Electronic component high-low temperature test equipment

Abstract

The utility model relates to electronic component testing technical field discloses a kind of electronic component high-low temperature test equipment, and the test equipment is constituted by high-low temperature test chamber and test component;Box door and display screen are provided on the high-low temperature test chamber, and its inside is further provided with independent high-temperature test cavity and low-temperature test cavity, high-temperature test cavity and low-temperature test cavity respectively have heating system and refrigeration system, and further respectively provided with magnetic seat;Test component is set to detachable structure, and it has several sockets for inserting electronic component pin, test component is magnetically connected with the magnetic seat in high-temperature test cavity and low-temperature test cavity respectively, to realize respectively in high-temperature test cavity and low-temperature test cavity high, low temperature test of electronic component.The utility model this test equipment is convenient for test component to be taken out and maintained, and it also has corresponding protective measures to circuit board, and circuit board is not easy to damage, prolongs service life and can reduce test error.

Description

Technical Field

[0001] This utility model relates to the field of electronic component testing technology, specifically to a high and low temperature testing device for electronic components. Background Technology

[0002] With the rapid development of modern technology, electronic components are increasingly widely used in various electronic products. However, these electronic components may be affected by temperature changes in different working environments, especially under extreme natural conditions of extreme cold and heat or in the high-temperature environment of industrial production lines, where the performance and stability of electronic components may significantly decrease. Therefore, in order to ensure the reliability and durability of electronic components in actual use, high and low temperature testing has become an essential procedure.

[0003] For example, Chinese patent (CN202220994945.X) discloses a high and low temperature screening test device for transformer inductance. This patent uses a test socket corresponding to the transformer pins and connects it to a circuit board with leads mounted on the circuit board. The test socket allows for quick installation of the transformer to be tested, and the leads then bring out the transformer pins one by one. This significantly improves testing efficiency, as only the transformer needs to be installed on the test socket. However, this patented test device still requires leads to connect to the testing instrument. The test box is fixed inside the high and low temperature testing equipment. During rapid switching between high and low temperatures, the device is susceptible to environmental temperature fluctuations, which can accelerate the aging of the leads and circuit board. Furthermore, it is inconvenient to remove the test box for maintenance, lacks protection for the circuit board, and is prone to testing errors due to circuit board damage. Therefore, a new type of high and low temperature testing equipment for electronic components is urgently needed to solve these problems. Utility Model Content

[0004] The purpose of this invention is to design a high and low temperature testing device for electronic components, aiming to solve the problems existing in the above-mentioned testing devices. The testing device designed by this invention facilitates the disassembly and maintenance of the test components, and also has corresponding protection measures for the circuit board, making the circuit board less prone to damage, extending its service life and reducing test errors.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: This utility model designs a high and low temperature testing device for electronic components, which consists of a high and low temperature test chamber and testing components;

[0006] The high and low temperature test chamber is equipped with a door and a display screen. Inside, there are independent high temperature test chambers and low temperature test chambers. The high temperature test chamber and the low temperature test chamber are equipped with heating system and cooling system, respectively, and magnetic bases are also provided.

[0007] The test assembly is configured as a detachable structure, having several sockets for inserting the pins of electronic components. The test assembly is magnetically connected to the magnetic bases in the high-temperature test chamber and the low-temperature test chamber, respectively, to enable high and low temperature testing of electronic components in the high-temperature test chamber and the low-temperature test chamber, respectively.

[0008] Furthermore, in a high and low temperature testing device for electronic components, an observation window is also provided on the door of the enclosure.

[0009] Furthermore, a high and low temperature testing device for electronic components includes an observation window equipped with a heating wire. The heating wire can defog the observation window.

[0010] Furthermore, a high and low temperature testing device for electronic components is provided: the high and low temperature test chamber is also equipped with indicator lights.

[0011] Furthermore, in an electronic component high and low temperature testing device, heat insulation pads are respectively provided in the high temperature testing chamber and the low temperature testing chamber, and the magnetic seat is disposed on the heat insulation pads.

[0012] Specifically, the heat insulation pad can be set as a rubber pad, which can support the test component and reduce the contact area between the test component and the high and low temperature test chamber, thereby reducing the heat conduction area.

[0013] Furthermore, a high and low temperature testing device for electronic components includes the following structural configuration of the testing components:

[0014] The fixing box has a first through hole at its bottom;

[0015] The first heat insulation cotton is disposed in the fixed box, and a second through hole corresponding to the position of the first through hole is also provided thereon.

