SSD high-low temperature control aging test machine

Abstract

The utility model discloses a kind of SSD high-low temperature control aging test machine, it is related to aging test technical field, including organism, first test chamber and second test chamber are provided on the organism;First semiconductor temperature regulating module is provided in the organism, the first semiconductor temperature regulating module has the first temperature regulating end and the second temperature regulating end based on Peltier effect and interchangeable as cold end / thermal end;The first temperature regulating end is thermally coupled with the first test chamber, for adjusting its temperature;The second temperature regulating end is thermally coupled with the second test chamber, for adjusting its temperature;This test machine utilizes single semiconductor temperature control module to provide service for two test chambers simultaneously, and the cold quantity required by a test chamber is just derived from the heat generated by another test chamber, realizes the direct transfer and efficient utilization of energy in system inside, substantially reduces the high energy consumption brought by heating and refrigeration in traditional scheme respectively.

Description

Technical Field

[0001] This utility model relates to the field of aging test technology, and in particular to an SSD high and low temperature controlled aging test machine. Background Technology

[0002] The SSD high and low temperature controlled aging test chamber is a professional device specifically designed to test the reliability, stability, and durability of solid-state drives (SSDs) under extreme temperature conditions. It simulates harsh environments such as high and low temperatures and temperature cycling to examine the performance and potential defects of SSDs, making it an indispensable part of SSD manufacturing and quality control.

[0003] Because SSD aging test equipment typically consumes a lot of energy, energy efficiency optimization for SSD aging test equipment is receiving increasing attention. Chinese utility model patent CN219202761U proposes a "cooling device for solid-state drive aging test." This device uses a heat exchange component to transfer the heat from the high-temperature gas discharged from the exhaust component to the low-temperature gas absorbed by the intake component. This appropriately raises the temperature of the low-temperature gas entering the aging chamber, preventing the low-temperature gas from directly affecting the solid-state drive and causing invisible damage to the internal electronic components, thus impacting the lifespan of the solid-state drive. The heat exchange effect can be achieved using a simple U-shaped hollow ventilation tube, which is inexpensive, easy to maintain, and helps reduce production costs.

[0004] However, the aforementioned patent CN219202761U only optimizes energy consumption after the test is completed. The SSD high and low temperature controlled aging test process is the time period with the highest energy consumption. In particular, when multiple test chambers of the high and low temperature controlled aging test machine are used to conduct high and low temperature aging tests on multiple SSDs, the energy consumption is very high. It is very important to minimize the energy consumption during aging as much as possible. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this invention aims to provide an SSD high and low temperature controlled aging test machine, so as to minimize the overall energy consumption when conducting high and low temperature aging tests on multiple SSDs through multiple test chambers.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an SSD high and low temperature controlled aging test machine, comprising a body, wherein a first test chamber and a second test chamber are disposed on the body; a first semiconductor temperature regulation module is disposed within the body, the first semiconductor temperature regulation module having a first temperature regulation end and a second temperature regulation end based on the Peltier effect and interchangeable as a cold end / hot end; the first temperature regulation end is thermally coupled to the first test chamber for regulating its temperature; the second temperature regulation end is thermally coupled to the second test chamber for regulating its temperature.

[0007] A further technical solution of this utility model: The first semiconductor temperature regulation module includes a control unit, a current commutation circuit and a Peltier module. The Peltier module has a thermocouple pair. The control unit controls the direction of the current flowing into the thermocouple pair through the current commutation circuit to switch the cold / hot function of the first temperature regulation terminal and the second temperature regulation terminal.

[0008] A further technical solution of this utility model: The body includes a first cabinet and a second cabinet that are isolated from each other, the first test chamber is the internal space of the first cabinet, and the second test chamber is the internal space of the second cabinet.

[0009] A further technical solution of this utility model: a first hard disk test module is provided in the first cabinet, and a second hard disk test module is provided in the second cabinet; both the first hard disk test module and the second hard disk test module have a test interface for connecting an SSD.

