A new type of heat dissipation computer case

Abstract

The utility model discloses a novel heat dissipation computer case, including case subassembly, heat dissipation air duct subassembly, control assembly and limiting component, heat dissipation air duct subassembly is located in the inner side wall of case subassembly, is convenient for with the cold air from the case side face import case interior, control assembly is located in the inner side wall of case subassembly, is convenient for the electronic element in the case interior carries out the control, limiting component is located in the inner side wall of case subassembly, is used for the location of case, heat dissipation air duct subassembly includes mainboard fan support and fan protective cover, mainboard fan support is located in the inner side wall of case subassembly, is convenient for with the cold wind accurate blowing to the mainboard power supply MOS pipe and carries out the cooling heat that produces from the case top exhaust, fan protective cover is located one end of mainboard fan support, and fan protective cover is convenient for the isolation of the excess wire rod in the case interior, avoids the interference and damage in the running process of fan scattering leaf.

Description

Technical Field

[0001] This utility model relates to the field of computer case technology, specifically a novel heat-dissipating computer case. Background Technology

[0002] With the continuous improvement of computer hardware performance, the heat dissipation requirements of CPUs, GPUs, and high-power storage devices (such as multi-drive arrays) are becoming increasingly stringent. Traditional computer case heat dissipation designs mostly adopt a "passive airflow + local reinforcement" mode. Especially in open-style cases, which are characterized by their high transparency, heat dissipation performance and hardware compatibility often face technical bottlenecks.

[0003] Traditional computer cases typically have their air intakes concentrated on the sides and bottom. Side intakes, due to their structural limitations, cannot directly target and cool storage devices like hard drives and SSDs, leading to prolonged heat buildup. Bottom intakes, while providing targeted cooling to components like graphics cards, suffer from uneven airflow distribution and clogged filters, limiting actual cooling efficiency, especially under heavy loads with multiple components, potentially causing localized overheating. Traditional exhaust vents rely on side panel mesh or a single top exhaust channel. The side panel mesh area often forms a loose airflow path with the rear fan bracket, cover, and cable management cover, creating negative pressure for auxiliary heat dissipation, but the discontinuous airflow structure results in low efficiency of hot air removal around the CPU cooler. Top exhaust vents concentrate heat due to the natural upward movement of hot air, but lack coordination with bottom intakes, leading to poor hot air circulation and heat buildup within the case. To address this issue, the inventors propose a novel cooling computer case. Utility Model Content

[0004] In view of the shortcomings of the above-mentioned technologies, this utility model provides a new type of heat-dissipating computer case.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a novel heat-dissipating computer chassis, comprising a chassis assembly, a heat dissipation duct assembly, a control assembly, and a limiting assembly. The heat dissipation duct assembly is disposed on the inner side wall of the chassis assembly to facilitate heat dissipation from the chassis. The control assembly is disposed on the inner side wall of the chassis assembly to facilitate the control of electronic components inside the chassis. The limiting assembly is disposed on the inner side wall of the chassis assembly to limit the movement of the chassis. The heat dissipation duct assembly includes a motherboard fan bracket and a fan cover. The motherboard fan bracket is disposed on the inner side wall of the chassis assembly to facilitate the exhaust of heat generated by the CPU from the top of the chassis. The fan cover is disposed at one end of the motherboard fan bracket.

[0006] As further explained, the control component includes an I / O cover and a control panel. The I / O cover is located at one end of the chassis assembly, and the control panel is located on the inner side wall of the I / O cover to facilitate the operation of the electronic components inside the chassis. One end of the control panel is provided with an LED light strip, one end of the LED light strip is provided with a light guide strip, and one end of the light guide strip is provided with a light strip device plate.

[0007] As further explained, the limiting component includes a pull rod body, a pull rod fixing block, and a connecting block. The pull rod body is located on the inner side wall of the chassis assembly, the pull rod fixing block is located on the inner side wall of the pull rod body, and the connecting block is located on the inner side wall of the chassis assembly, which facilitates limiting the chassis.

[0008] As further explained, the chassis assembly includes a base plate, a rear cover plate, a top cover plate, a right side plate, and feet. The base plate is disposed on the upper surface of the feet, the rear cover plate is disposed on the upper surface of the base plate, the top cover plate is disposed on the upper surface of the rear cover plate, the right side plate is located on one side of the rear cover plate and the base plate, the I / O cover plate is located at one end of the rear cover plate, the pull rod body is located on the inner side wall of the right side plate, and the connecting block is located on the inner side wall of the rear cover plate.

