Test equipment

Abstract

The application relates to a test device. The test device comprises a carrying plate for carrying a packaged device, the packaged device comprising a substrate, a plurality of test ports and a plurality of first functional devices, the first functional devices being electrically connected to the corresponding test ports; a test device arranged on one side of the packaged device when the carrying plate carries the packaged device; the test device comprises: a plurality of conversion modules electrically connected to the plurality of test ports respectively, for converting an initial test signal into a test signal matched with the first functional devices and transmitting the test signal to the corresponding test ports to test the first functional devices; and a plurality of test modules electrically connected to the conversion modules, for sending the initial test signal. The application provides an efficient way for debugging and problem determination of the packaged device.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a testing device. Background Technology

[0002] The space on the substrate is very limited, and it is mainly used to place functional devices such as chips and power modules. In order to improve the integration of devices on the substrate and prioritize the realization of the functions and performance of devices on the substrate, the test circuits corresponding to test signals and debugging signals on the substrate will be reduced. When a problem occurs in a device on the substrate, it is impossible to test and locate the problem of the device on the substrate through the test circuits on the substrate. Utility Model Content

[0003] Therefore, it is necessary to provide a testing device to address the problem of being unable to locate devices on a substrate through testing.

[0004] A testing device, comprising:

[0005] A carrier plate is used to carry a packaged device, the packaged device including a substrate, multiple test ports and multiple first functional devices, the test ports and the first functional devices being spaced apart on the substrate, and the first functional devices being electrically connected to the corresponding test ports.

[0006] A testing apparatus, configured to be disposed on one side of the packaged device when the packaged device is supported by a carrier plate; the testing apparatus includes:

[0007] The adapter module is electrically connected to the plurality of test ports respectively; the adapter module is used to convert the initial test signal into a test signal that matches the first functional device, and transmit it to the corresponding test port to test the first functional device;

[0008] Multiple test modules are electrically connected to the adapter module; the test modules are used to send the initial test signal.

[0009] In some embodiments, the adapter module includes:

[0010] The adapter module is electrically connected to the plurality of test modules respectively, and is used to convert the initial test signal into the test signal;

[0011] The first connector is electrically connected to the adapter module and the plurality of test ports respectively, and is used to transmit the test signal to the corresponding test port.

[0012] In some embodiments, the first connector includes a plurality of spaced-apart pins, the pins being electrically connected to corresponding test ports;

[0013] The pin is used to transmit the test signal between the adapter module and the corresponding test port.

[0014] In some embodiments, the orthographic projection of the pin on the substrate and the orthographic projection of the test port on the substrate at least partially overlap.

[0015] In some embodiments, the adapter module includes a test board located on one side of the first connector and detachably connected to the first connector;

[0016] The test modules are spaced apart on the test board and electrically connected to the test board.

[0017] In some embodiments, the adapter module further includes:

[0018] The second connector is located on the test board and is electrically connected to the test board; the second connector is used to connect external test equipment to the adapter module.

[0019] In some embodiments, the testing apparatus further includes:

[0020] A fixed structure, detachably connected to the support plate;

[0021] Multiple conductive structures are spaced apart, each of which penetrates the fixed structure and is electrically connected to the corresponding test port;

[0022] The adapter module is located on one side of the fixed structure and is fixedly connected to the fixed structure. The conductive structure is used to electrically connect the test port and the adapter module.

[0023] In some embodiments, when the carrier plate carries the packaging device, the substrate is housed in the carrier plate, and the first functional device is located on the side of the substrate closer to the test device.

[0024] In some embodiments, the carrier plate includes a first surface and a second surface disposed opposite to each other, and a first receiving groove is formed in the carrier plate, the first receiving groove extending from the first surface into the carrier plate, and the substrate is received in the first receiving groove.

[0025] In some embodiments, the carrier plate further includes:

[0026] The second receiving groove extends from the first receiving groove toward the second surface in the direction from the first surface toward the second surface;

[0027] The packaging device further includes a second functional device located on the side of the substrate opposite to the first functional device; when the substrate is housed in the first receiving groove, the second functional device is housed in the second receiving groove.

[0028] In some embodiments, the size of the opening of the second receiving groove is smaller than the size of the bottom of the first receiving groove near the second surface; a stepped surface is provided between the first receiving groove and the second receiving groove; the substrate is in contact with the stepped surface.

