Chip aging test apparatus

Abstract

The application relates to the chip testing technical field and discloses a chip aging test device which comprises a test seat, a near field communication controller and a near field communication antenna which are electrically connected with a chip burning plate; the test seat is electrically connected with the near field communication controller through a serial interface; the near field communication controller is electrically connected with the near field communication antenna, and a memory is arranged in the near field communication controller; wherein the near field communication antenna is used for receiving a preset identification and sending the preset identification to the near field communication controller; and the near field communication controller is used for storing the preset identification into the memory. The application improves the overall burning efficiency in the chip aging test process.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, specifically to a chip aging test device. Background Technology

[0002] In the chip manufacturing process, in order to ensure the stability and reliability of the chip under long-term use, it is usually necessary to perform aging tests on the chip. Chip aging tests are generally implemented through a dedicated chip programming board, which has multiple test sockets. Before the chip aging test, the markings of each test socket are programmed and modified through the reserved pins via external ribbon cables. Due to the large number of test sockets, this operation is repetitive and tedious, causing operators to spend a lot of time on marking and modification, resulting in low overall programming efficiency and making it difficult to meet the actual needs of large-scale parallel testing. Utility Model Content

[0003] In view of this, this application provides a chip aging test apparatus to solve the aforementioned technical problems.

[0004] This application discloses a chip aging test apparatus, comprising: The test socket, near-field communication controller, and near-field communication antenna are electrically connected to the chip programming board. The test socket is electrically connected to the near-field communication controller via a serial interface; The near-field communication controller is electrically connected to the near-field communication antenna, and the near-field communication controller has a memory inside; The near-field communication antenna is used to receive a preset identifier and send the preset identifier to the near-field communication controller, and the near-field communication controller is used to store the preset identifier in the memory.

[0005] In one possible example, a first plug-in socket is also included, one end of which is electrically connected to the chip programming board, and the other end of which is electrically connected to the near-field communication controller.

[0006] In one possible example, the first plug-in socket is provided with a plurality of first pins and a plurality of second pins, each of the first pins and each of the second pins are connected by a corresponding conductive line, and each of the first pins is electrically connected to the serial interface line corresponding to the chip programming board, and each of the second pins is electrically connected to the pad corresponding to the bottom of the near-field communication controller, so that the test socket is electrically connected to the near-field communication controller through the serial interface and the first plug-in socket.

[0007] In one possible example, the first plug-in socket has a cavity at the end opposite to the chip programming board, the second pin is located in the cavity, and the near-field communication controller is connected in the cavity.

[0008] In one possible example, the chip programming board has a plurality of test sockets, and the plurality of test sockets are arranged in a matrix.

[0009] In one possible example, the near-field communication antenna is located on the outer circuit layer of the chip programming board.

[0010] In one possible example, a second plug-in socket is also included, which is disposed on the chip programming board.

[0011] In one possible example, the second plug-in socket is a wireless radio frequency switch, and the near-field communication controller is electrically connected to the near-field communication antenna through the wireless radio frequency switch.

[0012] In one possible example, the near-field communication controller has a first connection line electrically connected to the wireless radio frequency switch, and the near-field communication antenna has a second connection line connected to the wireless radio frequency switch, with the plug of the second connection line corresponding to the interface of the wireless radio frequency switch.

[0013] In one possible example, the chip programming board is also provided with indicator lights, each of which is electrically connected to the corresponding test socket and is used to prompt when the preset identifier is written or read.

[0014] In summary, compared with the prior art, this application discloses a chip aging test device, including: a test socket, a near-field communication controller, and a near-field communication antenna, which are electrically connected to the chip programming board respectively; The test socket is electrically connected to the near-field communication controller via a serial interface; the near-field communication controller is electrically connected to the near-field communication antenna, and the near-field communication controller has a built-in memory; wherein, the near-field communication antenna is used to receive a preset identifier and send the preset identifier to the near-field communication controller, and the near-field communication controller is used to store the preset identifier in the memory. Thus, through the above configuration, this application improves the overall programming efficiency during the chip aging test process. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of the chip aging test device of this application; Figure 2 This is a partial structural schematic diagram of the chip aging test device of this application; Figure 3 This is a schematic diagram of the connection structure of the first plug-in socket in this application; Figure 4 This is a schematic diagram of the connection structure of the first near-field communication antenna in this application; Figure 5 This is a schematic diagram of the connection structure of the second type of near-field communication antenna in this application; Figure 6 This is a schematic diagram of the connection structure of the wireless radio frequency switch of this application. Detailed Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0018] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0021] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0023] As described in the background section, in the prior art, before chip aging tests, the markings of each test socket are programmed and modified through an external ribbon cable to the reserved pins. Due to the large number of test sockets, this operation is repetitive and tedious, requiring operators to spend a lot of time on the marking programming and modification process, resulting in low overall programming efficiency and difficulty in meeting the actual needs of large-scale parallel testing.

