A computer CPU processor heat dissipation device

Abstract

The utility model relates to the technical field of processor, concretely relates to a computer CPU processor heat abstractor, including radiator body, the recess is opened at the top of radiator body, the side surface fixed connection of radiator body has limit baffle, the bottom all around fixed connection of radiator body has the mounting bracket, the bottom fixed connection of radiator body has the heat conduction bottom plate, both sides fixed connection of heat conduction bottom plate has the fixed plate, the inside of fixed plate is equipped with the sliding slot no.

Description

Technical Field

[0001] This utility model belongs to the field of processor technology, and specifically relates to a heat dissipation device for a computer CPU processor. Background Technology

[0002] In recent years, with the continuous advancement of technology, the equipment and components in the field of personal computers have also been changing rapidly. Related products, such as central processing units, are processing larger and larger amounts of data at increasingly faster speeds. However, the increased speed of data processing has also led to excessively high operating temperatures of internal devices and integrated circuit components in personal computers. If the heat is not dissipated in a timely manner, it will inevitably affect their normal operation, resulting in reduced execution speed and even affecting their lifespan. Therefore, installing heat dissipation devices on the processor is a common solution.

[0003] Existing heat dissipation devices often require aligning the heat dissipation device with the mounting holes on the motherboard before securing it with bolts, which is inconvenient during installation. Furthermore, existing heat dissipation devices are not easy to store the wiring harness, which is unsightly and prone to damage when hanging beside the heat dissipation device. Therefore, we propose a computer CPU processor heat dissipation device. Utility Model Content

[0004] In order to overcome the above-mentioned technical problems, the purpose of this utility model is to provide a computer CPU processor heat dissipation device to solve the problem mentioned in the background art that the existing heat dissipation devices often require the heat dissipation device to be aligned with the mounting holes on the motherboard surface before being fixed with bolts, which is inconvenient during installation. In addition, the existing heat dissipation devices are not convenient for storing the wire harness, and the wire harness is dragging next to the heat dissipation device, which is not only unsightly but also easy to damage the wire harness.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer CPU processor heat dissipation device, comprising a heat sink body, a connecting wire fixedly connected to the surface of the heat sink body, a groove formed on the top of the heat sink body, a limit baffle fixedly connected to the side surface of the heat sink body, a mounting bracket fixedly connected to the bottom of the heat sink body around its perimeter, a heat-conducting base plate fixedly connected to the bottom of the heat sink body, fixing plates fixedly connected to both sides of the heat-conducting base plate, a second sliding groove formed inside the fixing plate, a motherboard mounted on the bottom of the heat sink body, a processor body fixedly connected to the surface of the motherboard, four sets of mounting posts fixedly connected to the surface of the motherboard, two sets of first sliding grooves formed on the surface of the motherboard, a rotating groove formed at the bottom of the first sliding groove, a locking structure provided inside the second sliding groove, the locking structure including a rotating rod, a stop plate fixedly connected to the bottom of the rotating rod, a knob fixedly connected to the top of the rotating rod, a limit block fixedly connected to the surface of the rotating rod, a spring sleeved on the surface of the rotating rod, and a fixing bolt rotatably connected to the top of the mounting post.

[0006] Preferably, the heat sink body is electrically connected to the motherboard via the connecting cable.

[0007] Preferably, the limiting baffle is L-shaped, and four sets of the limiting baffle are arranged around the side surface of the radiator body.

[0008] Preferably, the four sets of mounting posts are fixedly connected to the four corners of the processor body, the fixing bolts pass through the mounting bracket and are rotatably connected to the mounting posts, and the bottom of the heat-conducting base plate is in contact with the top of the processor body.

[0009] Preferably, the radius of the limiting block is larger than the radius of the rotating rod, the limiting block is slidably connected in the second slide groove, and the two ends of the rotating rod pass through the top and bottom of the second slide groove and are fixedly connected to the knob and the abutment plate respectively.

[0010] Preferably, the two ends of the spring abut against the bottom of the limiting block and the bottom of the inner wall of the second slide groove, respectively.