[0029] In some embodiments, the second receiving groove extends through the support plate.

[0030] In some embodiments, the distance between the surface of the packaging device near the second surface and the opening of the second receiving groove is less than or equal to the depth of the second receiving groove.

[0031] In some embodiments, the substrate includes a central region and a plurality of edge regions, the plurality of edge regions being arranged sequentially along the periphery of the central region, the first functional device being disposed in the central region, and the test port being disposed in the edge regions;

[0032] The testing equipment includes multiple testing devices, and the multiple testing devices and multiple edge regions are respectively arranged accordingly.

[0033] In some embodiments, the test port includes a pad and a conductive block; the test module includes a termination circuit; the size of the test port is smaller than the size of the first functional device; the test port and the first functional device are located on the same side of the substrate.

[0034] In the aforementioned testing equipment, the first functional device and its corresponding test port are electrically connected. The first functional device is led out through test port 304. The test module in the testing device sends an initial test signal. The adapter module is electrically connected to the test module and the test port respectively, converting the initial test signal into a test signal matching the first functional device and transmitting it to the corresponding test port. This realizes the testing of the first functional device in the packaged device, making the first functional device testable instead of untestable, improving the adjustability and testability of the packaged device, facilitating the location of problems in the packaged device, and providing an efficient way for debugging and problem identification of the packaged device. Attached Figure Description

[0035] Figure 1 This is one of the top views of the test equipment in the embodiments of this application;

[0036] Figure 2 This is a second top view of the test equipment in the embodiments of this application;

[0037] Figure 3This is a top view of the adapter module in the embodiments of this application;

[0038] Figure 4 This is a top view of the test device in an embodiment of this application;

[0039] Figure 5 This is a cross-sectional schematic diagram of the test device in an embodiment of this application;

[0040] Figure 6 For the bearing plate edge in the embodiments of this application Figure 1 One of the schematic cross-sectional views along the AA direction in the diagram;

[0041] Figure 7 This is a top view of the support plate in an embodiment of this application;

[0042] Figure 8 For the bearing plate edge in the embodiments of this application Figure 1 The second schematic diagram of the cross-section along the AA direction;

[0043] Figure 9 This is a top view of the packaged device in an embodiment of this application;

[0044] Figure 10 This is the third top view of the test equipment in the embodiments of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] Support plate 100; second through hole 102; first receiving groove 104; first receiving groove 106; stepped surface 108; testing device 200; adapter module 202; testing module 204; second connector 206; fixing structure 208; conductive structure 210; first through hole 212; adapter module 2021; first connector 2022; encapsulation device 300; substrate 302; test port 304; first functional device 306; second functional device 308; second preset test port 310; first frame 312; second frame 314; first area 316; third frame 318; second area 320; bolt 402; nut 404; spring 406. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] To facilitate understanding, the technical terms involved in this application will be explained first: CPU refers to Central Processing Unit, DCU refers to Deep Computing Processor, HBM refers to High Bandwidth Memory, IVR refers to Integrated Power Module, RAM refers to Random Access Memory, NAND SSD refers to Non-Volatile Hard Disk Drive, CPO refers to Co-packaged Optoelectronics, COWOS refers to Chip-Wafer-Substrate Packaging Technology, and BGA refers to Ball Grid Array.

[0054] Massive integration (MLI) technology integrates CPUs, DCUs, IVRs, 3D RAM / NAND SSDs, CPOs, and connectors onto a single substrate. Chip connectivity and functionality are implemented on the substrate itself, and COWOS packaging technology is used to encapsulate the chips on the substrate, eliminating the need to package them in BGA form to expose signals and power before soldering them onto the motherboard for interconnection. This approach reduces impedance discontinuities and improves signal integrity. However, the substrate has significantly less space than the motherboard. To maximize chip integration, the substrate space is primarily used for designing high-speed signal lines for inter-chip communication, placing chips and power modules, and prioritizing the functionality and performance of packaged devices. There is little space reserved for test and debugging signals.

[0055] The larger the substrate area, the greater the substrate warpage and the lower the yield. In order to ensure the performance of the packaged devices formed by large-scale integration technology, the substrate area should not be increased due to test signals and debugging signals. This makes it impossible to implement the circuit design corresponding to some debugging signals and test signals on the substrate. When problems occur in the packaged devices formed by large-scale integration technology, it is impossible to locate the problem by measurement, which affects the solution of chip problems in the packaged devices.

