Carrier kit and test fixture

CN224758592UActive Publication Date: 2026-09-15SEMICON MFG ELECTRONICS (SHAOXING) CORP
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Patent Information

Application Number
CN202522190140.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-16
Publication Date
2026-09-15
Estimated Expiration
2035-10-16

AI Technical Summary

Technical Problem

当前功率循环设备仅提供基础测试平台,包括:基础电压/电流源及冷却媒介;仅可满足平底板封装模块功率循环试验,无法满足双面封装类型样品试验需求

Benefits of technology

[0014] As described above, this application provides a carrier kit, including: a detachable and interoperable first carrier and a second carrier; both the first and second carriers include a base and lead terminals disposed on the base; when the first and second carriers are separated, the base of the first carrier or the base of the second carrier carries a device under test (DUT), and one test point of the DUT is electrically connected to the lead terminals on the carrier; when the first and second carriers are interoperated, the DUT is located between the bases of the first and second carriers, and the test points on both sides of the DUT are electrically connected to the lead terminals of the first and second carriers, respectively. In application, the carrier kit can be lifted by placing it on the support structure of a test fixture.

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Abstract

The application discloses a carrier kit and a test carrier; the carrier kit comprises a first carrier and a second carrier which can be separated and docked with each other; the first carrier and the second carrier each comprise a base body and a lead terminal arranged on the base body; when the first carrier and the second carrier are separated, the base body of the first carrier or the base body of the second carrier carries a device to be tested, and one side test point of the device to be tested is electrically connected with the lead terminal on the carrier; when the first carrier and the second carrier are docked, the device to be tested is located between the base bodies of the first carrier and the second carrier, and the two side test points of the device to be tested are electrically connected with the lead terminals of the first carrier and the second carrier respectively. The carrier kit which can be separated and docked is used to realize the compatibility test of single-sided packaging products and double-sided packaging products, so that the application range of power cycle tests is significantly widened.
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Description

Technical Field

[0001] This application relates to the field of semiconductor product testing, and more specifically, to a carrier kit and a test fixture. Background Technology

[0002] Power cycling testing is a core testing method for evaluating the reliability of power modules. Current power cycling equipment only provides a basic test platform, including a basic voltage / current source and cooling medium; it can only meet the power cycling testing needs of flat-panel packaged modules and cannot meet the testing requirements of double-sided packaged samples. Therefore, a test fixture capable of accommodating both single-sided and double-sided package types is needed to complete power cycling experiments. Utility Model Content

[0003] In view of this, the purpose of this application is to provide a carrier kit and test fixture, which aims to achieve universal compatibility for single-sided and double-sided packaged products through a separable and dockable carrier kit.

[0004] To achieve the above objectives, this application provides a vehicle kit comprising a detachable and dockable first vehicle and a second vehicle; Both the first carrier and the second carrier include a base and lead terminals disposed on the base; When the first carrier separates from the second carrier, the base of the first carrier or the base of the second carrier carries the device under test, and the test point on one side of the device under test is electrically connected to the lead terminal on the carrier. When the first carrier and the second carrier are docked, the device under test is located between the bases of the first carrier and the second carrier, and the test points on both sides of the device under test are electrically connected to the lead terminals of the first carrier and the second carrier, respectively.

[0005] In some embodiments, the substrate is a metal substrate; both the first carrier and the second carrier include an insulating portion disposed between the substrate and the lead terminal.

[0006] In some embodiments, the insulating portion is detachably connected to the substrate, and / or the lead terminal is detachably connected to the insulating portion.

[0007] In some embodiments, the insulating portion is provided with a slot; the lead terminal is partially inserted into the slot and crimped in place.

[0008] In some embodiments, at least one of the bases of the first carrier and the second carrier is provided with a recess for accommodating the device under test, and at least one side of the recess is not obscured by the base.

[0009] In some embodiments, the base of the first carrier is provided with the recess, the central region of the recess is provided with a first through hole, and the lead terminal of the first carrier extends from the first through hole and protrudes from the base of the first carrier in a direction away from the recess; and / or, The second carrier has a second through hole in the central region of its base, and the lead terminal of the second carrier extends from the second through hole and protrudes from the base of the second carrier.

