Mercury leakage detection mechanism applied to wafer testing

Abstract

The utility model discloses be applied to mercury leakage detection mechanism in wafer test, in view of the problem that camera is in the prior art and is located wafer top side or light source and camera angle are not suitable and lead to mercury liquid imaging is not obvious, mercury leakage is difficult to detect, the mechanism includes the camera and light source through support and is located wafer test device side, camera is inclined to wafer and is with wafer detection surface angle 30 degree 45 degree, light source is inclined to wafer and is with wafer detection surface angle 10 degree 30 degree, both along the device circumferential setting, circumferential angle 0 degree 45 degree, camera installs through classification connecting piece, light source support height adjustment hole is equipped with to adjust angle. The mechanism is through the optimization camera and light source's angle and position, makes mercury liquid imaging clear, promotes mercury leakage detection's accuracy and flexibility.

Description

Technical Field

[0001] This utility model relates to wafer mercury liquid testing technology, and in particular to a mercury leakage detection mechanism applied in wafer testing. Background Technology

[0002] In the mercury-based capacitor testing step of wafer fabrication, mercury leakage detection is required to prevent mercury residue from remaining on the wafer surface. The traditional approach involves placing a light source outside the wafer testing apparatus, illuminating the wafer surface, and then taking a picture of the wafer using a camera positioned on top. The presence of mercury leakage is determined by observing the image of the mercury residue in the photograph. However, in actual testing, it has been found that if the camera is positioned on top of the wafer, the mercury on the wafer surface appears silvery-gray, and the image in the photograph is merely a single point of light at the top, making it difficult to detect. Furthermore, when the angle between the light source and the camera is large, the mercury in the photograph blends almost seamlessly with the wafer background color, making it even harder to detect.

[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a mercury leakage detection mechanism for wafer testing to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a mercury leakage detection mechanism for use in wafer testing, so as to solve the problem of unclear mercury liquid imaging during mercury leakage detection in the prior art.

[0005] To achieve the above and other related objectives, the technical solution provided by this utility model is: a mercury leakage detection mechanism applied in wafer testing, comprising:

[0006] The camera is fixed to the side of the wafer testing device by a camera bracket;

[0007] A light source, which is fixed to the side of the wafer testing device by a light source bracket;

[0008] The camera is tilted toward the wafer testing device and the angle between the camera and the wafer testing surface is between 30° and 45°.

[0009] The light source is tilted toward the wafer testing device and the angle between it and the wafer testing surface is between 10° and 30°.

[0010] A preferred technical solution is that both the camera and the light source are arranged along the circumference of the wafer testing device, and the angle between the camera and the light source along the circumference of the wafer testing device is between 0° and 45°.

[0011] The preferred technical solution is that the camera is fixed to the camera bracket by a connector, and the connector is classified according to the angle of the camera mounting surface.

[0012] The preferred technical solution is as follows: the light source bracket is provided with a vertically set height adjustment hole, the light source is installed by bolts in cooperation with the height adjustment hole, and the angle between the light source and the wafer inspection surface is changed by adjusting the installation height.

[0013] The preferred technical solution is that the tilt angle of the camera is 35°.

[0014] The preferred technical solution is that the tilt angle of the light source is 20°.

[0015] Due to the application of the above technical solution, the beneficial effects of this utility model are as follows:

[0016] The proposed mercury leakage detection mechanism for wafer testing addresses this issue by tilting both the camera and light source to the side of the wafer testing device and limiting the angle between them and the wafer testing surface. This allows the mercury to form a clearer image when the light source illuminates it, making it easier for the camera to capture. This effectively solves the problem of unclear mercury imaging and difficulty in detection in existing technologies. Furthermore, the circumferential angle between the camera and light source, along with the design of the light source height adjustment hole, further enhances the flexibility and accuracy of the detection, enabling it to better adapt to different testing scenarios. Attached Figure Description

[0017] Figure 1 This is a top view of the mercury leakage detection mechanism involved in this utility model.

[0018] Figure 2 This is a front view of the mercury leakage detection mechanism involved in this utility model. Detailed Implementation

[0019] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0020] Please see Figures 1-2It should be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0021] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Example:

[0023] like Figures 1 to 2 As shown, in one embodiment of this invention, a mercury leakage detection mechanism applied in wafer testing includes a camera 1 and a light source 2. The camera 1 is fixed to the side of the wafer testing device 100 via a camera bracket 3, and the light source 2 is fixed to the side of the wafer testing device 100 via a light source bracket 4. The camera 1 is tilted towards the wafer testing device 100, and the angle α between it and the wafer testing surface is between 30° and 45°, preferably 35° in this embodiment. The light source 2 is also tilted towards the wafer testing device 100, and the angle β between it and the wafer testing surface is between 10° and 30°, preferably 20° in this embodiment.