[0016] The circuit board has several sockets and magnetic connecting blocks on its two opposite surfaces, which are stacked on the first heat insulation cotton. The magnetic connecting blocks pass through the second through hole and the first through hole in sequence, and are used to magnetically connect with the magnetic base.

[0017] The second heat insulation cotton has several third through holes, and is stacked on the circuit board, with the socket passing through the third through holes;

[0018] The cover plate has several fourth through holes, which are stacked on the second heat insulation cotton. The socket passes through the fourth through holes, and the cover plate is also connected and fixed to the fixing box.

[0019] Specifically, the first and second insulation materials can be made of fiberglass wool.

[0020] Furthermore, in an electronic component high and low temperature testing device, two fixing posts are provided at the bottom of the fixing box, and sleeves are provided on both sides of the magnetic base, with the fixing posts engaging with the sleeves.

[0021] Furthermore, a high and low temperature testing device for electronic components: fixing bolts are respectively provided on both sides of the cover plate, and the fixing bolts are connected and fixed to the fixing box.

[0022] Furthermore, in an electronic component high and low temperature testing device, the second heat insulation cotton is provided with several pin holes, and the cover plate is provided with several pins corresponding to the positions of the pin holes, the pins being inserted into the pin holes.

[0023] Furthermore, in an electronic component high and low temperature testing device, the magnetic connecting block and the magnetic base are respectively made of neodymium iron boron magnets.

[0024] The beneficial effects of this utility model are:

[0025] This invention, through the combination of magnetic connecting blocks and magnetic bases, allows for the simultaneous fixation of the test component (fixed box) inside the high and low temperature test chamber and the connection between the circuit board and the testing instrument. Connection is quick and easy without the need for wiring, eliminating the risk of wiring aging affecting usability. Furthermore, the component can be easily disassembled after connection. The modular internal structure of the test component facilitates the removal of the circuit board for maintenance when needed. The circuit board features sockets for connecting electronic components, and first and second heat insulation cotton on both sides provides thermal insulation protection, preventing test errors caused by circuit board damage and extending its service life. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the high and low temperature testing equipment for electronic components designed in Example 1;

[0028] Figure 2 A schematic diagram of the external structure of the high and low temperature test chamber in the high and low temperature test equipment for electronic components designed for Example 1;

[0029] Figure 3 This is a schematic diagram of the internal structure of the high and low temperature test chamber in the high and low temperature test equipment for electronic components designed in Example 1;

[0030] Figure 4 An exploded view of the test components in the high and low temperature testing equipment for electronic components designed for Example 1;

[0031] Figure 5 This is a schematic diagram of the magnetic base and heat insulation pad installed in the high-temperature test chamber in Example 1.

[0032] The markings in the image are as follows:

[0033] 1-High and low temperature test chamber, 2-Test components, 11-Door, 12-Display screen, 13-High temperature test chamber, 14-Low temperature test chamber, 15-Magnetic base, 16-Observation window, 17-Heating wire, 18-Indicator light, 19-Heat insulation pad, 21-Fixing box, 22-First heat insulation cotton, 23-Circuit board, 24-Second heat insulation cotton, 25-Cover plate, 151-Sleeve, 211-First through hole, 212-Fixing post, 221-Second through hole, 231-Socket, 232-Magnetic connecting block, 241-Third through hole, 242-Pin hole, 251-Fourth through hole, 252-Fixing bolt, 253-Pin post. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0035] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "top," and "bottom," etc., indicating orientation or positional relationships, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein.

[0036] Example 1

[0037] like Figures 1-5 As shown, this embodiment 1 designs a high and low temperature testing device for electronic components. The testing device consists of a high and low temperature test chamber 1 and a testing component 2.

[0038] The high and low temperature test chamber 1 is equipped with a door 11 and a display screen 12. Inside, there are independent high temperature test chambers 13 and low temperature test chambers 14. The high temperature test chamber 13 and the low temperature test chamber 14 are equipped with heating systems and cooling systems, respectively, and are also equipped with magnetic bases 15. The door 11 is also equipped with an observation window 16. Heating wires 17 are evenly distributed in the observation window 16. The high and low temperature test chamber 1 is also equipped with indicator lights 18 evenly distributed. The high temperature test chamber 13 and the low temperature test chamber 14 are also equipped with heat insulation pads 19. The magnetic bases 15 are set on the heat insulation pads 19. Sleeves 151 are also provided on both sides of the magnetic bases 15.

