Chip testing device with anti-offset mechanism

Abstract

The utility model relates to chip testing technical field and disclose a chip testing arrangement with anti -migration mechanism, including testing machine, the inner wall of testing machine is provided with heating lamp, the inner wall fixed mounting of testing machine has the fixed plate, the inner wall of testing machine is provided with electric push -rod, electric push -rod is connected with the side surface fixedly of support station. This chip testing arrangement with anti -migration mechanism is through being provided with control assembly, and when the convex block fixed in the inner wall of testing machine is in contact with the section of support bar when electric push -rod drives support station to move along the surface of fixed plate, support bar can slide in holding platform, and the support plate fixed on the surface of support bar converges to the central region of holding platform, and when two groups of support plate converge, can fix the chip, so that can still keep the stability of chip when testing without manual intervention chip, avoid the situation that deviates when testing.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically a chip testing device with an anti-offset mechanism. Background Technology

[0002] A chip is a highly integrated semiconductor device. It is made by fabricating electronic components such as transistors, resistors, and capacitors on semiconductor materials such as silicon, and connecting them with metal wires to form a circuit with specific functions. It is widely used in almost all electronic devices such as computers, mobile phones, automobiles, industrial equipment, and aerospace, and is the core component of the modern electronic information industry.

[0003] When a chip is powered on, the switching of internal transistors and the flow of current through wires generate heat. If the chip's high-temperature resistance is insufficient, this self-heating can lead to performance degradation of internal materials (such as semiconductor substrates, metal interconnects, and encapsulating adhesives), and even problems such as wire melting and transistor failure, directly causing functional malfunctions. Therefore, it is essential to verify the chip's stability under self-heating conditions through high-temperature resistance testing.

[0004] Existing chip testing equipment typically places the chip directly into the testing machine and manually adjusts the fixture to fix it in place. This is to prevent the chip from shifting during testing. However, manual intervention is very inconvenient, as both inserting and removing the chip require manual handling. When manually handling the chip, if fingers touch the chip surface, friction and pressure may cause the pins to bend, the oxide layer to be scratched, or impurities such as sweat and dust to come into contact with the chip, affecting its performance. To address this issue, we propose a chip testing device with an anti-shift mechanism. Utility Model Content

[0005] The purpose of this invention is to provide a chip testing device with an anti-offset mechanism to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip testing device with an anti-offset mechanism, comprising a testing machine, a heating lamp disposed on the inner wall of the testing machine, a fixing plate fixedly mounted on the inner wall of the testing machine, an electric push rod disposed on the inner wall of the testing machine, the electric push rod being fixedly connected to the side of a support platform, the bottom of the support platform being abutted against the top of the fixing plate, a control component disposed on the top of the support platform, and a driven component disposed within the support platform. The control component includes:

[0007] A rubber block is fixedly installed on the side of a support plate, and a support rod is fixedly installed on the side of the support plate.

[0008] Anti-deviation component, which is used to prevent the chip from shifting during the test, thereby maintaining the stability of the chip during the test without the need for manual intervention, and avoiding the situation of shifting during the test.

[0009] Preferably, the anti-deviation component includes a holding platform, which is fixedly installed on the top of the support platform. The support rod passes through the holding platform and is slidably connected to it. The holding platform ensures the stability of the support rod when it moves.

[0010] Preferably, the side of the support plate is fixedly connected to one end of the spring, and the other end of the spring is fixedly installed on the inner wall of the serving platform. When the support plate is no longer under force, it can spring up under the action of the spring.

[0011] Preferably, the inner wall of the testing machine is fixedly equipped with a protrusion, the bottom of which fits against the top of the support platform. The protrusion inside the testing machine can cause the support rod to move laterally when it comes into contact with the tangential surface of the support rod.

[0012] Preferably, the driven component includes a support plate, which is fixedly installed on the inner wall of the fixed plate. When the support plate abuts against the surface of the pressure rod, the pressure rod can slide within the support platform.

[0013] Preferably, a pressure rod is provided inside the support platform. The pressure rod passes through the support platform and is slidably connected to the support platform. The side of the pressure rod is fixedly connected to one end of the second spring. The other end of the second spring is fixedly installed on the inner wall of the support platform. When the pressure rod is no longer under force, it can spring up from inside the support platform under the action of the second spring.

[0014] Preferably, the side of the pressure rod is hinged to one end of the movable rod, and the other end of the movable rod is hinged to the side of the stop block. When the pressure rod moves, the movable rod can be flipped to push the stop block to slide.