[0010] In some embodiments, at least one of the bases of the first vehicle and the second vehicle has a built-in cooling channel.

[0011] In some embodiments, the vehicle kit further includes thermocouples for monitoring the temperature of the inlet and / or outlet of the cooling channel.

[0012] To achieve the above objectives, this application also provides a test fixture, which includes: Support structure; And any of the vehicle kits described herein, the vehicle kit being disposed on the support structure.

[0013] In some embodiments, the test fixture further includes a locking device; one of the first carrier and the second carrier is rotatably disposed on the support structure; at least one of the first carrier and the second carrier is locked to the support structure by the locking device.

[0014] As described above, this application provides a carrier kit, including: a detachable and interoperable first carrier and a second carrier; both the first and second carriers include a base and lead terminals disposed on the base; when the first and second carriers are separated, the base of the first carrier or the base of the second carrier carries a device under test (DUT), and one test point of the DUT is electrically connected to the lead terminals on the carrier; when the first and second carriers are interoperated, the DUT is located between the bases of the first and second carriers, and the test points on both sides of the DUT are electrically connected to the lead terminals of the first and second carriers, respectively. In application, the carrier kit can be lifted by placing it on the support structure of a test fixture.

[0015] With this configuration, when the device under test (DUT) is a double-sided package, it can be placed between the first and second carriers, with the first and second carriers connecting to the test points on both sides of the double-sided package, thus enabling double-sided testing. Conversely, when the DUT is a single-sided package, only one carrier is used to support the single-sided package, connecting to the test points on one side of the single-sided package, thus enabling single-sided testing. This allows the same test fixture to be flexibly adapted to different types of DUTs through detachable and dockable carrier kits, overcoming the drawback of traditional fixtures that require frequent changes of dedicated fixtures due to different product packaging forms. This significantly improves testing efficiency and reduces equipment costs. Especially when testing both sides simultaneously, more chips can be tested, greatly shortening testing time and testing cycle, and improving testing efficiency. Attached Figure Description

[0016] Those skilled in the art will understand that the accompanying drawings are provided to better understand this application and do not constitute any limitation on the scope of this application.

[0017] Figure 1 This is a schematic diagram of the test fixture in the embodiments of this application from a first perspective, in which the first carrier and the second carrier are in a docking state; Figure 2 This is a schematic diagram of the test fixture in the embodiments of this application from a second perspective. The second perspective is opposite to the first perspective, and the first carrier and the second carrier are in a docking state in the figure. Figure 3 This is a schematic diagram of the separation structure of the vehicle kit in the embodiment of this application, in which the first vehicle and the second vehicle are in a separated state; Figure 4 This is a schematic diagram of the rotatable structure of the vehicle kit in the embodiments of this application; Figure 5 for Figure 4 An enlarged structural diagram of the vehicle kit at position A.

[0018] Explanation of reference numerals in the attached figures: 100-Test fixture, 10-Support structure, 11-Base, 12-Bracket, 20-Carrier kit, 21-First carrier, 22-Second carrier, 201-Base, 2011-First through hole, 2012-Second through hole, 2013-Inlet, 2014-Outlet, 202-Lead terminal, 203-Insulation part, 2031-Slot, 30-Locking device, 40-Thermocouple, 200-Recess. Detailed Implementation

[0019] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show components related to this application and are not drawn according to the actual number, shape, and size of components in the implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0020] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this application must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, where implementation is possible, those skilled in the art can selectively implement some or all of the technical features in any embodiment, or selectively implement a combination of some or all of the technical features in multiple embodiments, based on the disclosure of this application and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this application.

