AR optical waveguide assembly and manufacturing jig

Abstract

The application relates to the optical technical field and discloses an AR optical waveguide splicing master and a manufacturing jig. The AR optical waveguide splicing master comprises a supporting layer, a first glue curing layer and a sub splicing master. The first glue curing layer is formed above the supporting layer, the upper surface of the first glue curing layer is concavely provided with a plurality of nesting grooves, and a filling strip integrated with the first glue curing layer is formed between two adjacent nesting grooves. The number of the sub splicing master corresponds to that of the nesting grooves, the sub splicing master is embedded in the corresponding nesting groove, one side of the sub splicing master away from the supporting layer is a structure surface, the structure surfaces of all the sub splicing masters are flush, and a grating imprint area is arranged on the structure surface. The AR optical waveguide splicing master disclosed by the application can realize the function of imprinting multiple optical functional areas at a time, improves the manufacturing yield of the AR optical waveguide splicing master, has a simple structure and reduces the process requirement.

Description

Technical Field

[0001] This application belongs to the field of optical technology, specifically relating to an AR optical waveguide panel master and manufacturing fixture. Background Technology

[0002] In existing technologies, the fabrication of optical waveguide panel molds typically involves simultaneously forming multiple optical panel areas with micro / nano structures on a single wafer substrate through imprinting, exposure, and demolding processes. However, this process has significant drawbacks: if the micro / nano structure in any of the optical functional areas collapses or shrinks, the entire panel mold will fail and be scrapped. Therefore, existing optical waveguide panel molds suffer from low manufacturing yield and demanding process requirements. Utility Model Content

[0003] The purpose of this application is to provide an AR optical waveguide panel master and manufacturing jig to solve the problems of low manufacturing yield and high process requirements in the existing optical waveguide panel mold structure.

[0004] To achieve the above objectives, the first aspect of this application provides an AR optical waveguide panel master, comprising: Support layer; A first adhesive curing layer is formed above the support layer. The upper surface of the first adhesive curing layer has several nested grooves, and a sealant strip integral with the first adhesive curing layer is formed between two adjacent nested grooves. Sub-panels, corresponding to the number of nested slots, are embedded in the corresponding nested slots. The side of the sub-panel facing away from the support layer is the structural surface. The structural surfaces of all the sub-panels are flush, and the structural surface is provided with a grating imprinting area.

[0005] As a further improvement to the above technical solution: In some embodiments, the height difference between the top surface of any of the sealant strips and the adjacent structural surface is less than 500 nm.

[0006] In some embodiments, the flatness of the surface formed by all the structural surfaces and the side of the first adhesive cured layer facing away from the support layer is less than 1 μm.

[0007] In some embodiments, the depth of the nested groove is less than the thickness of the first adhesive cured layer.

[0008] In some embodiments, the sub-panel includes a substrate layer and a second adhesive curing layer formed on the substrate layer, wherein the side of the second adhesive curing layer facing away from the substrate layer is the structural surface.

[0009] In some embodiments, the first adhesive curing layer and the second adhesive curing layer are both formed by curing the same adhesive; Alternatively, both the first and second adhesive curing layers are formed by UV adhesive curing, and the Young's modulus of the UV adhesive is greater than or equal to 3 GPA.

[0010] In some embodiments, the visible light transmittance of the substrate layer is greater than 91%, and the flatness of the surface of the substrate layer in contact with the second adhesive curing layer is less than 1 μm; And / or, the substrate layer is a glass component.

[0011] In some embodiments, the transmittance of the support layer is greater than 91%, the pencil hardness is greater than or equal to 6.5H, the flatness of the surface of the support layer in contact with the first adhesive curing layer is less than 1 μm; and / or, the bending radius of the support layer is less than or equal to 20 mm; and / or, the support layer is a UTG layer.

[0012] A second aspect of this application also provides a manufacturing jig for manufacturing an AR waveguide panel master according to the first aspect described above, the manufacturing jig comprising: Vacuum adsorption base; and A support base is disposed on the vacuum adsorption base, and a release coating is provided on the side of the support base facing away from the vacuum adsorption base; The support base has a corresponding number of recessed suction grooves for the sub-panels in the AR waveguide panel master plate. The length and width of the recessed suction grooves are smaller than the length and width of the sub-panel, and the length and width of the recessed suction grooves are larger than the length and width of the grating imprinting area.