[0056] Figure 1 This is one of the top views of the test equipment in the embodiments of this application. See also: Figure 1 In this embodiment, a testing device is provided, including a carrier plate 100 and a testing device 200.

[0057] The carrier plate 100 is used to carry the packaged device 300. The packaged device 300 includes a substrate 302, a plurality of test ports 304 and a plurality of first functional devices 306. The test ports 304 and the first functional devices 306 are spaced apart on the substrate 302, and the first functional devices 306 are electrically connected to the corresponding test ports 304.

[0058] It can be understood that the carrier plate 100 serves as a test platform for placing the packaged device 300, providing support, fixation, and load-bearing for the placed packaged device 300, without affecting the test results of the packaged device 300. As an example, the materials of the carrier plate 100 include stainless steel, titanium alloy, zirconium oxide, and aluminum oxide.

[0059] As an example, the package device 300 includes a package device that achieves overall integrated packaging using large-scale integration technology. Multiple functional devices are disposed at intervals on one side of the substrate 302. These functional devices are electrically connected via signal lines in the substrate 302, enabling high-speed signal transmission between the functional devices. Examples of functional devices include a CPU, DCU, IVR, HBM, 3D RAM, 3D NAND SSD, and CPO.

[0060] The first functional device 306 is the functional device under test, and multiple first functional devices 306 are arranged at intervals on the substrate 302. In practical applications, the first functional devices 306 among the functional devices can be set according to requirements.

[0061] Test port 304 is a test endpoint on substrate 302. Multiple test ports 304 are spaced apart on substrate 302. Test ports 304 and first functional devices 306 are spaced apart. The first functional devices 306 are electrically connected to the corresponding test ports 304. As an example, the first functional devices 306 and test ports 304 are electrically connected through signal lines in substrate 302.

[0062] As an example, test port 304 includes pads and / or conductive blocks, for example, conductive blocks are copper pillars soldered onto substrate 302.

[0063] As an example, the test port 304 and the first functional device 306 are located on the same side of the substrate 302, which facilitates the electrical connection between the test port 304 and the first functional device 306 through the signal lines in the substrate 302.

[0064] As an example, the size of test port 304 is smaller than the size of the first functional device 306. Testing of the first functional device 306 is achieved without affecting the configuration of the first functional device 306 and while keeping the size of the packaged device 300 unchanged.

[0065] It is understood that the packaged device 300 includes a first preset test port, and the first preset test port and the first preset functional device in the functional device are electrically connected. The first preset functional device can be a functional device that needs to be tested or / and debugged by test signals when the packaged device is abnormal. The test port 304 is the first preset test port electrically connected to the test device 200, and the first functional device 306 is the first preset functional device electrically connected to the test port 304 and receiving the test signals sent by the test device 200.

[0066] It is understood that the functional device includes multiple chips, and the chip in the first functional device 306 that receives the test signal transmitted from the test port 304 to the first functional device 306 can be set as needed.

[0067] The testing device 200 is used to be disposed on one side of the packaging device 300 when the carrier plate 100 carries the packaging device 300; the testing device 200 includes an adapter module 202 and a testing module 204.

[0068] As an example, when the carrier plate 100 carries the packaged device 300, the test device 200 can be arranged on the same layer as the packaged device, and the test module 204 in the test device 200 can be arranged near the test port 304; the test device 200 can also be arranged on the side of the packaged device 300 away from the carrier plate 100. This arrangement reduces the distance between the test device 200 and the packaged device 300 and avoids electrical connection between the test device 200 and the test port 304.

[0069] The adapter module 202 is electrically connected to multiple test ports 304 respectively. The adapter module 202 is used to convert the initial test signal into a test signal that matches the first functional device 306 and transmit it to the corresponding test port 304 to test the first functional device 306.

[0070] The adapter module 202 is electrically connected to multiple test ports 304. The adapter module 202 receives the initial test signal, converts the received initial test signal into a test signal, and transmits the test signal to the corresponding test port 304 to test the first functional device 306 corresponding to the initial test signal. The transmission rate of the test signal from the adapter module 202 to the test port 304 is the same as the transmission rate of the test signal from the signal line to the first functional device 306.