[0021] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “multiple” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “installed,” “connected,” and “linked” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” and “third,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate relative importance or implicitly specify the number of indicated technical features. Those skilled in the art will understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] First, it should be noted that the double-sided packaged products mentioned in this article refer to products where chips are mounted on both the bottom and top surfaces. Because the chips have pins, neither side of the product can be directly placed flat on a water-cooled plate for testing. Generally, the opposite sides of a double-sided packaged product refer to the two largest parallel and facing surfaces of the product, such as the top and bottom surfaces. Single-sided packaged products, on the other hand, only have chips mounted on the bottom or top surface; the side without chips is flat and can be directly placed flat on a water-cooled plate for testing.

[0023] Since current power cycling equipment only provides a basic test platform and cannot be compatible with double-sided packaged products, this application proposes a carrier kit and a test fixture containing the carrier kit. The aim is to achieve universal compatibility with single-sided and double-sided packaged products through a separable and dockable carrier kit, thereby solving the problem that current power cycling equipment cannot meet the testing requirements of double-sided packaged products.

[0024] To make the objectives, advantages, and features of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this application.

[0025] Figure 1 This is a schematic diagram of the test fixture 100 in the embodiments of this application from a first perspective. Figure 2 This is a schematic diagram of the test fixture 100 in the embodiments of this application from a second perspective, which is opposite to the first perspective. Figure 3 This is a schematic diagram of the detachable structure of the vehicle kit 20 in the embodiments of this application. Figure 4 This is a schematic diagram of the rotatable structure of the vehicle kit 20 in the embodiments of this application. Figure 5 for Figure 4 Enlarged structural diagram of the vehicle kit 20 at position A.

[0026] like Figures 1 to 5 As shown, based on one aspect, this application embodiment provides a test fixture 100; based on another aspect, this application embodiment also provides a vehicle kit 20. The test fixture 100 includes: a support structure 10; and a vehicle kit 20 disposed on the support structure 10.

[0027] The main function of the support structure 10 is to provide stable support and to secure and install the vehicle kit 20. The support structure 10 can be placed flat on the foundation or an existing foundation test platform to complete power cycle testing operations.

[0028] The support structure 10 can lift the carrier kit 20, indirectly lifting the device under test (DUT) to prevent damage to the DUT and wiring during installation. The lifting height of the carrier kit 20 can be adjusted as needed and is not limited thereto.

[0029] The support structure 10 can have various structures. As an example, the support structure 10 includes a base 11 and brackets 12, which can be integrated or separate. Two brackets 12 are vertically fixed to the base 11, facing each other and spaced apart. The carrier kit 20 can be installed between the two brackets 12 and connected to the brackets 12. Both the base 11 and the brackets 12 are simple plate-like or block-like structures, which are convenient for processing and manufacturing.

[0030] In one example, at least one of the base 11 and the bracket 12 is provided with a weight-reducing structure (not shown), such as weight-reducing holes, grooves, grids, or other weight-reducing structures. By providing weight-reducing structures on the base 11 and / or the bracket 12, the center of gravity of the entire test fixture 100 can be lowered, enhancing the overall stability of the fixture, especially when carrying the device under test, during the testing process. This avoids the risk of swaying or tipping due to top-heavy design, and also makes the installation and daily maintenance of the fixture more convenient. It is particularly suitable for power cycle testing scenarios that require frequent replacement of the device under test. Moreover, while ensuring structural rigidity and support strength, it saves material costs and meets lightweight design requirements.

[0031] Further, refer to Figure 3 As shown, the vehicle kit 20 includes a detachable and dockable first vehicle 21 and a second vehicle 22.

[0032] When the first carrier 21 and the second carrier 22 dock, they can be fixedly connected in various ways. Optionally, the first carrier 21 and the second carrier 22 can be fixed by clips, magnets, or screws, especially screws.

[0033] In addition, both the first carrier 21 and the second carrier 22 include a base 201 and lead terminals 202 disposed on the base 201. The lead terminals 202 can be directly or indirectly fixed to the base 201, and there are no restrictions on the fixing method.

[0034] The lead terminal 202 is used to connect the pins on the device under test (DUT) to the test system to achieve real-time monitoring of electrical parameters such as current and voltage. However, please note that the specific number of lead terminals 202 on each carrier can be selected and adjusted according to the actual circuit connection requirements, and this application does not limit this.