[0011] Preferably, the width of the abutting plate is equal to the width of the first slide groove, the abutting plate is slidably connected in the first slide groove, and the abutting plate is rotatably connected in the rotating groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This computer CPU processor heat dissipation device features a snap-fit ​​structure. During heatsink installation, the heat-conducting base plate at the bottom of the heatsink is placed on the surface of the processor body, aligning the abutment plates at the bottom of the fixing plates on both sides of the heatsink with the sliding groove. Pressing down the knob causes the abutment plate to slide down through the rotating rod into the rotating groove. At this point, the spring is compressed. Rotating the knob displaces the abutment plate from the sliding groove. Releasing the knob pushes the limiting block upwards under the spring's action, causing the abutment plate to move upwards and engage with the top of the rotating groove, thus completing the pre-installation of the heatsink. Subsequently, the mounting bracket can be fixed to the top of the mounting post using fixing bolts, thereby installing the heatsink onto the motherboard surface. The snap-fit ​​structure allows for pre-installation of the heatsink without the need for manual alignment of the mounting bracket and mounting post, making installation more convenient.

[0014] 2. The computer CPU processor heat dissipation device is provided with a groove and a limiting baffle. The groove can store the connecting wires, and the limiting baffle can wrap the connecting wires around the side surface of the heat sink body. The connecting wires can be bundled whether the heat sink body is in use or not, preventing the connecting wires from dragging on the surface of the heat sink body, increasing the protection performance of the connecting wires and ensuring aesthetics. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0016] Figure 2 This is an exploded view of the structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the radiator body of this utility model;

[0018] Figure 4 This is an exploded sectional view of the motherboard and heat sink body of this utility model;

[0019] Figure 5 This is an exploded sectional view of the fixing plate and the engaging structure of this utility model.

[0020] In the diagram: 1. Motherboard; 11. Processor body; 12. Mounting post; 13. Slide 1; 14. Rotating slot; 2. Heatsink body; 21. Connecting wire; 22. Groove; 23. Limiting baffle; 24. Mounting bracket; 25. Heat-conducting base plate; 26. Fixing plate; 27. Slide 2; 3. Engaging structure; 31. Rotating rod; 32. Abutting plate; 33. Limiting block; 34. Spring; 35. Knob; 4. Fixing bolt. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-5 One embodiment provided by this utility model:

[0023] A computer CPU processor heat dissipation device includes a heat sink body 2, a connecting wire 21 fixedly connected to the surface of the heat sink body 2, a groove 22 formed on the top of the heat sink body 2, a limit baffle 23 fixedly connected to the side surface of the heat sink body 2, mounting brackets 24 fixedly connected to the bottom perimeter of the heat sink body 2, a heat-conducting base plate 25 fixedly connected to the bottom of the heat sink body 2, fixing plates 26 fixedly connected to both sides of the heat-conducting base plate 25, a sliding groove 27 formed inside the fixing plate 26, a motherboard 1 mounted on the bottom of the heat sink body 2, a processor body 11 fixedly connected to the surface of the motherboard 1, and a mounting bracket 24 fixedly connected to the surface of the motherboard 1. Four sets of mounting posts 12 are connected. Two sets of sliding grooves 13 are formed on the surface of the motherboard 1. A rotating groove 14 is formed at the bottom of the sliding groove 13. A locking structure 3 is provided inside the sliding groove 27. The locking structure 3 includes a rotating rod 31. A stop plate 32 is fixedly connected to the bottom of the rotating rod 31. A knob 35 is fixedly connected to the top of the rotating rod 31. A limit block 33 is fixedly connected to the surface of the rotating rod 31. A spring 34 is sleeved on the surface of the rotating rod 31. A fixing bolt 4 is rotatably connected to the top of the mounting posts 12. With the locking structure 3 in place, when installing the heatsink body 2, the heat-conducting base plate 25 at the bottom of the heatsink body 2 is placed on the processor. On the surface of the main body 11, align the abutment plates 32 at the bottom of the fixing plates 26 on both sides of the radiator body 2 with the slide groove 13. Press down the knob 35, and the rotating rod 31 will drive the abutment plate 32 to move down and slide from the slide groove 13 into the rotating groove 14. At this time, the spring 34 is compressed. Rotate the knob 35 to displace the abutment plate 32 from the slide groove 13. After releasing the knob 35, the spring 34 will push the limiting block 33 upward, causing the abutment plate 32 to have an upward tendency, so that the limiting block 33 abuts against the top of the rotating groove 14, thereby completing the pre-installation of the radiator body 2. Subsequently, the mounting bracket 24 can be fixed to the mounting bracket using the fixing bolts 4. The top of the pillar 12 allows the heatsink body 2 to be mounted on the surface of the motherboard 1. The heatsink body 2 can be pre-installed via the snap-fit ​​structure 3, eliminating the need for manual alignment of the mounting bracket 24 and the mounting pillar 12, making installation more convenient. A groove 22 and a limiting baffle 23 are provided. The groove 22 can store the connecting wire 21, and the limiting baffle 23 can wrap the connecting wire 21 around the side surface of the heatsink body 2. The connecting wire 21 can be bundled regardless of whether the heatsink body 2 is in use or not, preventing the connecting wire 21 from dragging on the surface of the heatsink body 2, increasing the protection of the connecting wire 21 while ensuring aesthetics.