[0071] The adapter module 202 converts the initial test signal into a test signal that matches the first functional device 306. This can be understood as the output characteristics of the initial test signal and the input characteristics of the test signal being mutually adapted, resulting in a test signal with no distortion or loss compared to the initial test signal. Alternatively, it can be understood as the test signal being identical to the initial test signal, with consistent impedance along the transmission path of the initial test signal. The adapter module 202 ensures the accuracy of measurements taken by the testing equipment.

[0072] Taking a packaged device comprising three first functional devices 306 as an example, for ease of description, the three first functional devices 306 are respectively labeled as first functional device A11, first functional device A12 and first functional device A13, and the three test ports 304 corresponding to the three first functional devices 306 are respectively labeled as test port A21, test port A22 and test port A23; wherein, first functional device A11 and test port A21 are electrically connected, first functional device A12 and test port A22 are electrically connected, and first functional device A13 and test port A23 are electrically connected.

[0073] As an example, the adapter module 202 receives an initial test signal B11, which corresponds to the first functional device A11, and converts the initial test signal B11 into a test signal B21, and transmits the test signal B21 to the test port A21 to test the first functional device A11; wherein the test signal B21 matches the first functional device A11.

[0074] As an example, the adapter module 202 receives initial test signal B11 and initial test signal B12. Initial test signal B11 corresponds to the first functional device A11, and initial test signal B12 corresponds to the first functional device A12. The adapter module converts initial test signal B11 into test signal B21 and initial test signal B12 into test signal B22, respectively. Test signal B21 is transmitted to test port A21, and test signal B22 is transmitted to test port A22 to test the first functional device A11 and the first functional device A12. Among them, test signal B21 matches the first functional device A11, and test signal B22 matches the first functional device A12.

[0075] Multiple test modules 204 are electrically connected to the adapter module 202. The test modules 204 are used to send initial test signals.

[0076] As an example, multiple test modules 204 and multiple first functional devices 306 are respectively configured. For example, the test module 204 corresponding to the first functional device A11 sends an initial test signal B11 to the adapter module 202, and the test module 204 corresponding to the first functional device A12 sends an initial test signal B12 to the adapter module 202.

[0077] In the aforementioned testing equipment, the first functional device 306 is electrically connected to the corresponding test port 304. The first functional device 306 is led out through the test port 304. The test module 204 in the testing device 200 sends an initial test signal. The adapter module 202 is electrically connected to the test module 204 and the test port 304 respectively, converting the initial test signal into a test signal matching the first functional device 306 and transmitting it to the corresponding test port. This enables the testing of the first functional device 306 in the packaged device 300, transforming the first functional device 306 from untestable to testable, improving the adjustability and testability of the packaged device 300, facilitating the location of problems in the packaged device 300, and providing an efficient way for debugging and problem identification of the packaged device 300.

[0078] Figure 2 This is a second top view of the test equipment in an embodiment of this application. See also... Figure 2 In some embodiments, the adapter module 202 includes an adapter module 2021 and a first connector 2022.

[0079] The adapter module 2021 is electrically connected to multiple test modules 204 to convert the received initial test signal into a test signal; the first connector 2022 is electrically connected to the adapter module 2021 and multiple test ports 304 to transmit test signals to the corresponding test ports 304.

[0080] The adapter module 2021 is electrically connected to multiple test modules 204 respectively, and is used to receive the initial test signals sent by the test modules 204 and convert the initial test signals into corresponding test signals. The adapter module 2021 realizes signal matching between the test modules 204 and the corresponding first functional device 306. The first connector 2022 is electrically connected to the adapter module 2021 and multiple test ports 304 respectively, and realizes high-speed transmission of test signals between the adapter module 2021 and the corresponding test ports 304.

[0081] In some embodiments, the first connector 2022 includes a plurality of spaced pins, which are electrically connected to corresponding test ports 304; wherein the pins are used to transmit test signals between the adapter module 2021 and the corresponding test ports 304. The pins enable the transmission of test signals between the adapter module 2021 and the plurality of test ports 304.

[0082] As an example, the first connector 2022 is an SODIMM memory slot type connector. The first connector 2022 is used to connect the adapter module 2021 and to provide fixed expansion for the adapter module 2021. In practical applications, the first connector 2022 is selected as needed, as long as it meets the requirement of high-speed transmission of test signals between the adapter module 2021 and the test port 304.