[0024] Based on this, refer to Figure 1 and Figure 2 This application provides a chip aging test device, including: a chip programming board 1, a test socket 2, a near-field communication controller 3, and a near-field communication antenna 4. The test socket 2, near-field communication controller 3, and near-field communication antenna 4 are electrically connected to the chip programming board 1. The test socket 2 is electrically connected to the near-field communication controller 3 through the serial interface 21, and the near-field communication controller 3 is electrically connected to the near-field communication antenna 4. The near-field communication controller 3 is equipped with a memory 5. The near-field communication antenna 4 can receive a preset identifier and send the preset identifier to the near-field communication controller 3. The near-field communication controller 3 stores the preset identifier in the memory 5.

[0025] Therefore, the chip aging test device utilizes the near-field communication characteristics to achieve wireless reading and writing of the corresponding identifiers on the test socket 2 on the chip programming board 1. Specifically, when a near-field communication input device with multiple preset identifiers is brought close to the near-field communication antenna 4, the near-field communication controller 3 receives the preset identifiers through the near-field communication antenna 4 and writes them into the corresponding memory 5.

[0026] The chip programming board 1 may be equipped with several test sockets 2. Each test socket 2 can be uniquely identified. As the chip aging test process progresses, when a chip or a batch of chips completes the aging test, the host can read the preset identifier of the test socket 2 corresponding to the chip in the memory 5 through the near-field communication controller 3, so as to confirm and associate the chip's test data and test position.

[0027] Therefore, based on the near-field communication wireless interaction method, the test base 2 in this embodiment no longer needs to be connected to the external controller one by one through the traditional external cable to complete the writing and reading of identification information, thereby saving the connection of external cable and avoiding the risks of large space occupation, inconvenient installation and cable damage.

[0028] Furthermore, the preset identification data can be quickly written or read through near-field interaction, which greatly improves the parallel processing efficiency of batch chip aging tests, that is, improves the efficiency of programming and testing. Also, since the preset identification is directly written and read through near-field communication, there is no need for manual verification or cable plugging and unplugging, thereby reducing human operation errors. In addition, wireless interaction avoids the contact problems caused by frequent plugging and unplugging of ribbon cables, improving the long-term reliability of the test device and reducing maintenance costs.

[0029] In one example, a near-field communication input device is a terminal that can interact with other devices, send or receive data via near-field communication, and may include near-field communication watches / bands of smartphones / tablets or wearable devices.

[0030] It is understandable that near-field communication input devices are generally written with multiple preset identifiers. The preset identifiers include the unique ID information and encoding information of the test socket 2 and its corresponding chip under test. The encoding information may cover the test batch number, task number, chip type, test conditions, etc.

[0031] In one example, several test sockets 2 are arranged in a matrix on the chip programming board 1, for example, in a row and column distribution, with a preset spacing between each row and each column to ensure that the chip has sufficient heat dissipation space and electrical isolation during the aging test.

[0032] Preferably, the chip programming board 1 has 120 test sockets 2 arranged in a matrix of 12 rows × 10 columns.

[0033] Each test socket 2 is equipped with a serial interface 21 for data communication with the corresponding near-field communication controller 3. The near-field communication controller 3 of each test socket 2 is electrically connected to the near-field communication antenna 4, thereby enabling independent wireless identification writing and reading operations for each chip. The memory 5 of each test socket 2 is used to store the preset identification corresponding to the test socket 2, ensuring that data can be quickly distinguished, traced and recorded during batch chip aging tests.