[0013] As a further improvement to the above technical solution: In some embodiments, the support base has a group of fine holes surrounding the concave suction groove near the outer edge of each concave suction groove; and / or, the flatness of the upper surface of the support base is less than 1 μm.

[0014] Compared to existing technologies, the AR waveguide panel template and manufacturing jig provided in this application have at least the following beneficial effects: The AR waveguide panel master provided in this application supports a first adhesive curing layer through a support layer, and sub-panels are embedded in several nested grooves on the first adhesive curing layer. Gaps between adjacent sub-panels are filled with sealant strips. The side of each sub-panel facing away from the support layer is a structural surface, and all the structural surfaces of the sub-panels are flush. A grating imprinting area is provided on the structural surface. Since the AR waveguide panel master provided in this application is assembled from several finished sub-panels in the first adhesive curing layer, it achieves the function of imprinting multiple optical functional areas at once. Furthermore, based on the structural scheme of this application, ensuring that each individual finished sub-panel is of good quality during manufacturing guarantees that the entire AR waveguide panel master is of good quality. Therefore, the structural scheme of this application improves the yield rate of AR waveguide panel master manufacturing, simplifies the structure, and reduces process requirements.

[0015] Other features and advantages of the embodiments of this application will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the following detailed description to explain the embodiments of this application, but do not constitute a limitation on the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings: Figure 1 A schematic diagram of the structure of an AR optical waveguide panel template provided in this application embodiment; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 This is a schematic diagram of the structure of a jig for manufacturing, provided in an embodiment of this application. Figure 4 for Figure 3 A magnified view of a portion of point B in the middle; Figure 5 This application provides a schematic diagram showing the state of the sub-panels placed on the manufacturing fixture during the fabrication of an AR optical waveguide panel master template. Figure 6 This application provides a schematic diagram showing the state of applying and curing adhesive on the sub-panels to form a first adhesive curing layer during the fabrication of an AR optical waveguide panel master.

[0017] Explanation of reference numerals in the attached figures 100. AR waveguide panel master; 110. Support layer; 120. First adhesive curing layer; 121. Nesting groove; 122. Sealing strip; 130. Sub-panel; 130a. Structural surface; 131. Substrate layer; 132. Second adhesive curing layer; 1320. Grating imprinting area; 200. Fixture making; 210. Vacuum adsorption base; 211. Adsorption hole; 220. Support base; 221. Concave suction groove; 222. Fine hole group; 230. Demolding coating. Detailed Implementation

[0018] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0019] The present application will now be described in detail with reference to the accompanying drawings and exemplary embodiments.

[0020] Example 1 Please see Figure 1 and Figure 2 This embodiment provides an AR optical waveguide panel master 100, which is used to imprint the grating structure on the AR optical waveguide.

[0021] The AR waveguide panel master 100 includes a support layer 110, a first adhesive curing layer 120, and a sub-panel 130. The support layer 110 is used to support and fix the first adhesive curing layer 120 and the sub-panel 130.

[0022] The first adhesive curing layer 120 is formed by curing adhesive. In this embodiment, the first adhesive curing layer 120 is formed above the support layer 110. The upper surface of the first adhesive curing layer 120 is recessed with a plurality of nesting grooves 121. A sealant strip 122 integral with the first adhesive curing layer 120 is formed between two adjacent nesting grooves 121.

[0023] The number of sub-panels 130 corresponds to the number of nesting slots 121. The sub-panels 130 are embedded in the corresponding nesting slots 121, which can effectively prevent the sub-panels 130 from falling off. Thus, it can be understood that the gap between each two adjacent sub-panels 130 is filled by a sealant strip 122.

[0024] It should also be noted that the first adhesive curing layer 120 can be formed after all the sub-panels 130 have been arranged in advance (with a gap left between adjacent sub-panels 130). Then, adhesive is injected into the gaps between the sub-panels 130 to fill them (dispensing followed by spin coating can be used). After the adhesive cures, the first adhesive curing layer 120 is formed, thereby forming the nesting groove 121 of the nested sub-panels 130. The entire first adhesive curing layer 120 and the sub-panels 130 form a complete closed unit.