[0083] In some embodiments, the orthographic projection of the pin on the substrate 302 and the orthographic projection of the test port 304 on the substrate 302 at least partially overlap. This arrangement minimizes the connection between the pin and the test port 304, facilitating electrical connection between the pin and the test port 304 and reducing the testing cost of the first functional device 306.

[0084] As an example, the distance between two adjacent pins is equal to the distance between two adjacent test ports 304, which facilitates the electrical connection between the pins and the test ports 304.

[0085] As an example, the arrangement of test ports 304 on substrate 302 is set according to the pin arrangement in the first connector 2022. The first connector 2022 can be a standard component, such as a commonly used connector on the market. The distance between two adjacent test ports 304 is fixed by the first connector 2022, so that different packaged devices with the same spacing between two adjacent test ports 304 can reuse the same test equipment, reducing the test cost of packaged devices.

[0086] As an example, the first connector in the test equipment is selected based on the distance between two adjacent test ports 304. The design of the test ports 304 on the substrate 302 is flexible, and the matching degree between the test ports 304 and the first functional device 306 is high.

[0087] Figure 3 This is a top view of the adapter module in an embodiment of this application. See also: Figure 3 In some embodiments, the adapter module 2021 includes a test board located on one side of the first connector 2022 and detachably connected to the first connector 2022; wherein, a plurality of test modules 204 are spaced apart on the test board and electrically connected to the test board.

[0088] As an example, the test board is electrically connected to the first connector 2022 in a manner corresponding to the first connector 2022, such as through gold fingers. The test board can be located on the side of the first connector 2022 away from the package device 300, or it can be arranged on the same layer as the first connector 2022. In the case where the test board and the first connector 2022 are arranged on the same layer, the test board is located on one side of the first connector 2022 in a plane parallel to the substrate 302. The test board can be designed into various types based on the first connector 2022, facilitating the development of test boards with various test topologies by users.

[0089] As an example, multiple test modules 204 are spaced apart on the test board, and each test module 204 is electrically connected to the test board. The test board receives the initial test signal sent by the test module 204 and converts it into a test signal, which is then sent to the first connector 2022. The test board enables signal matching between the test module 204 and the first functional device 306.

[0090] See Figure 3 In some embodiments, the adapter module 202 further includes: a second connector 206; the second connector 206 is located on the test board and is electrically connected to the test board, and the second connector 206 and the test module 204 are spaced apart; the second connector 206 is used to connect external test equipment to the adapter module 2021.

[0091] As an example, the second connector 206 includes an SMA connector and a debug connector. For example, an external test device is an oscilloscope, which can be electrically connected to the test board via the SMA connector. The second connector 206 enables signal matching between the external test device and the test board. Furthermore, the inclusion of the second connector 206 allows for an increase in the types of tests the test device can perform, enabling the test board to cover more topologies required for testing the first functional device 306, improving the compatibility between the test device and the packaged device, and increasing the reusability of the test device.

[0092] As an example, test module 204 includes termination circuitry, such as resistor-capacitor termination circuitry. Furthermore, external test equipment is connected to the test board via a second connector 206, and the termination circuitry is connected to the test board. The external test equipment and the termination circuitry work together to test the first functional device 306.

[0093] Figure 4 This is a top view of the test device in an embodiment of this application. Figure 5 This is a cross-sectional schematic diagram of the test device in an embodiment of this application. Figure 6 For the bearing plate edge in the embodiments of this application Figure 1 One of the schematic cross-sectional views along the AA direction in the diagram, see [link / reference]. Figures 4-6In some embodiments, the test apparatus 200 further includes a fixing structure 208 and a conductive structure 210.

[0094] The fixed structure 208 is detachably connected to the carrier plate 100. The conductive structure 210 passes through the fixed structure 208 and is electrically connected to the corresponding test port 304. Multiple conductive structures 210 are arranged at intervals. The adapter module 202 is located on one side of the fixed structure 208 and is fixedly connected to the fixed structure 208. The conductive structure 210 is used to electrically connect the test port 304 and the adapter module.

[0095] As an example, the fixing structure 208 and the support plate 100 are connected by bolts. A first through hole 212 is provided in the fixing structure 208, penetrating the entire structure. A second through hole 102 is provided in the support plate 100, corresponding to the first through hole 212. A bolt 402 enters the second through hole 102 through the first through hole 212, achieving a detachable connection between the fixing structure 208 and the support plate 100. For example, the sidewall of the second through hole 102 is threaded. As an example, the first through holes 212 are located at opposite ends of the fixing structure 208; this arrangement increases the stability of the connection between the fixing structure 208 and the support plate 100.