[0024] Furthermore, the heatsink body 2 is electrically connected to the motherboard 1 via the connecting cable 21, and the motherboard 1 is powered by an external power supply. The motherboard 1 powers and controls the heatsink body 2.

[0025] Furthermore, the limiting baffle 23 is L-shaped, and four sets of limiting baffle 23 are arranged on the circumference of the side surface of the heat sink body 2. The connecting wire 21 can be wound around the side surface of the heat sink body 2 through the limiting baffle 23, and the connecting wire 21 can be bundled.

[0026] Furthermore, four sets of mounting posts 12 are fixedly connected to the four corners of the processor body 11, and fixing bolts 4 pass through the mounting bracket 24 and are rotatably connected inside the mounting posts 12. The bottom of the heat-conducting base plate 25 contacts the top of the processor body 11. The mounting bracket 24 is fixed to the top of the mounting post 12 by fixing bolts 4, thereby mounting the heat sink body 2 on the surface of the motherboard 1. The heat from the processor body 11 is transferred to the heat sink body 2 through the heat-conducting base plate 25.

[0027] Furthermore, the radius of the limiting block 33 is larger than the radius of the rotating rod 31. The limiting block 33 is slidably connected in the second slide groove 27. The two ends of the rotating rod 31 pass through the top and bottom of the second slide groove 27 and are fixedly connected to the knob 35 and the abutment plate 32 respectively. The maximum movement distance of the rotating rod 31 is limited by the limiting block 33 to prevent the rotating rod 31 from sliding out of the second slide groove 27. The rotating rod 31 can rotate freely in the second slide groove 27.

[0028] Furthermore, the two ends of the spring 34 abut against the bottom of the limiting block 33 and the bottom of the inner wall of the slide groove 27, respectively. When there is no external force, the spring 34 pushes the limiting block 33 upward, and drives the abutting plate 32 to move upward through the rotating rod 31, so that the abutting plate 32 abuts against the bottom of the fixed plate 26. When the spring 34 deforms, its inner surface will not interfere with the surface of the rotating rod 31.

[0029] Furthermore, the width of the abutment plate 32 is equal to the width of the slide groove 13. The abutment plate 32 is slidably connected in the slide groove 13 and rotatably connected in the rotating groove 14. Pressing down the knob 35 causes the abutment plate 32 to move down through the rotating rod 31 and slide from the slide groove 13 into the rotating groove 14. At this time, the spring 34 is compressed. Rotating the knob 35 causes the abutment plate 32 to be misaligned with the slide groove 13. After releasing the knob 35, the limiting block 33 is pushed upward under the action of the spring 34, so that the abutment plate 32 has an upward tendency to move, so that the limiting block 33 abuts against the top of the rotating groove 14, thereby completing the pre-installation of the radiator body 2.