[0039] The test component 2 is configured as a detachable structure, which has a number of sockets 231 for inserting the pins of electronic components. The test component 2 is magnetically connected to the magnetic bases 15 in the high temperature test chamber 13 and the low temperature test chamber 14 respectively, so as to realize high and low temperature tests of electronic components in the high temperature test chamber 13 and the low temperature test chamber 14 respectively.

[0040] Specifically, the test component 2 includes the following structural configuration:

[0041] The fixing box 21 has a first through hole 211 at its bottom and fixing posts 212 on both sides of its bottom, which engage with the sleeve 151.

[0042] The first heat insulation cotton 22 is disposed in the fixing box 21, and a second through hole 221 corresponding to the position of the first through hole 211 is also provided thereon;

[0043] The circuit board 23 has several sockets 231 and magnetic connecting blocks 232 respectively on its two opposite surfaces. The circuit board 23 is stacked on the first heat insulation cotton 22. The magnetic connecting blocks 232 pass through the second through hole 221 and the first through hole 211 in sequence, and are used to magnetically connect with the magnetic base 15.

[0044] The second heat insulation cotton 24 is provided with a plurality of third through holes 241 and a plurality of pin holes 242. The second heat insulation cotton 24 is stacked on the circuit board 23, and the socket 231 passes through the third through holes 241.

[0045] The cover plate 25 has several fourth through holes 251 and several pins 253 corresponding to the pin holes 242. The cover plate 25 is stacked on the second heat insulation cotton 24. The socket 231 passes through the fourth through holes 251, and the pins 253 are inserted into the pin holes 242. Fixing bolts 252 are respectively provided on both sides of the cover plate 25. The fixing bolts 252 are connected and fixed to the edge of the fixing box 21.

[0046] In the above embodiment 1, the high temperature test chamber 13 and the low temperature test chamber 14 are respectively equipped with a heating system and a refrigeration system (not shown in the figure). The heating system can be a nickel-chromium alloy heating wire or a stainless steel tubular electric heater. The refrigeration system can be composed of components such as a condenser, a compressor, a throttling device, and an evaporator. The high and low temperature test chamber 1 is model HZ-225. In the above embodiment 1, the first and second heat insulation cotton 22 and 24 can be made of glass fiber cotton, and the heat insulation pad 19 can be made of rubber. The heat insulation pad 19 can provide support for the fixing box 21 after the test component 2 is connected to the magnetic seat 2, reducing the contact area between the fixing box 21 and the high and low temperature test chamber 1, thereby reducing the heat conduction area.

[0047] In the above embodiment 1, in order to facilitate the observation of the status of the electronic components inside the high and low temperature test chamber 1, an observation window 16 is installed on the chamber door 1. Heating wires 17 are evenly distributed in the observation window 16. The heating wires 17 are of model UMIT7F and are used to defog the observation window 16.

[0048] In the above embodiment 1, in order to facilitate the display of test parameters and working status, a display screen 12 is also installed on the high and low temperature test chamber 1, and indicator lights 18 are equidistantly distributed on one side of the high and low temperature test chamber 1.

[0049] In the above embodiment 1, the magnets of the magnetic base 15 and the magnetic connecting block 232 can be neodymium iron boron magnets, whose demagnetization temperature is above 300°C, which is higher than the high and low temperature test range (85-200°C) of electronic components, thus preventing high temperature demagnetization.

[0050] The working principle of the above embodiment 1 is as follows: First, insert the pins of the electronic components into the socket 231 of the test assembly 2, then open the chamber door 11, and place the test assembly 2 together with the electronic components into the high and low temperature test chamber 1 according to the test requirements. The high temperature test is placed in the high temperature test chamber 13, and the low temperature test is placed in the low temperature test chamber 14. The fixing post 212 at the bottom of the fixing box 21 is inserted into the sleeves 151 on both sides of the magnetic base 15. At the same time, the magnetic connecting block 232 is magnetically connected to the magnetic base 15. Then close the chamber door 11, adjust the test temperature, and test the electronic components after heating or cooling. After the test, take out the test assembly 2 and remove the electronic components.