[0096] Furthermore, the second through hole 102 penetrates the support plate 100. The bolt 402 enters the second through hole 102 through the first through hole 212 and passes through the second through hole 102. The nut 404 is disposed on the side of the support plate 100 away from the fixing structure 208. The nut 404 is fitted onto the bolt 402, realizing the screw connection between the fixing structure 208 and the support plate 100. As an example, a spring 406 is provided on the bolt 402. The screw connection between the fixing structure 208 and the support plate 100 is realized through the bolt 402, the spring 406, and the nut 404.

[0097] The test device 200 is fixed on the carrier plate 100 by the fixing structure 208, and the first functional device 306 can be tested by the test device 200. The electrical connection between the test port 304 and the adapter module 202 is realized by the conductive structure 210 that passes through the fixing structure 208.

[0098] As an example, a detachable connection between the fixed structure 208 and the support plate 100 is achieved through a bayonet.

[0099] As an example, the fixed structure 208 has multiple conductive holes that penetrate the fixed structure. The multiple conductive holes are spaced apart, and the conductive structure 210 can be located on the sidewall of the conductive holes, reducing the cost of the test equipment.

[0100] As an example, the conductive structure 210 can also fill the conductive hole to reduce the resistance of the conductive structure 210. For example, the conductive structure 210 can be a conductive pillar, such as a copper pillar. The conductive structures 210 located in the conductive hole are spaced apart to avoid short circuits between the conductive structures 210.

[0101] As an example, the conductive structure 210 is in contact with the test port 304 to achieve an electrical connection between the conductive structure 210 and the test port 304.

[0102] See Figure 1 In some embodiments, when the carrier plate 100 carries the packaging device 300, the substrate 302 is housed within the carrier plate 100, and the first functional device 306 is located on the side of the substrate 302 closer to the test apparatus 200. By housing the substrate 302 within the carrier plate 100, displacement of the packaging device 300 relative to the carrier plate 100 during testing can be avoided, thus preventing any impact on the accuracy of the test.

[0103] Figure 7 This is a top view of the support plate in an embodiment of this application. See also: Figure 6 and Figure 7 In some embodiments, the support plate 100 includes a first surface and a second surface, which are disposed opposite to each other in the thickness direction of the support plate 100. A first receiving groove 104 is formed in the support plate 100, extending from the first surface into the support plate 100, and the substrate 302 is received in the first receiving groove 104. By providing the first receiving groove 104, the substrate 302 is received in the support plate 100.

[0104] As an example, in a plane parallel to the support plate 100, the size of the first receiving groove 104 is equal to the size of the substrate 302, and the substrate 302 can be accommodated in the first receiving groove 104, with the thickness direction being the line direction connecting the first surface and the second surface.

[0105] As an example, the first functional device 306 and the test port 304 are housed in the first receiving groove 104. As an example, the first receiving groove 104 has a rectangular cross-sectional shape, with the cross-section parallel to the thickness direction of the support plate 100 and parallel to the first surface. The method for forming the first receiving groove 104 is simple and low in cost.

[0106] As an example, the fixing structure 208 is located on the side of the packaged device 300 away from the carrier plate 100. Furthermore, the orthographic projection of the portion of the fixing structure 208 near the packaged device 300 onto the carrier plate 100 is located in the first receiving groove 104. The size of the first receiving groove 104 can be equal to the size of the portion of the fixing structure 208 near the packaged device 300. The distance between the surface of the packaged device 300 near the substrate 302 where the first functional device 306 is located and the substrate 302 is less than the depth D1 in the direction of the line connecting the first receiving groove 104. In this case, the portion of the fixing structure 208 near the packaged device 300 is located in the first receiving groove 104, thus fixing the test device 200 and avoiding the influence of the test device 200's offset on the test accuracy.

[0107] Figure 8 For the bearing plate edge in the embodiments of this application Figure 1 The second schematic diagram of the cross-section along the AA direction. Figure 9 This is a top view of the packaged device in an embodiment of this application. See also... Figures 7-9 In some embodiments, the carrier plate 100 further includes a second receiving groove 106, which extends from the first receiving groove 104 toward the second surface in the direction from the first surface to the second surface; wherein, the encapsulation device 300 further includes a second functional device 308, which is located on the side of the substrate 302 opposite to the first functional device 306; when the substrate 302 is received in the first receiving groove 104, the second functional device 308 is received in the second receiving groove 106. By providing the second receiving groove 106, interference between the second functional device 308 and the fixing structure 208 during testing can be reduced.