[0035] In addition, vehicle kit 20 has two usage modes: The first state is the separation state: the first carrier 21 and the second carrier 22 are separated from each other. At this time, the device under test is carried by the base 201 of the first carrier 21 or the base 201 of the second carrier 22, and the test point (the test point is the chip pin) on one side of the device under test is electrically connected to the lead terminal 202 on the carrier, so that one side of the single-sided packaged product can be connected to the test system. The second type is the docking state: the first carrier 21 docks with the second carrier 22, and the device under test is located between the base 201 of the first carrier 21 and the second carrier 22. The first carrier 21 and the second carrier 22 jointly support the device under test, and the test points on both sides of the device under test are electrically connected to the lead terminals 202 of the first carrier 21 and the second carrier 22 respectively, so that both sides of the double-sided packaged product can be connected to the test system at the same time.

[0036] In this way, the same test fixture 100 can be flexibly adapted to different types of devices under test through the detachable and dockable carrier kit 20, thereby overcoming the shortcomings of traditional fixtures that require frequent replacement of dedicated fixtures due to different product packaging forms. This significantly improves testing efficiency and reduces equipment costs. In particular, when testing both sides simultaneously, more chips can be tested, greatly shortening the testing time and testing cycle, and improving testing efficiency.

[0037] Furthermore, either the first carrier 21 or the second carrier 22 can be permanently fixed to the support structure 10 or removed from the support structure 10. As an example, the second carrier 22 is directly and permanently or removably mounted on the support structure 10.

[0038] Taking the second carrier 22 as an example, during single-sided testing, the single-sided packaged product is placed directly on the base 201 of the second carrier 22 and fixed, and one side of the single-sided packaged product is electrically connected to the lead terminal 202 of the second carrier 22; during double-sided testing, the double-sided packaged product is first placed on the base 201 of the second carrier 22 and fixed, then the base 201 of the first carrier 21 is covered on the base 201 of the second carrier 22, and then the base 201 of the first carrier 21 and the base 201 of the second carrier 22 are fixed.

[0039] Conversely, if the first carrier 21 is directly and permanently or removably mounted on the support structure 10, the same principle applies: during single-sided testing, the single-sided packaged product is placed directly on the base 201 of the first carrier 21 and fixed, and one side of the single-sided packaged product is electrically connected to the lead terminal 202 of the first carrier 21; during double-sided testing, the double-sided packaged product is first placed on the base 201 of the first carrier 21 and fixed, then the base 201 of the second carrier 22 is placed over the base 201 of the first carrier 21, and then the base 201 of the second carrier 22 is fixed to the base 201 of the first carrier 21.

[0040] Thus, the carrier kit 20 can be used to perform power cycle testing on both single-sided and double-sided packaged products, and is simple and easy to use. Moreover, during double-sided testing, the device under test (DUT) is fixedly connected to only one carrier, eliminating the need to connect both carriers to the DUT simultaneously, which greatly simplifies the operation and saves time.

[0041] It should be noted that any method of fixing the carrier to the device under test, as well as the method of fixing two carriers, includes, but is not limited to, screw fixing. Compared with other fixing methods, screw fixing has the advantage that it can directly utilize the inherent mounting holes on the device under test, and reliably fix it by designing matching threaded holes on the base 201 of the carrier. This not only saves the cost and time of complex structures, but also greatly simplifies the processing and manufacturing difficulty of the base 201 and reduces the overall cost, since threaded holes are a very common machining feature.

[0042] In some embodiments, the substrates 201 of both the first carrier 21 and the second carrier 22 are metal substrates. The material used to prepare the metal substrate is not limited; for example, stainless steel, aluminum alloy, or other suitable metals or alloys. In one example, the substrates 201 of the first carrier 21 and the second carrier 22 are made of stainless steel.

[0043] In other embodiments, the substrate 201 of the first carrier 21 and the second carrier 22 is itself an insulating substrate.

[0044] When the substrate 201 is a metal substrate, the first carrier 21 and the second carrier 22 also include an insulating portion 203, which is disposed between the substrate 201 and the lead terminal 202. See details... Figure 3 As shown.