[0015] Preferably, the stop block passes through the support platform and is slidably connected to the support platform. The support platform has a through hole, which can be blocked when the stop block moves toward both sides of the support platform.

[0016] Compared with the prior art, this utility model provides a chip testing device with an anti-offset mechanism, which has the following advantages:

[0017] 1. This chip testing device with an anti-offset mechanism, through the setting of a control component, when the electric push rod drives the support platform to move along the surface of the fixed plate, when the protrusion fixed to the inner wall of the testing machine abuts against the tangential surface of the support rod, the support rod can slide within the holding platform, and the support plate fixed to the surface of the support rod retracts towards the center area of ​​the holding platform. When the two sets of support plates retract, the chip can be fixed, thereby maintaining the stability of the chip during testing without the need for manual intervention, and avoiding offset during testing.

[0018] 2. This chip testing device with an anti-offset mechanism has a driven component. When the support plate fixed to the surface of the fixed plate abuts against the surface of the pressure rod, the pressure rod can slide within the support platform under force. When the pressure rod moves, the movable rod hinged to the surface of the pressure rod can be flipped, pushing the stop block to move and blocking the through hole. This method can remind the operator standing outside the testing machine that the support platform is in the correct testing position and can stop the movement of the support platform, avoiding inaccurate positions of the support platform and the holding platform, which would affect the chip testing. Attached Figure Description

[0019] Figure 1 This is a front view structural diagram of the present invention;

[0020] Figure 2 This is a frontal cross-sectional view of the present invention.

[0021] Figure 3 This is a top view sectional structural diagram of the present invention;

[0022] Figure 4 This is a schematic cross-sectional view of the support platform of this utility model.

[0023] In the diagram: 1. Testing machine; 2. Heating lamp; 3. Fixing plate; 4. Support platform; 5. Electric push rod; 6. Control component; 61. Rubber block; 62. Support plate; 63. Support rod; 64. Anti-deviation component; 641. Container platform; 642. Spring 1; 643. Protrusion; 7. Driven component; 71. Support plate; 72. Pressure rod; 73. Spring 2; 74. Movable rod; 75. Stop block; 76. Through hole. Detailed Implementation

[0024] like Figures 1-4As shown, this utility model provides a technical solution: a chip testing device with an anti-offset mechanism, including a testing machine 1, a heating lamp 2 installed on the inner wall of the testing machine 1, a fixing plate 3 fixedly installed on the inner wall of the testing machine 1, an electric push rod 5 installed on the inner wall of the testing machine 1, the electric push rod 5 being fixedly connected to the side of a support platform 4, the bottom of the support platform 4 being in contact with the top of the fixing plate 3, a control component 6 installed on the top of the support platform 4, and a driven component 7 installed inside the support platform 4. The control component 6 includes: a rubber block 61, the rubber block 61 being fixedly installed on the side of a support plate 62, and the support plate 62... A support rod 63 is fixedly installed on the side of the chip; an anti-deviation component 64 is used to prevent the chip from shifting during testing. When the protrusion 643 inside the tester 1 abuts against the cut surface of the support rod 63, the support rod 63 can slide into the tray 641. When the support rod 63 moves, the support plate 62 fixed to the surface of the support rod 63 moves synchronously. When the two sets of support plates 62 converge toward the center area of ​​the tray 641, the chip can be fixed, thus maintaining the stability of the chip during testing without manual intervention and avoiding deviation during testing.

[0025] The anti-deviation component 64 includes a holding platform 641, which is fixedly installed on the top of the support platform 4. A support rod 63 passes through the holding platform 641 and is slidably connected to it. The holding platform 641 ensures the stability of the support rod 63 during movement. The side of the support plate 62 is fixedly connected to one end of a spring 642, and the other end of the spring 642 is fixedly installed on the inner wall of the holding platform 641. When the support plate 62 is no longer under force, it can spring up under the action of the spring 642. A protrusion 643 is fixedly installed on the inner wall of the testing machine 1. The bottom of the protrusion 643 fits against the top of the support platform 4. The protrusion 643 in the testing machine 1 can cause the support rod 63 to move laterally when it abuts against the cut surface of the support rod 63. The driven component 7 includes a support plate 71, which is fixedly installed on the inner wall of the fixed plate 3. When the support plate 71 abuts against the surface of the pressure rod 72, the pressure rod 72 can slide within the support platform 4. A pressure rod 72 is installed inside the support platform 4, passing through and slidably connected to the support platform 4. One side of the pressure rod 72 is fixedly connected to one end of a second spring 73, and the other end of the second spring 73 is fixedly installed on the inner wall of the support platform 4. When the pressure rod 72 is no longer under force, it can spring out of the support platform 4 under the action of the second spring 73. The side of the pressure rod 72 is hinged to one end of a movable rod 74, and the other end of the movable rod 74 is hinged to the side of a stop block 75. When the pressure rod 72 moves, the movable rod 74 can rotate, pushing the stop block 75 to slide. The stop block 75 passes through and slidably connects to the support platform 4. A through hole 76 is provided inside the support platform 4. When the stop block 75 moves towards both sides of the support platform 4, it can block the through hole 76.