[0009] As further explained, one end of the upper cover plate is provided with a front cover plate, the inner side wall of the front cover plate is provided with a support column for support, and one end of the support column is provided with a frame to facilitate support of the chassis shell.

[0010] As further explained, the upper surface of the upper cover plate is provided with an upper cover mesh decorative plate, and one end of the upper cover mesh decorative plate is provided with an upper cover fixing plate for fixing.

[0011] As further explained, the inner wall of the rear cover is provided with an I / O rear plate, the inner wall of the rear cover is provided with a PCI slot, one end of the rear cover is provided with a motherboard body, one end of the motherboard body is provided with a graphics card bracket for supporting the graphics card, one end of the motherboard body is provided with a power supply bracket for supporting the power supply, and the motherboard fan bracket is located on the inner wall of the motherboard body.

[0012] As further explained, one end of the motherboard body is provided with a motherboard cable cover, the inner sidewall of the motherboard body is provided with a silicone wire guide, the inner sidewall of the motherboard body is provided with an HDD hard drive bracket, and one end of the motherboard body is provided with a motherboard cover for protecting the motherboard body.

[0013] As a further explanation, it also includes a side panel glass, a side panel upper retaining strip, and a side panel lower retaining strip. The side panel glass is disposed on the inner side wall of the right side panel, the side panel upper retaining strip is disposed on the upper surface of the side panel glass, and the side panel lower retaining strip is disposed on the bottom of the side panel glass.

[0014] As a further explanation, it also includes a panel glass body, an upper panel glass retaining strip, and a lower panel glass retaining strip. The panel glass body is disposed on the inner side wall of the front cover plate, the upper panel glass retaining strip is disposed on the upper surface of the panel glass body, and the lower panel glass retaining strip is disposed on the bottom of the front cover plate.

[0015] In summary, this utility model has the following beneficial effects: This utility model provides a novel heat-dissipating computer chassis. The heat dissipation airflow assembly adopts a collaborative design between the motherboard fan bracket and the top fan cover, forming a vertical airflow structure of "bottom air intake - top directional heat exhaust." Compared to the loose airflow of traditional chassis with mesh exhaust on the side panels, the motherboard fan bracket precisely targets the CPU area, and the top exhaust vents enable rapid upward expulsion of hot air, effectively preventing hot air stagnation around the CPU cooler. Simultaneously, the bottom air intake is optimized to distribute heat to key heat-generating areas such as the graphics card and storage devices. The use of silicone airflow coils reduces airflow resistance, solving the problems of easy blockage and uneven distribution in traditional bottom air intake systems. This upgrade from "passive airflow" to "active directional cooling" improves heat dissipation efficiency by more than 30%. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a novel heat-dissipating computer case according to the present invention.

[0017] Figure 2 This is a schematic diagram of the internal structure of a novel heat-dissipating computer case according to the present invention.

[0018] Figure 3 This is a schematic diagram of the internal structure of a novel heat-dissipating computer case according to the present invention.

[0019] Figure 4 This is a schematic diagram of the internal structure of a novel heat-dissipating computer case according to the present invention.

[0020] Figure 5 This is a schematic diagram of the internal structure of a novel heat-dissipating computer case according to the present invention.

[0021] Figure 6 This is an exploded view of a novel heat-dissipating computer case according to the present invention.

[0022] Figure 7 This is a schematic diagram of the airflow structure of the motherboard cable shield of a novel heat dissipation computer case according to this utility model.

[0023] Figure 8 This is a schematic diagram of the airflow structure of a motherboard fan bracket for a novel heat-dissipating computer case according to this utility model. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figure 1-8 As shown, this utility model discloses a novel heat-dissipating computer chassis, including a chassis assembly, a heat dissipation duct assembly, a control assembly, and a limiting assembly. The heat dissipation duct assembly is located on the inner wall of the chassis assembly to facilitate heat dissipation from the chassis. The control assembly is located on the inner wall of the chassis assembly to facilitate the control of the electronic components inside the chassis. The limiting assembly is located on the inner wall of the chassis assembly to limit the movement of the chassis. The heat dissipation duct assembly includes a motherboard fan bracket 21 and a fan cover 22. The motherboard fan bracket 21 is located on the inner wall of the chassis assembly to facilitate the exhaust of heat generated by the CPU from the top of the chassis. The fan cover 22 is located at one end of the motherboard fan bracket 21.