[0024] Both the camera 1 and the light source 2 are arranged along the circumference of the wafer testing device 100, and the angle γ between them in the circumferential direction is between 0° and 45°. This arrangement ensures that the light emitted by the light source 2 illuminates the mercury liquid on the wafer testing surface at a suitable angle, while the camera 1 can capture the image of the mercury liquid from the optimal angle.

[0025] Camera 1 is fixed to camera bracket 3 by connectors (not shown). The connectors are classified according to the angle of the mounting surface of camera 1 so as to adjust the tilt angle of camera 1 so that the angle between it and the wafer inspection surface meets the design requirements.

[0026] The light source bracket 4 is equipped with a vertically positioned height adjustment hole, and the light source 2 is installed by bolts fitting into the height adjustment hole. By adjusting the position of the bolts in the height adjustment hole, the installation height of the light source 2 can be changed, thereby adjusting the angle between the light source 2 and the wafer inspection surface to achieve the best irradiation effect.

[0027] It should be noted that the illumination for mercury leakage detection is primarily due to the transparency of the SiC sample and its thickness of 300 to 400 micrometers. Conventional supplementary lighting methods would allow the patterns on the support stage to pass through the sample, interfering with imaging. Therefore, light source 2 must be placed below camera 1 and graze at a large angle to avoid interference from the back of the transparent sample (wafer) or the support stage. To avoid imaging from reflected light from the front of the polished sample (wafer), camera 1 must also be placed at a large angle at the edge of the sample. This requires the detection area of ​​the test point to be within the optimal imaging range of camera 1. Furthermore, considering the high surface tension of mercury beads, their spherical and mirror-like shape on the silicon wafer surface means that the light from a point source is divergent, and the divergence angle is even greater after reflection from the mercury bead surface, resulting in an image much smaller than the actual mercury bead. This can be addressed by arranging surface light sources along the edge of the sample (wafer) to increase the cross-section of the reflected light from the mercury bead, thereby improving the detection capability. To reduce false positives, a comparison of pre-test and post-test photographs is used.

[0028] The above solution, by reasonably setting the position and angle of camera 1 and light source 2, enables the mercury liquid to form a clear image in the photograph, making it easier for inspectors to determine whether there is mercury leakage, thus improving the accuracy and efficiency of mercury leakage detection.

[0029] Therefore, this utility model has the following advantages:

[0030] The proposed mercury leakage detection mechanism for wafer testing addresses this issue by tilting both the camera and light source to the side of the wafer testing device and limiting the angle between them and the wafer testing surface. This allows the mercury to form a clearer image when the light source illuminates it, making it easier for the camera to capture. This effectively solves the problem of unclear mercury imaging and difficulty in detection in existing technologies. Furthermore, the circumferential angle between the camera and light source, along with the design of the light source height adjustment hole, further enhances the flexibility and accuracy of the detection, enabling it to better adapt to different testing scenarios.

[0031] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A mercury leakage detection mechanism applied in wafer testing, characterized in that, include: The camera is fixed to the side of the wafer testing device by a camera bracket; A light source, which is fixed to the side of the wafer testing device by a light source bracket; The camera is tilted toward the wafer testing device and the angle between the camera and the wafer testing surface is between 30° and 45°. The light source is tilted toward the wafer testing device and the angle between it and the wafer testing surface is between 10° and 30°.

2. The mercury leakage detection mechanism applied in wafer testing according to claim 1, characterized in that: Both the camera and the light source are arranged circumferentially along the wafer testing device, and the angle between the camera and the light source in the circumferential direction of the wafer testing device is between 0° and 45°.

3. The mercury leakage detection mechanism applied in wafer testing according to claim 1, characterized in that: The camera is fixed to the camera bracket by connectors, which are classified according to the angle of the camera mounting surface.

4. The mercury leakage detection mechanism applied in wafer testing according to claim 1, characterized in that: The light source bracket is provided with a vertically set height adjustment hole. The light source is installed by bolts in conjunction with the height adjustment hole, and the angle between the light source and the wafer inspection surface is changed by adjusting the installation height.

5. The mercury leakage detection mechanism applied in wafer testing according to claim 1, characterized in that: The camera is tilted at an angle of 35°.

6. The mercury leakage detection mechanism applied in wafer testing according to claim 1, characterized in that: The tilt angle of the light source is 20°.

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