[0108] like Figure 9 As shown, the packaged device 300 also includes a second preset test port 310, which is electrically connected to a second preset functional device in the second functional device 308. For example, the second preset test port 310 and the second preset functional device are electrically connected via signal lines in the substrate 302. Figure 9 The signal lines connecting the second preset test port 310 and the second preset functional device are shown in dashed lines. The second preset functional device can be a second functional device 308 that needs to be tested or / and debugged via test signals when the packaged device malfunctions.

[0109] It is understood that the test port can also be a second preset test port 310 electrically connected to the test device 200. In this case, the first functional device is a second preset functional device electrically connected to the test port and receiving the test signal sent by the test device 200. In this case, the functional device in the above embodiment is the second functional device.

[0110] As an example, the second functional device 308 includes a CPU, DCU, IVR, 3D RAM, 3D NAND SSD, and capacitors.

[0111] As an example, the second functional device 308 includes multiple chips, which can be configured as needed to receive test signals transmitted from the test port 304 to the first functional device in the second functional device.

[0112] See Figure 8 In some embodiments, the opening size L1 of the second receiving groove 106 is smaller than the bottom size L2 of the first receiving groove 104 near the second surface; a stepped surface 108 is provided between the first receiving groove 104 and the second receiving groove 106; the substrate 302 contacts the stepped surface 108. This arrangement further reduces the fluctuation of the position of the packaged device 200 during testing.

[0113] As an example, both the first receiving groove 104 and the second receiving groove 106 have rectangular cross-sectional shapes, with the cross-section parallel to the thickness direction of the support plate 100 and parallel to the first surface. In the direction parallel to the first surface, the dimension L1 of the second receiving groove 106 is smaller than the dimension L2 of the first receiving groove 104.

[0114] like Figure 7 As shown, the first frame 310 is the outer frame of the substrate 302, the second frame 312 is the boundary of the orthographic projection of the first receiving groove 104 on the substrate 302, the first region 314 is the orthographic projection of the step surface 108 on the substrate 302, and the third frame 316 is the boundary of the orthographic projection of the second receiving groove 106 on the substrate 302; wherein, the width W1 between the first frame 310 and the second frame 312 is greater than the size of the second through hole 102, and the second through hole 102 can be disposed between the first frame 310 and the second frame 312; the orthographic projection of the second functional device 308 on the substrate 302 is located in the second region 318.

[0115] As an example, the bottom of the second receiving groove 106 near the second surface is located in the support plate 100.

[0116] See Figure 8 In some embodiments, the second receiving groove 106 penetrates the support plate 100. Figure 7 The second region 320 is a cutout area. The side of the second functional device 308 away from the substrate 302 does not have a carrier plate 100, thus avoiding interference between the second functional device 308 and the carrier plate 100.

[0117] In some embodiments, when the packaged device 300 is located on the carrier plate 100, the distance between the surface of the packaged device 300 near the second surface and the opening of the second receiving groove 106 is less than or equal to the depth of the second receiving groove 106. With this arrangement, the second functional device 308 can be completely housed in the second receiving groove 106, preventing the substrate 302 from suspending in the first receiving groove 104 and avoiding movement of the packaged device 300 during testing, which could affect the test results. Furthermore, with the bottom of the second receiving groove 106 located within the carrier plate 100, interference between the second functional device 308 and the carrier plate 100 is avoided.

[0118] In some embodiments, the substrate 302 includes a central region and a plurality of edge regions, the plurality of edge regions being arranged sequentially along the periphery of the central region, a first functional device 306 being disposed in the central region, and a test port 304 being disposed in the edge regions; wherein, the test equipment includes a plurality of test devices 200, the plurality of test devices 200 and the plurality of edge regions being respectively disposed.

[0119] Figure 10 This is the third top view of the test equipment in the embodiments of this application. See also... Figure 10 The substrate 302 includes four edge regions, at least one edge region is provided with a plurality of first preset test ports, and when two or more edge regions are provided with first preset test ports, the number of first preset test ports provided in any two edge regions may be the same or different.

