A display device

Abstract

The utility model discloses a kind of display devices, the display device includes: drive chip, array substrate, flexible circuit board and interactive module, drive chip is respectively electrically connected array substrate, flexible circuit board and interactive module;Drive chip includes first pad group and second pad group, first pad group includes at least two first pads arranged along first direction, first pad is electrically connected flexible circuit board, second pad group includes at least two second pads, second pad is electrically connected array substrate, first pad group and second pad group are oppositely arranged along second direction;Drive chip further includes at least one third pad, third pad is electrically connected interactive module in display device with integration, so as to realize the drive, control and detection etc. of interactive module by drive chip;Without setting entity button and its supporting structure, the high integration of display device, low cost can be realized.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display device. Background Technology

[0002] Currently, in electronic paper products such as electronic price tags, e-books, flashcards, and shelf labels, the electronic paper screen serves only as a display module to present image information, while the information interaction function is implemented by a separately designed input module. This input module includes not only multiple individually designed physical buttons but also other supporting input units.

[0003] Clearly, existing electronic paper products have low integration and high cost. Summary of the Invention

[0004] This invention provides a display device to improve the integration of electronic paper products.

[0005] According to one aspect of the present invention, a display device is provided, comprising:

[0006] The system includes a driver chip, an array substrate, a flexible circuit board, and an interaction module, wherein the driver chip is electrically connected to the array substrate, the flexible circuit board, and the interaction module, respectively.

[0007] The driver chip includes a first pad group and a second pad group. The first pad group includes at least two first pads arranged along a first direction, and the first pads are electrically connected to the flexible circuit board. The second pad group includes at least two second pads, and the second pads are electrically connected to the array substrate. The first pad group and the second pad group are arranged opposite to each other along a second direction, and the first direction and the second direction intersect.

[0008] The driver chip also includes at least one third pad, which is electrically connected to the interaction module.

[0009] In this invention, the display device includes one or more interactive modules with different functions. These interactive modules are integrated within the display device. The driver chip of the display device integrates at least one third pad corresponding to the interactive module. The interactive module can implement interactive functions such as touch, magnetic control, pressure sensing, and photoelectric sensing. The third pad enables the circuitry in the printed circuit board (PCB) to drive and control the interactive module. In this invention, the third pad in the driver chip is electrically connected to the integrated interactive module in the display device. This allows the driver chip to drive, control, and detect the interactive module, thus enabling simple and efficient integration of interactive functions such as touch, magnetic control, pressure sensing, and photoelectric sensing into the display device. Compared to existing electronic paper products, the display device provided by this invention, when used as an electronic paper display device, eliminates the need for physical buttons and their associated structures, achieving high integration and low cost for the electronic paper display device.

[0010] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of an electronic paper product provided by related technologies;

[0013] Figure 2 This is a schematic diagram of a display device provided in an embodiment of the present utility model;

[0014] Figure 3 yes Figure 2 A schematic diagram along A1-A2;

[0015] Figure 4 This is a schematic diagram of a driver chip provided in an embodiment of the present utility model;

[0016] Figure 5 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0017] Figure 6 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0018] Figure 7This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0019] Figure 8 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0020] Figure 9 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0021] Figure 10 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model;

[0022] Figure 11 This is a schematic diagram of another display device provided in an embodiment of the present utility model;

[0023] Figure 12 yes Figure 2 Another schematic diagram along A1-A2;

[0024] Figure 13 yes Figure 2 Another schematic diagram along A1-A2;

[0025] Figure 14 yes Figure 2 Another schematic diagram along A1-A2;

[0026] Figure 15 This is a schematic diagram of another display device provided in an embodiment of the present utility model;

[0027] Figure 16 yes Figure 15 A schematic diagram along A3-A4;

[0028] Figure 17 This is a schematic diagram of another driver chip provided in an embodiment of this utility model. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first", "second" and the like in the description and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such data may be interchanged under appropriate circumstances, so that the embodiments of the present utility model described herein can be implemented in sequences other than those illustrated or described herein. In addition, the terms "comprise" and "include" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those explicitly listed steps or units, but may include other steps or units not explicitly listed or inherent to the process, method, product or device.

[0031] Figure 1 It is a schematic diagram of an electronic paper product provided by the related art. As Figure 1 shown, the electronic paper product 10 includes a display area 11 and a plurality of keys 12. Currently, in electronic paper products 10 such as electronic price tags, e-books, word cards, and shelf labels, the electronic paper screen is only used as a display module to present image information, while the information interaction function is implemented by an independently provided input module. The display module includes the display area 11. The input module includes a plurality of keys 12, which are protruding physical keys arranged on the side frame of the electronic paper product 10. A user can implement a series of information interaction functions such as restarting, networking, refreshing, and page turning of the electronic paper product 10 by operating one or more keys 12.

[0032] As mentioned above, the information interaction function of the existing electronic paper product 10 is implemented by an independent input module. The input module not only includes a plurality of separately arranged physical keys 12, but also includes a plurality of discrete input units such as independently arranged touch devices, and further includes a power supply unit, a communication unit, a driving unit and the like that are supportingly provided for the plurality of discrete input units. Obviously, in the existing electronic paper product 10, the input module for implementing the information interaction function has low integration and high cost.

