unit 104, the spectral response curve shows that the resonance peak is at 976.284 nm in the near-infrared band, corresponding to a refractive index of 1.332 for the biological solution. Subsequently, DNA is used as ligand 201 to bind to the amino group, and the spectral response curve shows that the resonance peak is at 977.056 nm in the near-infrared band, corresponding to a refractive index of 1.334 for the biological solution. When the target analyte 202 binds to the DNA ligand 201, the spectral response curve shows that the resonance peak is at 977.829 nm in the near-infrared band, corresponding to a refractive index of 1.337 for the biological solution.

[0054] Depend on Figure 6 As can be seen, the optical sensor chip 101 of this specific embodiment can monitor minute changes in the refractive index of a solution in real time, with a detection sensitivity on the order of 0.001. The optical sensor chip 101 of this embodiment possesses high sensitivity and rapid response characteristics, making it suitable for the detection of biomolecules such as DNA, peptides, proteins, carbohydrates, and lipids. Furthermore, the detection process does not require chemical labeling or drastic treatment of the sample, nor does it damage the original state of the sample, making it suitable for real-time detection of structure-sensitive biological samples such as proteins and nucleic acids.

[0055] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. An optical sensor chip, characterized in that, include: A transparent substrate, wherein the substrate is made of a non-metallic material, and the outer surface of the substrate includes a connecting surface; A dielectric layer includes at least one dielectric unit, the dielectric unit being made of a non-metallic material, the dielectric unit being connected to the connecting surface, and the central axis of the dielectric unit being inclined relative to the connecting surface.

2. The optical sensor chip according to claim 1, characterized in that, The dielectric layer includes a plurality of dielectric units, with any two dielectric units spaced apart, and all dielectric units arranged in a periodic array.

3. The optical sensor chip according to claim 2, characterized in that, All the media units have the same tilt direction and the same tilt angle.

4. The optical sensor chip according to claim 1, characterized in that, The dielectric unit is in the shape of a quadrangular prism, and both the top and bottom surfaces of the dielectric unit are rectangular.

5. The optical sensor chip according to claim 1, characterized in that, The angle between the central axis of the medium unit and the normal of the connecting surface is α, where 5°≤α≤20°.

6. The optical sensor chip according to claim 1, characterized in that, The dielectric unit is made of monocrystalline silicon.

7. The optical sensor chip according to claim 6, characterized in that, The length of the dielectric unit is L, where 300nm≤L≤500nm; The width of the dielectric unit is W, where 100nm ≤ W ≤ 200nm; The height of the dielectric unit is H, where 100nm ≤ H ≤ 300nm.

8. The optical sensor chip according to claim 6, characterized in that, The dielectric layer includes a plurality of dielectric units, any two dielectric units are spaced apart, and all dielectric units are arranged in a periodic array. In the first direction, the arrangement period of the dielectric cells is Z1, 500nm≤Z1≤700nm; in the second direction, the distance between the arrangement periods of the dielectric cells is Z2, 500nm≤Z2≤700nm; any two of the first direction, the second direction, and the thickness direction of the substrate are perpendicular to each other.

9. The optical sensor chip according to claim 1, characterized in that, The optical sensor chip further includes a modification layer connected to the side surface of the dielectric unit facing away from the substrate, the modification layer being used for binding with ligands.

10. A detection device, characterized in that, include: The optical sensor chip as described in any one of claims 1 to 9; A sample container, including a sample chamber for containing a sample, wherein the optical sensor chip is exposed in the sample chamber; A light source for emitting light toward the sample chamber; A spectrometer is used to collect the spectrum of light emitted from a sample chamber.

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