[0026] In this invention, during use, the chip to be tested is placed on top of the holding platform 641. After placement, the electric push rod 5 drives the support platform 4 to slide along the surface of the fixing plate 3 and move towards the testing machine 1. When the protrusion 643 inside the testing machine 1 abuts against the cut surface of the support rod 63, the support rod 63 can slide towards the holding platform 641. When the support rod 63 moves, the support plate 62 fixed to the surface of the support rod 63 moves synchronously. When the two sets of support plates 62 converge towards the center area of ​​the holding platform 641, the chip can be fixed. At the same time, when the support platform 4 moves into the testing machine 1, the support plate 71 fixed to the surface of the fixing plate 3 will abut against the surface of the pressure rod 72. When the pressure rod 72 is abutted, the pressure rod 72 can move towards the support platform 4. When the pressure rod 72 moves, it stimulates the spring 72. 3. When the pressure rod 72 moves, the movable rod 74 hinged to the surface of the pressure rod 72 can be flipped, pushing the stop 75 to move towards both sides of the support platform 4, blocking the through hole 76, thereby reminding the operator to move the support platform 4 to the accurate position. This also ensures that the chip remains stable during testing without manual intervention, preventing displacement during testing. During testing, the heating lamp 2 is turned on to test the chip's high temperature resistance. After the test, the electric push rod 5 is driven to move the support platform 4 from outside the testing machine 1. The protrusion 643 will no longer abut against the cut surface of the support rod 63, and the support plate 62 fixed to the surface of the support rod 63 can spring up under the action of the spring 642 and no longer fix the chip, making it easier for the operator to remove the chip.

[0027] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A chip testing device with an anti-offset mechanism, comprising a testing machine (1), characterized in that: The inner wall of the testing machine (1) is provided with a heating lamp (2), a fixing plate (3) is fixedly installed on the inner wall of the testing machine (1), an electric push rod (5) is provided on the inner wall of the testing machine (1), the electric push rod (5) is fixedly connected to the side of the support platform (4), the bottom of the support platform (4) is attached to the top of the fixing plate (3), a control component (6) is provided on the top of the support platform (4), a driven component (7) is provided inside the support platform (4), and the control component (6) includes: A rubber block (61) is fixedly installed on the side of a support plate (62), and a support rod (63) is fixedly installed on the side of the support plate (62). Anti-deviation component (64) is used to prevent the chip from shifting during testing.

2. The chip testing device with an anti-offset mechanism according to claim 1, characterized in that: The anti-deviation component (64) includes a holding platform (641), which is fixedly installed on the top of the support platform (4), and the support rod (63) passes through the holding platform (641) and is slidably connected to the holding platform (641).

3. The chip testing device with an anti-offset mechanism according to claim 2, characterized in that: The side of the support plate (62) is fixedly connected to one end of the spring (642), and the other end of the spring (642) is fixedly installed on the inner wall of the serving platform (641).

4. A chip testing device with an anti-offset mechanism according to claim 3, characterized in that: The inner wall of the testing machine (1) is fixedly installed with a protrusion (643), the bottom of which is in contact with the top of the support platform (4).

5. A chip testing device with an anti-offset mechanism according to claim 1, characterized in that: The driven component (7) includes a support plate (71), which is fixedly installed on the inner wall of the fixed plate (3).

6. A chip testing device with an anti-offset mechanism according to claim 1, characterized in that: A pressure rod (72) is provided inside the support platform (4). The pressure rod (72) passes through the support platform (4) and is slidably connected to the support platform (4). The side of the pressure rod (72) is fixedly connected to one end of the second spring (73). The other end of the second spring (73) is fixedly installed on the inner wall of the support platform (4).

7. A chip testing device with an anti-offset mechanism according to claim 6, characterized in that: The side of the pressure rod (72) is hinged to one end of the movable rod (74), and the other end of the movable rod (74) is hinged to the side of the stop block (75).

8. A chip testing device with an anti-offset mechanism according to claim 7, characterized in that: The stop block (75) passes through the support platform (4) and is slidably connected to the support platform (4), and a through hole (76) is provided in the support platform (4).

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