[0033] In order to solve the above technical problems, an embodiment of the present utility model provides a display device, which can eliminate a plurality of discrete input units such as physical keys and independent touch devices as well as supporting power supply units, communication units, driving units and the like in the electronic paper product 10, so as to realize high integration and low cost of the electronic paper product.

[0034] Figure 2 is a schematic diagram of a display device provided by an embodiment of the present utility model, Figure 3 is Figure 2 a schematic view along A1-A2, Figure 4 is a schematic diagram of a driving chip provided by an embodiment of the present utility model, Figure 5This is a schematic diagram of another driver chip provided in an embodiment of this utility model. Figures 2 to 5 As shown, in this embodiment, the display device 100 includes: a driver chip 101, an array substrate 102, a flexible circuit board 103, and an interaction module 104. The driver chip 101 is electrically connected to the array substrate 102, the flexible circuit board 103, and the interaction module 104. The driver chip 101 includes a first pad group 111 and a second pad group 113. The first pad group 111 includes at least two first pads 112 arranged along a first direction F1. The first pads 112 are electrically connected to the flexible circuit board 103. The second pad group 113 includes at least two second pads 114. The second pads 114 are electrically connected to the array substrate 102. The first pad group 111 and the second pad group 113 are arranged opposite to each other along a second direction F2. The first direction F1 and the second direction F2 intersect. The driver chip 101 also includes at least one third pad 116, which is electrically connected to the interaction module 104.

[0035] like Figure 4 As shown, the optional second pad group 113 includes at least two second pads 114 arranged along the first direction F1. Figure 5 and Figure 4 The second pad group 113 is different. For example... Figure 5 As shown, the optional second pad group 113 includes at least two rows of second pads 114 arranged along the second direction F2, and each row of second pads 114 includes at least one second pad 114 arranged along the first direction F1; the third pad 116 is disposed on at least one side of the second pad group 113.

[0036] like Figure 4 As shown, the optional driver chip 101 includes a third pad 116. Figure 5 and Figure 4 The number of pads 116 in the third pad is different. For example... Figure 5 As shown, the optional driver chip 101 includes at least two third pads 116, which together constitute at least one third pad group 115. The third pad group 115 includes at least two third pads 116 arranged along the second direction F2. Figure 5 Multiple third pads 116 that are clustered together are defined as a third pad group 115.

[0037] The following embodiments are mainly based on Figure 5 The layout of the first pad group 111 and the second pad group 113 is used as an example to illustrate the distribution of the third pad 116.

[0038] The display device 100 provided by this utility model can be any electronic device with display function.

[0039] In this embodiment, the optional display device 100 is an electronic paper display device, but it is not limited to this. In other embodiments, the display device can also be a liquid crystal display device, an OLED display device, etc. An electronic paper display device is a display device made using electrophoretic display technology. It achieves the effect of displaying images by applying driving voltage to each pixel through a control circuit on a TFT substrate. The screen of an electronic paper display device is a reflective display screen, which can maintain the image for a long time without continuous refreshing after an image update, thus resulting in very low power consumption. Due to its many characteristics such as low power consumption, wide viewing angle, high contrast, and eye protection, electronic paper display devices are increasingly widely used in many fields such as electronic price tags, e-books, flashcards, and shelf labels.

[0040] The display device 100 includes a driver chip 101, an array substrate 102, a flexible circuit board 103, and an interaction module 104. The driver chip 101 is electrically connected to the array substrate 102, the flexible circuit board 103, and the interaction module 104. The display device 100 also includes a printed circuit board 105, and the flexible circuit board 103 is electrically connected to the printed circuit board 105. The array substrate 102 includes a substrate 102a and a thin-film transistor array layer 102b disposed on the substrate 102a. The thin-film transistor array layer 102b includes a plurality of thin-film transistors (TFTs). It is understood that the substrate 102a has a multi-layer stacked structure, and the thin-film transistor array layer 102b has a multi-layer stacked structure. The specific layers of the substrate 102a and the TFT array layer 102b are not described in detail here. Optionally, the display device 100 also includes an interaction connection circuit 106, which is electrically connected to the driver chip 101 and the interaction module 104. Specifically, the interaction module 104 is electrically connected to the printed circuit board 105 through the interaction connection circuit 106, and the printed circuit board 105 is electrically connected to the driver chip 101 through the flexible circuit board 103, thereby realizing the driving and control of the driver chip 101 and the interaction module 104.