[0010] A further technical solution of this utility model: a heat insulation structure is provided between the first cabinet and the second cabinet.

[0011] A further technical solution of this utility model: the machine body is also provided with a first air supply device and a second air supply device; the first air supply device is configured to supply air to the first test chamber, and the second air supply device is configured to supply air to the second test chamber.

[0012] A further technical solution of this utility model: both the first test chamber and the second test chamber are provided with air vents.

[0013] A further technical solution of this utility model: The body is also provided with a second semiconductor temperature regulation module, and one temperature regulation terminal of the second semiconductor temperature regulation module is thermally coupled to the first test chamber for auxiliary or independent temperature regulation.

[0014] A further technical solution of this utility model: The body is also provided with a third semiconductor temperature regulation module, and one temperature regulation terminal of the third semiconductor temperature regulation module is thermally coupled to the second test chamber for auxiliary or independent temperature regulation.

[0015] Compared with existing technologies, the beneficial effects of this technical solution are: this testing machine uses a single semiconductor temperature control module to provide services for two testing chambers at the same time, and the cooling required by one testing chamber comes exactly from the heat generated by the other testing chamber (or vice versa), realizing the direct transfer and efficient utilization of energy within the system, and significantly reducing the high energy consumption caused by separate heating and cooling in traditional solutions.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a circuit block diagram of the first semiconductor temperature regulation module in this utility model; Figure 3 This is a circuit block diagram of the Polterge module in this utility model; Figure 4 This is another circuit block diagram of the Bolt module in this utility model, and... Figure 3 In contrast, the direction of the current is reversed by the current commutation circuit.

[0019] The corresponding labels in the attached diagram are explained as follows: 1-Main body, 11-First cabinet, 111-First test chamber, 12-Second cabinet, 121-Second test chamber, 13-Insulation structure, 2-First semiconductor temperature regulation module, 21-Control unit, 22-Current commutation circuit, 23-Peltier module, 231-First temperature regulation terminal, 232-Second temperature regulation terminal, 3-First hard disk test module, 4-Second hard disk test module, 5-First air circulation device, 6-Second air circulation device, 7-Air outlet, 8-Second semiconductor temperature regulation module, 9-Third semiconductor temperature regulation module. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 A high and low temperature controlled aging test machine for SSDs includes a body 1, which has a first test chamber 111 and a second test chamber 121.

[0022] The body 1 is also provided with a first semiconductor temperature regulation module 2, which has a first temperature regulation terminal 231 and a second temperature regulation terminal 232 that are interchangeable as cold end / hot end.

[0023] The first temperature regulating terminal 231 of the first semiconductor temperature regulating module is used to regulate the temperature of the first test chamber 111, and the second temperature regulating terminal 232 of the first semiconductor temperature regulating module is used to regulate the temperature of the second test chamber 121.

[0024] When using the first test chamber 111 and the second test chamber 121 simultaneously to conduct high and low temperature controlled aging tests on multiple SSDs (solid-state drives), the aforementioned first semiconductor temperature regulation module enables the recovery and utilization of heat or cold energy. That is, when the first temperature regulation end 231 is used as the cold end, the second temperature regulation end 232 corresponds to the hot end, so that the first test chamber 111 and the second test chamber 121 can perform low temperature and high temperature tests respectively; when the second temperature regulation end 232 is used as the cold end, the first temperature regulation end 231 corresponds to the hot end, so that the first test chamber 111 and the second test chamber 121 can perform high temperature and low temperature tests respectively.

[0025] In this embodiment, the first semiconductor temperature regulation module 2 includes a control unit 21, a current commutation circuit 22, and a Peltier module 23 (or Peltier radiator, Peltier cooler).

[0026] Peltier module 23 utilizes the Peltier effect to form a first temperature regulating end and a second temperature regulating end. When the first temperature regulating end is the cold end, the second temperature regulating end corresponds to the hot end; when the second temperature regulating end is the cold end, the first temperature regulating end corresponds to the hot end.

