A tool for testing signals of a circuit board

Abstract

The utility model provides a kind of tool for circuit board signal test belongs to circuit board test technical field, to solve the problem in prior art, using cable welding on printed board corresponding solder point carries out circuit board test, increases production procedure and workload;Including bottom plate, the bottom plate is equipped with to place placement opening for detecting test piece, the bottom plate is supported with pressing plate by support above, the pressing plate is rotatably connected with support by pivot, and the pressing plate is equipped with probe, the probe passes through pressing plate from bottom to top, and the probe is located above placement opening;In the utility model, by the design of placement opening, effectively avoid circuit board bottom device;The rotatable structure of the pivot connection of pressing plate and support makes that probe can quickly approach or away from solder point, replaces traditional welding and disassembly operation, greatly improves test efficiency, reduces manpower cost.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board testing technology, specifically relating to a tooling for circuit board signal testing. Background Technology

[0002] In the field of circuit board signal testing, the commonly used testing method is to directly solder the signal test cables to the corresponding solder points on the printed circuit board. This testing method is highly applicable in the circuit board development stage. Since signal connections often need to be adjusted based on test results during the development process, directly soldering the cables allows for convenient changes to the solder points, meeting the needs of frequent debugging and optimization during the development stage. Therefore, it is widely used in this stage.

[0003] Problems with existing technology

[0004] However, the drawbacks of the aforementioned testing methods become apparent when circuit boards enter the mass production stage. On the one hand, if signal testing continues to be performed by soldering each cable to its solder joint in mass production, repeated soldering and disassembly operations are required. This process is cumbersome, time-consuming, and labor-intensive, resulting in low testing efficiency and failing to meet the high-efficiency requirements of mass production. On the other hand, frequent soldering and disassembly leave solder joint marks on the circuit board, affecting not only its appearance but also potentially damaging the solder pads during operation, leading to problems such as pad detachment and oxidation, thereby affecting the electrical performance and reliability of the circuit board. Furthermore, damaged solder pads require additional repair or treatment during subsequent assembly, increasing production steps and workload. In conclusion, existing testing methods cannot meet the requirements for efficient and reliable testing in mass production scenarios, necessitating the design of a testing fixture that can solve these problems. Utility Model Content

[0005] In view of this, the present invention provides a tooling for circuit board signal testing to solve the problem that the existing technology of using cables to solder to the corresponding solder points on the printed circuit board for circuit board testing increases the production process and workload.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A circuit board signal testing fixture includes a base plate with a placement opening for placing test pieces through it. A pressure plate is supported above the base plate by a bracket. The pressure plate is rotatably connected to the bracket via a rotating shaft. A probe is provided on the pressure plate, which passes through the pressure plate from bottom to top and is located above the placement opening.

[0008] In this technical solution, it should be noted that the base plate, as the basic load-bearing component, provides a stable mounting and support platform for the entire fixture, ensuring the stability of the relative positions of each component during testing. The placement opening through the base plate is mainly used to accommodate the circuit board test piece to be tested. Since various electronic components are usually installed on the bottom of the circuit board, the size and position design of the placement opening can precisely avoid the components on the bottom of the circuit board, avoiding physical interference between the fixture and the components during testing, and providing placement space for the circuit board. The bracket above the base plate supports the pressure plate. The pressure plate is rotatably connected to the bracket via a pivot, allowing the pressure plate to flip up and down or swing around the pivot, thereby enabling the pressure plate to move closer to or away from the circuit board during testing. The probe passes vertically from bottom to top through the pressure plate, with its lower end aligned with the solder joint of the circuit board in the placement opening. When the pressure plate is pressed down, the probe can form an electrical connection with the solder joint, thereby transmitting the signal on the circuit board to the external testing equipment. The overall working principle is as follows: First, the circuit board to be tested is placed in the placement slot of the base plate. Then, the pressure plate is rotated, causing it to swing downwards around the pivot until the lower end of the probe on the pressure plate contacts the solder joint of the circuit board. At this point, a reliable electrical connection is formed between the probe and the solder joint. External testing equipment is connected to the upper end of the probe via a cable, allowing the probe to acquire signals at the solder joint of the circuit board and complete the signal testing process. After the test is completed, the pressure plate is rotated upwards to separate the probe from the solder joint, allowing the circuit board to be removed. The advantages of this fixture are: the placement slot design effectively avoids components at the bottom of the circuit board; the rotatable structure connecting the pressure plate and the support via the pivot allows the probe to quickly approach or move away from the solder joint, replacing traditional soldering and disassembly operations, significantly improving testing efficiency and reducing labor costs.