[0041] Specifically, the printed circuit board PCB 105 and the driver chip 101 are located on opposite sides of the array substrate 102. The driver chip 101 is disposed on the side of the thin-film transistor array layer 102b facing away from the substrate 102a. The flexible circuit board 103 is bent so that its two sides are electrically connected to the driver chip 101 and the printed circuit board PCB 105 respectively. The interaction module 104 is located on the side of the driver chip 101 facing away from the array substrate 102. Figure 3As shown, the optional driver chip 101 is directly bonded to and electrically connected to the thin-film transistor array layer 102b, the thin-film transistor array layer 102b is electrically connected to the flexible circuit board 103, the flexible circuit board 103 is electrically connected to the printed circuit board PCB 105, and the printed circuit board PCB 105 is electrically connected to the interaction module 104. This enables communication between different components in the display device 100, such as communication between the driver chip 101 and the interaction module 104. It is understood that, based on different circuit designs, the electrical connection relationships between the components in the display device are not limited to this; for example, the driver chip can be directly bonded to and electrically connected to the flexible circuit board; or, the interaction connection circuit of the interaction module can be bonded to and electrically connected to the thin-film transistor array layer or the flexible circuit board; and so on.

[0042] The connection methods such as "electrical connection" and "coupling" described in this utility model include direct electrical connection between two components, as well as indirect electrical connection between two components through at least one third-party component. For example, the interactive connection circuit 106 is directly electrically connected to the printed circuit board PCB 105; the driver chip 101 is indirectly electrically connected to the printed circuit board PCB 105 through the flexible circuit board 103.

[0043] The driver chip 101 includes a first pad group 111, which includes at least two first pads 112 arranged along a first direction F1, where the first direction F1 can be the long side direction of the driver chip 101. The first pads 112 are electrically connected to a flexible circuit board FPC 103. Optionally, the first pad group 111 can be an input pad group. Specifically, the first pads 112 are electrically connected to a printed circuit board PCB 105 through the flexible circuit board FPC 103. The printed circuit board PCB 105 integrates multiple circuits with different functions, including at least power supply, voltage regulation, testing, data communication, and drive control circuits, thereby enabling the circuits in the printed circuit board PCB 105 to provide power supply, voltage regulation, testing, data communication, and drive control functions to the driver chip IC 101.

[0044] The driver chip 101 includes a second pad group 113. For example... Figure 4 As shown, the second pad group 113 includes a row of second pads 114, and the row of second pads 114 includes at least two second pads 114 arranged along the first direction F1. Figure 5As shown, the second pad group 113 includes at least two rows of second pads 114 arranged along a second direction F2. Each row of second pads 114 includes at least one second pad 114 arranged along a first direction F1. Here, the second direction F2 can be the short side direction of the driver chip 101. The second pads 114 are electrically connected to the array substrate 102. Optionally, the second pad group 113 can be an output pad group. In the driver chip 101, the second pad group 113 and the first pad group 111 can be arranged opposite to each other along the second direction F2. The multiple second pads 114 in the second pad group 113 can include source drive (Source) pads 114a and power supply (VBD) pads 114b. The Source pads 114a can be distributed in the middle region of the second pad group 113, and at least two VBD pads 114b can be distributed in the edge region of the second pad group 113. When the Source pads 114a in the second pad group 113 are distributed in two rows, at least two VBD pads 114b can be distributed on at least one side of the Source pads 114a and distributed in different rows.

[0045] For example, two VBD pads 114b are distributed on opposite sides of the area where the Source pad 114a is located and are located in different rows. The thin-film transistor array layer 102b includes data traces, and the Source pad 114a is used to electrically connect to the data traces in the thin-film transistor array layer 102b, thereby enabling the circuit in the printed circuit board 105 to drive and control the data traces. The array substrate 102 includes multiple power electrodes or traces, and the VBD pads 114b are used to electrically connect to the power electrodes or power traces in the array substrate 102. For example, the power electrodes include border electrodes, and at least one VBD pad 114b is used to electrically connect to the border electrodes, thereby enabling the circuit in the printed circuit board 105 to drive and control the power electrodes.

[0046] The driver chip 101 also includes at least one third pad 116, which is electrically connected to the interaction module 104. Depending on product requirements, one or more third pad groups 115 are provided in the driver chip 101. Each third pad group 115 includes one or more third pads 116. This invention does not limit the location of the third pad group 115 or the arrangement of the third pads 116 within it. Figure 4 As shown, a third pad 116 is provided in the driver chip 101, and this third pad 116 can also be regarded as a third pad group. Figure 5 As shown, the third pad group 115 includes two third pad groups 115, and the third pad group 115 includes at least two third pads 116. This enables the circuit in the printed circuit board PCB 105 to drive and control the interactive module 104.

[0047] like Figure 5 As shown, the optional driver chip 101 further includes at least two third pads 116, which constitute at least one third pad group 115. The third pad group 115 includes at least two third pads 116 arranged along a first direction F1 and / or a second direction F2. Along the second direction F2, the third pad group 115 is located between the first pad group 111 and the second pad group 113. Optionally, along the first direction F1, the third pad group 115 is disposed near the edge of the driver chip 101 relative to the first pad group 111 and the second pad group 113. In this embodiment, the driver chip 101 includes a plurality of third pads 116, which can be divided into two third pad groups 115. The third pad group 115 includes a plurality of third pads 116 arranged along the F2 direction. The first pad group 111, the second pad group 113, and the third pad group 115 are arranged along the F2 direction. The third pad group 115 is located between the first pad group 111 and the second pad group 113. The two third pad groups 115 can be arranged along the F1 direction. The third pad group 115 is set close to the edge of the driver chip 101, so that the third pad 116 can be electrically connected to the flexible circuit board 103, thereby realizing the driving and control of the interactive module 104 by the circuit in the printed circuit board PCB 105.