[0026] Specifically, the heat dissipation airflow assembly centers on the motherboard fan bracket 21, forming a vertical airflow channel of "bottom intake - top directional heat dissipation". The bottom air intake (located in the base plate 11 area) draws in cool air, which is then guided by the silicone coil 118 to the top of the motherboard body 113, first cooling the hardware below, such as the graphics card and SSD. The airflow rises along the surface of the motherboard body 113, is precisely guided to the CPU area by the motherboard fan bracket 21, and, in conjunction with the exhaust function of the fan cover 22, efficiently dissipates the heat generated by the CPU through the top cover mesh decorative plate 101. The PCI slots 111 of the rear cover 13 and the I / O rear plate 110 work together to optimize the airflow path, forming a directional cooling chain of "bottom intake - storage devices - CPU area - top heat dissipation", solving the problems of traditional chassis side intake not being able to cover storage devices and top single-channel heat dissipation easily accumulating heat.

[0027] The control assembly includes an I / O cover plate 31 and a control panel 32. The I / O cover plate 31 is located at one end of the chassis assembly, and the control panel 32 is located on the inner side wall of the I / O cover plate 31, which facilitates the operation of the electronic components inside the chassis. One end of the control panel 32 is provided with an LED light strip 33, one end of the LED light strip 33 is provided with a light guide strip 35, and one end of the light guide strip 35 is provided with a light strip device plate 34.

[0028] Specifically, the control components are integrated inside the I / O cover 31. The control panel 32 is equipped with LED light strips 33 and light guide strips 35, and the status is visualized through the light strip device board 34. Users can directly operate the electronic components on the motherboard body 113 (such as the power supply bracket 114 and the graphics card bracket 115) through the control panel 32. With the cable management functions of the motherboard cable cover 116 and the silicone wire guide coil 118, the internal space utilization is optimized. The HDD hard drive cage 112 is located inside the motherboard body 113 and is directly cooled through bottom air intake. The power supply bracket 114 and the graphics card bracket 115 support the power supply and the graphics card respectively, ensuring the stability of the hardware installation.

[0029] The limiting component includes a pull rod body 41, a pull rod fixing block 42, and a connecting block 43. The pull rod body 41 is located on the inner side wall of the chassis component, the pull rod fixing block 42 is located on the inner side wall of the pull rod body 41, and the connecting block 43 is located on the inner side wall of the chassis component, which facilitates limiting the chassis.

[0030] Specifically, the lever body 41, lever fixing block 42 and connecting block 43 of the limiting component constitute a triple limiting mechanism, which, together with the inner sidewall positioning of the right side plate 15 and the rear cover plate 13, ensures the structural stability of the high-transparency glass shell (such as the side plate glass 120 and the panel glass) under the open design, and avoids resonance or deformation.

[0031] The chassis assembly includes a base plate 11, a rear cover plate 13, a top cover plate 14, a right side panel 15, and feet 16. The base plate 11 is located on the upper surface of the feet 16, the rear cover plate 13 is located on the upper surface of the base plate 11, the top cover plate 14 is located on the upper surface of the rear cover plate 13, the right side panel 15 is located on one side of the rear cover plate 13 and the base plate 11, the I / O cover plate 31 is located at one end of the rear cover plate 13, the pull rod body 41 is located on the inner side wall of the right side panel 15, and the connecting block 43 is located on the inner side wall of the rear cover plate 13. A front cover plate 12 is located at one end of the top cover plate 14, and a support column 18 is located on the inner side wall of the front cover plate 12 for support. A frame 17 is located at one end of the support column 18 to facilitate support of the chassis shell. A perforated decorative panel 101 is located on the upper surface of the top cover plate 14, and a fixing plate 102 is located at one end of the perforated decorative panel 101 for fixing.

[0032] Specifically, the combination of the feet 16 and the base plate 11 provides stable support and reduces the impact of external vibrations on the internal hardware of the chassis through the cushioning effect of the feet 16, ensuring the continuous and efficient operation of the heat dissipation system.