[0027] The Peltier effect refers to the phenomenon that when an electric current passes through a circuit composed of different conductors, in addition to generating irreversible Joule heating, heat absorption and heat release will occur at the junction of different conductors depending on the direction of the current.

[0028] like Figure 2 , 3 As shown in Figure 4, specifically, the Peltier module includes a pair of thermocouples composed of N-type and P-type materials. The control unit 21 controls the direction of the current flowing into the pair of thermocouples through the current commutation circuit 22. When a direct current is applied to the pair of thermocouples, due to the different directions of the direct current, heat absorption and heat release phenomena will occur at the junction of the pair of thermocouples, thereby forming interchangeable cold / hot junctions at the two junctions of the pair of thermocouples. This phenomenon is called the Peltier effect.

[0029] The first temperature regulating end 231 and the second temperature regulating end 232 are two different junctions of the thermocouple pair, or heat-conducting components used to transfer the temperature of the two different junctions.

[0030] The heat-conducting component is, for example, aluminum, which transfers the temperature of the corresponding node to the corresponding test chamber.

[0031] In some embodiments, the body 1 has a first cabinet 11 and a second cabinet 12.

[0032] The first cabinet 11 houses the first hard disk test module 3, which has a test interface for connecting to an SSD (Solid State Drive) for running SSD tests. The first test chamber 111 is the space inside the first cabinet 11.

[0033] The second cabinet 12 houses a second hard disk test module 4, which has a test interface for connecting to an SSD, enabling SSD testing. The second test chamber 121 is the space within the second cabinet 12.

[0034] In some embodiments, the first cabinet has a first through-inlet, and the second cabinet has a second through-inlet. A heat-conducting component corresponding to the first temperature regulating end enters the first cabinet through the first through-inlet. A heat-conducting component corresponding to the second temperature regulating end enters the second cabinet through the second through-inlet.

[0035] In some embodiments, the body 1 is further provided with a heat insulation structure 13, which constitutes temperature insulation between the first test chamber 111 and the second test chamber 121. The heat insulation structure is, for example, heat insulation foam disposed between the first test chamber and the second test chamber.

[0036] In some embodiments, the body 1 is further provided with a second semiconductor temperature regulation module 8 corresponding to the first test chamber 111. The second semiconductor temperature regulation module 8 is used to regulate the high and low temperatures of the first test chamber 111.

[0037] The second semiconductor temperature regulation module can be configured with reference to the first semiconductor temperature regulation module. One of the temperature regulation terminals of the second semiconductor temperature regulation module is used to regulate the temperature of the first test chamber.

[0038] In some embodiments, the body 1 is further provided with a third semiconductor temperature regulation module 9 corresponding to the second test chamber 121. The third semiconductor temperature regulation module 9 is used to regulate the high and low temperatures of the second test chamber 121.

[0039] The third semiconductor temperature regulation module can be configured with reference to the first semiconductor temperature regulation module. One of the temperature regulation terminals of the third semiconductor temperature regulation module is used to regulate the temperature of the second test chamber.

[0040] In this embodiment, the temperatures within the first test chamber 111 and the second test chamber 121 can be adjusted independently via the second semiconductor temperature adjustment module 8 and the third semiconductor temperature adjustment module 9, respectively. When it is not necessary to use the first test chamber 111 and the second test chamber 121 simultaneously, the corresponding test chamber can be used individually, resulting in better applicability.

[0041] In this embodiment, when the first semiconductor temperature regulation module 2 is working, the temperatures in the corresponding first test chamber 111 and second test chamber 121 are further adjusted by the second semiconductor temperature regulation module 8 and the third semiconductor temperature regulation module 9.

[0042] For example, the output from the hot end of the first semiconductor temperature regulating module 2 makes the temperature of the first test chamber 111 meet the requirement of 50°C, while the output from the cold end of the first semiconductor temperature regulating module 2 only makes the temperature of the second test chamber 121 at -5°C, which does not meet the requirement of -10°C for the second test chamber 121. At this time, the third semiconductor temperature regulating module 9 can be intervened to jointly make the second test chamber 121 meet the requirement of -10°C.