[0045] Thus, the mechanical part of the carrier is formed by the metal substrate, the electrical part of the carrier is formed by the lead terminal 202, and the insulating part 203 provides electrical isolation between the metal substrate and the lead terminal 202 to ensure safety.

[0046] The insulating portion 203 is made of any insulating material capable of achieving reliable electrical isolation and meeting the test temperature and strength requirements, such as polymers, ceramics, or engineering plastics. In one example, the insulating portion 203 is made of engineering plastic. The insulating portion 203 indirectly fixes the lead terminal 202 to the base 201, and the lead terminal 202 is located on the side of the insulating portion 203 opposite to the base 201.

[0047] The shape and size of the insulating part 203 are not limited. There are also no special requirements for the connection method between the insulating part 203, the lead terminal 202, and the base 201.

[0048] The insulating portion 203 is permanently or removably disposed on the substrate 201. Preferably, the insulating portion 203 is detachably connected to the substrate 201 so that the insulating portion 203 or the substrate 201 can be replaced when needed.

[0049] Lead terminals 202 are permanently or removably disposed on the insulating portion 203. Preferably, the lead terminals 202 are detachably connected to the insulating portion 203 so that the insulating portion 203 or the lead terminals 202 can be replaced when needed.

[0050] In one example, the insulating portion 203 is screwed to the base 201. In another example, multiple lead terminals 202 on the same carrier are disposed on the same insulating portion 203.

[0051] In one example, the lead terminal 202 is crimped and fixed to the insulation portion 203. Specifically, the tail of the lead terminal 202 is designed with a mounting hole. Under pressure, the riveting component passes through the mounting hole on the lead terminal 202 and undergoes plastic deformation, thus firmly locking the lead terminal 202 onto the insulation portion 203 like a rivet, preventing it from loosening. In this way, after the lead terminal 202 is led out from inside the base 201, sufficient space is maintained for installation and operation, as well as a safe distance for reliability testing.

[0052] In addition, the insulating part 203 may be provided with some limiting measures to ensure the positioning accuracy of the lead terminal 202. For example, the insulating part 203 is provided with positioning holes, and the lead terminal 202 is provided with corresponding positioning posts. Through the cooperation of the positioning posts and positioning holes, the lead terminal 202 can be accurately positioned in two directions. Alternatively, the design can be reversed, with the insulating part 203 provided with positioning posts and the lead terminal 202 provided with corresponding positioning holes.

[0053] In some embodiments, a slot 2031 is provided on the insulating part 203, and the lead terminal 202 is partially inserted into the slot 2031, which can prevent the lead terminal 202 from wobbling left and right, and facilitate the disassembly and assembly of the lead terminal 202.

[0054] The lead terminals 202 on each carrier are arranged according to the position and number of chip pins on the device under test. In one example, multiple slots 2031 can be provided on the same insulating part 203, and the multiple slots 2031 are spaced apart along the pin arrangement direction on the same side, and each slot 2031 can be plugged into one lead terminal 202.

[0055] Furthermore, at least one of the bases 201 of the first carrier 21 and the second carrier 22 may be provided with a recess 200 for accommodating the device under test, such as... Figures 2 to 4 As shown, this is especially true for double-sided testing.

[0056] In one example, the second carrier 22 directly loads the device under test (DUT) and fixes the DUT directly to the second carrier 22, while the base 201 of the first carrier 21 has a recess 200, and the base 201 of the second carrier 22 does not have a recess but is a flat surface.

[0057] In other examples, the first carrier 21 directly loads the device under test and fixes the device under test directly to the first carrier 21, while the base 201 of the second carrier 22 has a recess 200, and the base 201 of the first carrier 21 does not have a recess, but is a plane.

[0058] In another example, recesses 200 can be provided on the base 201 of both the first carrier 21 and the second carrier 22, and the two recesses 200 together enclose and accommodate the device under test.