[0009] Preferably, a spring is provided on the top of the base plate, the top of the spring is connected to the pressure plate, and the spring is located on the side of the bracket away from the probe.

[0010] In this technical solution, it should be noted that the spring installed on the top of the base plate serves as an elastic support component. Its lower end is fixed to the top surface of the base plate, and its upper end is connected to the bottom surface of the pressure plate. The spring is installed on the side of the bracket away from the probe. This design, through the transmission of elastic force and the combination of lever principle, provides an auxiliary function for the movement of the pressure plate: when the pressure plate is pressed down, the spring is compressed and generates an upward elastic force; when the pressure plate is lifted, it provides an upward driving force through elastic restoring force, thereby achieving force balance on both sides of the pressure plate at the pivot point. The spring on the side away from the probe absorbs pressure through elastic deformation and maintains continuous contact force, ensuring that the probe is in contact with the solder joint with a stable and moderate pressure, avoiding damage to the solder pad due to excessive pressure or poor contact due to insufficient pressure. The advantages of this preferred structure are as follows: the introduction of the spring creates an elastic contact mechanism, which automatically adjusts the contact pressure between the probe and the solder joint through elastic force, solving the problem of uneven pressure that may be caused by traditional rigid contact. While ensuring the stability of signal transmission, it effectively protects the solder pad from damage. The spring is located on the side of the bracket away from the probe, forming a lever-type elastic support with the pivot as the fulcrum. This makes the rotation of the pressure plate smoother and more stable, reducing the difficulty of applying force for the operator. In particular, it can reduce hand fatigue and improve operating efficiency in batch testing.

[0011] Preferably, the bottom of the pressure plate has a slope at the end away from the probe, and the slope is inclined upward in the direction away from the probe.

[0012] In this technical solution, it should be noted that the bottom of the pressure plate, away from the probe, has an upward-sloping surface that moves away from the probe. This slope serves as a force-applying trigger surface and, together with the rotating shaft, forms a lever structure. The rotating shaft divides the pressure plate into two arms: the "probe end" and the "sloping surface end." A spring supports the side of the sloping surface end and normally provides an upward thrust, keeping the probe end in an raised state. When downward pressure is applied to the sloping surface end (such as manually pressing the top of the sloping surface), the sloping surface end rotates downward around the rotating shaft, causing the probe end to rotate upward synchronously (the pressure plate is in an "open" position, avoiding the workpiece). At this time, the spring is compressed and accumulates elastic potential energy. After the circuit board is placed in the base plate slot, the pressure on the sloping surface end is removed. The elastic restoring force of the spring pushes the sloping surface end to rotate upward, and the probe end rotates downward accordingly. The probe presses down and contacts the solder joint. The spring force, the weight of the probe end, and the contact reaction force form a balance, ensuring that the probe pressure is stable and controllable. After the test is completed, the sloping surface end is pressed down again, the probe end rises, and the circuit board can be removed. The inclined surface achieves the following effects: a small press can achieve a large probe stroke and lift, reducing the operating force and adapting to high-frequency operations in batch testing; the inclined surface increases the contact area with the top plate, preventing slippage during pressing and improving operational stability.