[0033] The inner wall of the rear cover 13 is provided with an I / O rear plate 110, and a PCI slot 111. One end of the rear cover 13 is provided with a motherboard body 113, a graphics card bracket 115 for supporting the graphics card, and a power supply bracket 114 for supporting the power supply. The motherboard fan bracket 21 is located on the inner wall of the motherboard body 113. One end of the motherboard body 113 is provided with a motherboard cable management cover 116, and the inner wall of the motherboard body 113 is provided with a silicone wire guide 118. An HDD hard drive bracket 112 is located on the inner wall of the motherboard body 113. One end of the motherboard body 113 is provided with a motherboard cover 117 for protecting the motherboard body 113.

[0034] Specifically, the coordinated optimization of the top exhaust vent and bottom intake vent, combined with the layout of the PCI slots 111 and I / O rear panel 110 on the inner side of the rear cover 13, reduces ineffective circulation of hot air within the chassis. The support pillars 18 and frame 17 on the inner side of the front cover 12 form a chassis support skeleton, enhancing the overall rigidity of the chassis. The motherboard cable management cover 116 works in conjunction with the silicone cable guide coils 118 to standardize cable paths and reduce airflow obstruction; the HDD drive cage 112 and power supply bracket 114 are precisely positioned to ensure stable hardware installation and unobstructed heat dissipation paths.

[0035] It also includes a side panel glass 120, a side panel upper retaining strip 121, and a side panel lower retaining strip 122. The side panel glass 120 is located on the inner side wall of the right side panel 15. The side panel upper retaining strip 121 is located on the upper surface of the side panel glass 120, and the side panel lower retaining strip 122 is located at the bottom of the side panel glass 120. It also includes a front panel glass body 123, a front panel glass upper retaining strip 124, and a front panel glass lower retaining strip 125. The front panel glass body 123 is located on the inner side wall of the front cover plate 12. The front panel glass upper retaining strip 124 is located on the upper surface of the front panel glass body 123, and the front panel glass lower retaining strip 125 is located at the bottom of the front cover plate 12.

[0036] Specifically, the side panel glass 120 on the inner side of the right side panel 15 is fixed to the side panel lower clip 122 by the upper clip 121 on the side panel, and the panel glass body 123 on the inner side of the front cover 12 is fixed to the panel glass lower clip 125 by the upper clip 124 on the panel glass, forming a double protection of "snap-limit" to ensure the tight fit between the glass panel and the chassis frame 17 and reduce the risk of air leakage.

[0037] The heat dissipation airflow assembly adopts a collaborative design between the motherboard fan bracket 21 and the top fan cover 22 to form a vertical airflow structure of "bottom air intake - top directional heat exhaust". Compared with the loose airflow of traditional chassis side panel mesh heat exhaust, this invention uses the motherboard fan bracket 21 to precisely align with the CPU area, and works with the top air outlet to achieve rapid upward exhaust of hot air, effectively avoiding the stagnation of hot air around the CPU heatsink; at the same time, the bottom air intake is optimized to distribute to key heat-generating areas such as graphics cards and storage devices, and with the silicone airflow coil 118 to reduce airflow resistance, it solves the problems of easy blockage and uneven distribution of traditional bottom air intake, realizing an upgrade from "passive airflow" to "active directional cooling", improving heat dissipation efficiency by more than 30%.

[0038] MOSFETs (not shown) generate a lot of heat under high loads (such as high CPU current requirements, multiple games running simultaneously, stress testing, etc.). Insufficient heat dissipation can lead to excessively high temperatures (in some cases, the MOSFET temperature reached 98 degrees Celsius, even 20 degrees Celsius higher than the CPU). The airflow from the motherboard cable management cover 116 can directly blow air onto the MOSFET or its heatsink, accelerating heat dissipation and effectively reducing the operating temperature.

[0039] Overheating of MOSFETs can lead to voltage instability, which in turn can cause CPU throttling, game frame drops, and other problems. Improving airflow in the cooling system can reduce such instability and ensure sustained hardware performance.

[0040] Motherboards (such as X99, gaming motherboards, etc.) have high power consumption due to their power supply design (such as multiple MOSFETs) or positioning (gaming, high performance). Independent cooling fans can specifically enhance heat dissipation to meet high load requirements.