[0059] In some embodiments, at least one side of the recess 200 is not obscured by the substrate 201 and is visible to the outside. This arrangement allows operators to directly observe the product status and check the connection during testing. Preferably, the front and rear sides, as well as the top and bottom sides of the recess 200, are all visible.

[0060] In one example, only the base 201 of the first carrier 21 has a recess 200, and the central region of the recess 200 has a first through hole 2011. The lead terminal 202 of the first carrier 21 extends from the first through hole 2011 and protrudes from the base 201 of the first carrier 21 in a direction away from the recess 200. The first through hole 2011 can avoid the pins on the device under test and make the pins contact the lead terminal 202 of the first carrier 21.

[0061] In one example, the base 201 of the second carrier 22 has a second through hole 2012 in its central region, and the lead terminal 202 of the second carrier 22 extends from the second through hole 2012 and protrudes from the base 201 of the second carrier 22. The second through hole 2012 can avoid the pins on the device under test and make the pins contact the lead terminal 202 of the second carrier 22.

[0062] It should be noted that when the first carrier 21 and the second carrier 22 are docked, the lead terminals 202 on the first carrier 21 and the lead terminals 202 on the second carrier 22 extend in a direction away from each other and do not interfere with each other.

[0063] Therefore, regardless of whether a single-sided or double-sided packaged product is installed, the pins of the device under test can directly contact the lead terminals 202 on the carrier to achieve electrical connection, avoiding the use of wires, saving materials, and further simplifying the operation.

[0064] Furthermore, at least one of the first carrier 21 and the second carrier 22 is rotatably connected to the support structure 10. Preferably, only one of the first carrier 21 and the second carrier 22 is rotatably mounted on the support structure 10. This rotatable design of the carriers reduces wire connection stress during installation, lowering the risk of wire damage, and allows the operator to rotate the carriers to observe the product's condition, such as whether its shape has changed.

[0065] In one example, the second carrier 22 is rotatably connected to the support 12 via a pivot 24 or a hinge. In other examples, the first carrier 21 is rotatably connected to the support 12 via a pivot 24 or a hinge.

[0066] The second vehicle 22 is used as an illustration, such as Figures 3 to 5 As shown, a transition block 23 is provided on each of the left and right sides of the second vehicle 22. The transition block 23 is connected to one end of the rotating shaft 24, and the other end of the rotating shaft 24 is connected to the bracket 12. This method is also applicable to the first vehicle 21.

[0067] Meanwhile, the test fixture 100 also includes a locking device 30. At least one of the first carrier 21 and the second carrier 22 is locked to the support structure 10 by the locking device 30.

[0068] Those skilled in the art should be able to understand how to implement the locking device 30 based on their knowledge; therefore, this application does not limit the specific implementation of the locking device 30. An exemplary description follows.

[0069] In one example, the locking device 30 is a locking screw, which is mounted on the bracket 12. The corresponding carrier has a threaded hole. The locking screw extends into the threaded hole on the carrier. Tightening the locking screw can fix the carrier. Conversely, loosening the locking screw can release the carrier.

[0070] In other examples, the locking device 30 is a positioning pin. The carrier and the bracket 12 are provided with a series of positioning holes distributed at different angles. The positioning pin can be inserted into any positioning hole of the bracket 12 and the carrier at the same time to achieve locking and fixation.

[0071] Alternatively, the bracket 12 has an arc-shaped groove centered on the pivot 24, and the carrier has a corresponding threaded hole. The locking screw passes through the arc-shaped groove and is screwed into the threaded hole. When the locking screw is tightened, its head presses against the side wall of the arc-shaped groove, generating a huge frictional force, thereby reliably locking the carrier at the required angle. The arc-shaped groove also limits the rotation range of the carrier.

[0072] Furthermore, to address the heat dissipation issue under high-power testing, at least one of the bases 201 of the first carrier 21 and the second carrier 22 is provided with a cooling channel for forced heat dissipation of the device under test.

[0073] In one example, only the base 201 of the second vehicle 22 has built-in cooling channels. For example... Figures 1 to 4 As shown, the second carrier 22 has a water inlet 2013 and a water outlet 2014 on the side away from the first carrier 21, which are respectively connected to the built-in cooling channel.