[0030] Working principle: Both the heatsink body 2 and the motherboard 1 are existing technologies. During installation, the heat-conducting base plate 25 at the bottom of the heatsink body 2 is placed on the surface of the processor body 11, aligning the abutment plates 32 at the bottom of the fixing plates 26 on both sides of the heatsink body 2 with the slide groove 13. Pressing down the knob 35 causes the abutment plate 32 to move downwards via the rotating rod 31, sliding from the slide groove 13 into the rotating groove 14. At this time, the spring 34 is compressed. Rotating the knob 35 causes the abutment plate 32 to be displaced from the slide groove 13. After releasing the knob 35, the limiting block 33 is pushed upwards by the spring 34, giving the abutment plate 32 an upward tendency, so that the limiting block 33 and the rotating groove 14 are aligned. The tops abut against each other, thus completing the pre-installation of the heat sink body 2. Then, the mounting bracket 24 can be fixed to the top of the mounting post 12 by fixing bolts 4, thereby installing the heat sink body 2 on the surface of the motherboard 1. The heat sink body 2 is connected to the motherboard 1 through the connecting cable 21. The connecting cable 21 can be stored through the groove 22. The connecting cable 21 can be wrapped around the side surface of the heat sink body 2 through the limiting baffle 23. The connecting cable 21 can be bundled whether the heat sink body 2 is in use or not. The heat-conducting base plate 25 transfers the heat from the processor body 11 to the heat sink body 2, and the heat sink body 2 dissipates heat from the processor body 11.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A computer CPU processor heat dissipating device comprising a heat sink body (2), characterized in that: A connecting wire (21) is fixedly connected to the surface of the heat sink body (2). A groove (22) is provided on the top of the heat sink body (2). A limit baffle (23) is fixedly connected to the side surface of the heat sink body (2). A mounting bracket (24) is fixedly connected to the bottom of the heat sink body (2). A heat-conducting base plate (25) is fixedly connected to the bottom of the heat sink body (2). Fixing plates (26) are fixedly connected to both sides of the heat-conducting base plate (25). A sliding groove (27) is provided inside the fixing plate (26). A motherboard (1) is installed at the bottom of the heat sink body (2). A processor body (11) is fixedly connected to the surface of the motherboard (1). Four sets of mounting posts (12) are fixedly connected to the surface of the plate (1). Two sets of sliding grooves (13) are opened on the surface of the main plate (1). A rotating groove (14) is opened at the bottom of the sliding groove (13). A locking structure (3) is provided inside the sliding groove (27). The locking structure (3) includes a rotating rod (31). A stop plate (32) is fixedly connected to the bottom of the rotating rod (31). A knob (35) is fixedly connected to the top of the rotating rod (31). A limit block (33) is fixedly connected to the surface of the rotating rod (31). A spring (34) is sleeved on the surface of the rotating rod (31). A fixing bolt (4) is rotatably connected to the top of the mounting post (12).

2. A computer CPU processor heat dissipating device as claimed in claim 1 wherein: The heat sink body (2) is electrically connected to the motherboard (1) via the connecting line (21).

3. The computer CPU processor heat dissipation device according to claim 1, characterized in that: The limiting baffle (23) is L-shaped, and four sets of the limiting baffle (23) are arranged on the circumference of the side surface of the radiator body (2).

4. The computer CPU processor heat dissipation device according to claim 1, characterized in that: The four sets of mounting posts (12) are fixedly connected to the four corners of the processor body (11). The fixing bolts (4) pass through the mounting bracket (24) and are rotatably connected to the mounting posts (12). The bottom of the heat-conducting base plate (25) is in contact with the top of the processor body (11).

5. A computer CPU processor heat dissipation device according to claim 1, characterized in that: The radius of the limiting block (33) is greater than the radius of the rotating rod (31). The limiting block (33) is slidably connected in the second slide groove (27). The two ends of the rotating rod (31) pass through the top and bottom of the second slide groove (27) and are fixedly connected to the knob (35) and the abutment plate (32) respectively.

6. A computer CPU processor heat dissipation device according to claim 1, characterized in that: The two ends of the spring (34) abut against the bottom of the limiting block (33) and the bottom of the inner wall of the second slide (27), respectively.

7. A computer CPU processor heat dissipation device according to claim 1, characterized in that: The width of the abutting plate (32) is equal to the width of the first slide groove (13). The abutting plate (32) is slidably connected in the first slide groove (13) and rotatably connected in the rotating groove (14).

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