[0048] In other embodiments, the third pad group in the driver chip may include a plurality of third pads in at least two rows and / or a plurality of third pads in at least two columns; or, in the driver chip, the plurality of third pad groups are arranged along the second direction F2; the present invention does not specifically limit the setting position of the third pad group in the driver chip or the arrangement of the third pads therein. It is not limited thereto.

[0049] The optional driver chip 101 further includes at least one gate pad group 117, which includes at least two gate pads 118 arranged along a first direction F1. The gate pads 118 are electrically connected to the array substrate 102. Along the first direction F1, the gate pad group 117 is located on at least one side of the first pad group 111 or the second pad group 113. Here, the first pad group 111 includes two opposite sides along the first direction F1, and a gate pad group 117 is disposed on one of the opposite sides of the first pad group 111, or a gate pad group 117 is disposed on either side of the opposite sides of the first pad group 111. The gate pad group 117 may include one or more rows of gate pads 118. The thin-film transistor array layer 102b includes an electrically connected gate drive circuit and a gate trace. The gate trace is used to control the opening or closing of the thin-film transistor TFT. The gate pad 118 is used to electrically connect the gate drive circuit in the thin-film transistor array layer 102b. Thus, the gate drive circuit integrated in the thin-film transistor array layer 102b enables the circuit in the printed circuit board PCB 105 to drive and control the gate trace.

[0050] like Figure 5 As shown, optionally along the F1 direction, the gate pad group 117 is located on one side of the first pad group 111. When the plurality of gate pads 118 in the driver chip 101 are divided into two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed on opposite sides of the first pad group 111. The gate pad groups 117 are disposed close to the edge of the driver chip 101 to facilitate the electrical connection of the gate pads 118 to the thin-film transistor array layer 102b.

[0051] Figure 6 This is a schematic diagram of another driver chip provided in an embodiment of this utility model. Figure 6 As shown, optionally along the F1 direction, the gate pad group 117 is located on one side of the second pad group 113. When the plurality of gate pads 118 in the driver chip 101 are divided into two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed on opposite sides of the second pad group 113. The gate pad groups 117 are disposed close to the edge of the driver chip 101 to facilitate the electrical connection of the gate pads 118 to the thin-film transistor array layer 102b.

[0052] This invention does not specifically limit the location of the gate pad group in the driver chip or the arrangement of the gate pads therein. It is not limited thereto. It is understood that the structure of the display device 100 shown above only includes a portion of the structure; the actual structure of the display device 100 includes, but is not limited to, the above structures, which will not be described in detail here.

[0053] In this invention, the display device includes one or more interactive modules with different functions. These interactive modules are integrated within the display device. The driver chip of the display device integrates multiple third pads corresponding to the interactive modules. The interactive modules can implement interactive functions such as touch, magnetic control, pressure sensing, and photoelectric sensing. The third pads enable the circuitry in the printed circuit board (PCB) to drive and control the interactive modules. In this invention, the third pads in the driver chip are electrically connected to the integrated interactive modules in the display device. This allows the driver chip to drive, control, and detect the interactive modules, thus enabling the simple and efficient integration of interactive functions such as touch, magnetic control, pressure sensing, and photoelectric sensing into the display device. Compared to existing electronic paper products, the display device provided by this invention, when used as an electronic paper display device, eliminates the need for physical buttons and their associated structures, achieving high integration and low cost for electronic paper display devices.

[0054] Figure 7 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model. Figure 8 This is a schematic diagram of another driver chip provided in an embodiment of this utility model. Figure 7 and Figure 8As shown, the optional driver chip 101 further includes at least two third pads 116, which constitute at least one third pad group 115. The third pad group 115 includes at least two third pads 116 arranged along a first direction F1 and / or a second direction F2. Along the first direction F1, the third pad group 115 is located on at least one side of the first pad group 111. The gate pad group 117 is located on the side of the third pad group 115 away from the first pad group 111, or the gate pad group 117 is located on at least one side of the second pad group 113.

[0055] In this embodiment, the driver chip 101 includes a plurality of third pads 116, which can be divided into two third pad groups 115. Each third pad group 115 includes a plurality of third pads 116 arranged along the F1 direction. Along the F1 direction, the two third pad groups 115 are located on opposite sides of the first pad group 111, facilitating the electrical connection of the third pads 116 to the flexible circuit board 103.

[0056] like Figure 7 As shown, the gate pad group 117 and the third pad group 115 can be disposed on the lower side of the driver chip 101, i.e., on the side where the input pad group is located. Specifically, the gate pad group 117 is located on the side of the third pad group 115 away from the first pad group 111. When the multiple gate pads 118 in the driver chip 101 are divided into two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed on the outside of the third pad group 115, that is, the gate pad groups 117 are disposed close to the edge of the driver chip 101, which facilitates the electrical connection of the gate pads 118 to the thin film transistor array layer 102b.