[0043] In some embodiments, both the first and second test chambers are equipped with corresponding temperature sensors (not shown). The control unit detects the temperature through the corresponding temperature sensors and performs corresponding temperature control. For example, it controls the hot-end temperature or cold-end temperature of the first semiconductor temperature regulating module, or it performs joint temperature control with the intervention of the third semiconductor temperature regulating module as mentioned in the above embodiments.

[0044] In some embodiments, the body 1 is further provided with a first air circulation device 5 corresponding to the first test chamber 111 and a second air circulation device 6 corresponding to the second test chamber 121. The air circulation devices make the temperature inside the corresponding test chamber more uniform. For example, the air circulation devices are used to blow or guide air to the corresponding temperature regulating end so that the heat or cold can be transferred to other areas inside the test chamber as much as possible.

[0045] Furthermore, both the first test chamber 111 and the second test chamber 121 are equipped with air vents 7.

[0046] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An SSD high and low temperature controlled aging test machine, comprising a body (1), characterized in that, The body (1) is provided with a first test chamber (11) and a second test chamber (12); The machine body is provided with a first semiconductor temperature regulation module (2), which has a first temperature regulation terminal (231) and a second temperature regulation terminal (232) based on the Peltier effect and interchangeable as cold end / hot end. The first temperature regulating terminal (231) is thermally coupled to the first test chamber (11) for regulating its temperature; The second temperature regulating end (232) is thermally coupled to the second test chamber (12) for regulating its temperature.

2. The SSD high and low temperature controlled aging test machine according to claim 1, characterized in that, The first semiconductor temperature regulation module (2) includes a control unit (21), a current commutation circuit (22) and a Peltier module. The Peltier module (23) has a thermocouple pair. The control unit (21) controls the direction of the current flowing into the thermocouple pair through the current commutation circuit (22) to switch the cooling / heating functions of the first temperature regulation terminal (231) and the second temperature regulation terminal (232).

3. The SSD high and low temperature controlled aging test machine according to claim 1, characterized in that, The body (1) includes a first cabinet and a second cabinet that are isolated from each other. The first test chamber (11) is the internal space of the first cabinet, and the second test chamber (12) is the internal space of the second cabinet.

4. The SSD high and low temperature controlled aging test machine according to claim 3, characterized in that, The first cabinet is equipped with a first hard disk test module (3), and the second cabinet is equipped with a second hard disk test module (4); both the first hard disk test module (3) and the second hard disk test module (4) have test interfaces for connecting SSDs.

5. The SSD high and low temperature controlled aging test machine according to claim 3, characterized in that, A heat insulation structure (13) is provided between the first cabinet and the second cabinet.

6. The SSD high and low temperature controlled aging test machine according to claim 1, characterized in that, The machine body (1) is also provided with a first air supply device (5) and a second air supply device (6); the first air supply device (5) is configured to supply air to the first test chamber (11), and the second air supply device (6) is configured to supply air to the second test chamber (12).

7. The SSD high and low temperature controlled aging test machine according to claim 6, characterized in that, Both the first test chamber (11) and the second test chamber (12) are equipped with air vents (7).

8. The SSD high and low temperature controlled aging test machine according to claim 1, characterized in that, The body (1) is also provided with a second semiconductor temperature regulation module. One temperature regulation terminal of the second semiconductor temperature regulation module is thermally coupled to the first test chamber (11) for auxiliary or independent temperature regulation.

9. The SSD high and low temperature controlled aging test machine according to claim 1 or 8, characterized in that, The body (1) is also provided with a third semiconductor temperature regulation module. One temperature regulation terminal of the third semiconductor temperature regulation module is thermally coupled to the second test chamber (12) for auxiliary or independent temperature regulation.

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