[0025] The side of the sub-panel 130 facing away from the support layer 110 is a structural surface 130a, on which a grating imprinting area 1320 is provided. All sub-panels 130 have their structural surfaces 130a flush. The grating imprinting area 1320 is a region that carries the micro / nano structure texture pattern and is used to imprint an optically functional grating structure. In this embodiment, designing all sub-panels 130 with their structural surfaces 130a flush ensures good consistency in the grating structure imprinted by each sub-panel 130 during subsequent grating imprinting.

[0026] The AR waveguide master plate 100 provided in this embodiment is assembled from several (two or more) finished sub-panels 130 within the first adhesive curing layer 120. This achieves the function of imprinting multiple optical functional areas in a single operation. Furthermore, based on the structural scheme of this application, ensuring the quality of each individual finished sub-panel 130 during manufacturing guarantees the quality of the entire AR waveguide master plate 100. Therefore, the structural scheme of this application improves the yield rate of the AR waveguide master plate 100, simplifies the structure, and reduces process requirements.

[0027] To more clearly describe the technical solution of this application, the structure of the AR optical waveguide panel master 100 provided in this embodiment is described in detail below: The aforementioned sub-panel 130 includes a substrate layer 131 and a second adhesive curing layer 132 formed on the substrate layer 131; similarly, the second adhesive curing layer 132 is also formed by adhesive curing. The side of the second adhesive curing layer 132 facing away from the substrate layer 131 is the structural surface 130a, that is, the side of the second adhesive curing layer 132 facing away from the substrate layer 131 is provided with a grating imprinting area 1320.

[0028] It should be noted that traditional embossing molds, due to the direct cleaning of uncured adhesive, result in gaps or steps between adjacent embossed areas. Therefore, in this embodiment, the height difference between the top surface of any sealant strip 122 and the structural surface 130a on the adjacent second cured adhesive layer 132 is designed to be less than 500 nm. Optionally, the height difference can be further less than 430 nm. This avoids problems such as watermarks, pitting, and grating structure collapse in the final embossed appearance due to a large height difference during subsequent embossing.

[0029] The flatness of the surface formed by all structural surfaces 130a and the side of the first adhesive curing layer 120 facing away from the support layer 110 is less than 1µm. In other words, the flatness of the surface formed by the upper surface of all second adhesive curing layers 132 and the first adhesive curing layer 120 is less than 1µm. This ensures that the top surface of the entire AR waveguide panel 100 is relatively flat, thereby further ensuring the consistency of subsequent grating imprinting and avoiding problems such as watermarks, pitting, and grating structure collapse in the appearance after imprinting.

[0030] Furthermore, the depth of the nesting groove 121 is less than the thickness of the first adhesive curing layer 120. This serves several purposes: firstly, it prevents the substrate layer 131 of the sub-panel 130 from directly contacting the support layer 110, while the first adhesive curing layer 120 effectively connects the substrate layer 131 and the support layer 110, improving the stability of the sub-panel 130 after installation; secondly, each sub-panel 130 has a certain thickness error, which can be eliminated by the first adhesive curing layer 120 reserved between the substrate layer 131 and the support layer 110, ensuring that the structural surfaces 130a of each sub-panel 130 are flush, improving the consistency of the imprinting; and thirdly, it allows control over the flatness of the side of the first adhesive curing layer 120 near the support layer 110 after curing, thus ensuring the flatness of the surface of the AR waveguide panel master 100 after molding.

[0031] In some embodiments, the first adhesive curing layer 120 and the second adhesive curing layer 132 are both formed by curing the same adhesive, thus resulting in a better bonding effect after curing and consistent tension on the common surface.

[0032] Optionally, both the first adhesive curing layer 120 and the second adhesive curing layer 132 are formed by UV adhesive curing, and the Young's modulus of the UV adhesive is greater than or equal to 3 GPa. A high Young's modulus can be better used for grating structure replication.

[0033] The visible light transmittance of the substrate layer 131 is greater than 91%, with low UV light blocking. The flatness of the surface of the substrate layer 131 in contact with the second adhesive curing layer 132 is less than 1μm, ensuring uniform imprinting. Optionally, the substrate layer 131 is made of glass, characterized by being scratch-free and colorfast, having good transparency, being wear-resistant, and having good control over flatness.

[0034] Furthermore, the substrate layer 131 has a hardness greater than or equal to 6.5H, making it wear-resistant and preventing scratches during the imprinting process.