[0057] like Figure 8 As shown, the third pad group 115 can be disposed on the lower side of the driver chip 101, i.e., the side where the input pad group is located, and the gate pad group 117 can be disposed on the upper side of the driver chip 101, i.e., the side where the output pad group is located. When the driver chip 101 includes two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed on opposite sides of the second pad group 113, i.e., the gate pad groups 117 are disposed close to the edge of the driver chip 101, which facilitates the electrical connection of the gate pads 118 to the thin-film transistor array layer 102b.

[0058] Figure 9 This is a schematic diagram of another driver chip provided in an embodiment of the present utility model. Figure 10 This is a schematic diagram of another driver chip provided in an embodiment of this utility model. Figure 9 and Figure 10As shown, the optional driver chip 101 further includes at least two third pads 116, which constitute at least one third pad group 115. The third pad group 115 includes at least two third pads 116 arranged along a first direction F1 and / or a second direction F2. Along the first direction F1, the third pad group 115 is located on at least one side of the second pad group 113. The gate pad group 117 is located on at least one side of the first pad group 111. Alternatively, the gate pad group 117 is located on the side of the third pad group 115 away from the second pad group 113.

[0059] In this embodiment, the driver chip 101 includes a plurality of third pads 116, which can be divided into two third pad groups 115. Each third pad group 115 includes a plurality of third pads 116 arranged along the F1 direction. Along the F1 direction, the two third pad groups 115 are located on opposite sides of the second pad group 113, facilitating the electrical connection of the third pads 116 to the flexible circuit board 103.

[0060] like Figure 9 As shown, the gate pad group 117 can be disposed on the lower side of the driver chip 101, i.e., the side where the input pad group is located, and the third pad group 115 can be disposed on the upper side of the driver chip 101, i.e., the side where the output pad group is located. Specifically, when the multiple gate pads 118 in the driver chip 101 are divided into two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed on opposite sides of the first pad group 111, i.e., the gate pad groups 117 are disposed close to the edge of the driver chip 101, which facilitates the electrical connection of the gate pads 118 to the thin film transistor array layer 102b.

[0061] like Figure 10 As shown, the gate pad group 117 and the third pad group 115 can be disposed on the upper side of the driver chip 101, i.e., on the side where the output pad group is located. Specifically, the gate pad group 117 is located on the side of the third pad group 115 away from the second pad group 113. When the multiple gate pads 118 in the driver chip 101 are divided into two gate pad groups 117, along the F1 direction, the two gate pad groups 117 can be distributed outside the third pad group 115, that is, the gate pad groups 117 are disposed close to the edge of the driver chip 101, which facilitates the electrical connection of the gate pads 118 to the thin film transistor array layer 102b.

[0062] Continue to refer to Figure 3The following description uses display device 100 as an example of an electronic paper display device to illustrate the structure of other parts of display device 100. Display device 100 includes display area AA and non-display area NA. It should be noted that the positions of the edge sealing adhesive 126 and the silver paste (Ag paste) 124 cannot be used for display. Therefore, display area AA is usually located within edge sealing adhesive 126 and Ag paste 124. At the same time, in order to consider the positional tolerance in production, the boundary of display area AA is usually left with a distance of about 1mm from edge sealing adhesive 126 and Ag paste 124.

[0063] The electronic paper display device also includes a front housing 121, a rear housing 122, and an electronic paper film 123. The front housing 121 is disposed on the light-emitting side (top) of the electronic paper film 123, and the rear housing 122 is disposed on the backlight side (bottom) and around the electronic paper film 123. Together, the front housing 121 and the rear housing 122 serve to fix and protect the internal components of the electronic paper display device. An optional interactive module 104 is disposed between the electronic paper film 123 and the front housing 121.

[0064] The front shell 121 is typically made of a specific color of organic resin. It is U-shaped and features a perforated or transparent display area AA to expose the display area of ​​the electronic paper film 123. The non-display area NA, i.e., the surrounding area, is perforated or screen-printed as needed to achieve specific shapes, colors, and patterns. Specifically, the front shell 121 includes a lens, typically made of transparent organic resin or inorganic glass. The lens remains transparent in the display area AA to ensure effective display of the electronic paper film 123. The back shell 122 is typically made of a specific color of organic resin and is shaped using injection molding or die casting. The electronic paper film 123, also known as the front plane laminate (FPL), is used to display the image actually seen by the human eye. The FPL 123 is attached above the array substrate 102. An electric field is formed between the pixel electrodes on the array substrate 102 and the common transparent electrode (VCOMITO) on the FPL 123, driving the electronic ink in the FPL 123 to display the image. In the array substrate 102, the substrate 102a serves as the carrier of the thin film transistor array layer 102b. The substrate 102a can be made of materials such as glass, PI, or FPC. By performing processes such as coating, exposure, development, and etching on the substrate 102a, a patterned thin film transistor array and its driving circuit are formed to realize the driving control of the electronic paper film 123 by the array substrate 102.