[0034] For example, when a chip is loaded onto a test socket 2, the tester can wirelessly write the corresponding preset identifier into the memory 5 corresponding to that test socket 2 using a near-field communication input device. After the test is completed, the identifiers in each memory 5 can be read in batches by the host to quickly obtain the chip identity and test status corresponding to each test socket 2.

[0035] Therefore, by arranging them in a matrix, a single chip programming board 1 can support a large number of test sockets 2, enabling parallel aging tests on a large number of chips. Each test socket 2 is independently equipped with a near-field communication controller 3 and a near-field communication antenna 4. The near-field communication controller 3 has a memory 5 corresponding to the test socket 2, ensuring that the test data and chip identification correspond one-to-one and avoiding identification confusion. After the test is completed, the host can directly read the identification information to achieve batch traceability and result statistics.

[0036] It is understood that the serial interface 21 in this embodiment is the I2C interface (Inter-Integrated Circuit, serial communication bus interface). As a standardized serial bus interface, it can transmit data between the test socket 2 and the near-field communication controller 3, realize the writing and reading of preset identifiers, and since the chip programming board 1 usually has hundreds of test sockets 2 working at the same time, the I2C interface supports multiple slave devices to be connected on the same bus and distinguished by address, thereby simplifying the wiring on the board. In addition, compared with the parallel communication method, I2C only requires two signal lines (SDA, SCL) to complete bidirectional data transmission. When the number of test sockets 2 is huge, it can significantly save the wiring space and interface resources of the programming board.

[0037] In one possible implementation of this application, see below. Figure 3 The chip aging test device also includes a first plug-in socket 6, one end of which is electrically connected to the chip programming board 1, and the other end of which is electrically connected to the near field communication controller 3, so as to realize the pluggable connection of the near field communication controller 3 relative to the chip programming board 1.

[0038] In one example, the first plug-in socket 6 is provided with a plurality of first pins 61 and a plurality of second pins 62. Each first pin 61 and each second pin 62 are connected through a corresponding conductive line. Each first pin 61 is electrically connected to the serial interface line corresponding to the chip programming board 1, and each second pin 62 is electrically connected to the pad corresponding to the bottom of the near-field communication controller 3, so that the test socket 2 is electrically connected to the near-field communication controller 3 through the serial interface 21 and the first plug-in socket 6.

[0039] It is understandable that during the chip aging test, the chip programming board 1 usually needs to be in a high-temperature and high-load working environment for a long time. This can easily cause the onboard electronic devices, especially the near-field communication controller 3 which is frequently used in this application, to age faster. When the near-field communication controller 3 fails due to aging, if the traditional soldering method is used, not only will the entire programming board need to be disassembled, but it may also cause damage to other devices, increasing maintenance costs and downtime.

[0040] Therefore, this embodiment is equipped with a first plug-in socket 6, which allows the near-field communication controller 3 to be quickly replaced with a new device when it fails, without scrapping the entire board or performing complicated rework operations. In this way, when it is necessary to re-burn the identifier or perform subsequent batch aging tests, the normal writing and reading functions of the near-field communication identifier can still be guaranteed.

[0041] Therefore, based on the design of the first plug-in socket 6, the near-field communication controller 3 can be quickly replaced after a failure, reducing maintenance time, avoiding rework problems caused by soldering operations, avoiding the scrapping of the entire board due to the failure of local components, and ensuring the long-term stable operation of the programming board in large-scale testing.

[0042] Preferably, the first plug-in socket 6 has a receiving cavity 63 at one end away from the chip programming board 1, the second pin 62 is located in the receiving cavity 63, and the near field communication controller 3 is connected in the receiving cavity 63.

[0043] The accommodating cavity 63 forms a space for installing and fixing the near-field communication controller 3. The second pin 62 is connected to the corresponding pad on the bottom of the near-field communication controller 3. Through this structural design, the near-field communication controller 3 can be stably installed in the accommodating cavity 63, and electrical connection is achieved through the pin.