[0035] The support layer 110 has a transmittance greater than 91% and low UV light blocking. Its pencil hardness is greater than or equal to 6.5H, which helps it resist ink abrasion and scratches, facilitating subsequent contact and adsorption by the vacuum suction cup for even application of the adhesive. The surface of the support layer 110 in contact with the first adhesive curing layer 120 has a flatness of less than 1μm, ensuring uniform pressure during printing.

[0036] Furthermore, the bending radius of the support layer 110 is less than or equal to 20 mm; thus, the small bending radius enables soft-on-hard roller imprinting without damaging the substrate.

[0037] In some embodiments, the support layer 110 is a UTG layer; the UTG layer serves as a substrate for: 1. performing soft-to-hard imprinting; 2. supporting these sub-panel structures 130; 3. serving as a wear-resistant substrate that can subsequently come into direct contact with the uniform adhesive vacuum chuck.

[0038] The AR waveguide panel master 100 provided in this embodiment is composed of a support layer 110, a first adhesive curing layer 120 and multiple sub-panels 130. This panel mold not only has no splicing gaps, but also the top surface of the caulking strip 122 is basically consistent with the height of the structural surface 130a on the adjacent second adhesive curing layer 132 (≤500nm), and the surface structure and composition are consistent, and the surface tension is consistent (the same type of adhesive), forming a complete closed whole.

[0039] Example 2 Please see Figure 3 This embodiment provides a jig 200 for fabricating the AR waveguide panel master 100 provided in Embodiment 1 above.

[0040] The jig 200 includes a vacuum adsorption base 210 and a support base 220. The support base 220 is mounted on the vacuum adsorption base 210. The vacuum adsorption base 210 is externally connected to a vacuum generator. The vacuum adsorption base 210 fixes the support base 220 by negative pressure adsorption. A release coating 230 (e.g., ...) is provided on the side of the support base 220 facing away from the vacuum adsorption base 210. Figure 5 (as shown), so as to facilitate the subsequent separation of the AR waveguide panel master 100 and the support base 220.

[0041] The support base 220 has a corresponding number of recessed suction grooves 221 for the sub-panels 130 in the AR waveguide panel master 100. The length and width of the recessed suction grooves 221 are smaller than the length and width of the sub-panel 130, and the length and width of the recessed suction grooves 221 are larger than the length and width of the grating imprint area 1320, so as to support the sub-panel 130 (e.g., Figure 5 As shown), while avoiding the grating imprinting area 1320.

[0042] Please refer to the following: Figure 4 , Figure 5 and Figure 6It is understandable that when making the AR waveguide panel master 100, the corresponding number of sub-panels 130 are first upside down on the support base 220, and the sub-panels 130 and the concave suction grooves 221 are arranged in a one-to-one correspondence. The concave suction grooves 221 adopt an inward shrinking design, which on the one hand can use the outer edge to support the sub-panels 130; on the other hand, it can avoid the grating imprint area 1320 and protect the integrity of the grating imprint area 1320.

[0043] Furthermore, the support base 220 has a group of fine holes 222 surrounding each concave suction groove 221 near the outer edge of the concave suction groove 221, and the group of fine holes 222 extends along the thickness direction of the support base 220. In this way, the negative pressure airflow generated on the vacuum suction base 210 passes through its own suction holes 211 and then through the group of fine holes 222 to further adsorb and position the sub-assembly 130, avoiding displacement during subsequent manufacturing processes.

[0044] Optionally, the concave suction groove 221 is 0.5 mm inward relative to the outer shape of the sub-panel 130. The fine hole group 222 is composed of multiple micropores, which are spaced 0.18~0.34 mm apart and have a diameter of 0.23~0.35 mm.

[0045] After all sub-panels 130 are positioned and adsorbed (visual positioning and arrangement can be performed using a CCD camera), UV adhesive is applied to the side of the sub-panels 130 facing away from the support base 220. Slot coating or spin coating can be used to ensure the adhesive covers all sub-panels 130. Then, the support layer 110 is brought into contact with the adhesive-coated side of the sub-panels 130, and cured using a roller pressing method and overall exposure. The next step is then performed to finally obtain the AR waveguide panel master 100 provided in Example 1.