[0013] Preferably, the top of the base plate is further provided with a support shaft, the support shaft is vertically arranged, and the top of the support shaft is in contact with the bottom of the pressure plate.

[0014] In this technical solution, it should be noted that the support shaft vertically installed at the top of the base plate has its lower end fixedly connected to the base plate and its upper end in contact with the bottom of the pressure plate. As a rigid limiting component, it works with the spring to form a dual constraint mechanism: when the spring pushes the pressure plate to rotate around the pivot and the probe end is pressed down, the support shaft limits its maximum rotation angle by contacting the bottom of the pressure plate, thereby controlling the compression stroke of the probe within a safe range.

[0015] Preferably, the bottom of the base plate is provided with a support leg. The top of the support leg is provided with a threaded post, which is threadedly connected to the base plate.

[0016] In this technical solution, it should be noted that the bottom of the base plate is equipped with a support leg, and the threaded column at the top of the support leg is threadedly connected to the base plate. The support height can be flexibly adjusted through the threaded helical transmission: the bottom of the support leg contacts the bearing surface (such as the workbench) to provide vertical support, and the threaded column can change the length of the support leg extending below the base plate when it is screwed, thereby adjusting the height of the base plate above the ground.

[0017] Preferably, the pressure plate is provided with a probe sleeve on the top, the probe sleeve is vertically arranged, and the probe sleeve surrounds the probe.

[0018] In this technical solution, it should be noted that the probe sleeve serves as a mechanical protection and guiding component for the probe.

[0019] Preferably, the bracket is connected to the base plate by screws.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0021] 1. In this utility model, the placement port design effectively avoids components at the bottom of the circuit board; the rotatable structure connecting the pressure plate and the bracket via a rotating shaft allows the probe to quickly approach or move away from the solder joint, replacing traditional soldering and disassembly operations, greatly improving testing efficiency and reducing labor costs;

[0022] 2. In this utility model, the introduction of a spring establishes an elastic contact mechanism. The contact pressure between the probe and the solder joint is automatically adjusted by the elastic force, which solves the problem of uneven pressure that may be caused by traditional rigid contact. While ensuring the stability of signal transmission, it effectively protects the solder pad from damage. The spring is located on the side of the bracket away from the probe, forming a lever-type elastic support with the pivot as the fulcrum. This makes the rotation of the pressure plate smoother and more stable, reduces the difficulty of applying force for the operator, and can reduce hand fatigue and improve operating efficiency, especially in batch testing.

[0023] 3. In this utility model, the following effects can be achieved by setting the inclined surface: a small amount of pressing can realize the large stroke of the probe, reduce the operating force, and adapt to the high-frequency operation of batch testing; the inclined surface increases the contact area with the top plate, avoids slippage when pressing, and improves the stability of operation. Attached Figure Description

[0024] This utility model will be described by way of example and with reference to the accompanying drawings, wherein:

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure when no test specimen is present.

[0027] Figure 3 for Figure 2 A schematic diagram of a squinting three-dimensional structure;

[0028] Figure 4 This is a bottom view of the structure of this utility model;

[0029] Figure 5 This is a three-dimensional structural diagram of the present invention;

[0030] Wherein: 1-pressure plate, 2-sloping surface, 3-base plate, 4-spring, 5-support leg, 6-test piece, 7-probe sleeve, 8-probe, 9-bracket, 10-placement port, 11-support shaft, 12-screw, 13-threaded post. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can typically be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0033] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0037] Example