[0044] To further improve reliability, the inner wall of the receiving cavity 63 may be provided with a limiting groove or positioning protrusion, so that the near-field communication controller 3 can be automatically limited and ensure the correct insertion direction when inserted, avoiding electrical short circuits or functional failures caused by incorrect insertion. In addition, a certain gap may be reserved in the receiving cavity 63 for heat dissipation of the near-field communication controller 3 during high-temperature aging test to prevent failure due to local overheating. Alternatively, several heat dissipation holes may be provided on the outer wall of the first plug-in socket 6 at the location corresponding to the receiving cavity 63.

[0045] In practical applications, when a near-field communication controller 3 needs to be replaced due to aging or failure, maintenance personnel only need to pull out the faulty controller from the accommodating cavity 63 and insert the new near-field communication controller 3 into the accommodating cavity 63. There is no need to desolder or replace the entire chip programming board 1, which greatly simplifies the maintenance operation. In addition, the accommodating cavity 63 provides a fixed space for the near-field communication controller 3, preventing it from being vibrated or loosened by external forces.

[0046] Preferably, the sidewall of the receiving cavity 63 is provided with an elastic retaining strip 6a, which is inclined toward the outer wall of the near-field communication controller 3. The end of the elastic retaining strip 6a away from the receiving cavity 63 is designed with a rounded head. Correspondingly, the outer wall of the near-field communication controller 3 is provided with a plug-in groove 3a to match the end of the elastic retaining strip 6a away from the receiving cavity 63. That is, during the process of inserting the near-field communication controller 3 into the receiving cavity 63 of the first plug-in socket 6, the near-field communication controller 3 can compress the inclined elastic retaining strip 6a. Close to the side wall of the receiving cavity 63, and after the near-field communication controller 3 is fully inserted into the receiving cavity 63, the end of the round-headed elastic locking strip 6a slides into the insertion groove 3a, thereby stabilizing the connection between the near-field communication controller 3 and the first insertion socket 6. Furthermore, when it is necessary to remove the near-field communication controller 3, the operator can overcome the elastic potential energy of the elastic locking strip 6a, causing the round-headed end of the elastic locking strip 6a to slide out of the insertion groove 3a, thereby unlocking the connection between the near-field communication controller 3 and the first insertion socket 6.

[0047] Optionally, the flexible clip 6a is integrally connected to the first plug-in socket 6.

[0048] The near-field communication controller 3 has a rounded corner at the bend of the end facing the receiving cavity 63, so that when the near-field communication controller 3 is inserted into the receiving cavity 63 of the first plug-in socket 6, it can better compress the elastic retaining strip 6a.

[0049] Furthermore, the outer wall of the near-field communication controller 3 may also be provided with a sliding groove corresponding to the elastic card strip 6a, so that when the near-field communication controller 3 is inserted, the end of the elastic card strip 6a can be guided into the insertion groove 3a.

[0050] Preferably, the second pin 62 is configured as a spring pin structure. It can be understood that the spring pin consists of a needle tip, a needle tube and a built-in spring. The needle tip can achieve axial extension and retraction under the action of the spring. One end of the spring pin is fixed in the first plug-in socket 6, and the end of the spring pin with the needle tip can elastically extend out in the receiving cavity 63 and reliably contact the bottom pad of the near field communication controller 3.

[0051] When the near-field communication controller 3 is inserted into the receiving cavity 63, the tip of the spring pin retracts under pressure and adheres tightly to the bottom pad surface of the near-field communication controller 3, thereby ensuring the reliability of the electrical connection. When the near-field communication controller 3 is pulled out, the tip of the spring pin returns to its original length under the action of the spring, making it easy to insert for the next time. Because the spring pin has a certain elastic stroke and self-adaptive capability, even if slight displacement, vibration or device size tolerance occurs during long-term aging test, it can maintain good contact performance and avoid affecting the accuracy of data transmission or marking due to poor contact.

[0052] In one example, connecting blocks 64 may be provided on both sides of the first plug-in socket 6. The connecting blocks 64 are fixedly connected to the chip programming board 1. Specifically, the fixed connection can be achieved by screws or adhesive to ensure the reliability of the connection between the first plug-in socket 6 and the chip programming board 1.