[0065] The electronic paper display device also includes Ag adhesive 124 and PS 125. Ag adhesive 124 is disposed between array substrate 102 and FPL 123. A common electrode VCOM for connecting Ag adhesive 124 is disposed on array substrate 102 at a position corresponding to Ag adhesive 124. A VCOM ITO electrode is disposed on FPL 123 at a position corresponding to Ag adhesive 124. Ag adhesive 124 is used to connect the VCOM electrode on array substrate 102 and the VCOM ITO electrode on FPL 123. FPL 123 needs to be laser-cut to drill holes to expose the VCOM ITO electrode. PS 125 is attached above FPL 123. PS 125 is larger than FPL 123, and the edges of PS 125 wrap around FPL 123 to protect FPL 123 and isolate it from moisture.

[0066] In the electronic paper display device, the driver chip IC101 receives signals transmitted from external circuits (such as printed circuit boards PCB 105) via a flexible circuit board FPC 103 and converts these signals into voltage and timing parameters to drive the electronic paper diaphragm 123 for screen refresh. The flexible circuit board FPC 103 connects the printed circuit board PCB 105 and the electronic paper diaphragm 123 to enable signal transmission between them. The printed circuit board PCB 105 is the main control circuit of the electronic paper display device, receiving instructions and data from the electronic paper display system and controlling the device to perform specific actions.

[0067] The electronic paper display device also includes edge sealing adhesive 126, silicone 127, and a battery 128. Edge sealing adhesive 126 is applied around the edges of the PS125 to fill the gap between the PS125 and the thin-film transistor array layer 102b, further isolating moisture. Silicone 127 is disposed on the lower border area of ​​the thin-film transistor array layer 102b to protect the traces on the array substrate 102 and the driver chip IC101 and flexible circuit board FPC103 in the area. The battery 128 is connected to the printed circuit board PCB 105 via pads or contacts to power the electronic paper display device.

[0068] Based on the structure of the display device 100 described above, the placement of the interaction module 104 is flexible and varied. The following examples illustrate different placement methods of the interaction module 104 in the display device 100. It is understood that the placement of the interaction module 104 in the display device 100 is not limited to the embodiments described in the application documents. Since the interaction module is positioned between the electronic paper screen and the lens / front shell, its placement is no longer limited by the electronic paper screen and can be placed at any location in the surrounding area of ​​the electronic price tag. Furthermore, compared to placing the interaction module on the TFT substrate, placing it between the electronic paper screen and the lens / front shell not only effectively reduces the distance between the interaction module and the outer surface of the electronic price tag but also avoids interference between the interaction module and other components on the electronic paper screen, thereby achieving higher detection sensitivity and signal-to-noise ratio.

[0069] The optional display device 100 further includes an interactive connection circuit 106, which electrically connects the driver chip 101 and the interactive module 104. The display device 100 includes a display area AA and a non-display area NA, with the interactive module 104 located in either the display area AA or the non-display area NA. When the interactive module 104 is located in the display area AA, the display area AA includes a display functional layer, and the interactive module 104 is located on the side of the display functional layer facing the array substrate 102. When the interactive module 104 is located in the non-display area NA, the interactive module 104 and the driver chip 101 are located on the same side or opposite sides of the non-display area NA. Here, the non-display area NA at least partially surrounds the display area AA. The display area AA is used to display images, and the non-display area NA includes related circuitry for driving the display. The interactive module 104 is disposed in either the display area AA or the non-display area NA.

[0070] like Figure 2 As shown, the interaction module 104 and the driver chip 101 are located on the same side of the non-display area NA, which facilitates wiring and facilitates the electrical connection between the interaction module 104 and the driver chip 101.

[0071] Figure 11 This is a schematic diagram of another display device provided in an embodiment of the present utility model, as shown below. Figure 11 As shown, the interaction module 104 and the driver chip 101 are located on opposite sides of the non-display area NA, which allows for flexible design of the position and number of the interaction module 104, enabling the display device 100 to perform multiple functions. In other embodiments, the interaction module and the driver chip may be located on adjacent sides of the non-display area, and are not limited to the above example.

[0072] Here it is only for Figure 2 The cross-sectional structure of the display device 100 is illustrated by taking the example of the interaction module 104 and the driver chip 101 being located on the same side of the non-display area NA.

[0073] Combination Figure 2 and Figure 3 As shown, the interaction module 104 is located on the side of the silicone 127 facing away from the array substrate 102. The interaction module 104 is disposed between the electronic paper film 123 and the front shell 121, and is connected to the PCB 105 through the interaction connection circuit 106.

[0074] Figure 12 yes Figure 2 Another schematic diagram along A1-A2. (See diagram below.) Figure 12 As shown, the optional interaction module 104 is located on the side of the thin-film transistor array layer 102b facing the driver chip 101. Specifically, the interaction module 104 and the driver chip 101 can be electrically connected through the array substrate 102, and the interaction connection circuit can be integrated in the array substrate 102.