[0038] like Figures 1-5As shown in the figure, this utility model discloses a circuit board signal testing fixture, including a base plate 3. The base plate 3 has a through-hole 10 for placing test pieces 6. A pressure plate 1 is supported on the base plate 3 by a bracket 9. The pressure plate 1 is rotatably connected to the bracket 9 by a rotating shaft. A probe 8 is provided on the pressure plate 1. The probe 8 passes through the pressure plate 1 from bottom to top and is located above the through-hole 10. It should be noted that in this fixture, the base plate 3 serves as the basic load-bearing component, providing a stable mounting and support platform for the entire fixture and ensuring the stability of the relative positions of each component during testing. The placement opening 10, which runs through the base plate 3, is mainly used to accommodate the circuit board test piece to be tested. Since various electronic components are usually installed on the bottom of the circuit board, the size and position design of the placement opening 10 can precisely avoid the components on the bottom of the circuit board, preventing physical interference between the fixture and the components during testing and providing placement space for the circuit board. The bracket 9 above the base plate 3 supports the pressure plate 1. The pressure plate 1 is rotatably connected to the bracket 9 via a pivot, allowing the pressure plate 1 to flip up and down or swing around the pivot, thereby enabling the pressure plate 1 to move closer to or away from the circuit board during testing. The probe 8 passes vertically from bottom to top through the pressure plate 1, with its lower end aligned with the solder joint of the circuit board inside the placement opening 10. When the pressure plate 1 is pressed down, the probe 8 can form an electrical connection with the solder joint, thereby transmitting the signal on the circuit board to the external testing equipment through the probe 8. The overall working principle is as follows: First, the circuit board to be tested is placed in the placement opening 10 of the base plate 3. Then, the pressure plate 1 is rotated, causing it to swing downwards around the pivot until the lower end of the probe 8 on the pressure plate 1 contacts the solder joint of the circuit board. At this point, the probe 8 and the solder joint form a reliable electrical connection. External testing equipment is connected to the upper end of the probe 8 via a cable, allowing the signal at the solder joint of the circuit board to be acquired through the probe 8, completing the signal testing process. After the test is completed, the pressure plate 1 is rotated upwards to separate the probe 8 from the solder joint, allowing the circuit board to be removed. The advantages of this fixture are: the design of the placement opening 10 effectively avoids components at the bottom of the circuit board; the rotatable structure connecting the pressure plate 1 and the bracket 9 via the pivot allows the probe 8 to quickly approach or move away from the solder joint, replacing traditional soldering and disassembly operations, significantly improving testing efficiency and reducing labor costs.

[0039] like Figure 1As shown, in another embodiment, a spring 4 is provided on the top of the base plate 3. The top of the spring 4 is connected to the pressure plate 1, and the spring 4 is located on the side of the bracket 9 away from the probe 8. It should be noted that the spring 4 provided on the top of the base plate 3 serves as an elastic support component. Its lower end is fixed to the top surface of the base plate 3, and its upper end is connected to the bottom surface of the pressure plate 1. The installation position of the spring 4 is located on the side of the bracket 9 away from the probe 8. This design provides an auxiliary function for the movement of the pressure plate 1 through the combination of elastic force transmission and lever principle: when the pressure plate 1 is pressed down, the spring 4 is compressed and generates an upward elastic force. When the pressure plate 1 is lifted, it provides an upward driving force through elastic restoring force, thereby achieving force balance on both sides of the pivot point of the pressure plate 1. The spring 4 on the side away from the probe 8 absorbs pressure through elastic deformation and maintains continuous contact force, ensuring that the probe 8 is in contact with the solder joint with stable and moderate pressure, avoiding damage to the solder pad due to excessive pressure or poor contact due to insufficient pressure. The beneficial effects of this preferred structure are as follows: the introduction of spring 4 establishes an elastic contact mechanism, which automatically adjusts the contact pressure between probe 8 and solder joint through elastic force, solving the problem of uneven pressure that may be caused by traditional rigid contact, and effectively protecting the solder pad from damage while ensuring the stability of signal transmission; spring 4 is located on the side of bracket 9 away from probe 8, forming a lever-type elastic support with the pivot as the fulcrum, making the rotation of pressure plate 1 more stable and smooth, reducing the difficulty of applying force for operators, and especially reducing hand fatigue and improving operating efficiency in batch testing.