[0120] It is understood that when the test equipment includes a test device 200, the test device and an edge area are set up accordingly, and the first preset test port in the edge area corresponding to the test device is test port 304.

[0121] like Figure 7 As shown, the orthographic projection of the edge region onto the substrate 302 is located in the first region 316.

[0122] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A testing device, characterized in that, include: A carrier plate is used to carry a packaged device, the packaged device including a substrate, multiple test ports and multiple first functional devices, the test ports and the first functional devices being spaced apart on the substrate, and the first functional devices being electrically connected to the corresponding test ports. A testing device, configured to be positioned on one side of the packaging device when the packaging device is supported on the carrier plate; The testing apparatus includes: The adapter module is electrically connected to the plurality of test ports respectively; the adapter module is used to convert the initial test signal into a test signal that matches the first functional device, and transmit it to the corresponding test port to test the first functional device; Multiple test modules are electrically connected to the adapter module; the test modules are used to send the initial test signal.

2. The testing equipment according to claim 1, characterized in that, The adapter module includes: The adapter module is electrically connected to the plurality of test modules respectively, and is used to convert the initial test signal into the test signal; The first connector is electrically connected to the adapter module and the plurality of test ports respectively, and is used to transmit the test signal to the corresponding test port.

3. The testing equipment according to claim 2, characterized in that, The first connector includes a plurality of spaced-apart pins, which are electrically connected to the corresponding test ports; The pin is used to transmit the test signal between the adapter module and the corresponding test port.

4. The testing equipment according to claim 3, characterized in that, The orthographic projection of the pin on the substrate and the orthographic projection of the test port on the substrate at least partially overlap.

5. The testing equipment according to claim 2, characterized in that, The adapter module includes a test board located on one side of the first connector and is detachably connected to the first connector; The test modules are spaced apart on the test board and electrically connected to the test board.

6. The testing equipment according to claim 5, characterized in that, The adapter module also includes: The second connector is located on the test board and is electrically connected to the test board; the second connector is used to connect external test equipment to the adapter module.

7. The testing equipment according to claim 1, characterized in that, The testing apparatus also includes: A fixed structure, detachably connected to the support plate; Multiple conductive structures are spaced apart, each of which penetrates the fixed structure and is electrically connected to the corresponding test port; The adapter module is located on one side of the fixed structure and is fixedly connected to the fixed structure. The conductive structure is used to electrically connect the test port and the adapter module.

8. The testing equipment according to claim 1, characterized in that, When the packaged device is supported on the carrier plate, the substrate is housed in the carrier plate, and the first functional device is located on the side of the substrate closer to the test device.

9. The testing equipment according to claim 8, characterized in that, The carrier plate includes a first surface and a second surface disposed opposite to each other. A first receiving groove is formed in the carrier plate, the first receiving groove extending from the first surface into the carrier plate, and the substrate is received in the first receiving groove.

10. The testing equipment according to claim 9, characterized in that, The support plate also includes: The second receiving groove extends from the first receiving groove toward the second surface in the direction from the first surface toward the second surface; The packaging device further includes a second functional device located on the side of the substrate opposite to the first functional device; when the substrate is housed in the first receiving groove, the second functional device is housed in the second receiving groove.

11. The testing equipment according to claim 10, characterized in that, The opening size of the second receiving groove is smaller than the bottom size of the first receiving groove near the second surface; a stepped surface is provided between the first receiving groove and the second receiving groove; the substrate is in contact with the stepped surface.

12. The testing equipment according to claim 10, characterized in that, The second receiving groove penetrates the support plate.

13. The testing equipment according to claim 10, characterized in that, The distance between the surface of the packaging device near the second surface and the opening of the second receiving groove is less than or equal to the depth of the second receiving groove.

14. The testing apparatus according to any one of claims 1 to 13, characterized in that, The substrate includes a central region and multiple edge regions, with the multiple edge regions arranged sequentially along the periphery of the central region. The first functional device is disposed in the central region, and the test port is disposed in the edge regions. The testing equipment includes multiple testing devices, and the multiple testing devices and multiple edge regions are respectively arranged accordingly.

15. The testing apparatus according to any one of claims 1 to 13, characterized in that, The test port includes pads and conductive blocks; the test module includes termination circuitry; the size of the test port is smaller than the size of the first functional device; the test port and the first functional device are located on the same side of the substrate.

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