[0075] Figure 13 yes Figure 2 Another schematic diagram along A1-A2. (See example...) Figure 13 As shown, the optional interaction module 104 is located on the side of the substrate 102a facing the thin-film transistor array layer 102b. Specifically, the interaction module 104 and the driver chip 101 can be electrically connected through the thin-film transistor array layer 102b, and the interaction connection circuit can be integrated into the array substrate 102.

[0076] Figure 14 yes Figure 2 Another schematic diagram along A1-A2. (See example...) Figure 14 As shown, the optional interaction module 104 is integrated inside the front housing 121, and the interaction module 104 is electrically connected to the PCB 105 via the interaction connection circuit 106. In other embodiments, the interaction module may also be integrated on the side of the front housing facing the array substrate; or, the interaction module may be integrated inside the front housing, and the plane of the interaction module may be flush with the light-emitting surface of the front housing; and so on. Here, the interaction module 104 is integrated on the upper or lower surfaces or inside the front housing 121, and the interaction module 104 can be integrated on the front housing 121 using processes such as bonding, printing, or etching.

[0077] When the interaction module 104 is positioned between the PS125 and the front housing 121, its placement is no longer restricted by the electronic paper film 123, allowing it to be positioned anywhere within the peripheral area NA of the display area AA. This not only improves the integration of the display device 100 but also effectively reduces the distance between the interaction module 104 and the light-emitting surface of the front housing 121. Furthermore, it avoids interference between the interaction module 104 and other components on the electronic paper film 123, thereby achieving higher detection sensitivity and signal-to-noise ratio, higher integration, and better interactive performance.

[0078] In other embodiments, the optional interaction module may be located on any film layer between the driver chip and the front housing; or, the interaction module may be on the same layer as the driver chip; or, the interaction module may be located on any film layer between the driver chip and the rear housing. For example, the interaction module may be integrated on the side of the rear housing facing the array substrate, or integrated on the inner surface of the rear housing sidewall, or integrated inside the rear housing sidewall, etc.

[0079] Figure 15 This is a schematic diagram of another display device provided in an embodiment of the present utility model. Figure 16 yes Figure 15 A schematic diagram along A3-A4, as shown below. Figure 15 and Figure 16 As shown, the optional display device 100 includes a display area AA and a non-display area NA, and the interaction module 104 is located in the display area AA; the display area AA includes a display function layer, and the interaction module 104 is located on the side of the display function layer facing the array substrate 102.

[0080] In this embodiment, the interaction module 104 is located in the display area AA. For an electronic paper display device, its display functional layer is an electronic paper film 123, and the optional interaction module 104 is located on the side of the electronic paper film 123 facing the array substrate 102. Specifically, the interaction module 104 can be integrated into the array substrate 102. In other embodiments, without affecting the display, the interaction module can be located on the side of the electronic paper film facing away from the array substrate, which will not be described in detail here.

[0081] In this invention, the interactive module 104 can be disposed on a specific substrate of the display device 100. The specific substrate may be made of materials such as glass, PI, FPC, PCB, PET, etc. It is connected to the PCB 105 via an interactive connection circuit 106 through FPC, metal lines or silk screen lines, and finally connected to the third pad of the driver chip 101 through the traces on the PCB 105, FPC 103 and array substrate 102, thereby realizing the driving and detection of the interactive module 104.

[0082] The interaction module 104 can be directly electrically connected to the PCB 105 via the interaction connection circuit 106, and then connected to the third pad of the driver chip 101 via traces on the PCB 105, FPC 103, and array substrate 102; or, the interaction module 104 can be directly electrically connected to the FPC 103 via the interaction connection circuit 106, and then connected to the third pad of the driver chip 101 via traces on the FPC 103 and array substrate 102; or, the interaction module 104 can be directly electrically connected to the array substrate 102 via the interaction connection circuit 106, and then connected to the third pad of the driver chip 101 via traces on the array substrate 102, thereby enabling the driving and detection of the interaction module 104.

[0083] In this invention, the position of the interaction module can be flexibly designed without affecting other circuits and functions in the display device, and there are no restrictions on the electrical connection method between the interaction module and the driver chip. In actual products, the interaction module 104 can be a touch module, a magnetic control module, a pressure sensing module, a photoelectric sensing module, etc., and there are no limitations on this.

[0084] Figure 17 This is a schematic diagram of another driver chip provided in an embodiment of the present invention, as shown below. Figure 17 As shown, the display device can be an electronic paper display device. The circuit of the driver chip of the electronic paper display device mainly includes the following circuit modules: timing control unit 131, storage unit 132, power supply unit 133, communication unit 134, frame electrode driving unit 135, shift register driving unit 136, source driving unit 137, interactive data storage unit 138, and interactive module driving unit 139.