[0040] like Figure 1 As shown, in another embodiment, the bottom end of the pressure plate 1 away from the probe 8 is provided with an inclined surface 2, which slopes upward in the direction away from the probe 8. It should be noted that the inclined surface 2, which slopes upward in the direction away from the probe 8, serves as a force-applying trigger surface and, together with the rotating shaft, forms a lever structure. The rotating shaft divides the pressure plate 1 into two arms: the "probe 8 end" and the "inclined surface 2 end." The spring 4 supports the side of the inclined surface 2 end and normally provides an upward thrust, keeping the probe 8 end in a raised state. When downward pressure is applied to the inclined surface 2 end (such as manually pressing the top of the inclined surface 2), the inclined surface 2 end rotates downward around the rotating shaft, causing the probe 8 end to rotate synchronously. Rotate upwards (pressure plate 1 is in an "open" position, avoiding the workpiece). At this time, spring 4 is compressed and accumulates elastic potential energy. After the circuit board is placed in the placement opening 10 of the base plate 3, the pressure at the end of the inclined plane 2 is removed. The elastic restoring force of spring 4 pushes the end of the inclined plane 2 to rotate upwards, and the end of probe 8 rotates downwards accordingly. Probe 8 presses down and contacts the solder joint. The elastic force of spring 4, the gravity of the end of probe 8, and the contact reaction force form a balance, ensuring that the pressure of probe 8 is stable and controllable. After the test is completed, press down on the end of the inclined plane 2 again, and the end of probe 8 rises, allowing the circuit board to be removed. The setting of the inclined plane 2 achieves the following effects: a small amount of pressing can achieve a large stroke lifting of probe 8, reducing the operating force and adapting to the high-frequency operation of batch testing; the inclined plane 2 increases the contact area with the top plate, avoiding slippage during pressing and improving operational stability.

[0041] like Figure 3 As shown, in another embodiment, the top of the base plate 3 is also provided with a support shaft 11. The support shaft 11 is vertically arranged, and the top of the support shaft 11 contacts the bottom of the pressure plate 1. It should be noted that the support shaft 11, which is vertically arranged at the top of the base plate 3, is fixedly connected to the base plate 3 at its lower end and contacts the bottom of the pressure plate 1 at its upper end. As a rigid limiting component, it works with the spring 4 to form a double constraint mechanism: when the spring 4 pushes the pressure plate 1 to rotate around the axis and the probe 8 is pressed down, the support shaft 11 limits its maximum rotation angle by abutting the bottom of the pressure plate 1, thereby controlling the compression stroke of the probe 8 within a safe range.

[0042] like Figure 5 As shown, in another embodiment, the bottom of the base plate 3 is provided with a support leg 5. The top of the support leg 5 is provided with a threaded post 13, which is threadedly connected to the base plate 3. It should be noted that the support leg 5 at the bottom of the base plate 3, and the threaded post 13 at its top, are threadedly connected to the base plate 3, so that the support height can be flexibly adjusted through the threaded helical transmission: the bottom of the support leg 5 contacts the bearing surface (such as a workbench) to provide vertical support, and the threaded post 13, by means of the threaded engagement with the base plate 3, can change the length of the support leg 5 extending below the base plate 3 when screwed, thereby adjusting the height of the base plate 3 above the ground.

[0043] like Figure 1 As shown, in another embodiment, the pressure plate 1 is provided with a probe sleeve 7 on its top. The probe sleeve 7 is vertically arranged and surrounds the probe 8. It should be noted that the probe sleeve 7 serves as a mechanical protection and guiding component for the probe 8.

[0044] like Figure 4 As shown, in another embodiment, the bracket 9 is connected to the base plate 3 by screws 12.