[0074] In other examples, the first vehicle 21 has a built-in cooling channel in its base 201 and an inlet 2013 and an outlet 2014 on the side away from the second vehicle 22, which can also achieve similar functions.

[0075] In some embodiments, the test fixture 100 further includes a thermocouple 40 for real-time monitoring of the temperature of the inlet 2013 and / or outlet 2014 of the cooling channel.

[0076] In one example, a thermocouple 40 is installed on the second vehicle 22 near the inlet 2013 and another thermocouple 40 is installed near the outlet 2014.

[0077] Based on this, the temperature of the cooling water can be adjusted according to the temperature data monitored by the thermocouple 40 to ensure heat dissipation and thus improve testing efficiency.

[0078] In summary, this application provides a carrier kit 20. By mounting the carrier kit 20 on the support structure 10 of the test fixture, the carrier kit 20 can be raised for power cycle testing. This allows the same test fixture 100 to be flexibly adapted to different types of devices under test (DUTs) through the detachable and dockable carrier kit 20, overcoming the shortcomings of traditional fixtures that require frequent replacement of dedicated fixtures due to different product packaging forms. This significantly improves testing efficiency and reduces equipment costs.

[0079] It should be understood that the above embodiments specifically disclose the features of the preferred embodiments of this application, enabling those skilled in the art to better understand this application. Those skilled in the art should understand that, based on the disclosure of this application, appropriate modifications can be easily made to this application to achieve the same purpose and / or the same advantages as the embodiments disclosed in this application. Those skilled in the art should also recognize that such similar structures do not depart from the scope of this application, and that they can be changed, substituted, and modified in various ways without departing from the scope of this application.

Claims

1. A vehicle kit, characterized in that, Includes a first and a second vehicle that are separable and capable of docking with each other; Both the first carrier and the second carrier include a base and lead terminals disposed on the base; When the first carrier separates from the second carrier, the base of the first carrier or the base of the second carrier carries the device under test, and the test point on one side of the device under test is electrically connected to the lead terminal on the carrier. When the first carrier and the second carrier are docked, the device under test is located between the bases of the first carrier and the second carrier, and the test points on both sides of the device under test are electrically connected to the lead terminals of the first carrier and the second carrier, respectively.

2. The vehicle kit according to claim 1, characterized in that, The substrate is a metal substrate; both the first carrier and the second carrier include an insulating part, which is disposed between the substrate and the lead terminal.

3. The vehicle kit according to claim 2, characterized in that, The insulating portion is detachably connected to the substrate, and / or the lead terminal is detachably connected to the insulating portion.

4. The vehicle kit according to claim 2, characterized in that, The insulating part is provided with a slot; the lead terminal is partially inserted into the slot and crimped in place.

5. The vehicle kit according to claim 1 or 2, characterized in that, At least one of the bases of the first carrier and the second carrier is provided with a recess for accommodating the device under test, and at least one side of the recess is not covered by the base.

6. The vehicle kit according to claim 5, characterized in that, The first carrier has a recess on its base, a first through hole in the central region of the recess, and a lead terminal of the first carrier extends from the first through hole and protrudes from the base of the first carrier in a direction away from the recess; and / or, The second carrier has a second through hole in the central region of its base, and the lead terminal of the second carrier extends from the second through hole and protrudes from the base of the second carrier.

7. The vehicle kit according to claim 1 or 2, characterized in that, At least one of the bases of the first vehicle and the second vehicle has a built-in cooling channel.

8. The vehicle kit according to claim 7, characterized in that, It also includes thermocouples for monitoring the temperature of the inlet and / or outlet of the cooling channel.

9. A test fixture, characterized in that, include: Support structure; And the vehicle kit as described in any one of claims 1-8, wherein the vehicle kit is disposed on the support structure.

10. The test fixture according to claim 9, characterized in that, It also includes a locking device; one of the first carrier and the second carrier is rotatably mounted on the support structure; at least one of the first carrier and the second carrier is locked to the support structure by the locking device.