[0053] The near-field communication controller 3 may be provided with stop blocks 65 on both sides. After the near-field communication controller 3 is fully inserted into the receiving cavity 63, the stop blocks 65 abut against the top of the first plug-in socket 6 to limit the stroke of the near-field communication controller 3 into the receiving cavity 63, avoid excessive hard contact between the pads at the bottom of the near-field communication controller 3 and the second pin 62, thereby protecting the second pin 62 and ensuring the reliability of plugging and unplugging between the first plug-in socket 6 and the near-field communication controller 3.

[0054] In one possible implementation of this application, the near-field communication antenna 4 is disposed on the outer circuit layer of the chip programming board 1. Thus, by directly integrating the near-field communication antenna 4 on the outer circuit layer of the chip programming board 1, no additional independent antenna device is required, thereby avoiding the occupation of additional installation space, which is conducive to miniaturization design. Furthermore, the antenna and the circuit board can be integrated without additional connection and soldering processes, reducing manufacturing and assembly complexity. The routing shape and area of ​​the near-field communication antenna 4 can also be flexibly adjusted according to the layout of the chip programming board 1 in order to optimize the matching and transmission performance of near-field communication.

[0055] In one possible implementation of this application, reference is made to... Figures 4 to 6 It also includes a second plug-in socket 7, which is disposed on the chip programming board 1, and a near-field communication antenna 4 connected to the second plug-in socket 7.

[0056] During the chip aging test, the chip programming board 1 usually needs to be in a high-temperature and high-load working environment for a long time. This can easily cause the onboard electronic components, especially the near-field communication antenna 4 which is frequently used in this application, to age faster. When the near-field communication antenna 4 fails due to aging, if an integrated connection method is used, not only will the entire programming board need to be disassembled, but it may also cause damage to other components, increasing maintenance costs and downtime.

[0057] Therefore, this embodiment includes a second plug-in socket 7, which allows for rapid replacement of the near-field communication antenna 4 in the event of failure, without the need for complete board scrapping or complex rework. This ensures that the near-field communication identifier can still be written and read normally when reprogramming or subsequent batch aging tests are required. Based on the design of the second plug-in socket 7, the near-field communication antenna 4 can be quickly replaced after a failure, reducing maintenance time, avoiding rework difficulties caused by soldering operations, and preventing the complete board scrapping due to the failure of local components, thus ensuring the long-term stable operation of the programming board during large-scale testing.

[0058] The structure of the second plug-in socket 7 can be the same as that of the first plug-in socket 6 in the above embodiment, so as to realize the detachable connection of the near-field communication antenna 4 relative to the chip programming board 1.

[0059] In one example, the second plug-in socket 7 is a wireless radio frequency switch 8, and the near field communication controller 3 and the near field communication antenna 4 are electrically connected through the wireless radio frequency switch 8.

[0060] Therefore, by switching the wireless radio frequency switch 8, the near-field communication antenna 4 can be selected for activation in different test modes, thereby improving the system's flexibility and adaptability.

[0061] Preferably, the near-field communication controller 3 is provided with a first connecting line 31, which is connected to the wireless radio frequency switch 8, and the near-field communication antenna 4 is provided with a second connecting line 41, which is connected to the wireless radio frequency switch 8. The plug 411 of the second connecting line 41 corresponds to the interface 81 of the wireless radio frequency switch 8, so as to ensure that a reliable electrical connection is formed between the near-field communication antenna 4 and the wireless radio frequency switch 8. At the same time, when it is necessary to replace or maintain the near-field communication antenna 4, the disassembly and replacement operation can be completed by simply slightly turning or unplugging the plug 411 on the interface 81.

[0062] In one possible implementation of this application, the chip programming board 1 is further provided with an indicator light (not shown), each indicator light being electrically connected to the corresponding test socket 2, for providing a prompt when the preset identifier is written or read.

[0063] Optionally, the indicator light can be set to a single-color or dual-color LED to emit corresponding light signals.

[0064] For example, when the near-field communication controller 3 successfully receives and writes the preset identifier into the memory 5 through the near-field communication antenna 4, the indicator light automatically turns green to indicate that the identifier writing of the test socket 2 has been completed. After the chip aging test is completed, when the host successfully reads the preset identifier in the memory 5 through the near-field communication controller 3, the indicator light may flash or change to another color (such as blue) to indicate that the identifier reading of the test socket 2 has been completed.