[0051] If the circuit board 23 built into the test component 2 is damaged, remove the fixing bolts 252 on the cover plate 25, then remove the cover plate 25 and take out the second heat insulation cotton 24 and the circuit board 23 in sequence. Replace or maintain the circuit board 23 and reinstall it into the fixing box 21. Then, install the second heat insulation cotton 24 on the side of the circuit board 23 with the socket 231, and then install the cover plate 25. The four pins 253 set on the cover plate 25 can pass through the four pin holes 242 set on the second heat insulation cotton 24 respectively to achieve the positioning of the second heat insulation cotton 24. At the same time, the pins 253 can also press down the circuit board 23 so that the magnetic connecting block 232 at the bottom of the circuit board 23 can fully contact the magnetic base 15.

[0052] The above-described preferred embodiments of this utility model are for illustrative purposes only and are not intended to limit the scope of this utility model. Any obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A high and low temperature testing device for electronic components, characterized in that, The testing equipment consists of a high and low temperature test chamber (1) and a testing component (2); The high and low temperature test chamber (1) is equipped with a door (11) and a display screen (12). Inside it are independent high temperature test chamber (13) and low temperature test chamber (14). The high temperature test chamber (13) and the low temperature test chamber (14) are equipped with a heating system and a cooling system, respectively, and are also equipped with magnetic bases (15). The test assembly (2) is configured as a detachable structure, having several sockets (231) for inserting the pins of electronic components. The test assembly (2) is magnetically connected to the magnetic bases (15) in the high-temperature test chamber (13) and the low-temperature test chamber (14) respectively, so as to realize high and low temperature tests of electronic components in the high-temperature test chamber (13) and the low-temperature test chamber (14) respectively.

2. The high and low temperature testing equipment for electronic components according to claim 1, characterized in that, An observation window (16) is also provided on the box door (11).

3. The high and low temperature testing equipment for electronic components according to claim 2, characterized in that, A heating wire (17) is provided in the observation window (16).

4. The high and low temperature testing equipment for electronic components according to claim 1, characterized in that, The high and low temperature test chamber (1) is also equipped with an indicator light (18).

5. The high and low temperature testing equipment for electronic components according to claim 1, characterized in that, The high-temperature test chamber (13) and the low-temperature test chamber (14) are respectively provided with heat insulation pads (19), and the magnetic seat (15) is disposed on the heat insulation pads (19).

6. The high and low temperature testing equipment for electronic components according to claim 1, characterized in that, The test component (2) includes the following structural configuration: The fixing box (21) has a first through hole (211) at its bottom; The first heat insulation cotton (22) is disposed in the fixing box (21), and a second through hole (221) corresponding to the position of the first through hole (211) is also provided thereon; The circuit board (23) has several sockets (231) and magnetic connecting blocks (232) respectively on its two opposite surfaces. These are stacked on the first heat insulation cotton (22). The magnetic connecting blocks (232) penetrate the second through hole (221) and the first through hole (211) and are used to magnetically connect with the magnetic base (15). The second heat insulation cotton (24) is provided with a plurality of third through holes (241), which are stacked on the circuit board (23), and the socket (231) passes through the third through holes (241); The cover plate (25) is provided with several fourth through holes (251), which are stacked on the second heat insulation cotton (24). The socket (231) passes through the fourth through holes (251), and the cover plate (25) is also connected and fixed to the fixing box (21).

7. The high and low temperature testing equipment for electronic components according to claim 6, characterized in that, The bottom of the fixing box (21) is also provided with two fixing posts (212), and sleeves (151) are respectively provided on both sides of the magnetic seat (15). The fixing posts (212) are engaged with the sleeves (151).

8. The high and low temperature testing equipment for electronic components according to claim 6, characterized in that, Fixing bolts (252) are provided on both sides of the cover plate (25), and the fixing bolts (252) are connected and fixed to the fixing box (21).

9. The high and low temperature testing equipment for electronic components according to claim 6, characterized in that, The second heat insulation cotton (24) is also provided with a number of pin holes (242), and the cover plate (25) is provided with a number of pins (253) corresponding to the positions of the pin holes (242), and the pins (253) are inserted into the pin holes (242).

10. The high and low temperature testing equipment for electronic components according to claim 6, characterized in that, The magnetic connecting block (232) and the magnetic base (15) are respectively made of neodymium iron boron magnets.

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