[0085] The timing control unit 131 includes a timing controller (TCON), which serves as the core circuit for controlling the timing operation of the electronic paper display device. It provides timing control signals to the VCOM electrode, VCOM ITO electrode, border electrode, gate traces, gate drive circuit, and data traces. The storage unit 132 mainly includes a register unit, MTP / OTP, and RAM. The register unit stores configuration data for each register. The MTP / OTP (Multiple-Time Programmable / One-Time Programmable) stores drive waveform data for various temperature ranges. The RAM (Frame Buffer) stores the currently displayed dot matrix image data. The power supply unit 133 includes a boost circuit and regulator to generate multiple power supply voltages required by the driver chip IC. The communication unit 134 mainly includes an SPI interface and an I2C interface for data transmission with peripheral devices. The border electrode driving unit 135 outputs signals such as VBD_L and VBD_R to the VBD pad 114b, providing driving voltage for the border electrodes of the electronic paper film. The shift register driving unit 136 is electrically connected to the gate pad 118 and mainly includes a gate driving unit. It provides the required voltage timing to the gate driving circuit on the array substrate through gate traces, controlling the gate driving circuit to output the required driving voltage for the gate traces. The source driving unit 137 is electrically connected to the source driving pad 114a and is mainly used to output data source signals, providing driving voltage for the data traces on the array substrate. The interactive data storage unit 138 stores the initialization settings and interactive detection results of the interactive module. The interactive module driving unit 139 is electrically connected to the third pad 116 and is mainly used to output specific voltage timing and control signals to the interactive module, realizing the driving and detection of the interactive module.

[0086] Continue to refer to Figure 2 As shown, the interaction module 104 is used to implement interactive functions, and the location of the interaction module 104 is the area corresponding to the interaction point. When an external interactive subject triggers the interaction point, the interactive behavior is detected by the interaction module 104, which serves as the input unit, and the driver chip 101 executes a preset action according to the specific interactive behavior.

[0087] In this invention, the driver chip for the display device can be a GIP-type electronic paper driver chip, but it is not limited to this. In actual products, the driver chip can also be a non-GIP-type electronic paper driver chip, including AIO-type driver chips, Gate-type driver chips, Source-type driver chips, etc., and can also integrate corresponding interactive control components, without any limitations.

[0088] It should be understood that the various forms of the process shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein.

[0089] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A display device, characterized in that, include: The system includes a driver chip, an array substrate, a flexible circuit board, and an interaction module, wherein the driver chip is electrically connected to the array substrate, the flexible circuit board, and the interaction module, respectively. The driver chip includes a first pad group and a second pad group. The first pad group includes at least two first pads arranged along a first direction, and the first pads are electrically connected to the flexible circuit board. The second pad group includes at least two second pads, and the second pads are electrically connected to the array substrate. The first pad group and the second pad group are arranged opposite to each other along a second direction, and the first direction and the second direction intersect. The driver chip also includes at least one third pad, which is electrically connected to the interaction module.

2. The display device according to claim 1, characterized in that, The second pad group includes at least two rows of second pads arranged along the second direction, and each row of second pads includes at least one second pad arranged along the first direction; The third pad is disposed on at least one side of the second pad group.

3. The display device according to claim 1, characterized in that, The driver chip further includes at least two third pads, which constitute at least one third pad group, and the third pad group includes at least two third pads arranged along the first direction and / or the second direction; Along the second direction, the third pad group is located between the first pad group and the second pad group.

4. The display device according to claim 3, characterized in that, Along the first direction, the third pad group is positioned close to the edge of the driver chip relative to the first pad group and the second pad group.

5. The display device according to claim 1, characterized in that, The driver chip further includes at least one gate pad group, the gate pad group including at least two gate pads arranged along the first direction, the gate pads being electrically connected to the array substrate; Along the first direction, the gate pad group is located on at least one side of the first pad group or the second pad group.

6. The display device according to claim 5, characterized in that, The driver chip further includes at least two third pads, which constitute at least one third pad group, and the third pad group includes at least two third pads arranged along the first direction and / or the second direction; Along the first direction, the third pad group is located on at least one side of the first pad group; The gate pad group is located on the side of the third pad group opposite to the first pad group, or the gate pad group is located on at least one side of the second pad group.

7. The display device according to claim 5, characterized in that, The driver chip further includes at least two third pads, which constitute at least one third pad group, and the third pad group includes at least two third pads arranged along the first direction and / or the second direction; Along the first direction, the third pad group is located on at least one side of the second pad group; The gate pad group is located on the side of the third pad group away from the second pad group, or the gate pad group is located on at least one side of the first pad group.

8. The display device according to claim 1, characterized in that, Also includes: An interactive connection circuit is provided, which is electrically connected to the driver chip and the interactive module respectively. The display device includes a display area and a non-display area, and the interactive module is located in the display area or the non-display area; When the interactive module is located in the display area, the display area includes a display function layer, and the interactive module is located on the side of the display function layer facing the array substrate; When the interaction module is located in the non-display area, the interaction module and the driver chip are located on the same side or opposite sides of the non-display area.

9. The display device according to claim 1, characterized in that, The display device is an electronic paper display device.

10. The display device according to claim 9, characterized in that, The electronic paper display device includes an electronic paper film and a front shell; The front shell is disposed on the light-emitting side of the electronic paper film, and the interaction module is disposed between the electronic paper film and the front shell.

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