[0065] Therefore, operators can quickly confirm the writing or reading status of each test socket 2 through the indicator lights on the chip programming board 1 without relying on additional software interfaces. The light signal prompts can promptly detect if a certain test socket 2 has not completed the marking writing or reading, avoiding the chaos of chip batch management caused by test omissions. Moreover, there are usually hundreds of test sockets 2 on the chip programming board 1. With the help of the distributed prompting function of the indicator lights, the status of large-scale chip aging tests can be quickly monitored, improving the overall work efficiency.

[0066] In one example, one end of the chip programming board 1 is provided with an aluminum handle 11. The aluminum handle 11 is fixed to the chip programming board 1 by screws or clips and is made of lightweight and high-strength aluminum alloy. The surface can be anodized to improve corrosion resistance and wear resistance. Testers can easily move, insert, or remove the chip programming board 1 through the aluminum handle 11. Especially during the chip aging test, the chip programming board 1 usually needs to be frequently moved between the test rack and the aging furnace. The aluminum handle 11 on the board can significantly improve the convenience and safety of handling.

[0067] In one example, the other end of the chip programming board 1 is provided with multiple signal input interfaces 12. The signal input interface 12 includes multiple gold fingers 121, which are electrically connected to the external test host through the gold fingers 121 to realize high-speed and reliable transmission of test signals, control signals and power signals. The structure of the gold fingers 121 is preferably a multi-layer gold plating process, and its contact surface is treated with nickel-plating and gold-plating to improve conductivity and wear resistance, thereby ensuring the stability of multiple signals during transmission.

[0068] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. A chip aging test apparatus, characterized in that, include: The test socket, near-field communication controller, and near-field communication antenna are electrically connected to the chip programming board. The test socket is electrically connected to the near-field communication controller via a serial interface; The near-field communication controller is electrically connected to the near-field communication antenna, and the near-field communication controller has a memory inside; The near-field communication antenna is used to receive a preset identifier and send the preset identifier to the near-field communication controller, and the near-field communication controller is used to store the preset identifier in the memory.

2. The chip aging test apparatus as described in claim 1, characterized in that, It also includes a first plug-in socket, one end of which is electrically connected to the chip programming board, and the other end of which is electrically connected to the near-field communication controller.

3. The chip aging test apparatus as described in claim 2, characterized in that, The first plug-in socket is provided with a plurality of first pins and a plurality of second pins. Each first pin and each second pin are connected through a corresponding conductive line. Each first pin is electrically connected to the serial interface line corresponding to the chip programming board. Each second pin is electrically connected to the pad corresponding to the bottom of the near-field communication controller, so that the test socket is electrically connected to the near-field communication controller through the serial interface and the first plug-in socket.

4. The chip aging test apparatus as described in claim 3, characterized in that, The first plug-in socket has a receiving cavity at one end away from the chip programming board, the second pin is located in the receiving cavity, and the near-field communication controller is connected in the receiving cavity.

5. The chip aging test apparatus as described in claim 1, characterized in that, The chip programming board is provided with a plurality of test sockets, and the plurality of test sockets are arranged in a matrix.

6. The chip aging test apparatus as described in claim 1, characterized in that, The near-field communication antenna is located on the outer circuit layer of the chip programming board.

7. The chip aging test apparatus as described in claim 1, characterized in that, It also includes a second plug-in socket, which is disposed on the chip programming board.

8. The chip aging test apparatus as described in claim 7, characterized in that, The second plug-in socket is a wireless radio frequency switch, and the near-field communication controller and the near-field communication antenna are electrically connected through the wireless radio frequency switch.

9. The chip aging test apparatus as described in claim 8, characterized in that, The near-field communication controller is provided with a first connection line, which is electrically connected to the wireless radio frequency switch, and the near-field communication antenna is provided with a second connection line, which is connected to the wireless radio frequency switch, and the plug of the second connection line corresponds to the interface of the wireless radio frequency switch.

10. The chip aging test apparatus as described in claim 1, characterized in that, The chip programming board is also equipped with indicator lights. Each indicator light is electrically connected to the corresponding test socket and is used to provide a prompt when the preset identifier is written or read.

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