[0045] The working principle of this utility model is as follows:

[0046] First, the circuit board to be tested is placed smoothly on the base plate 3 through the placement opening 10. The size and position of the placement opening 10 are precisely avoided to prevent interference with the components at the bottom of the circuit board. The bracket 9 is fixedly connected to the base plate 3 by screws 12 and supports the pressure plate 1. The pressure plate 1 is rotatably connected to the bracket 9 through a rotating shaft to form a lever structure with the rotating shaft as the fulcrum. The probe 8 passes vertically through the pressure plate 1 and its lower end is aligned with the solder joint of the circuit board inside the placement opening 10. When testing is required, downward pressure is applied to the inclined surface 2 at the bottom of the pressure plate 1, which is inclined upward away from the probe 8. The inclined surface 2 rotates downward around the rotating shaft, causing the probe 8 to rotate upward synchronously, raising the probe 8 to avoid being misaligned. After the circuit board is placed into the placement opening 10, the inclined surface 2 is released. The elastic restoring force of the spring 4 pushes the inclined surface 2 to rotate upward, and the probe 8 rotates downward accordingly, so that the lower end of the probe 8 contacts the solder joint of the circuit board. At this time, the support shaft 11 at the top of the base plate 3 abuts against the bottom of the pressure plate 1, thereby limiting the pressure. The maximum rotation angle of board 1 controls the compression stroke of probe 8 within a safe range, ensuring that probe 8 forms a stable and moderate contact pressure with the solder joint using the elastic force of spring 4 (avoiding excessive pressure that damages the solder pad or insufficient pressure that leads to poor contact). Probe sleeve 7 surrounds probe 8 and provides guidance and protection, suppressing lateral displacement of probe 8 and blocking foreign object intrusion, ensuring accurate axial extension and contraction of probe 8 and stable signal transmission. External testing equipment can be connected to the upper end of probe 8 via cable to obtain solder joint signals and complete the test. After the test is completed, the inclined plane 2 is pressed down again to raise the end of probe 8, and spring 4 is compressed again. After probe 8 separates from the solder joint, the circuit board is removed. Throughout the process, the support leg 5 at the bottom of base plate 3 is connected to base plate 3 via the threaded post 13 at the top. The extension length of support leg 5 can be adjusted by turning it to adapt to worktables of different heights or to correct the horizontal posture of base plate 3, ensuring stable support of the fixture and uniform force on probe 8.

[0047] The circuits, electronic components, and modules involved are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0048] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0049] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fixture for testing circuit board signals, characterized in that, Includes a base plate (3), on which a placement opening (10) for placing a test piece (6) is provided. A pressure plate (1) is supported above the base plate (3) by a bracket (9). The pressure plate (1) is rotatably connected to the bracket (9) by a rotating shaft. A probe (8) is provided on the pressure plate (1). The probe (8) passes through the pressure plate (1) from bottom to top and is located above the placement opening (10). The bottom plate (3) is provided with a spring (4) at the top. The top of the spring (4) is connected to the pressure plate (1), and the spring (4) is located on the side of the bracket (9) away from the probe (8). The bottom end of the pressure plate (1) away from the probe (8) is provided with a slope (2), and the slope (2) is inclined upward in the direction away from the probe (8); The top of the base plate (3) is also provided with a support shaft (11), which is vertically arranged and the top of the support shaft (11) is in contact with the bottom of the pressure plate (1).

2. The circuit board signal testing fixture according to claim 1, characterized in that, The bottom of the base plate (3) is provided with support legs (5).

3. The tool for testing a signal of a circuit board according to claim 2, wherein The top of the support leg (5) is provided with a threaded post (13), which is threadedly connected to the base plate (3).

4. The apparatus according to claim 1, wherein The pressure plate (1) is provided with a probe sleeve (7) at the top. The probe sleeve (7) is set vertically and surrounds the probe (8).

5. The circuit board signal testing fixture according to claim 1, characterized in that, The bracket (9) is connected to the base plate (3) by screws (12).

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