[0046] In some embodiments, in order to reduce manufacturing costs, the vacuum adsorption base 210 may not have adsorption holes 211 in the area corresponding to the concave suction groove 221.

[0047] In some embodiments, the flatness of the upper surface of the support base 220 is less than 1 μm. The thickness can be selected from 0.5 to 1.25 mm.

[0048] Optionally, the support base 220 is made of glass; the vacuum adsorption base 210 can be made of metal, such as aluminum alloy, copper or steel.

[0049] The AR waveguide master template 100 fabricated using the jig 200 provided in this embodiment has a splicing position accuracy of 0.005-0.01 mm. The splicing step height is less than 500 nm. This enables rapid large-size micro / nano imprinting, improving production efficiency and reducing master template development costs.

[0050] It should be noted that, in this application, unless otherwise stated, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0051] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0054] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. An AR optical waveguide panel master, characterized in that, include: Support layer (110); A first adhesive curing layer (120) is formed above the support layer (110). The upper surface of the first adhesive curing layer (120) is recessed with a plurality of nested grooves (121). A sealant strip (122), integral with the first adhesive curing layer (120), is formed between two adjacent nested grooves (121). The number of sub-panels (130) corresponds to the number of nesting slots (121). The sub-panels (130) are embedded in the corresponding nesting slots (121). The side of the sub-panel (130) facing away from the support layer (110) is the structural surface (130a). The structural surfaces (130a) of all the sub-panels (130) are flush. The structural surface (130a) is provided with a grating imprinting area (1320).

2. The AR optical waveguide panel master according to claim 1, characterized in that, The height difference between the top surface of any of the sealant strips (122) and the adjacent structural surface (130a) is less than 500 nm.

3. The AR optical waveguide panel master according to claim 1, characterized in that, The surface flatness of all the structural surfaces (130a) and the side of the first adhesive curing layer (120) facing away from the support layer (110) is less than 1 μm.

4. The AR optical waveguide panel master according to claim 1, characterized in that, The depth of the nested groove (121) is less than the thickness of the first adhesive curing layer (120).

5. The AR optical waveguide panel master according to claim 1, characterized in that, The sub-panel (130) includes a substrate layer (131) and a second adhesive curing layer (132) formed on the substrate layer (131), wherein the side of the second adhesive curing layer (132) facing away from the substrate layer (131) is the structural surface (130a).

6. The AR optical waveguide panel master according to claim 5, characterized in that, The first adhesive curing layer (120) and the second adhesive curing layer (132) are both formed by curing the same adhesive. Alternatively, both the first adhesive curing layer (120) and the second adhesive curing layer (132) are formed by UV adhesive curing, and the Young's modulus of the UV adhesive is greater than or equal to 3 GPA.

7. The AR optical waveguide panel master according to claim 5, characterized in that, The visible light transmittance of the substrate layer (131) is greater than 91%, and the flatness of the surface of the substrate layer (131) in contact with the second adhesive curing layer (132) is less than 1 μm. And / or, the substrate layer (131) is a glass material.

8. The AR optical waveguide panel master according to any one of claims 1-7, characterized in that, The transmittance of the support layer (110) is greater than 91%, the pencil hardness is greater than or equal to 6.5H, the flatness of the surface of the support layer (110) in contact with the first adhesive curing layer (120) is less than 1μm; and / or, the bending radius of the support layer (110) is less than or equal to 20mm; and / or, the support layer (110) is a UTG layer.

9. A jig for manufacturing, characterized in that, For fabricating the AR waveguide panel master (100) according to any one of claims 1-8, the fabrication fixture (200) comprises: Vacuum adsorption base (210); and A support base (220) is disposed on the vacuum adsorption base (210), and a release coating (230) is provided on the side of the support base (220) facing away from the vacuum adsorption base (210). The support base (220) is provided with a corresponding number of recessed suction grooves (221) on the sub-panel (130) in the AR waveguide panel master plate (100). The length and width of the recessed suction groove (221) are smaller than the length and width of the sub-panel (130), and the length and width of the recessed suction groove (221) are larger than the length and width of the grating imprint area (1320).

10. The jig for manufacturing according to claim 9, characterized in that, The support base (220) has a group of fine holes (222) surrounding the concave suction groove (221) near the outer edge of each concave suction groove (221); and / or, the flatness of the upper surface of the support base (220) is less than 1 μm.

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