[0041] In real-world applications, the airflow generated by the shielding cover successfully reduced the excessively high temperature of the MOSFET, resolving the frequency reduction issue caused by overheating and verifying the practicality of the cooling system's airflow.

[0042] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0043] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A novel heat-dissipating computer case, characterized in that: Including chassis components; A heat dissipation duct assembly is disposed on the inner side wall of the chassis assembly to facilitate heat dissipation from the chassis. A control component is located on the inner wall of the chassis assembly, which facilitates the operation of electronic components inside the chassis. A limiting component is provided on the inner sidewall of the chassis assembly for limiting the chassis position. The heat dissipation airflow assembly includes a motherboard fan bracket and a fan cover. The motherboard fan bracket is located on the inner side wall of the chassis assembly to facilitate the exhaust of heat generated by the CPU from the top of the chassis. The fan cover is located at one end of the motherboard fan bracket.

2. The novel heat-dissipating computer chassis according to claim 1, characterized in that: The control component includes an I / O cover and a control panel. The I / O cover is located at one end of the chassis assembly, and the control panel is located on the inner side wall of the I / O cover to facilitate the operation of electronic components inside the chassis. One end of the control panel is provided with an LED light strip, one end of the LED light strip is provided with a light guide strip, and one end of the light guide strip is provided with a light strip device plate.

3. A novel heat-dissipating computer chassis according to claim 2, characterized in that: The limiting component includes a pull rod body, a pull rod fixing block, and a connecting block. The pull rod body is located on the inner side wall of the chassis assembly, the pull rod fixing block is located on the inner side wall of the pull rod body, and the connecting block is located on the inner side wall of the chassis assembly, which facilitates limiting the chassis.

4. A novel heat-dissipating computer chassis according to claim 3, characterized in that: The chassis assembly includes a base plate, a rear cover plate, a top cover plate, a right side plate, and feet. The base plate is located on the upper surface of the feet, the rear cover plate is located on the upper surface of the base plate, the top cover plate is located on the upper surface of the rear cover plate, the right side plate is located on one side of the rear cover plate and the base plate, the I / O cover plate is located at one end of the rear cover plate, the pull rod body is located on the inner side wall of the right side plate, and the connecting block is located on the inner side wall of the rear cover plate.

5. A novel heat-dissipating computer chassis according to claim 4, characterized in that: One end of the upper cover plate is provided with a front cover plate, and the inner side wall of the front cover plate is provided with a support column for support. One end of the support column is provided with a frame to facilitate the support of the chassis shell.

6. A novel heat-dissipating computer chassis according to claim 5, characterized in that: The upper surface of the upper cover plate is provided with an upper cover mesh decorative plate, and one end of the upper cover mesh decorative plate is provided with an upper cover fixing plate for fixing.

7. A novel heat-dissipating computer chassis according to claim 4, characterized in that: The inner wall of the rear cover is provided with an I / O rear plate, the inner wall of the rear cover is provided with a PCI slot, one end of the rear cover is provided with a motherboard body, one end of the motherboard body is provided with a graphics card bracket for supporting the graphics card, one end of the motherboard body is provided with a power supply bracket for supporting the power supply, and the motherboard fan bracket is located on the inner wall of the motherboard body.

8. A novel heat-dissipating computer chassis according to claim 7, characterized in that: One end of the motherboard body is provided with a motherboard cable cover, the inner side wall of the motherboard body is provided with a silicone wire guide, the inner side wall of the motherboard body is provided with an HDD hard drive bracket, and one end of the motherboard body is provided with a motherboard cover for protecting the motherboard body.

9. A novel heat-dissipating computer chassis according to claim 4, characterized in that: It also includes a side panel glass, a side panel upper retaining strip, and a side panel lower retaining strip. The side panel glass is located on the inner side wall of the right side panel, the side panel upper retaining strip is located on the upper surface of the side panel glass, and the side panel lower retaining strip is located at the bottom of the side panel glass.

10. A novel heat-dissipating computer chassis according to claim 5, characterized in that: It also includes a panel glass body, an upper panel glass retaining strip, and a lower panel glass retaining strip. The panel glass body is located on the inner side wall of the front cover plate, the upper panel glass retaining strip is located on the upper surface of the panel glass body, and the lower panel glass retaining strip is located at the bottom of the front cover plate.

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